CN220794098U - Detection device for thickness of semiconductor wafer - Google Patents
Detection device for thickness of semiconductor wafer Download PDFInfo
- Publication number
- CN220794098U CN220794098U CN202322696643.1U CN202322696643U CN220794098U CN 220794098 U CN220794098 U CN 220794098U CN 202322696643 U CN202322696643 U CN 202322696643U CN 220794098 U CN220794098 U CN 220794098U
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- thickness gauge
- wafer
- thickness
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- servo motor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000001514 detection method Methods 0.000 title abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 230000007306 turnover Effects 0.000 claims description 4
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 6
- 235000012431 wafers Nutrition 0.000 description 51
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
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Abstract
The utility model discloses a device for detecting the thickness of a semiconductor wafer, and relates to the field of measuring instruments. Including the thickness gauge casing, thickness gauge casing upper end fixed mounting has test assembly, thickness gauge casing bottom fixed mounting has the wafer seat, the discharge gate has been seted up to thickness gauge casing bottom in wafer seat one side, the inside and outside of thickness gauge casing all is equipped with feed mechanism, servo motor fixed mounting is in thickness gauge casing upper end department, servo motor's output end is equipped with the drive shaft, drive shaft end fixed mounting has the bogie, bogie end fixed mounting has driving cylinder, driving cylinder's output end is equipped with rubber suction cup, thickness gauge casing bottom is equipped with conveying mechanism. After the detection is finished, the wafer can be transferred into the discharge hole through the feeding mechanism in the thickness gauge shell, the wafer transferred into the discharge hole can drop onto the first conveying belt, the first conveying belt can rapidly convey the detected wafer, the detection step is automatically completed, and the detection speed is improved.
Description
Technical Field
The utility model relates to the field of measuring instruments, in particular to a device for detecting the thickness of a semiconductor wafer.
Background
In the semiconductor wafer detection process, a thickness detection device is needed to detect the thickness of the center point of the semiconductor wafer, and the semiconductor thickness detection device can be divided into: the non-contact thickness detection device mainly detects the thickness of the semiconductor wafer in a mode of measuring the reflectivity and the fluorescence of the semiconductor wafer, and has the advantages of convenience in use and small damage to the semiconductor wafer. The existing semiconductor wafer thickness detection device needs workers to place wafers on wafer seats of thickness gauges in the use process, and after detection is completed, the workers need to take down the wafers on the wafer seats again, so that the automation degree is low, and the detection speed is low.
Disclosure of utility model
The utility model mainly aims to provide a device for detecting the thickness of a semiconductor wafer, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a detection device of semiconductor wafer thickness, includes the thickness gauge casing, thickness gauge casing upper end fixed mounting has test assembly, thickness gauge casing bottom fixed mounting has the wafer seat, thickness gauge casing bottom is located wafer seat one side and has seted up the discharge gate, the inside and outside of thickness gauge casing all is equipped with feed mechanism, feed mechanism includes servo motor, drive shaft, actuating cylinder, bogie and rubber suction cup, servo motor fixed mounting in thickness gauge casing upper end department, servo motor's output end is equipped with the drive shaft, actuating shaft end fixed mounting has the bogie, bogie end fixed mounting has actuating cylinder, actuating cylinder's output end is equipped with rubber suction cup, and is connected with the breathing pipe on the rubber suction cup, thickness gauge casing bottom is equipped with conveying mechanism, conveying mechanism includes first conveyer belt, business turn over opening, feed inlet, support base and second conveyer belt, support base one side is equipped with the second conveyer belt, support base upper surface has seted up the feed inlet, support base below is located first conveyer belt opening, the support base opposite side is equipped with the feed inlet.
Further, a coupler is arranged at the output end of the servo motor, and the driving shaft is fixed on the output end of the servo motor through the coupler.
Further, one end of the driving shaft is fixed on the output end of the servo motor, the other end of the driving shaft is fixed on the bogie, and the driving cylinder is connected to the tail end of the driving shaft through the bogie.
Furthermore, the upper end of the supporting base is provided with a screw, and the supporting base is fixed at the bottom of the thickness gauge shell through the screw.
Further, the feeding hole on the supporting base is aligned with the discharging hole at the bottom of the shell of the thickness gauge, and the first conveying belt stretches into the supporting base through the inlet and outlet opening.
Furthermore, the front surface of the thickness gauge shell is provided with an observation window, and the side wall of the thickness gauge shell is provided with a feeding hole.
Compared with the prior art, the utility model has the following beneficial effects:
During the use can be through second conveyer belt with wafer transport to thickness gauge casing one side, can start driving cylinder after the wafer transport to thickness gauge casing one side for rubber sucking disc inhales and removes wafer department and inhale it, can start servo motor after the wafer is inhaled, makes the bogie rotatory to transfer the wafer to wafer seat department detection fast, can transfer the discharge gate with the wafer through the feed mechanism in the thickness gauge casing after detecting, and the wafer that transfers to the discharge gate can drop on first conveyer belt, and first conveyer belt can carry out the wafer that the detection was accomplished fast, and then accomplish the detection step voluntarily, promotes detection speed.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a feeding mechanism according to the present utility model;
Fig. 3 is a schematic view of a conveying mechanism according to the present utility model.
In the figure: 1. a thickness gauge housing; 2. a discharge port; 3. a wafer seat; 4. a testing component; 5. a feeding mechanism; 501. a servo motor; 502. a drive shaft; 503. a driving cylinder; 504. a bogie; 505. a rubber suction cup; 6. a conveying mechanism; 601. a first conveyor belt; 602. entering and exiting the opening; 603. a feed inlet; 604. a support base; 605. and a second conveyor belt.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1 to 3, a device for detecting the thickness of a semiconductor wafer comprises a thickness gauge shell 1, wherein a testing component 4 is fixedly arranged at the upper end of the thickness gauge shell 1, a wafer seat 3 is fixedly arranged at the bottom of the thickness gauge shell 1, a discharge hole 2 is formed in one side of the wafer seat 3 at the bottom of the thickness gauge shell 1, a feeding mechanism 5 is arranged at the inner part and the outer part of the thickness gauge shell 1, the feeding mechanism 5 comprises a servo motor 501, a driving shaft 502, a driving cylinder 503, a bogie 504 and a rubber sucker 505, a conveying mechanism 6 is arranged at the bottom of the thickness gauge shell 1, an observation window is arranged on the front surface of the thickness gauge shell 1, and a feeding hole is formed in the side wall of the thickness gauge shell 1.
The inside and outside of the thickness gauge housing 1 are all provided with feed mechanism 5, feed mechanism 5 includes servo motor 501, drive shaft 502, actuating cylinder 503, bogie 504 and rubber suction cup 505, servo motor 501 fixed mounting is in thickness gauge housing 1 upper end department, servo motor 501's output end is equipped with actuating shaft 502, the terminal fixed mounting of actuating shaft 502 has bogie 504, bogie 504 end fixed mounting has actuating cylinder 503, actuating cylinder 503's output end is equipped with rubber suction cup 505, and be connected with the breathing pipe on the rubber suction cup 505, thickness gauge housing 1 bottom is equipped with transport mechanism 6, transport mechanism 6 includes first conveyer belt 601, business turn over opening 602, feed inlet 603, supporting base 604 and second conveyer belt 605, supporting base 604 sets up in thickness gauge housing 1 bottom, supporting base 604 one side is equipped with second conveyer belt 605, supporting base 604 upper surface has seted up feed inlet 603, be located the feed inlet 603 below in supporting base 604, supporting base 604 opposite side has seted up business turn over opening 602, the actuating cylinder 503 can be started after the wafer carries to thickness gauge housing 1 one side, make rubber suction cup 505 remove and absorb wafer and shift fast to detect the wafer in the wafer 5, can detect the wafer in the step of 2 and can be carried out the step and carry out the wafer and carry out the step and carry out the wafer by detecting in the wafer, can be carried out in the wafer 5, can be detected and the wafer 1 and the wafer is detected and the wafer is transferred fast and can be carried out by the step and can be carried out by the wafer and is detected by the rotary carrier 5.
In practical use, the wafer is conveyed to one side of the thickness gauge housing 1 by the second conveying belt 605, the driving cylinder 503 can be started after the wafer is conveyed to one side of the thickness gauge housing 1, the rubber sucker 505 can be sucked and moved to the wafer and sucked up, the servo motor 501 can be started after the wafer is sucked up, one end of the driving shaft 502 is fixed at the output end of the servo motor 501, the other end of the driving shaft 502 is fixed on the bogie 504, the driving cylinder 503 is connected at the tail end of the driving shaft 502 by the bogie 504, the bogie 504 can be rotated after the servo motor 501 is started, so that the wafer is quickly transferred to the wafer seat 3 for detection, after the detection is finished, the wafer can be transferred to the discharge port 2 by the feeding mechanism 5 in the thickness gauge housing 1, the wafer which is transferred to the discharge port 2 can fall onto the first conveying belt 601, the detected wafer can be quickly conveyed out by the first conveying belt 601, and then the detection step is automatically completed, and the detection speed is improved.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. A semiconductor wafer thickness inspection apparatus, characterized in that: including thickness gauge casing (1), thickness gauge casing (1) upper end fixed mounting has test subassembly (4), thickness gauge casing (1) bottom fixed mounting has wafer seat (3), thickness gauge casing (1) bottom is located wafer seat (3) one side and has seted up discharge gate (2), thickness gauge casing (1) inside and outside all are equipped with feed mechanism (5), feed mechanism (5) including servo motor (501), drive shaft (502), actuating cylinder (503), bogie (504) and rubber suction cup (505), servo motor (501) fixed mounting in thickness gauge casing (1) upper end department, servo motor (501) output end is equipped with drive shaft (502), drive shaft (502) end fixed mounting has bogie (504), bogie (504) end fixed mounting has actuating cylinder (503), the output end of actuating cylinder (503) is equipped with rubber suction cup (505), and is connected with the breathing pipe on rubber suction cup (505), thickness gauge casing (1) bottom is equipped with conveying mechanism (6), conveying mechanism (6) including first conveyer belt (603), second conveyer belt (605), support base (601) and inlet and outlet (605), support base (604) set up in thickness gauge casing (1) bottom, support base (604) one side is equipped with second conveyer belt (605), feed inlet (603) have been seted up to support base (604) upper surface, be located feed inlet (603) below and be equipped with first conveyer belt (601) in support base (604), business turn over opening (602) have been seted up to support base (604) opposite side.
2. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the output end of the servo motor (501) is provided with a coupler, and the driving shaft (502) is fixed on the output end of the servo motor (501) through the coupler.
3. A semiconductor wafer thickness inspection apparatus according to claim 2, wherein: one end of the driving shaft (502) is fixed on the output end of the servo motor (501), the other end of the driving shaft (502) is fixed on the bogie (504), and the driving cylinder (503) is connected to the tail end of the driving shaft (502) through the bogie (504).
4. A semiconductor wafer thickness inspection apparatus according to claim 3, wherein: the upper end of the supporting base (604) is provided with a screw, and the supporting base (604) is fixed at the bottom of the thickness gauge shell (1) through the screw.
5. The semiconductor wafer thickness inspection apparatus according to claim 4, wherein: the feeding hole (603) on the supporting base (604) is aligned with the discharging hole (2) at the bottom of the thickness gauge shell (1), and the first conveying belt (601) stretches into the supporting base (604) through the in-out opening (602).
6. The semiconductor wafer thickness inspection apparatus according to claim 5, wherein: the front surface of the thickness gauge shell (1) is provided with an observation window, and the side wall of the thickness gauge shell (1) is provided with a feeding hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322696643.1U CN220794098U (en) | 2023-10-09 | 2023-10-09 | Detection device for thickness of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322696643.1U CN220794098U (en) | 2023-10-09 | 2023-10-09 | Detection device for thickness of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220794098U true CN220794098U (en) | 2024-04-16 |
Family
ID=90658360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322696643.1U Active CN220794098U (en) | 2023-10-09 | 2023-10-09 | Detection device for thickness of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220794098U (en) |
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2023
- 2023-10-09 CN CN202322696643.1U patent/CN220794098U/en active Active
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