CN220773505U - Mini host extensible interface mainboard - Google Patents

Abstract

The utility model is suitable for the technical field of mini hosts, and provides a mini host extensible interface mainboard which comprises a case, a mainboard and radiating holes, wherein an installation seat is arranged in the case, the top end of the installation seat is provided with the mainboard, the bottom end of the mainboard is provided with a radiating structure, two sides of the mainboard are provided with dustproof structures, the two sides of the case are provided with radiating holes, the radiating structure comprises radiating fins, a heat conducting plate and fixing rods, the heat conducting plate is arranged at the bottom end of the mainboard, the bottom end of the heat conducting plate is provided with the radiating fins, the two sides of the bottom end of the heat conducting plate are provided with the fixing rods, and the radiating fins are arranged at equal intervals at the bottom end of the heat conducting plate.

Description

Mini host extensible interface mainboard

Technical Field

The utility model belongs to the technical field of mini hosts, and particularly relates to a mini-host extensible interface mainboard.

Background

The mini computer host has small volume, can save space, has low power consumption, saves cost and is environment-friendly, and can realize single machine and multiple users. Once deployed, no application program, software or driver needs to be managed on the device, and the main part of the mini-host is the internal main board, however, the traditional mini-host main board has some problems in use;

traditional mini host computer mainboard, because whole volume diminishes when using, this just can be to some curtails of some original additional structures of mainboard when processing, guarantee at the mainboard in the in-process of normal use, can reduce the volume again, however traditional mini host computer mainboard is long-time in-process of using, and the heat that its produced can not be quick give off, leads to the mainboard temperature to rise to influence normal use, consequently just needs to use a mini host computer extensible interface mainboard to solve foretell problem.

Disclosure of Invention

The utility model provides a mini-host extensible interface main board, which aims to solve the problem that the normal use is affected by the increase of the temperature of the main board because the heat generated by the traditional mini-host main board can not be rapidly emitted in the long-time use process.

The utility model discloses a mini-host extensible interface main board, which comprises a case, a main board and radiating holes, wherein an installation seat is arranged in the case, the top end of the installation seat is provided with the main board, the bottom end of the main board is provided with a radiating structure, two sides of the main board are provided with dustproof structures, two sides of the case are provided with the radiating holes, the radiating structure comprises radiating fins, a heat conducting plate and fixing rods, and the heat conducting plate is arranged at the bottom end of the main board.

Preferably, the bottom end of the heat conducting plate is provided with a radiating fin, and both sides of the bottom end of the heat conducting plate are provided with fixing rods;

preferably, the heat dissipation plate is provided with a plurality of heat dissipation plates, and the plurality of heat dissipation plates are arranged at equal intervals at the bottom end of the heat conduction plate.

Preferably, the fixing rods are arranged in two groups, and the two groups of fixing rods are symmetrically distributed on two sides of the bottom end of the heat conducting plate.

Preferably, the dustproof structure comprises a dustproof net, a mounting groove and a mounting rod, wherein the mounting groove is formed in the two sides of the main board, the dustproof net is arranged on the two sides of the main board, and the mounting rod penetrates through the dustproof net and is inserted into the mounting groove.

Preferably, the inner side of the mounting groove is provided with an internal thread, the outer side of the mounting rod is provided with an external thread, and the mounting groove is in threaded connection with the mounting rod.

Preferably, the dustproof net is provided with two groups, and the two groups of dustproof nets are symmetrically distributed on two sides of the main board.

Compared with the prior art, the embodiment of the application has the following main beneficial effects:

the heat generated by the main board can be conducted out through the use of the heat conducting plate, and then the heat radiating area of the heat conducting plate is increased through the use of the heat radiating fins, so that the heat radiating of the main board is faster, and the heat radiating efficiency is improved;

through being provided with dustproof construction, in order to prevent that the dust in the air can fall to the mainboard when the louvre is dispelled the heat and cause the influence to the mainboard, consequently can carry out a filtration to the dust in the air through the use of dust screen, make its during operation, the dust in the air is difficult for falling on the surface of mainboard to dustproof effect has been improved.

Drawings

FIG. 1 is a schematic top view of the cross-sectional structure of the present utility model;

FIG. 2 is a schematic side sectional view of the present utility model;

FIG. 3 is a schematic view of a partially enlarged structure of FIG. 1A according to the present utility model;

FIG. 4 is a schematic front perspective view of a dust-proof structure of the present utility model;

fig. 5 is a schematic diagram of a side view partially in cross section of a heat dissipating structure according to the present utility model.

In the figure: 1. a chassis; 2. a dust-proof structure; 201. a dust screen; 202. a mounting groove; 203. a mounting rod; 3. a main board; 4. a heat radiation hole; 5. a mounting base; 6. a heat dissipation structure; 601. a heat sink; 602. a heat conductive plate; 603. and a fixing rod.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The embodiment of the utility model provides a mini-host extensible interface main board, which comprises a case 1, a main board 3 and radiating holes 4, wherein an installation seat 5 is arranged in the case 1, the top end of the installation seat 5 is provided with the main board 3, the section of the main board 3 is provided with a radiating structure 6, two sides of the main board 3 are provided with dustproof structures 2, and two sides of the case 1 are provided with the radiating holes 4;

specifically, in the present embodiment: when using mainboard 3, heat radiation structure 6 uses just can accelerate the radiating speed of mainboard 3, makes mainboard 3 more quick when the heat dissipation to through the use of dustproof construction 2, can carry out a filtration to the inside air of entering into quick-witted case 1, prevent that the dust from falling to the surface of mainboard 3, thereby accomplish dustproof work.

In a further preferred embodiment of the present utility model, as shown in FIGS. 1-5: the heat radiation structure 6 includes fin 601, heat conduction board 602 and dead lever 603, and heat conduction board 602 sets up in the bottom of mainboard 3, and the bottom of heat conduction board 602 is provided with fin 601, and the both sides of heat conduction board 602 bottom are provided with dead lever 603, and fin 601 is provided with two sets of, and two sets of fins 601 are equidistant the range in the bottom of heat conduction board 602, and dead lever 603 is provided with two sets of, and two sets of dead levers 603 are symmetric distribution in the both sides of heat conduction board 602 bottom.

Specifically, when the main board 3 is used, the main board 3 is mounted at the top end of the inner mounting seat 5 of the chassis 1, after the mounting is completed, when the main board 3 works, heat is conducted to the heat conducting plate 602, then the heat conducting plate 602 conducts heat to the heat radiating fins 601, the heat radiating area of the heat conducting plate 602 can be increased through the use of the plurality of groups of heat radiating fins 601, and the heat radiating operation of the main board 3 is completed more quickly.

In a further preferred embodiment of the present utility model, as shown in FIGS. 1-5: dustproof construction 2 includes dust screen 201, mounting groove 202 and installation pole 203, and the inside in mainboard 3 both sides is seted up to the mounting groove 202, and dust screen 201 sets up in the both sides of mainboard 3, and installation pole 203 runs through dust screen 201 and inserts the inside of establishing into mounting groove 202, and the outside of mounting groove 202 is provided with the external screw thread, and the outside of installation pole 203 is provided with the external screw thread, constitutes threaded connection between mounting groove 202 and the installation pole 203, and dust screen 201 is provided with two sets of, and two sets of dust screens 201 are symmetric distribution in the both sides of mainboard 3.

Specifically, when the main board 3 is before working, the dust screen 201 is installed on two sides of the main board 3 through the matching use of the installation groove 202 and the installation rod 203, and when the main board 3 is working, the dust screen 201 can filter the air entering the chassis 1 through the heat dissipation holes 4, so that dust in the air is reduced, the dust is not easy to fall on the surface of the main board 3, the using effect of the main board 3 is affected, and the dust-proof work is completed.

It should be noted that, for simplicity of description, the foregoing embodiments are all illustrated as a series of acts, but it should be understood by those skilled in the art that the present utility model is not limited by the order of acts, as some steps may be performed in other order or concurrently in accordance with the present utility model. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present utility model.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, and such partitioning of the above-described elements may be implemented in other manners, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or communication connection shown or discussed as being between each other may be an indirect coupling or communication connection between devices or elements via some interfaces, which may be in the form of telecommunications or otherwise.

The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model. It will be apparent that the described embodiments are merely some, but not all, embodiments of the utility model. Based on these embodiments, all other embodiments that may be obtained by one of ordinary skill in the art without inventive effort are within the scope of the utility model. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art may still combine, add or delete features of the embodiments of the present utility model or make other adjustments according to circumstances without any conflict, so as to obtain different technical solutions without substantially departing from the spirit of the present utility model, which also falls within the scope of the present utility model.

Claims (7)

1. A mini-host extensible interface mainboard is characterized in that: the cooling device comprises a case (1), a main board (3) and a heat dissipation hole (4), wherein an installation seat (5) is arranged in the case (1), and the main board (3) is arranged at the top end of the installation seat (5);

the bottom end of the main board (3) is provided with a heat radiation structure (6), and two sides of the main board (3) are provided with dustproof structures (2);

the two sides of the case (1) are provided with radiating holes (4), and the radiating structure (6) comprises radiating fins (601), a heat conducting plate (602) and a fixing rod (603);

the heat conducting plate (602) is arranged at the bottom end of the main board (3).

2. A mini-host extensible interface motherboard according to claim 1, characterized in that the bottom end of the heat-conducting plate (602) is provided with a heat sink (601);

and fixing rods (603) are arranged on two sides of the bottom end of the heat conducting plate (602).

3. The mini-host expandable interface motherboard of claim 1, wherein a plurality of heat sinks (601) are provided, and the plurality of heat sinks (601) are arranged at equal intervals at the bottom end of the heat conducting plate (602).

4. A mini-host expandable interface motherboard according to claim 3, wherein two groups of fixing rods (603) are provided, and the two groups of fixing rods (603) are symmetrically distributed on two sides of the bottom end of the heat conducting plate (602).

5. The mini-host extensible interface main board according to claim 1, wherein the dustproof structure (2) comprises a dustproof net (201), a mounting groove (202) and a mounting rod (203), the mounting groove (202) is formed in the inside of two sides of the main board (3), the dustproof net (201) is arranged on two sides of the main board (3), and the mounting rod (203) penetrates through the dustproof net (201) and is inserted into the inside of the mounting groove (202).

6. The mini-host expandable interface motherboard of claim 5, wherein the inner side of the mounting groove (202) is provided with an internal thread, the outer side of the mounting rod (203) is provided with an external thread, and the mounting groove (202) and the mounting rod (203) form a threaded connection.

7. The mini-host extensible interface motherboard of claim 5, wherein two groups of the dustproof nets (201) are arranged, and the two groups of the dustproof nets (201) are symmetrically distributed on two sides of the motherboard (3).