CN220796682U

CN220796682U - Silicon controlled rectifier packaging equipment

Info

Publication number: CN220796682U
Application number: CN202321517521.5U
Authority: CN
Inventors: 郑锦春; 郑李耿
Original assignee: JINZHOU JINLI ELECTRIC CO Ltd
Current assignee: JINZHOU JINLI ELECTRIC CO Ltd
Priority date: 2023-06-14
Filing date: 2023-06-14
Publication date: 2024-04-16
Anticipated expiration: 2033-06-14

Abstract

The utility model discloses a silicon controlled rectifier packaging device which comprises a bottom plate, wherein a supporting leg is arranged at the lower end of the bottom plate, a rotating structure is arranged at the lower end of the bottom plate, a turntable is arranged at the upper end of the bottom plate, a side plate I and a side plate II are respectively arranged on one side of the bottom plate, a glue dripping structure is arranged at one end of the side plate I, which is close to the bottom plate, a reciprocating structure is arranged at one end of the side plate II, which is close to the bottom plate, a groove is formed in the groove, a connecting plate is arranged in the groove, a cross rod is arranged at one end of the connecting plate, which is close to the bottom plate, and an electromagnetic chuck is arranged at one end of the cross rod. Compared with the prior art, the utility model has the advantages that: the utility model can not only avoid manual transfer of the silicon controlled rectifier, but also facilitate industrial production.

Description

Silicon controlled rectifier packaging equipment

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a silicon controlled rectifier packaging device.

Background

The silicon controlled rectifier is also called a thyristor, and has developed into a large family since the 50 th century, and its main members are unidirectional thyristor, bidirectional thyristor, photo-controlled thyristor, reverse-conducting thyristor, turn-off thyristor, fast thyristor, etc., which are one of the more commonly used semiconductor devices, the semiconductor packaging refers to the process of processing the tested wafer into an independent chip according to the product model and function requirement, and the packaging dispensing process (electronic product chip dispensing process) has important role in the field of assembling the PCB circuit board and the chip of the electronic product, mainly performing bonding sealing reinforcement and waterproof protection work on the PCB chip of the electronic product, and can well prolong the use effect and service life of the chip on the PCB circuit board of the electronic product.

The patent number among the prior art is CN 218215225U's patent discloses a semiconductor packaging equipment, and its technical scheme main points are: the packaging device comprises a packaging table, wherein a mounting frame is fixedly arranged on the top surface of the packaging table, an adjusting plate is arranged on the top surface of the packaging table, a packaging plate is arranged on the top surface of the adjusting plate, and a PLC (programmable logic controller) is fixedly arranged on the top surface of the packaging table; the packaging assembly is arranged on the top surface of the packaging table and used for packaging semiconductors, the packaging assembly comprises a mounting groove, the mounting groove is formed in the top surface of the packaging table, a driving motor is fixedly sleeved on the inner circular wall surface of the mounting groove, a driving shaft of the driving motor is fixedly mounted on the adjusting plate, and the packaging table, the mounting frame, the adjusting plate, the packaging plate, the mounting groove, the driving motor, the adjusting groove, the screw rod, the movable groove, the stepping motor, the adjusting block, the limiting groove and the PLC are mutually matched for use, so that workers can conveniently perform multi-position dispensing on the semiconductors, and the semiconductors are packaged.

However, the prior art patents suffer from several drawbacks:

(1) In the prior art, only one semiconductor can be packaged, and an operator is required to take out the semiconductor in the adjusting plate after the packaging is completed and then move the semiconductor to the next process for detection, and the like, so that the packaging is complicated;

(2) The prior art can not be matched with a production line as separate equipment, and the produced semiconductors and packaging shells are required to be transported separately, so that the method is not suitable for industrial production.

Disclosure of Invention

The utility model aims to overcome the technical defects, and provides the silicon controlled rectifier packaging equipment which can not only avoid manual transfer of the silicon controlled rectifier, but also facilitate industrial production.

In order to solve the problems, the technical scheme of the utility model is as follows: the silicon controlled rectifier packaging equipment comprises a bottom plate, wherein the lower end of the bottom plate is provided with supporting legs, the lower end of the bottom plate is provided with a rotating structure, the upper end of the bottom plate is provided with a rotary table, one side of the bottom plate is respectively provided with a side plate I and a side plate II, one end of the side plate I, which is close to the bottom plate, is provided with a glue dripping structure, one end of the side plate II is provided with a reciprocating structure, one end of the side plate II, which is close to the bottom plate, is provided with a groove, a connecting plate is arranged in the groove, one end of the connecting plate, which is close to the bottom plate, is provided with a cross rod, and one end of the cross rod is provided with an electromagnetic chuck;

preferably, the rotating structure comprises a rotating shaft, the upper end of the rotating shaft penetrates through the bottom plate fixedly connected turntable, the lower end of the rotating shaft is provided with an adjusting plate, arc grooves are formed in four sides of the adjusting plate, sliding grooves are formed between two adjacent arc grooves, one side of the adjusting plate is provided with a semicircular disc, the lower end of the semicircular disc is provided with a rotating rod I, the lower end of the rotating rod I is provided with a motor I, one side of the rotating rod I is provided with a connecting rod, and the upper end of the other end of the connecting rod is provided with a deflector rod.

Further, reciprocating structure includes dwang two, dwang two one end is equipped with the elliptic plate, dwang two fixed connection elliptic plate one end edge, dwang two lower extreme is equipped with fixed frame, fixed frame one end cover is equipped with the slider, slider one end is equipped with the riser, riser upper end contact elliptic plate lower extreme, the slider is located the inside one end lower extreme of fixed frame and is equipped with the spring telescopic link.

Further, riser one end fixed connection is in the connecting plate, connecting plate one end runs through sliding connection curb plate two, the box is established to reciprocating structure outer pot head, the connecting plate runs through sliding connection box.

Further, the glue dripping structure comprises an electric telescopic rod, a glue dripping head is arranged at the telescopic end of the electric telescopic rod, and an electromagnetic valve is arranged at one end of the glue dripping head.

Further, the edge of the turntable is uniformly provided with four placing grooves, and the positions of the placing grooves correspond to the first side plate and the second side plate.

Further, a second motor is arranged at one end of the second rotating rod, and a support column is arranged at the lower end of the second motor to place the ground.

Further, the semicircular disc is mutually attached to the arc groove, and the size of the deflector rod is slightly smaller than that of the chute.

Compared with the prior art, the utility model has the advantages that:

(1) According to the utility model, the rotating structure is arranged to control the periodic interval rotation of the turntable, so that the process of glue dripping and capping of the silicon controlled rectifier is completed when the placing groove in the turntable rotates, the packaged silicon controlled rectifier can be conveyed to the next process, the silicon controlled rectifier is not required to be transported again by personnel, and the personnel cost is saved;

(2) According to the utility model, the connecting plate cross rod is driven to move by the mounting reciprocating structure, so that the packaging of the silicon controlled rectifier is realized, and the electromagnetic chuck can absorb the packaging shell, thereby being convenient for industrialized production.

Drawings

Fig. 1 is a perspective view of a thyristor packaging apparatus according to the present utility model.

Fig. 2 is a perspective view of a thyristor packaging device according to the present utility model.

Fig. 3 is an enlarged view of a portion a of a thyristor packaging device according to the present utility model.

Fig. 4 is a reciprocating structural diagram of a silicon controlled rectifier packaging device of the present utility model.

As shown in the figure: 1. a bottom plate; 2. support legs; 3. a rotating structure; 4. a turntable; 5. a first side plate; 6. a glue dripping structure; 7. a second side plate; 8. a reciprocating structure; 9. a connecting plate; 10. a cross bar; 11. an electromagnetic chuck; 12. a rotating shaft; 13. an adjusting plate; 14. an arc groove; 15. a chute; 16. a half-disc; 17. rotating the first rod; 18. a first motor; 19. a connecting rod; 20. a deflector rod; 21. a second rotating rod; 22. an elliptical plate; 23. a riser; 24. a slide block; 25. a fixed frame; 26. a spring telescoping rod; 27. an electric telescopic rod; 28. a glue dripping head; 29. an electromagnetic valve; 30. a placement groove; 31. and a second motor.

Detailed Description

Specific embodiments of the present utility model will be further described below with reference to the accompanying drawings. Wherein like parts are designated by like reference numerals.

It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component.

In order to make the contents of the present utility model more clearly understood, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

As shown in fig. 1 to 4, a silicon controlled rectifier packaging device includes a bottom plate 1, four supporting legs 2 are installed at the lower end of the bottom plate 1, the supporting legs 2 are in contact with the ground, a rotating structure 3 is installed at the lower end of the bottom plate 1, a rotating disc 4 is installed at the upper end of the bottom plate 1, the rotating structure 3 can control the rotating disc 4 to rotate, the rotating structure 3 includes a rotating shaft 12, the upper end of the rotating shaft 12 penetrates through the bottom plate 1 to be fixedly connected with the rotating disc 4, an adjusting plate 13 is installed at the lower end of the rotating shaft 12, arc grooves 14 are formed in four sides of the adjusting plate 13, a half disc 16 and the arc grooves 14 are mutually attached, the half disc 16 rotates and cannot drive the adjusting plate 13 to rotate through the friction arc grooves 14, sliding grooves 15 are formed between two adjacent arc grooves 14, four sliding grooves 15 are respectively located at diagonal positions of the adjusting plate 13, a rotating rod 17 is installed at the lower end of the half disc 16, a motor 18 is installed at the lower end of the rotating rod 17, a connecting rod 19 is installed at one side of the rotating rod 18, a deflector 20 is installed at the other end of the connecting rod 19, and the deflector 20 is slightly smaller than the sliding grooves 20 in a circle than 15, and when the rotating rod 20 is rotated by the rotating plate 13, the rotating plate 13 can be driven to enter the adjusting plate 13, and the rotating plate 13 periodically, so that the sliding grooves can be periodically adjusted.

The first side plate 5 and the second side plate 7 are respectively arranged on one side of the bottom plate 1, the edges of the rotary table 4 are uniformly provided with four placing grooves 30, and the positions of the placing grooves 30 correspond to the first side plate 5 and the second side plate 7.

The side plate I5 is close to the glued structure 6 of bottom plate 1 one end installation, and glued structure 6 includes electric telescopic handle 27, and the flexible end installation of electric telescopic handle 27 is glued the head 28, and solenoid valve 29 is installed to the head 28 one end, and electric telescopic handle 27 can adjust the position of the head 28 of gluing, can make gluey can cover the silicon controlled wafer surface, and solenoid valve 29 can control whether the head 28 of gluing drips.

The reciprocating structure 8 is installed to curb plate two 7 one end, reciprocating structure 8 is located the box inside, reciprocating structure 8 includes dwang two 21, the edge at elliptic plate 22 one end is installed to dwang two 21 one end, dwang two 21 rotations make elliptic plate 22 rotate, fixed frame 23 is installed to dwang two 21 lower extreme, slider 24 is cup jointed to fixed frame 23 one end, riser 25 has been installed to slider 24 one end, when elliptic plate 22 rotates, drive riser 25 and reciprocate, slider 24 is located the inside one end lower extreme of fixed frame 23 and has installed spring telescopic link 26, spring telescopic link 26 can reset riser 25.

The second side plate 7 is close to one end of the bottom plate 1 and is provided with a groove, a connecting plate 9 capable of sliding up and down is arranged in the groove, a cross rod 10 is arranged at one end of the connecting plate 9 close to the bottom plate 1, an electromagnetic chuck 11 is arranged at one end of the cross rod 10, the electromagnetic chuck 11 is used for sucking a packaging shell, and the packaging shell is conveyed to the electromagnetic chuck from outside.

One end of the second rotating rod 21 is provided with a second motor 31, and the lower end of the second motor 31 is provided with a supporting column for placing the ground.

When in use, the silicon controlled rectifier with the lower shell is conveyed to the position of the placing groove 30 of the turntable 4 at the upper end of the bottom plate 1 through an external conveying device, the first rotary rod 17 is driven to rotate through the first starting motor 18, so that the half disc 16, the connecting rod 19 and the deflector rod 20 are driven to rotate, when the half disc 16 passes through the arc groove 14 of the adjusting plate 13, the adjusting plate 13 is not moved, when the deflector rod 20 rotates to the inside of the sliding groove 15, the deflector rod 20 drives the adjusting plate 13 to rotate, so that the rotating shaft 12 is driven to rotate, so that the turntable 4 is driven to rotate ninety degrees each time, so that the silicon controlled rectifier moves to the position of the glue dripping structure 6 along with the turntable 4, the first motor 27 and the electromagnetic valve 29 are used for controlling glue dripping heads to drip glue on the surface, at the moment, the deflector rod 20 again drives the adjusting plate 13, so that the turntable 4 again rotates ninety degrees, so that the silicon controlled rectifier is positioned at the lower end of the reciprocating structure 8, the second motor 31 drives the second rotary rod to rotate, so that the elliptical plate 22 is driven to rotate, when the deflector rod 20 rotates one hundred eighty degrees, the vertical plate 25 is driven to move downwards, so that the sliding block 24 drives the sliding plate 24 to rotate downwards, so that the electromagnetic valve 26 drives the electromagnetic valve 26 to move downwards, so that the electromagnetic valve 25 drives the electromagnetic valve 25 to move upwards, so that the electromagnetic valve 25 continues to move upwards, so that the electromagnetic valve 11 continues to move upwards, so that the sealing plate 11, so that the electromagnetic valve 11 continues to move upwards, and the sealing plate 11, so that the sealing plate 11 is driven to move upwards, and the electromagnetic rod 11, so that the sealing plate 11 is continuously, and the sealing plate is continuously moved upwards, and the sealing plate 11, and the sealing plate is moved. So that the packaged silicon controlled rectifier flows to the next process through an external conveyor belt.

The first motor 18, the second motor 31, the electromagnetic chuck 11 and the electromagnetic valve 29 are controlled by the controller end, so that the use of the structure can be satisfied.

The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.

Claims

1. A silicon controlled rectifier packaging device, characterized in that: the novel multifunctional electric heating device comprises a bottom plate (1), wherein a supporting leg (2) is arranged at the lower end of the bottom plate (1), a rotating structure (3) is arranged at the lower end of the bottom plate (1), a turntable (4) is arranged at the upper end of the bottom plate (1), a first side plate (5) and a second side plate (7) are respectively arranged on one side of the bottom plate (1), a glue dripping structure (6) is arranged at one end, close to the bottom plate (1), of the first side plate (5), a reciprocating structure (8) is arranged at one end, close to the bottom plate (1), of the second side plate (7), a groove is formed in the groove, a connecting plate (9) is arranged at one end, close to the bottom plate (1), of the connecting plate (9), a transverse rod (10) is arranged at one end, and an electromagnetic chuck (11) is arranged at the other end of the transverse rod (10).

The rotating structure (3) comprises a rotating shaft (12), the upper end of the rotating shaft (12) penetrates through a bottom plate (1) to be fixedly connected with a rotary table (4), an adjusting plate (13) is arranged at the lower end of the rotating shaft (12), arc grooves (14) are formed in four sides of the adjusting plate (13), sliding grooves (15) are formed between the arc grooves (14) in two adjacent modes, a semicircular disc (16) is arranged on one side of the adjusting plate (13), a rotating rod I (17) is arranged at the lower end of the semicircular disc (16), a motor I (18) is arranged at the lower end of the rotating rod I (17), a connecting rod (19) is arranged on one side of the rotating rod I (17), and a deflector rod (20) is arranged at the upper end of the other end of the connecting rod (19).

2. A silicon controlled rectifier packaging apparatus as in claim 1, wherein: reciprocating structure (8) are including dwang two (21), dwang two (21) one end is equipped with oval board (22), dwang two (21) fixed connection oval board (22) one end edge, dwang two (21) lower extreme is equipped with fixed frame (23), fixed frame (23) one end cover is equipped with slider (24), slider (24) one end is equipped with riser (25), riser (25) upper end contact oval board (22) lower extreme, slider (24) are located fixed frame (23) inside one end lower extreme and are equipped with spring telescopic link (26).

3. A silicon controlled rectifier packaging apparatus as in claim 2, wherein: one end of the vertical plate (25) is fixedly connected with the connecting plate (9), one end of the connecting plate (9) penetrates through the sliding connection side plate II (7), the outer end of the reciprocating structure (8) is sleeved with the box body, and the connecting plate (9) penetrates through the sliding connection box body.

4. A silicon controlled rectifier packaging apparatus as in claim 1, wherein: the glue dripping structure (6) comprises an electric telescopic rod (27), a glue dripping head (28) is arranged at the telescopic end of the electric telescopic rod (27), and an electromagnetic valve (29) is arranged at one end of the glue dripping head (28).

5. A silicon controlled rectifier packaging apparatus as in claim 1, wherein: the edge of the rotary table (4) is uniformly provided with four placing grooves (30), and the positions of the placing grooves (30) correspond to the first side plate (5) and the second side plate (7).

6. A silicon controlled rectifier packaging apparatus as in claim 2, wherein: one end of the second rotating rod (21) is provided with a second motor (31), and the lower end of the second motor (31) is provided with a support column for placing the ground.

7. A silicon controlled rectifier packaging apparatus as in claim 1, wherein: the semicircular disc (16) is mutually attached to the arc groove (14), and the size of the deflector rod (20) is slightly smaller than that of the chute (15).