CN219843915U

CN219843915U - High-precision die bonding equipment

Info

Publication number: CN219843915U
Application number: CN202223117028.2U
Authority: CN
Inventors: 邱国良; 张晓伟; 王永书; 何伟洪; 戴红葵
Original assignee: Dongguan Kaige Precision Machinery Co ltd
Current assignee: Dongguan Kaige Precision Machinery Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-10-17
Anticipated expiration: 2032-11-23

Abstract

The utility model discloses high-precision die bonding equipment, which comprises a supporting plate, a wafer disc feeding device, a chip adjusting device, a transferring swing arm and a patch device, wherein the wafer disc feeding device and the chip adjusting device are arranged on the supporting plate; the chip adjusting device comprises an adjusting rotating shaft, an adjusting table arranged on the adjusting rotating shaft and an adjusting motor used for driving the adjusting rotating shaft to rotate; the top one side of adjustment platform still is provided with the detection camera that is used for detecting the chip position, just one side of adjustment platform is provided with NG chip collection device, NG chip collection device's vacuum adsorption mouth aligns the adjustment platform, just NG chip collection device with the detection camera electricity is connected. The high-precision die bonding equipment can effectively improve die bonding precision of the chip.

Description

High-precision die bonding equipment

Technical Field

The utility model relates to the technical field of die bonding, in particular to high-precision die bonding equipment.

Background

In the die bonding process, a mechanical arm is adopted to absorb the chip, and then the chip is attached to a set position on the circuit board, so that the die bonding patch for the chip is completed.

In the prior art, after the mechanical arm absorbs the chips on the wafer disc, the chips are directly attached to the set positions on the circuit board, and as the local tensioning degree of the blue film on the wafer disc is different, the rotation angle of the chips relative to the mechanical arm cannot be completely consistent when the mechanical arm absorbs the chips, so that the deviation of the die bonding positions of the chips in the subsequent process is caused, and the processing accuracy is poor.

In view of this, there is a need to design a high-precision die bonding apparatus to improve the accuracy of die bonding.

Disclosure of Invention

The utility model aims to provide high-precision die bonding equipment so as to improve the accuracy of die bonding.

To achieve the purpose, the utility model adopts the following technical scheme:

the high-precision die bonding equipment comprises a supporting plate, a wafer disc feeding device, a chip adjusting device, a transferring swing arm and a patch device, wherein the wafer disc feeding device and the chip adjusting device are arranged on the supporting plate;

the chip adjusting device comprises an adjusting rotating shaft, an adjusting table arranged on the adjusting rotating shaft and an adjusting motor used for driving the adjusting rotating shaft to rotate;

the top one side of adjustment platform still is provided with the detection camera that is used for detecting the chip position, just one side of adjustment platform is provided with NG chip collection device, NG chip collection device's vacuum adsorption mouth aligns the adjustment platform, just NG chip collection device with the detection camera electricity is connected.

Optionally, the transferring swing arm is disposed between the wafer tray feeding device and the chip adjusting device;

still be provided with the mounting bracket in the backup pad, shift the swing arm rotatable install in on the mounting bracket, just be provided with on the mounting bracket and be used for the drive shift the swing arm wobbling pendulous device.

Optionally, the wafer disc feeding device comprises a bearing ring for bearing the wafer ring, an adjusting device for driving the bearing ring to rotate and a thimble device for ejecting the chip on the blue film of the wafer ring.

Optionally, the patch device comprises a patch head, a linear driving device for driving the patch head to move along the horizontal direction, and a lifting device for driving the patch head to lift along the vertical direction.

Optionally, the NG chip collecting device comprises a collecting pipeline, a collecting bottle and an air outlet pipeline;

the air outlet of the collecting pipeline extends into the collecting bottle, and the air inlet faces the adjusting table;

the air inlet of the air outlet pipeline extends into the collecting bottle, and the air outlet is communicated with the negative pressure generating device;

the collecting bottle is also provided with a filtering device for filtering the NG chip, the filtering device separates the air outlet of the collecting pipeline from the air inlet of the air outlet pipeline, and the air can pass through the gap of the filtering device.

Optionally, the high-precision die bonding equipment further comprises a circuit board conveying device, wherein the circuit board conveying device comprises a first bearing rail and a second bearing rail which are arranged in parallel, and a driving module used for driving the first bearing rail and the second bearing rail to synchronously move along the conveying direction.

Optionally, a CCD camera is further arranged on the mounting frame, and the CCD camera is arranged on one side of the top of the circuit board conveying device;

the CCD camera is respectively and electrically connected with the linear driving device and the driving module.

Optionally, the driving module is a servo motor.

Optionally, the swing angle of the transfer swing arm ranges from 0 ° to 180 °.

Compared with the prior art, the utility model has the following beneficial effects:

in this embodiment, transfer the swing arm and shift the chip from wafer dish loading attachment to the adjustment platform, then detect the camera and shoot the chip on the adjustment platform, detect the angle of chip, then adjust the motor shaft of motor and drive the adjustment platform and rotate, make the chip adjusted to the angle of settlement, then the chip of paster device absorption adjustment bench and paste the chip on the circuit board and carry out die bonding processing to can effectively promote the die bonding precision of chip.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are therefore not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would still fall within the scope of the present disclosure without affecting the efficacy or achievement of the present disclosure.

FIG. 1 is a schematic diagram of a high-precision die bonding apparatus according to an embodiment of the present utility model;

FIG. 2 is an enlarged schematic view of the position A in FIG. 1;

fig. 3 is a schematic structural diagram of an NG chip collecting device according to an embodiment of the present utility model.

Illustration of: 1. a support plate; 11. a mounting frame; 12. a swinging device; 2. a wafer disc feeding device; 21. a carrier ring; 22. an adjusting device; 23. a thimble device; 31. an adjusting table; 32. adjusting a motor; 4. transferring a swing arm; 5. a patch device; 51. a patch head; 52. a linear driving device; 53. a lifting device; 6. detecting a camera; 7. NG chip collection device; 71. a collection pipe; 72. a collection bottle; 73. an air outlet pipe; 8. a circuit board supporting device; 81. a first support rail; 82. a second support rail; 83. a driving module; 9. a CCD camera.

Detailed Description

In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

The embodiment of the utility model provides high-precision die bonding equipment, which can effectively improve the die bonding precision of chips. In addition, the detecting camera 6 is used for detecting the chip position so as to improve the die bonding precision. The high-precision die bonding equipment disclosed by the utility model is beneficial to improving the die bonding precision of the chip, can effectively avoid sticking the NG chip on the circuit board, and can effectively improve the processing yield.

Referring to fig. 1 to 3, the high-precision die bonding apparatus includes a supporting plate 1, a die-pad feeding device 2 mounted on the supporting plate 1, a die-pad adjusting device, a transferring swing arm 4 for transferring the die on the die-pad feeding device 2 to the die-pad adjusting device, and a chip attaching device 5 for attaching the die on the die-pad adjusting device to a set position of a circuit board;

the chip adjusting device comprises an adjusting rotating shaft, an adjusting table 31 arranged on the adjusting rotating shaft and an adjusting motor 32 used for driving the adjusting rotating shaft to rotate;

the top side of the adjustment table 31 is also provided with a detection camera 6 for detecting positions, and one side of the adjustment table 31 is provided with a NG chip collecting device 7, the vacuum suction port of the NG chip collecting device 7 is aligned with the adjustment table 31, and the NG chip collecting device 7 is electrically connected with the detection camera 6.

Specifically, the wafer disc loading device 2 is provided with a wafer disc, a blue film is tensioned on the wafer disc, and a chip is carried on the blue film; the chip on the blue film is transferred by the transferring swing arm 4, the chip is transferred to the adjusting table of the chip adjusting device, then the position of the chip is detected by the detecting camera 6, the adjusting table 31 is driven to rotate so that the chip rotates to a set angle, and finally the chip is sucked by the chip mounting device 5 and is mounted on the circuit board to finish die bonding chip mounting. The detection camera 6 is also used for detecting whether the chip is qualified or not, and the NG chip collecting device 7 is started and collects the NG chip when the chip is detected to be unqualified.

In this embodiment, in the previous process of attaching the chips to the circuit board, the rotation angle of the chips is adjusted so that the rotation angle of each chip is the same, and the positions of the chips sucked by the chip mounting device 5 are the same, thereby effectively improving the die bonding precision. It is also to supplement that through being provided with NG chip collection device 7 to can effectively suck the NG chip away, avoid the NG chip to paste on the circuit board, thereby be favorable to promoting circuit board production yield.

Optionally, the transferring swing arm 4 is arranged between the wafer disc feeding device 2 and the chip adjusting device;

the support plate 1 is also provided with a mounting frame 11, the transfer swing arm 4 is rotatably arranged on the mounting frame 11, and the mounting frame 11 is provided with a swinging device 12 for driving the transfer swing arm 4 to swing.

Specifically, the transferring swing arm 4 swings at a set angle, so that the chip of the wafer tray on the wafer tray feeding device 2 is transferred to the chip adjusting device. It is necessary to supplement that the swing angle of the transfer swing arm 4 is 0-180 °. The swinging device 12 can be a motor, a cylinder or other types of devices capable of driving the transferring swing arm 4 to swing.

Optionally, the wafer disc feeding device 2 comprises a bearing ring 21 for bearing the wafer ring, an adjusting device 22 for driving the bearing ring 21 to rotate, and a thimble device 23 for ejecting the wafer ring blue film chip.

Specifically, the ejector pin device 23 ejects the blue film upper chip, and then the transfer swing arm 4 sucks the blue film upper chip and transfers to the chip adjusting device.

Alternatively, the patch device 5 includes a patch head 51, a linear driving device 52 for driving the patch head 51 to move in the horizontal direction, and a lifting device 53 for driving the patch head 51 to lift in the vertical direction.

Specifically, the linear driving device 52 is used for driving the chip bonding head 51 to move onto the adjustment table 31, then the chip bonding head 51 moves down to adsorb chips under the driving of the lifting device 53, then the chip bonding head 51 is driven to rise, and the chips are transferred to the upper side of the circuit board by the linear driving device 52 and attached to the circuit board.

Optionally, NG chip collection apparatus 7 includes collection conduit 71, collection bottle 72, and outlet conduit 73;

the air outlet of the collecting pipe 71 extends into the collecting bottle 72, and the air inlet faces the adjusting table 31;

the air inlet of the air outlet pipeline 73 extends into the collecting bottle 72, and the air outlet is communicated with the negative pressure generating device;

the collection bottle 72 is also provided therein with a filter device for filtering the NG chip, which separates the gas outlet of the collection pipe 71 from the gas inlet of the gas outlet pipe 73, and the gas can pass through the gap of the filter device.

The negative pressure generating device is operated to generate negative pressure so that the collecting pipe 71 collects NG chips, and then the negative pressure generating device is stopped after the NG chips are collected.

Optionally, the high-precision die bonding apparatus further includes a circuit board conveying device 8, where the circuit board conveying device 8 includes a first support rail 81 and a second support rail 82 that are disposed in parallel, and a driving module 83 that is used to drive the first support rail 81 and the second support rail 82 to move synchronously along the conveying direction.

Specifically, the circuit board is placed on the first support rail 81 and the second support rail 82, and then is driven by the driving module 83 to move to one side of the bottom of the chip mounting device 5, so that the chip mounting device 5 can attach the chip to the circuit board to complete die bonding.

Optionally, the mounting frame 11 is further provided with a CCD camera 9, and the CCD camera 9 is arranged at one side of the top of the circuit board conveying device 8;

the CCD camera 9 is electrically connected to the linear driving device 52 and the driving module 83, respectively.

The CCD camera 9 detects the mounting position of the chip on the circuit board, and then moves through the linear driving device 52 and the driving module 83, so that the chip mounting head 51 is located directly above the circuit board.

In one embodiment, the driving module 83 is a servo motor.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The high-precision die bonding equipment is characterized by comprising a supporting plate (1), a wafer disc feeding device (2) arranged on the supporting plate (1), a chip adjusting device, a transfer swing arm (4) for transferring chips on the wafer disc feeding device (2) to the chip adjusting device, and a patch device (5) for attaching the chips on the chip adjusting device to a set position of a circuit board;

the chip adjusting device comprises an adjusting rotating shaft, an adjusting table (31) arranged on the adjusting rotating shaft and an adjusting motor (32) for driving the adjusting rotating shaft to rotate;

and a detection camera (6) for detecting the position of the chip is further arranged on one side of the top of the adjusting table (31).

2. The high-precision die bonding equipment according to claim 1, wherein the transfer swing arm (4) is arranged between the wafer disc feeding device (2) and the chip adjusting device;

still be provided with mounting bracket (11) on backup pad (1), shift swing arm (4) rotatable install in on mounting bracket (11), just be provided with on mounting bracket (11) and be used for the drive shift swing arm (4) wobbling pendulous device (12).

3. The high-precision die bonding equipment according to claim 1, wherein the wafer disc feeding device (2) comprises a bearing ring (21) for bearing a wafer ring, an adjusting device (22) for driving the bearing ring (21) to rotate and a thimble device (23) for ejecting a chip on a blue film of the wafer ring.

4. The high-precision die bonding equipment according to claim 2, wherein the die bonding device (5) comprises a die bonding head (51), a linear driving device (52) for driving the die bonding head (51) to move along the horizontal direction and a lifting device (53) for driving the die bonding head (51) to lift along the vertical direction.

5. The high-precision die bonding equipment according to claim 1, wherein a NG chip collecting device (7) is arranged on one side of the adjusting table (31), a vacuum adsorption port of the NG chip collecting device (7) is aligned to the adjusting table (31), and the NG chip collecting device (7) is electrically connected with the detecting camera (6).

6. The high-precision die bonding equipment according to claim 5, wherein the NG chip collecting device (7) comprises a collecting pipeline (71), a collecting bottle (72) and an air outlet pipeline (73);

the air outlet of the collecting pipeline (71) extends into the collecting bottle (72), and the air inlet faces the adjusting table (31);

an air inlet of the air outlet pipeline (73) extends into the collecting bottle (72), and an air outlet is communicated with a negative pressure generating device;

the collecting bottle (72) is also provided with a filtering device for filtering the NG chip, the filtering device separates the air outlet of the collecting pipeline (71) from the air inlet of the air outlet pipeline (73), and the air can pass through the gap of the filtering device.

7. The high-precision die bonding equipment according to claim 4, further comprising a circuit board conveying device (8), wherein the circuit board conveying device (8) comprises a first bearing rail (81) and a second bearing rail (82) which are arranged in parallel, and a driving module (83) for driving the first bearing rail (81) and the second bearing rail (82) to synchronously move along a conveying direction.

8. The high-precision die bonding equipment according to claim 7, wherein the mounting frame (11) is further provided with a CCD camera (9), and the CCD camera (9) is arranged on one side of the top of the circuit board conveying device (8);

the CCD camera (9) is electrically connected with the linear driving device (52) and the driving module (83) respectively.

9. The high-precision die bonding apparatus according to claim 7, wherein the driving module (83) is a servo motor.

10. The high-precision die bonding apparatus according to claim 7, wherein the swing angle of the transfer swing arm (4) ranges from 0 ° to 180 °.