CN220796735U - Packaging support and electronic component - Google Patents

Abstract

The utility model discloses a packaging support and an electronic component, wherein the packaging support comprises: the device comprises a frame and a plurality of unit columns transversely arranged in the frame, wherein each unit column comprises a plurality of packaging units which are longitudinally and linearly arranged; the space L1 is reserved between any two adjacent unit columns to form a hollow processing area, each packaging unit comprises a base island, a plurality of upper pins and a plurality of lower pins, the upper pins and the base island are arranged on the upper side and the lower side of the base island, the upper pins and the base island are connected into a whole, the base island protrudes out of a plane where the frame is located, one surface, close to the frame, of the base island is a working surface, the chip is arranged on the working surface, one surface, far away from the frame, of the base island is a heat radiating surface, and the heat radiating surface is exposed on the outer surface of the plastic package body after the packaging units are packaged. The utility model has the advantages of reducing processing difficulty, avoiding die damage, improving the structural stability of the packaging bracket, and the like.

Description

Packaging support and electronic component

Technical Field

The present utility model relates to the field of semiconductor packaging technology, and in particular, to a packaging support and an electronic component.

Background

The semiconductor package support is a substrate for supporting and packaging a semiconductor chip, plays an important role in the semiconductor packaging process, provides support and protection for the chip, and connects the chip with an external circuit through wires. For high-power electronic components, the packaging unit has larger volume, the packaging bracket has enough mechanical strength, can resist mechanical impact and vibration and prevent chips from falling off or being damaged, and meanwhile, the manufacturing cost and the production process of the packaging bracket need to be considered, so that a design scheme suitable for mass production is selected.

TOLT packaging is one of packaging modes suitable for high-power electronic components, TOLT packaging refers TO TO-Lead Top-side cooling (Top heat dissipation type TO tape Lead packaging), has the advantages of high current and low height, adopts Top heat dissipation design, and effectively improves heat performance, but the density of an existing TOLT packaging support is relatively high, the space between packaging units is small, processing is difficult, and a die is easy TO damage.

Disclosure of utility model

Aiming at the defects in the prior art, the utility model provides the packaging support and the electronic component, and a processing area with larger space is reserved between the unit columns of the packaging support, so that the processing difficulty is effectively reduced.

The utility model adopts the technical scheme that the design package support comprises: the device comprises a frame and a plurality of unit columns transversely arranged in the frame, wherein each unit column comprises a plurality of packaging units which are longitudinally and linearly arranged; a space L1 is reserved between any two adjacent unit columns to form a hollow processing area.

Further, each packaging unit comprises a base island, a plurality of upper pins and a plurality of lower pins which are arranged on the upper side and the lower side of the base island, the upper pins are connected with the base island into a whole, the base island protrudes out of the plane where the frame is located, one surface of the base island, which is close to the frame, is a working surface, a chip is arranged on the working surface, one surface of the base island, which is far away from the frame, is a heat dissipation surface, and the heat dissipation surface is exposed on the outer surface of the plastic package body after the packaging unit is packaged.

Further, the frame comprises upper and lower side ribs parallel to each other, and longitudinal separation ribs connected between the upper and lower side ribs, at least one unit row is arranged between two adjacent longitudinal separation ribs, the longitudinal separation ribs penetrate through the processing area, and a distance L2 is reserved between the longitudinal separation ribs and the adjacent unit rows.

Further, a plurality of packaging units which are transversely and linearly arranged are used as a unit row, each unit row is provided with an upper connecting rib and a lower connecting rib, the upper connecting ribs are used for transversely connecting all upper pins of the unit row, and the lower connecting ribs are used for transversely connecting all lower pins of the unit row.

Further, a transverse separation rib is arranged between two longitudinally adjacent unit rows, lower pins of the unit rows positioned on the upper sides of the transverse separation ribs are connected with the transverse separation ribs, and upper pins of the unit rows positioned on the lower sides of the transverse separation ribs are connected with the transverse separation ribs.

In some embodiments, each cell column contains 4 packaged cells.

In the above embodiment, the pitch L1 is 4.2mm, and the pitch L2 is 1.3mm.

Further, the edge of the base island is provided with a glue buckling groove.

The utility model also provides an electronic component, which is packaged by adopting the packaging bracket.

Compared with the prior art, the utility model has the following beneficial effects:

1. The larger interval L1 is reserved between the adjacent unit columns to form a hollow processing area, so that the processing difficulty is effectively reduced, and the damage of a die is avoided;

2. A longitudinal separation rib is connected between the upper edge rib and the lower edge rib, a space L2 is reserved between the longitudinal separation rib and the unit row, and a processing space is reserved while the mechanical strength of the bracket is improved;

3. Each unit row is provided with an upper connecting rib and a lower connecting rib, a transverse separation rib is arranged between every two adjacent unit rows, and the packaging support is stable in structure and higher in mechanical strength.

Drawings

The utility model is described in detail below with reference to examples and figures, wherein:

FIG. 1 is a schematic plan view of a package support;

FIG. 2 is a schematic plan view of a packaging unit;

FIG. 3 is a schematic side view of a package support;

FIG. 4 is a schematic side view of a packaging unit;

Reference numerals: 1. a frame; 11. a top rim; 12. a lower edge rib; 13. longitudinal separation ribs; 14. a connecting rib is arranged on the upper part; 15. a lower connecting rib; 16. transverse separation ribs; 2. a packaging unit; 21. a base island; 211. a working surface; 212. a heat radiating surface; 22. an upper pin; 23. a lower pin; 3. a processing zone; 4. and (5) plastic packaging.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present patent.

As shown in fig. 1, the package support provided by the present utility model includes: the frame 1 and be located a plurality of encapsulation unit 2 in the frame, a plurality of encapsulation unit 2 of vertical linear arrangement are as a unit row, transversely arrange a plurality of unit row in the frame, leave interval L1 between two arbitrary unit rows and form hollow processing district 3, interval L1 exceeds 1.5mm, effectively reduces the processing degree of difficulty, avoids the mould damage.

The frame 1 comprises an upper side rib 11, a lower side rib 12 and a longitudinal separation rib 13, wherein the upper side rib 11 and the lower side rib 12 are mutually parallel and transversely arranged, the longitudinal separation rib 13 is connected between the upper side rib 11 and the lower side rib 12, namely one end of the longitudinal separation rib 13 is connected with the upper side rib 11, the other end of the longitudinal separation rib is connected with the lower side rib 12, at least one unit row is arranged between two adjacent longitudinal separation ribs 13, the longitudinal separation rib 13 penetrates through a processing area 3, a distance L2 is reserved between the longitudinal separation rib 13 and the adjacent unit row, the distance L2 exceeds 1mm, and a processing space is reserved when the mechanical strength of the bracket is improved by the longitudinal separation rib 13.

As shown in fig. 2 to 4, each packaging unit 2 includes a base island 21, a plurality of upper pins 22, and a plurality of lower pins 23, the upper pins 22 are disposed on the upper side of the base island 21, the lower pins 23 are disposed on the lower side of the base island 21, the upper pins 22 are integrally connected with the base island 21, the base island 21 protrudes out of a plane where the frame 1 is located, one surface of the base island 21, which is close to the frame, is a working surface 211, a chip is mounted on the working surface 211, one surface of the base island 21, which is far away from the frame 1, is a heat dissipation surface 212, after the packaging unit 2 is packaged by plastic, the chip is located inside the plastic package body 4, the heat dissipation surface 212 of the base island 21 is exposed on the outer surface of the plastic package body 4, and the outer ends of the upper pins 22 and the lower pins 23 are located outside the plastic package body 4. Generally, the edge of the base island 21 is designed with a glue buckling groove, the glue buckling groove is filled with plastic during packaging, and after demolding, the glue buckling groove is firmly embedded in the plastic package body 4, so that the packaging stability is better.

As shown in fig. 1, a plurality of packaging units 2 are arranged in a transverse and straight manner as a unit row, each unit row is provided with an upper connecting rib 14 and a lower connecting rib 15, the upper connecting rib 14 and the lower connecting rib 15 are both arranged transversely, the upper connecting rib 14 is used for transversely connecting all upper pins 22 of the unit row, and the lower connecting rib 15 is used for transversely connecting all lower pins 23 of the unit row. A transverse separation rib 16 is arranged between two longitudinally adjacent unit rows, lower pins 23 of the unit rows positioned on the upper side of the transverse separation rib 16 are connected to the transverse separation rib 16, and upper pins 22 of the unit rows positioned on the lower side of the transverse separation rib 16 are connected to the transverse separation rib 16. The upper connecting ribs 14, the lower connecting ribs 15 and the transverse separation ribs 16 are beneficial to the stability of the packaging support, so that the mechanical strength of the packaging support is higher, and the packaging quality is ensured.

In some application examples, each unit column comprises 4 packaging units 2, 2 unit columns are arranged between two adjacent longitudinal separation ribs 13, the distance L1 is 4.2mm, the distance L2 is 1.3mm, the packaging unit density and the mechanical strength of the packaging support are moderate, the cost is low, and the processing is convenient.

The packaging support is particularly suitable for TOLT packaging of high-power electronic components, such as high-power drivers with power levels up to 50 kW.

It should be understood that reference herein to "a number" means at least one, the lateral direction means the length direction of the upper or lower bead, and the longitudinal direction means the direction perpendicular to the lateral direction in the same plane. For ease of understanding, taking fig. 1 as an example, in the plane of the package support, the direction from left to right is transverse, and the direction from top to bottom is longitudinal.

It is noted that the above-mentioned terms are used merely to describe specific embodiments, and are not intended to limit exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (9)

1. A package support, comprising: the device comprises a frame and a plurality of unit columns transversely arranged in the frame, wherein each unit column comprises a plurality of packaging units which are longitudinally and linearly arranged; the device is characterized in that a space L1 is reserved between any two adjacent unit columns to form a hollow processing area.

2. The packaging support according to claim 1, wherein each packaging unit comprises a base island, a plurality of upper pins and a plurality of lower pins, wherein the upper pins and the base island are arranged on the upper side and the lower side of the base island, the upper pins and the base island are connected into a whole, the base island protrudes out of a plane where the frame is located, one surface, close to the frame, of the base island is a working surface, a chip is mounted on the working surface, one surface, far away from the frame, of the base island is a heat dissipation surface, and the heat dissipation surface is exposed on the outer surface of the plastic package body after the packaging unit is packaged.

3. The packaging bracket according to claim 1 or 2, wherein the frame comprises an upper side rib and a lower side rib which are parallel to each other, and a longitudinal separation rib connected between the upper side rib and the lower side rib, at least one unit row is arranged between two adjacent longitudinal separation ribs, the longitudinal separation rib passes through the processing area, and a space L2 is reserved between the longitudinal separation rib and the adjacent unit row.

4. A package support according to claim 3, wherein a plurality of package units are arranged in a horizontal line as a unit row, each unit row is provided with an upper connecting rib for connecting all upper pins of the unit row horizontally and a lower connecting rib for connecting all lower pins of the unit row horizontally.

5. The package support according to claim 4, wherein a transverse partition rib is provided between two longitudinally adjacent unit rows, lower pins of the unit rows located on the upper side of the transverse partition rib are connected to the transverse partition rib, and upper pins of the unit rows located on the lower side of the transverse partition rib are connected to the transverse partition rib.

6. A package support according to claim 3, wherein each of said columns of cells comprises 4 package cells.

7. The package support of claim 6, wherein the pitch L1 is 4.2mm and the pitch L2 is 1.3mm.

8. The package support of claim 2, wherein the edges of the base islands are provided with glue grooves.

9. An electronic component, wherein the electronic component is packaged using the package support according to any one of claims 1 to 8.