CN220767161U - Graphite plate jig - Google Patents
Graphite plate jig Download PDFInfo
- Publication number
- CN220767161U CN220767161U CN202322431021.6U CN202322431021U CN220767161U CN 220767161 U CN220767161 U CN 220767161U CN 202322431021 U CN202322431021 U CN 202322431021U CN 220767161 U CN220767161 U CN 220767161U
- Authority
- CN
- China
- Prior art keywords
- graphite
- dish
- base
- support frame
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 101
- 239000010439 graphite Substances 0.000 title claims abstract description 101
- 230000000670 limiting effect Effects 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 25
- 238000000034 method Methods 0.000 description 6
- 238000010574 gas phase reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The application relates to a graphite dish tool, is used in the semiconductor production equipment field, the on-line screen storage device comprises a base, be equipped with a plurality of support frames on the base, be equipped with the supporting shoe on the support frame, the graphite dish erects on the supporting shoe, the support frame is equipped with the lug with the buckle groove assorted of graphite dish on the face that the supporting shoe is located, the lug is pegged graft in the buckle inslot of graphite dish. The technical effect that this application had is: the graphite disc is erected on the jig and then enters the high-temperature furnace to start baking and cleaning work, the surface of the graphite disc for placing the wafer is not attached to the jig, the possibility that the subsequent epitaxial growth of the wafer is polluted is reduced, and the quality of the epitaxial growth of the wafer is improved.
Description
Technical Field
The application relates to the technical field of semiconductor production equipment, in particular to a graphite disc jig.
Background
The graphite disc consists of a thin edge and a thick bottom support, the front surface of the graphite disc is provided with a plurality of round wafer grooves for carrying wafers to carry out gas phase reaction, the back surface of the graphite disc is provided with a buckling groove, the surface of the graphite disc is coated with a silicon carbide coating and simultaneously is also adhered with organic compounds of III group elements and II group elements and hydrides of V group elements and VI group elements, and the graphite disc adhered with the metal compounds can pollute the wafers in the grooves to cause the scrapping of the wafers when carrying out gas phase reaction, so that the graphite disc is required to be placed in a high-temperature furnace by a jig, and the metal compounds adhered on the surface of the graphite disc are removed by baking the aid of clean gas mixed with H2/N2 under the condition of high vacuum temperature, so that the surface of the graphite disc is clean.
The traditional graphite jig is provided with four balance beam clamping grooves, the clamping grooves are attached to the graphite jig, each graphite jig corresponds to four balance beam clamping grooves, the attached positions of the four balance beam clamping grooves cannot be baked cleanly, and four blackening points can occur.
The laminating position that current graphite dish tool corresponds at four constant beam clamping grooves of in-process graphite dish and tool is difficult to toast clean in place to lead to attached organometallic compound to volatilize wantonly, diffuse to the wafer surface pollution wafer, and the in-process that operating personnel took the graphite dish damages the thin limit of graphite dish easily. In the epitaxial growth process, the surface of the graphite disc is not thoroughly baked and cleaned, and the wafer is not completely grown and is polluted and destroyed, so that the crystal lattice cannot continue to be subjected to tired crystal growth and is even scrapped, and the quality of the epitaxial growth of the wafer during gas phase reaction is affected.
Disclosure of Invention
In order to help solving the problem that graphite dish laminating position is difficult to thoroughly toast clean, the application provides a graphite dish tool adopts following technical scheme: the support frame is provided with a plurality of supporting frames, supporting blocks are arranged on the supporting frames, the graphite plates are erected on the supporting blocks, the supporting frames are provided with protruding blocks matched with the buckling grooves of the graphite plates on the surfaces where the supporting blocks are located, and the protruding blocks are inserted into the buckling grooves of the graphite plates.
Through above-mentioned technical scheme, when the graphite dish needs to get into high Wen Lushi, operating personnel places the graphite dish on the supporting shoe, peg graft the lug in the buckle inslot at the graphite dish back, the lug plays auxiliary stay's effect to the graphite dish, the possibility that the graphite dish erect and rock on the support frame has been reduced, the stability of graphite dish tool has been improved, the graphite dish erects and gets into the high temperature furnace after on the tool and begins to toast clean work, the surface that the wafer was placed to the graphite dish is not laminated with the tool, the possibility that the follow-up epitaxial growth of wafer was polluted has been reduced, the quality of wafer epitaxial growth has been improved.
In a specific embodiment, the support blocks rest against the thick shoe of the graphite disk.
Through above-mentioned technical scheme, the supporting shoe only contacts the thick collet of graphite dish and provides holding power to the graphite dish, plays the bearing effect, does not contact the thin edge of graphite dish and the circular recess on surface, and the in-process that operating personnel took the graphite dish is difficult for damaging the thin edge of graphite dish, can also make the circular recess of placing the wafer thoroughly toast clean.
In a specific implementation mode, a plurality of placing grooves matched with the supporting frame are formed in the base, bolt holes communicated with the placing grooves are formed in the base, fixing bolts penetrate through the bolt holes, rotating holes matched with the fixing bolts are formed in the supporting frame, the fixing bolts penetrate through the rotating holes, bolt grooves are formed in the placing grooves corresponding to the groove walls of the bolt holes, and the fixing bolts are connected in the bolt grooves in a threaded mode.
Through the technical scheme, the support frame can rotate along the fixing bolt, so that the support frame can move, an operator can adjust the angle of the support frame according to the actual use condition, and the operator can conveniently take and put the graphite disc. Utilize fixing bolt threaded connection on the base, operating personnel can labour saving and time saving must dismantle fixing bolt down from the base, and the operating personnel of being convenient for dismantle and change fixing bolt.
In a specific implementation manner, a limiting block is arranged on the surface, away from the supporting block, of the supporting frame, and the limiting block abuts against the base.
Through above-mentioned technical scheme, utilize the stopper to realize fixed to backup pad pivoted angle, play spacing effect to the support frame, strengthened the stability when the graphite dish was placed to the support frame.
In summary, the present application has the following beneficial technical effects: when the graphite disc needs to enter the high Wen Lushi, an operator places the graphite disc on the supporting block, plugs the protruding blocks in the buckling grooves in the back of the graphite disc, the protruding blocks play a role in supporting the graphite disc in an auxiliary mode, the possibility that the graphite disc is erected on the supporting frame and shakes is reduced, the stability of a graphite disc jig is improved, the graphite disc is erected on the jig and then enters the high-temperature furnace to start baking and cleaning work, the surface of the graphite disc for placing a wafer is not attached to the jig, the possibility that the wafer is polluted in subsequent epitaxial growth is reduced, and the quality of the wafer epitaxial growth is improved.
Drawings
Fig. 1 is a schematic structural view of a prior art graphite disk.
Fig. 2 is a schematic overall structure of an embodiment of the present application.
Reference numerals: 1. a base; 2. a placement groove; 3. a limiting block; 4. a support frame; 5. a bump; 6. a graphite plate; 7. a support block; 8. a fixing bolt; 61. a thick bottom support; 62. a thin edge; 63. wafer grooves.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-2.
The embodiment of the application discloses a graphite disc jig.
Referring to fig. 1, a graphite disk 6 is a necessary consumable for crystal epitaxial growth, the graphite disk 6 is composed of a front thin edge 62 and a back thick bottom support 61, a fastening groove is formed in the back of the graphite disk 6, and a plurality of circular wafer grooves 63 for carrying wafers to perform gas phase reaction are formed in the front of the graphite disk 6.
Referring to fig. 2, the graphite disc jig comprises a base 1, a plurality of arc-shaped supporting frames 4 are uniformly arranged on the base 1, supporting blocks 7 are fixedly connected to the supporting frames 4, and the supporting blocks 7 are abutted against thick bottom supports 61 of the graphite disc 6. The arc-shaped supporting frame 4 can reduce the contact area with the graphite disc 6 while providing supporting force for the graphite disc 6, and the possibility that the joint is not thoroughly baked is reduced. The supporting shoe 7 only contacts the thick collet 61 of graphite dish 6 and provides holding power to graphite dish 6, plays the bearing effect, does not contact the circular recess on thin limit 62 and surface of graphite dish 6, and the in-process that operating personnel took graphite dish 6 is difficult for damaging thin limit 62 of graphite dish 6, can also make the circular recess of placing the wafer thoroughly toast clean. The support frame 4 is fixedly connected with a lug 5 matched with the buckling groove of the graphite disc 6 on the surface where the support block 7 is located, and the lug 5 is inserted into the buckling groove of the graphite disc 6.
Therefore, when the graphite disc 6 uses the jig to enter the height Wen Lushi, operators place the thick bottom support 61 of the graphite disc 6 on the supporting block 7 of the supporting frame 4, the convex blocks 5 are inserted into the buckling grooves on the back of the graphite disc 6, the convex blocks 5 play an auxiliary supporting role on the graphite disc 6, the possibility that the graphite disc 6 is erected on the supporting frame 4 to shake is reduced, the stability of the jig of the graphite disc 6 is improved, the graphite disc 6 enters the high-temperature furnace to start baking and cleaning work after being erected on the jig, the surface of the graphite disc 6 on which the wafer is placed is not attached to the jig, the possibility that the wafer is polluted in subsequent epitaxial growth is reduced, and the quality of the epitaxial growth of the wafer is improved.
Referring to fig. 2, a plurality of holding grooves 2 corresponding to the positions of the supporting frames 4 are formed in the base 1, bolt holes communicated with the holding grooves 2 are formed in the base 1, fixing bolts 8 penetrate through the bolt holes, rotating holes matched with the fixing bolts 8 are formed in the supporting frames 4, the fixing bolts 8 penetrate through the rotating holes, the supporting frames 4 can rotate around the fixing bolts 8, bolt grooves are formed in the holding grooves 2 corresponding to the groove walls of the bolt holes, and the fixing bolts 8 are connected in the bolt grooves in a threaded mode. Therefore, the support frame 4 can rotate along the fixing bolt 8, so that the support frame 4 can move, an operator can adjust the angle of the support frame 4 according to the actual use condition, and the operator can conveniently take and place the graphite disc 6. Utilize fixing bolt 8 threaded connection on base 1, operating personnel can labour saving and time saving must dismantle fixing bolt 8 from base 1, and the operating personnel of being convenient for dismantle and change fixing bolt 8.
Referring to fig. 2, a limiting block 3 is fixedly connected to a surface, away from the supporting block 7, of the supporting frame 4, the limiting block 3 abuts against the base 1, and at the moment, the supporting frame 4 and the base 1 form an included angle of 75 degrees. Therefore, the support plate is fixed by utilizing the angle of the limiting block 3 to rotate, the limiting effect on the support frame 4 is achieved, and the stability of the support frame 4 when the graphite disc 6 is placed is enhanced.
The implementation principle of the embodiment of the application is as follows: when the graphite disc 6 needs to enter a high-temperature furnace for baking and cleaning, an operator places a thick bottom support 61 of the graphite disc 6 on a supporting block 7 of a supporting frame 4, inserts a convex block 5 into a buckling groove on the back of the graphite disc 6, and puts the graphite disc into the high-temperature furnace for baking and cleaning; when the graphite disc 6 is baked and cleaned and needs to be taken out, an operator can rotate the support frame 4 to adjust the angle of the support frame 4, so that the graphite disc 6 is conveniently taken and placed, and the possibility that the jig is knocked to in the taking process of the thin edge 62 of the graphite disc 6 to damage the graphite disc 6 is reduced. The graphite disc 6 is erected on the jig and then enters the high-temperature furnace to start baking and cleaning work, the surface of the graphite disc 6 on which the wafer is placed is not attached to the jig, the surface of the graphite disc 6 can be completely baked, the possibility that the subsequent epitaxial growth of the wafer is polluted is reduced, and the quality of the epitaxial growth of the wafer is improved.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.
Claims (4)
1. A graphite dish tool, its characterized in that: including base (1), be equipped with a plurality of support frames (4) on base (1), be equipped with supporting shoe (7) on support frame (4), graphite dish (6) erect on supporting shoe (7), support frame (4) are equipped with on the face that supporting shoe (7) are located with buckle groove assorted lug (5) of graphite dish (6), lug (5) are pegged graft in the buckle inslot of graphite dish (6).
2. The graphite disc jig of claim 1, wherein: the supporting block (7) is abutted against the thick bottom support (61) of the graphite disc (6).
3. The graphite disc jig of claim 1, wherein: the base (1) is provided with a plurality of holding grooves (2) matched with the support frame (4), the base (1) is provided with bolt holes communicated with the holding grooves (2), fixing bolts (8) are arranged in the bolt holes in a penetrating mode, the support frame (4) is provided with rotating holes matched with the fixing bolts (8), the fixing bolts (8) penetrate through the rotating holes, the holding grooves (2) are provided with bolt grooves relative to the groove walls of the bolt holes, and the fixing bolts (8) are connected in the bolt grooves in a threaded mode.
4. The graphite disc jig of claim 1, wherein: the limiting block (3) is arranged on the surface, deviating from the supporting block (7), of the supporting frame (4), and the limiting block (3) abuts against the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322431021.6U CN220767161U (en) | 2023-09-07 | 2023-09-07 | Graphite plate jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322431021.6U CN220767161U (en) | 2023-09-07 | 2023-09-07 | Graphite plate jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220767161U true CN220767161U (en) | 2024-04-12 |
Family
ID=90605406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322431021.6U Active CN220767161U (en) | 2023-09-07 | 2023-09-07 | Graphite plate jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220767161U (en) |
-
2023
- 2023-09-07 CN CN202322431021.6U patent/CN220767161U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |