CN220783622U - Semiconductor heater size detects uses support tool - Google Patents
Semiconductor heater size detects uses support tool Download PDFInfo
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- CN220783622U CN220783622U CN202322302980.8U CN202322302980U CN220783622U CN 220783622 U CN220783622 U CN 220783622U CN 202322302980 U CN202322302980 U CN 202322302980U CN 220783622 U CN220783622 U CN 220783622U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 abstract description 59
- 238000010438 heat treatment Methods 0.000 abstract description 32
- 238000000034 method Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
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Abstract
The utility model discloses a supporting jig for detecting the size of a semiconductor heater, and aims to solve the defects that a ceramic supporting tube is used for supporting a ceramic heating plate in the prior art, and the ceramic supporting tube is easy to topple and has poor supporting stability in the supporting process due to the small sectional area of the ceramic supporting tube. The utility model solves the technical problems by the following technical proposal: comprising the following steps: the base plate and the supporting plate are provided with supporting columns between; the base plate, the support column and the support plate are all provided with support notches penetrating through the support column in the axial direction, and the support notches are arranged in the radial direction of the support column. According to the utility model, the whole ceramic heating plate can be stably placed on the upper end surface of the support plate by arranging the support notch, so that the ceramic heater does not need to be placed on the support plate from the top, and the use is more convenient.
Description
Technical Field
The utility model relates to the technical field of semiconductor detection, in particular to a supporting jig for detecting the size of a semiconductor heater.
Background
In the semiconductor process, the ceramic heater is used as an important component of PVD, CVD, etching, ion implantation and other equipment to play an important role in carrying wafers, adsorbing wafers, controlling temperature, feeding radio frequency and the like. The basic structure of the ceramic heating plate is divided into a ceramic heating plate and a ceramic supporting tube, wherein the ceramic heating plate is internally provided with a heating layer, a radio frequency layer and other functional layers; the ceramic supporting tube is used as a supporting rod to support the ceramic heating disc and is connected with the equipment cavity, and an electrode rod of a functional layer of the ceramic heating disc penetrates through the ceramic tube to be connected with the equipment power supply.
In order to meet the technical requirements in the semiconductor manufacturing process, the ceramic heating disc needs to be designed with specific morphological characteristics on the upper surface in the manufacturing process, and detection comprises a plane with small enough flatness, a regularly distributed boss or a specific air passage and the like. Therefore, in the manufacturing and using processes of the ceramic heater, the dimension detection needs to be performed on the surface morphology features of the ceramic heating plate so as to confirm the state of the ceramic heater, and the function of the ceramic heater is ensured to meet the requirements of semiconductor manufacturing.
In the prior art, a ceramic supporting tube is generally used for supporting a ceramic heating plate during inspection, and because the sectional area of the ceramic supporting tube is small, the ceramic supporting tube is easy to fall down in the supporting process, and the supporting stability is poor; therefore, a supporting fixture is needed to support the ceramic heating plate so as to facilitate the detection of the ceramic heating plate.
Disclosure of Invention
The utility model overcomes the defects that the ceramic support tube is used for supporting the ceramic heating plate in the prior art, and the ceramic support tube is easy to fall down in the supporting process due to the small sectional area of the ceramic support tube, and the stability of the support is poor; the support jig for the size detection of the semiconductor heater can facilitate the support of the ceramic heater, facilitates the inspection of the ceramic heater, and has a simple structure and is very convenient to use.
In order to solve the technical problems, the utility model adopts the following technical scheme: a semiconductor heater dimension detection use support jig, comprising: the base plate and the supporting plate are provided with supporting columns between; the base plate, the support column and the support plate are all provided with support notches penetrating through the support column in the axial direction, and the support notches are arranged in the radial direction of the support column.
According to the utility model, the support notch is arranged, so that the whole ceramic heating plate can be stably placed on the upper end surface of the support plate, a ceramic heater does not need to be placed on the support plate from the top, and the use is more convenient; in addition, be provided with the supporting groove on the terminal surface at the top of supporting disk, the supporting groove not only can use the supporting jig to pile up with the supporting shoe when polylith semiconductor heater size detects for semiconductor heater size after the pile detects and uses the supporting jig stable in structure, simultaneously, when taking and putting down ceramic heating disk, can put the hand on the supporting groove, also makes the convenience that takes and put down ceramic heating disk more.
Preferably, a plurality of supporting blocks are uniformly arranged in the circumferential direction of the end surface of the bottom of the base plate, and the plurality of supporting blocks are arranged at the edge of the bottom of the base plate; a plurality of supporting grooves matched with the supporting blocks are formed in the circumferential direction of the end face of the top of the supporting disc.
The supporting groove not only can be matched with the supporting block when the supporting jig is used for detecting the sizes of the semiconductor heaters, so that the supporting jig is stable in structure for detecting the sizes of the semiconductor heaters after stacking, but also can be used for placing hands on the supporting groove when the ceramic heating disc is taken and put down, and the ceramic heating disc is taken and put down more conveniently.
Preferably, the height of the support block is less than the depth of the support groove.
When adjacent semiconductor heater size detects and uses the support tool to pile up, the supporting shoe can the butt in the bottom of supporting slot to prevent two adjacent semiconductor heater size and detect and use the terminal surface mutual friction that support tool contacted each other.
Preferably, the edge of the supporting groove is provided with a first chamfering structure, and the edge of the supporting block is provided with a second chamfering structure.
Through the cooperation of first chamfer structure and second chamfer structure for supporting shoe and supporting groove can the cooperation of easier.
Preferably, the edge of the bottom end of the supporting notch is provided with a convex rib, and the edge of the top end of the supporting notch is provided with a groove matched with the convex rib.
The rib is matched with the groove, so that when two adjacent semiconductor heaters are stacked by using the supporting jig in size detection, the two adjacent semiconductor heaters can be more conveniently stacked.
Preferably, the base plate also comprises a connecting block, the cross section of the connecting block is -shaped, a plurality of lower edge grooves are uniformly formed in the circumferential direction of the end face of the bottom of the base plate, and lower connecting grooves are formed in the lower edge grooves; an upper edge groove matched with the lower edge groove is formed in the edge of the circumferential direction of the end face of the top of the supporting disc, and an upper connecting groove is formed in the upper edge groove; when two support jigs are stacked, the connecting block is inserted into the upper connecting groove and the lower connecting groove.
When two support jigs are stacked, the connecting block is inserted into the upper connecting groove and the lower connecting groove which are connected, and the connecting block can play a role in connecting and limiting the adjacent semiconductor heater size detection support jigs, so that the adjacent two semiconductor heater size detection support jigs can be more stable when stacked.
Preferably, the end face of the connection plate is provided with a connection plate.
Through taking the connecting plate, can be convenient install and demolish the connecting block.
Compared with the prior art, the utility model has the beneficial effects that:
(1) By arranging the supporting notch, the whole ceramic heating plate can be stably placed on the upper end surface of the supporting plate, the ceramic heater does not need to be arranged on the supporting plate from the top, and the ceramic heating plate is more convenient to use; the method comprises the steps of carrying out a first treatment on the surface of the
(2) The support jig can adapt to ceramic support pipes with different lengths, so that the support jig is used for detecting the sizes of semiconductor heaters with different heights by stacking, and the use is more convenient;
(3) Be provided with the supporting groove on the terminal surface at the top of supporting disk, the supporting groove not only can use the supporting jig to pile up with the supporting shoe when polylith semiconductor heater size detects for semiconductor heater size after the pile detects uses the supporting jig stable in structure, simultaneously, when taking and putting down ceramic heating dish, can put the hand on the supporting groove, also makes the convenience that takes and put down ceramic heating dish more. .
Drawings
Fig. 1 is a perspective view of a first embodiment of the present utility model;
fig. 2 is a perspective view of another angle of the first embodiment of the present utility model;
FIG. 3 is a state diagram of the first embodiment of the present utility model when stacked;
fig. 4 is a perspective view of a second embodiment of the present utility model;
FIG. 5 is a cross-sectional view of a second embodiment of the utility model stacked;
fig. 6 is a perspective view of a second embodiment of the present utility model when stacked;
in the figure: 1. base plate, 11, supporting shoe, 12, lower side groove, 121, lower connecting groove, 2, supporting plate, 21, supporting groove, 22, upper side groove, 221, upper connecting groove, 3, supporting column, 4, supporting notch, 41, bead, 42, groove, 5, connecting block, 51, connecting plate.
Detailed Description
The technical scheme of the utility model is further specifically described by the following specific embodiments with reference to the accompanying drawings:
example 1: referring to fig. 1 to 3, a semiconductor heater dimension detection support jig includes: the base plate 1 and the support plate 2 are provided with support columns 3 between the base plate 1 and the support plate 2; the base plate 1, the support column 3 and the support plate 2 are all provided with support notches 4 penetrating through the support column 3 along the axial direction of the support column 3, and the support notches 4 are formed in the radial direction of the support column 3.
A plurality of supporting blocks 11 are uniformly arranged in the circumferential direction of the end face of the bottom of the base plate 1, three supporting blocks 11 are arranged in the embodiment, the three supporting blocks 11 are arranged at the edge of the bottom of the base plate 1, and a second chamfering structure is arranged at the edge of the supporting blocks 11; the circumferential direction of the terminal surface at the top of supporting disk 2 is provided with a plurality of supporting groove 21 that cooperate with supporting shoe 11, and the edge of supporting groove 21 is provided with first chamfer structure. Through the cooperation of first chamfer structure and second chamfer structure for supporting shoe 11 and supporting groove 21 can the cooperation of easier, and the high degree of depth that is less than supporting groove 21 of supporting shoe 11.
In addition, the edge of the bottom end of the supporting notch 4 is provided with a rib 41, and the edge of the top end of the supporting notch 4 is provided with a groove 42 matched with the rib 41. The rib 41 and the groove 42 are matched, so that when two adjacent semiconductor heaters are stacked by using the support jig, the two adjacent semiconductor heaters can be more conveniently stacked.
In the embodiment, when in use, the number of the supporting jigs used for detecting the size of the semiconductor heater is determined according to the overall height of the ceramic supporting pipe and the ceramic heating disc; specifically, when the overall height of the ceramic support tube and the ceramic heating plate is smaller than the height of a semiconductor heater for size detection using the support jig, the ceramic heating plate is stably placed on the upper end face of the support plate 2, so that the ceramic support tube is located in the support notch 4, the surface of the ceramic heater is inspected, and after the inspection is completed, the ceramic heating plate is taken down by stretching into the support groove 21 by hand. When the overall height of the ceramic support tube and the ceramic heating plate is larger than the height of a semiconductor heater size detection support jig, two or more semiconductor heater size detection support jigs can be stacked, when two adjacent semiconductor heater size detection support jigs are stacked, the support block 11 on one of the support blocks is just matched with the support groove 21 of the other support block, so that the two semiconductor heater size detection support jigs can be stacked together very stably, and then the ceramic heating plate is placed on the stacked semiconductor heater size detection support jigs for detection.
According to the utility model, the support notch 4 is arranged, so that the whole ceramic heating plate can be stably placed on the upper end surface of the support plate 2, a ceramic heater does not need to be placed on the support plate 2 from the top, and the use is more convenient; in addition, be provided with supporting groove 21 on the terminal surface at the top of supporting disk 2, supporting groove 21 not only can be when polylith semiconductor heater size detects and uses the supporting jig to pile up with supporting shoe 11 for semiconductor heater size after the pile detects and uses supporting jig stable in structure, simultaneously, when taking and put down ceramic heating disk, can put the hand on supporting groove 21, also make the convenience more of taking and putting down ceramic heating disk.
Example 2: referring to fig. 4 to 6, the present embodiment is similar to embodiment 1 in structure, except that in order to make the structure of the support jig for detecting the size of the semiconductor heater after stacking more stable, a connection block 5 is provided, the section of the connection block 5 is in a shape of ", a plurality of lower side grooves 12 are uniformly provided in the circumferential direction of the end face of the bottom of the base tray 1, four lower side grooves 12 are provided in the present embodiment, and lower connection grooves 121 are provided in the lower side grooves 12; an upper side groove 22 matched with the lower side groove 12 is arranged at the edge of the circumferential direction of the end surface of the top of the supporting disc 2, and an upper connecting groove 221 is arranged in the upper side groove 22; when two support jigs are stacked, the connecting block 5 is inserted into the upper connecting groove 221 and the lower connecting groove 121 which are connected, and the connecting block 5 can play a role in connecting and limiting the adjacent semiconductor heater size detection support jigs, so that the adjacent two semiconductor heater size detection support jigs can be more stable when stacked.
In addition, in order to facilitate the installation of the connection plate, a connection plate 51 is provided on the outer end face of the connection plate. By taking the connection plate 51, the connection block 5 can be conveniently installed and removed.
The above-described embodiments are merely preferred embodiments of the present utility model, and the present utility model is not limited in any way, and other variations and modifications may be made without departing from the technical aspects set forth in the claims.
Claims (7)
1. A semiconductor heater size detects uses support tool, characterized by includes: the base plate and the supporting plate are provided with supporting columns between; the base plate, the support column and the support plate are all provided with support notches penetrating through the support column in the axial direction, and the support notches are arranged in the radial direction of the support column.
2. The supporting jig for semiconductor heater dimension inspection according to claim 1, wherein a plurality of supporting blocks are uniformly provided in a circumferential direction of an end face of a bottom portion of the base plate, the plurality of supporting blocks being provided at an edge of the bottom portion of the base plate; a plurality of supporting grooves matched with the supporting blocks are formed in the circumferential direction of the end face of the top of the supporting disc.
3. The semiconductor heater dimension inspection using support jig according to claim 2, wherein the height of the support block is smaller than the depth of the support groove.
4. A semiconductor heater dimension inspection use support jig according to claim 2 or 3, wherein the edge of the support groove is provided with a first chamfer structure, and the edge of the support block is provided with a second chamfer structure.
5. The semiconductor heater dimension inspection using support jig according to claim 2 or 3, wherein,
the edge of the bottom of the supporting notch is provided with a convex rib, and the edge of the top of the supporting notch is provided with a groove matched with the convex rib.
6. The supporting jig for detecting the size of a semiconductor heater according to claim 1 or 2, further comprising a connecting block, wherein the cross section of the connecting block is -shaped, a plurality of lower side grooves are uniformly formed in the circumferential direction of the end face of the bottom of the base plate, and lower connecting grooves are formed in the lower side grooves; an upper edge groove matched with the lower edge groove is formed in the edge of the circumferential direction of the end face of the top of the supporting disc, and an upper connecting groove is formed in the upper edge groove; when two support jigs are stacked, the connecting block is inserted into the upper connecting groove and the lower connecting groove.
7. The semiconductor heater dimension inspection supporting jig according to claim 6, wherein the end face of the connection plate is provided with a connection plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322302980.8U CN220783622U (en) | 2023-08-25 | 2023-08-25 | Semiconductor heater size detects uses support tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322302980.8U CN220783622U (en) | 2023-08-25 | 2023-08-25 | Semiconductor heater size detects uses support tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220783622U true CN220783622U (en) | 2024-04-16 |
Family
ID=90665004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322302980.8U Active CN220783622U (en) | 2023-08-25 | 2023-08-25 | Semiconductor heater size detects uses support tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220783622U (en) |
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2023
- 2023-08-25 CN CN202322302980.8U patent/CN220783622U/en active Active
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