CN220766507U - Electronic equipment - Google Patents

Abstract

An electronic device is disclosed. The electronic device includes a support structure, a microelectromechanical system die, the microelectromechanical system die incorporating a microstructure and a connection structure between the microelectromechanical system die and the support structure. The connection structure includes a spacer structure bonded to the support structure, and a membrane applied to a face of the spacer structure opposite the support structure. The spacer structure at least partially laterally defines a cavity and the membrane extends over the cavity at a distance from the support structure. The mems die is bonded to the membrane on the cavity. The present technology provides improved electronic devices that mitigate or at least reduce defects due to stress.

Description

Electronic equipment

Technical Field

The present disclosure relates to microelectromechanical devices and processes for fabricating microelectromechanical devices.

Background

It is well known that some microelectromechanical devices are particularly sensitive to stress, which may lead to deformations, even very small deformations. For example, different membrane sensors and transducers, such as pressure sensors and electroacoustic transducers, are affected by mechanical stresses transmitted by the packages in which they are housed. Stress may come from a variety of sources. Among the most common are thermal mechanical stresses due to exposure to strong temperature changes or to the presence of materials with different coefficients of thermal expansion, and stresses resulting from residual internal strain after fabrication. As mentioned above, such mechanical stresses result in temporary or permanent deformation of critical elements (e.g., membrane or piezoelectric transducer structures) affecting the sensor and may change performance. In some cases, errors due to package stress may be incompatible with the required resolution and accuracy.

To overcome the problems caused by the mechanical stresses transferred by the package, it has been proposed to insert a soft glue layer between the die containing the microelectromechanical structure of the device and the supporting structure of the die (typically a polymer substrate or a printed circuit board; or an additional die possibly mounted on a polymer substrate or a printed circuit board). In this way, a degree of decoupling is obtained.

However, the above situation may not be entirely satisfactory. In fact, a relatively thick layer of soft gel may be required to achieve the desired degree of decoupling. However, providing a soft gel layer of sufficient thickness can be difficult. In addition, soft gel layers exceeding a certain thickness do not provide a sufficiently hard support during the step of placing the microelectromechanical device and may make bonding difficult, thereby reducing the yield of the manufacturing process. Conversely, the reduced thickness may not achieve a suitable degree of mechanical decoupling and thus may not represent an acceptable solution.

Disclosure of Invention

In view of the above-described problems faced with the design of microelectromechanical devices, the present disclosure aims to provide a microelectromechanical device that allows overcoming, or at least alleviating, the described limitations.

At least one embodiment of the apparatus of the present disclosure may be summarized as including: a substrate comprising a first surface; a control die on the first surface of the substrate, the control die including a second surface facing away from the substrate; a suspension support structure suspended above the second surface of the control die, the suspension support structure including an outer frame and one or more openings surrounded by the outer frame; and a microelectromechanical system (MEMS) die coupled to the outer frame of the suspension support structure.

Embodiments of the present disclosure provide an electronic device, including: a support structure; a microelectromechanical system die comprising a microstructure; and a connection structure between the mems die and the support structure, the connection structure comprising: a spacing structure coupled to the support structure; and a membrane on a face of the spacer structure opposite the support structure, the membrane being spaced apart from the support structure by the spacer structure, and the membrane being coupled to the microelectromechanical system die, a cavity at least partially defined by the spacer structure.

In some embodiments, the film is a dry resist

In some embodiments, the MEMS die overlaps the cavity but not the spacer structures surrounding the cavity

In some embodiments, the membrane defines a mesa that overlaps the cavity, and the microelectromechanical system die is coupled to the mesa.

In some embodiments, the cavity is filled with a sealing gel.

In some embodiments, the platform is suspended by anchors.

In some embodiments, the anchors are defined by anchor portions of the spacer structure.

In some embodiments, the platform is centrally supported by the anchors.

In some embodiments, the platform includes a central anchor portion supported by the anchors, an outer frame, and arms protruding from the anchors and connecting the central anchor portion to the outer frame.

In some embodiments, the platform is laterally supported by anchors.

In some embodiments, the membrane includes an anchor portion supported by the anchor and at least one arm connecting the anchor portion to the platform.

In some embodiments, the platform is frame-shaped, and wherein an outer side of the platform is connected to the anchor portion of the membrane by at least one arm.

In some embodiments, the support structure includes a substrate and a control die coupled to the substrate and in electrical communication with the microstructure of the microelectromechanical system die; and the connection structure couples the microelectromechanical system die to the control die.

The embodiment of the disclosure also provides an electronic device, including: a substrate including a first surface; a control die on the first surface of the substrate, the control die including a second surface facing away from the substrate; a suspension support structure suspended above the second surface of the control die, the suspension support structure including an outer frame and one or more openings surrounded by the outer frame; and a microelectromechanical system die coupled to the outer frame of the suspension support structure.

In some embodiments, the electronic device further includes an anchor coupled to the suspension support structure and to the second surface of the control die.

In some embodiments, the suspension support structure further comprises: a central anchor portion within the outer frame, the central anchor portion being coupled to an anchor of the suspension support structure; a plurality of arms extending from the outer frame to a central anchor portion; and a plurality of openings defined by the plurality of arms and the outer frame.

In some embodiments, the electronic device further includes an anchor extending around the outer frame of the suspension support structure, the anchor coupled to the outer frame and coupled to the second surface of the control die.

The present technology provides improved electronic devices that mitigate or at least reduce defects due to stress.

Drawings

For a better understanding of the present disclosure, some embodiments thereof will now be described, purely by way of non-limiting example, with reference to the accompanying drawings, in which:

FIG. 1 is a top plan view of a microelectromechanical device according to an embodiment of the disclosure;

FIG. 2 is a cross-section of the microelectromechanical device of FIG. 1, taken along line II-II of FIG. 1;

FIG. 3 is a cross-section of the microelectromechanical device of FIG. 1, taken along line III-III of FIG. 1;

FIG. 4 is a cross-section of a microelectromechanical device according to various embodiments of the present disclosure;

FIG. 5 is a top plan view of a microelectromechanical device according to another embodiment of the disclosure;

FIG. 6 is a cross-section of the microelectromechanical device of FIG. 5, taken along line VI-VI of FIG. 5;

FIG. 7 is a cross-section of a microelectromechanical device according to another embodiment of the disclosure;

FIG. 8 is a cross-section of a microelectromechanical device according to various embodiments of the disclosure;

9-11 illustrate successive steps of a process for fabricating a microelectromechanical device according to embodiments of the disclosure; and

fig. 12 is a simplified block diagram of an electronic system incorporating a microelectromechanical device according to the present disclosure.

Detailed Description

Referring to fig. 1-3, a microelectromechanical device or MEMS (microelectromechanical system) is indicated as a whole by numeral 1 and comprises a package, of which only the substrate 3, the control die 5 and the microelectromechanical system die are shown, or for simplicity, the MEMS die 7 is shown as follows.

The substrate 3 has a supporting function and may be, for example, a polymer material layer or a Printed Circuit Board (PCB).

The control die 5 is bonded to the substrate 3 by means of an adhesive layer 8 and incorporates a dedicated control circuit or ASIC (application specific integrated circuit) 9, not shown in detail here. The control die 5, and in particular the dedicated control circuit 9, is functionally coupled to the MEMS die 7 to perform operations whereby the MEMS die 7 is designed (typically, converting sensed physical quantities into electrical signals and/or converting electrical signals into physical quantities). The connection between the dedicated control circuit 9 and the MEMS die 7 may be obtained by wire bonding and is not shown here for simplicity.

The MEMS die 7 incorporates a microelectromechanical structure 12, such as a membrane, and is used, for example, as a piezoelectric, piezoresistive, or capacitive pressure sensor. However, the present disclosure should not be construed as limited to these examples, but rather may generally be utilized when needed for any type of microelectromechanical device, including electroacoustic transducers (microphones and speakers) in particular.

The MEMS die 7 is bonded to a support structure, which in the embodiment of fig. 1-3 is defined by the substrate 3 and the control die 5. In particular, the MEMS die 7 is bonded to the face of the control die 5 opposite the substrate 3. In other embodiments, not shown, the MEMS die may be directly bonded to the substrate 3 or a different intermediate substrate, or the support structure may be defined by a unique control die 5.

To connect the MEMS die 7 to the support structure, the microelectromechanical device 1 comprises a connection structure 13. Further, the connection structure 13 includes a spacer structure 15 formed on the control die 5, and a film 16 applied to one face of the spacer structure 15 opposite to the control die 5. The membrane 16 may completely cover one face of the spacer structure.

The spacer structures 15 are formed, for example, by a resist layer deposited on the control die 5 and subsequently patterned. In the embodiment of fig. 1-3, spacer structure 15 includes a first portion that forms an outer frame 17 that laterally defines a cavity 18 and a second portion that defines an anchor 20 within cavity 18. The cavity 18 is further defined by the face of the control die 5 on which the spacer structures 15 are formed. In plan, the frame 17 and the anchors 20 may have a polygonal shape, such as square or rectangular. In some embodiments, the frame 17 may not be continuous. In these cases, the cavity 18 is only partially defined laterally and may be in communication with the outside. The cavity 18 has a larger size (width and length) with respect to the corresponding size of the MEMS die 7.

In the case where the frame 17 is discontinuous, the frame 17 may instead be a plurality of discrete portions that are discrete and separate from one another and extend around the anchor 20 such that the cavity 18 is defined in part by the plurality of discrete portions. Adjacent pairs of the plurality of discrete portions of the frame 17 may be separated from one another by respective ones of the plurality of openings or channels.

As shown in fig. 1, a portion of the membrane 16 is hidden to the right in fig. 1, so that the spacer structure 15 covered by the membrane 16 is easily visible in fig. 1.

In one embodiment, the film 16 is obtained from a dry resist sheet laminated on the spacer structure 15 and subsequently patterned. In particular, the membrane 16 forms a platform 21, which platform 21 is coupled to the anchor 20 and is kept at least partially suspended from the cavity 18 by the same anchor 20, at a distance from the control die 5. The outer portion 22 of the membrane 16 may be present on the frame 17 of the spacer structure 15.

In the embodiment of fig. 1-3, the platform 21 is centrally supported by the anchors 20. Specifically, the platform 21 includes a central anchor portion 21a supported by the anchors 20, an outer frame 21b, and arms 21c protruding from the anchors 20 and connecting the central anchor portion 21a to the outer frame 21b. In one embodiment, the outer frame 21b is quadrilateral and defines the outer shape of the platform 21. The anchor 20 is also quadrilateral in shape with a dimension not greater than 30% of the corresponding dimension of the platform 21. In practice, each side of the anchors 20 is no more than 30% of the corresponding side of the outer frame 21b of the platform 21. The width of the arm 21c is 5% to 15%, for example 10%, of the maximum dimension of the platform 21.

As shown in fig. 1, the anchors 20 extend laterally outward from the central anchor portion 21a and are larger than the central anchor portion 21a. The anchors 20, which are larger than the central anchor portion 21a, are shown by L-shaped features at each corner of the central anchor portion 21a.

The MEMS die 7 is bonded to the platform 21, more precisely to the outer frame 21b. Like the platform 21, the MEMS die 7 is also centrally supported and laterally protruding by a single anchor 20, remaining suspended from the cavity 18. Since the dimensions (width and length) of the cavity 18 are larger than the corresponding dimensions of the MEMS die 7, the MEMS die may be arranged such that it is not superimposed on the frame 17 of the spacer structure 15.

In the described embodiment, the mechanical connection between the MEMS die 7 and the support structure (in this case formed by the substrate 3 and the control die 5) is limited to the anchors 20. Due to the small size of the anchors 20 and the significantly smaller size relative to the MEMS die 7, deformations and stresses to which the support structure is subjected are not transferred to the MEMS die 7 or at least to a negligible extent to the MEMS die 7. Thus, the operation of the MEMS die 7 is not affected by deformations and stresses caused by external factors (e.g. thermo-mechanical sources), which is advantageous for precision.

The dimensions of the platform 21 may be conveniently chosen so that the placement of the MEMS die 7 may be performed accurately and without difficulty.

As shown in fig. 1 and 3, one or more openings 23 may be present in the platform 21. As shown in fig. 1, one or more openings 23 have a square or rectangular shape and are positioned around the central anchor portion 21a.

In one embodiment (fig. 4), the cavity 18 is filled with a sealing gel 25, such as a potting gel. The sealing gel 25 makes the cavity 18 impermeable and protects the dedicated control circuit 9 from moisture. The sealing gel may cover the platform 21. In this case, a thin gel layer may be interposed between the platform 21 and the MEMS die 7.

In accordance with an embodiment of the present disclosure, as shown in fig. 5 and 6, microelectromechanical device 100 includes a package, only substrate 103, control die 105, and MEMS chip 107 of which are shown for simplicity. The substrate 103 and the control die 5 are bonded to each other, for example by means of an adhesive layer 108, and form a support structure for the MEMS die 107, substantially as already described.

The MEMS die 107 comprises a microelectromechanical structure 112, here also a thin film, and is used for example as an electroacoustic transducer (microphone or loudspeaker).

The microelectromechanical device 100 comprises a connection structure 113 that connects the MEMS die 107 to a support structure, in particular to the control die 105. Further, connection structure 113 includes a spacer structure 115 formed on control die 105, and a film 116 applied to a face of spacer structure 115 opposite control die 105. The spacer structures 115 form a frame laterally defining a cavity 118 having a larger dimension (width and length) relative to the corresponding dimension of the MEMS die 107.

The film 116 is obtained from a dry resist sheet laminated on the spacer structure 115 and subsequently patterned. In particular, the membrane 116 forms a platform 121 that is bonded to an anchor 120, the anchor 120 being defined by a portion (e.g., one side) of the spacer structure 115. Platform 121 is laterally supported by anchors 120 and is held at least partially suspended from cavity 118 by the same anchors 120 at a distance from control die 105. More precisely, the membrane 116 comprises an anchor portion 116a supported by the anchor 120 and an arm 116b connecting the anchor portion 116a to the outside of the platform 121, the platform 121 being frame-shaped and having a central opening 109.

The MEMS die 107 is bonded to the platform 121 and is thus supported laterally above the cavity 118 relative to the anchor 120. In this case, support for the MEMS die 107 is provided only by the platform 121 and the arm 116b connecting the platform 121 to the anchor portion 116 of the membrane 116. In particular, the width and length of the arms 116b may be selected such that the same arms 116b have sufficient rigidity to support the MEMS die 107.

The central opening 109 present in the platform 121 is surrounded by the platform 121. The central opening 109 is indicated by the dashed lines shown in fig. 5 and 6, respectively. As shown in fig. 5, the central opening 109 has a square or rectangular shape. As shown in fig. 5, a portion of the film 116 is hidden such that a portion of the spacer structure 115 covered by the film 116 is readily visible in fig. 5.

In this case, the MEMS die 107 is completely insensitive to deformations of the support structure and the function is not affected by thermo-mechanical and residual stresses, which may be transferred in particular through the support structure. In fact, the platform 121 is connected to the anchor 120 only by the arm 116b and the MEMS die 107 does not overlap at any point on the spacer structure 115. Deformation of the support structure may at most slightly alter the relative positions of the platform 121 and MEMS die 107 with respect to the same support structure, but does not impart strain.

In the embodiment of fig. 5, the spacer structure 115 includes an outer frame 117 laterally defining a cavity 118. Cavity 118 is also defined by the face of control die 105 on which spacer structures 15 are formed. In plan, the frame 117 may have a polygonal shape, such as a square or rectangle. In some embodiments, the frame 117 may not be continuous. In these cases, the cavity 118 is only partially laterally defined and may be in communication with the outside. The cavity 118 has a larger size (width and length) relative to the corresponding size of the MEMS die 107.

In the case where the frame 117 is discontinuous, the frame 117 may instead be a plurality of discrete portions that are discrete and separate from one another and extend around the cavity 118 such that the cavity 118 is defined in part by the plurality of discrete portions. Adjacent pairs of the plurality of discrete portions of the frame 117 may be separated from one another by respective ones of the plurality of openings or channels.

An outer portion 122 of the membrane 116 may be present on the frame 117 of the spacer structure 115.

Also in this case, the cavity 118 may be filled with a sealing gel 125, as shown in the embodiment of fig. 7.

Referring to fig. 8, in one embodiment of the present disclosure, a microelectromechanical device 200 may include a package having a substrate 203, a control die 205, a MEMS die 207 (including a microelectromechanical structure 212), and a connection structure 213, the connection structure 213 bonding the MEMS die 207 to a support structure formed by the substrate 203 and the control die 205 connected to each other. The connection structure 213 includes a frame-shaped spacer structure 215 formed on the control die 205 and defining a cavity 218, and a film 216 applied to one face of the spacer structure 215 opposite the control die 205. In this case, the membrane 216 is continuous and encloses the cavity 218, the length and width of the cavity 218 being greater than the length and width of the MEMS die 207.

The MEMS die 207 is bonded to the membrane 216 over the cavity 218 and is thus suspended from overlapping the spacer structure 215.

Fig. 9-11 generally illustrate examples of methods for fabricating microelectromechanical devices in accordance with the present disclosure, and in particular microelectromechanical devices of fig. 1-3.

In the semiconductor wafer 300, the dedicated control circuitry 9 is initially provided, and then a spacer layer 301 of resist is deposited and patterned by a first photolithographic process to form the spacer structure 15 comprising the anchors 20.

A film 16 (fig. 10) of dry resist is laminated over the wafer 300 and adhered to the protruding spacer structures 15.

The membrane 16 is defined with a second photolithographic process to form a mesa 21 (fig. 11), and the MEMS die 7 provided separately from a different semiconductor wafer not shown is connected to the mesa 21. The wafer 300 is then diced and the resulting combined dicing sheets are bonded to respective substrates 3 to form the microelectromechanical device 1 of fig. 1-3.

Optionally, the cavity is filled with a sealing gel 25 prior to connecting the MEMS die 7 to obtain the structure of fig. 4.

The structures of fig. 5-6 and 7 may provide the same process simply by using a photolithographic mask having the desired pattern.

To provide the microelectromechanical device 200 of fig. 8, the mems die 207 is connected to the membrane 216 without performing a second photolithographic process.

FIG. 12 illustrates an electronic system 400 that may be of any type, particularly but not limited to a wearable device, such as a watch, bracelet, or "smart" band; computers, such as mainframes, personal computers, laptops or tablets; a smart phone; a digital music player, a digital camera, or any other device for processing, storing, transmitting, or receiving information. Electronic system 400 may be a general purpose or device embedded processing system, a device, or another system.

Electronic system 400 includes a processing unit 402, a memory device 403, a microelectromechanical device according to the present disclosure, such as microelectromechanical device (pressure sensor) 1 of fig. 1, and may also be provided with an input/output (I/O) device 405, such as a keyboard, pointer or touch screen, a wireless interface 406, peripheral devices 407.1, …, 407.N, and possibly other auxiliary devices, not shown here. The components of electronic system 400 may be communicatively coupled to each other directly and/or indirectly via a bus 408. Electronic system 400 may also include a battery 409. It should be noted that the scope of the present disclosure is not limited to embodiments that must have one or all of the listed devices.

Depending on design preferences, processing unit 402 may include, for example, one or more microprocessors, microcontrollers, or the like.

The memory device 403 may include various types of volatile memory devices and nonvolatile memory devices, such as SRAM and/or DRAM memory for volatile memory and solid state memory, magnetic disks and/or optical disks for nonvolatile memory.

Finally, it is clear that modifications and variations may be made to the micro-electromechanical device described without departing from the scope of the present disclosure as defined in the appended claims.

In particular, it should be understood that all of the described connection structures may be used with any type of microelectromechanical device, including thin film types and other types, depending on design preferences.

The support structure may be of any suitable type other than the type described. For example, the MEMS die may be directly bonded to a portion of the package without the interposition of a control die, and any suitable portion of the package may be used as a support structure. Instead, other components may be interposed between the MEMS die and the package or control die (e.g., another die).

Microelectromechanical may be generalized to include support structures (3, 5;103, 105;203, 205); a micro-electromechanical system die (7; 107; 207) incorporating microstructures (12; 112; 212); and a connection structure (13; 113; 213) between the MEMS die (7; 107; 207) and the support structure (3, 5;103, 105;203, 205); wherein the connecting structure (13; 113; 213) comprises a spacing structure (15; 115; 215) joined to the supporting structure (3, 5;103, 105;203, 205) and a membrane (16; 116; 216) applied to a face of the spacing structure (15; 115; 215) opposite to the supporting structure (3, 5;103, 105;203, 205); wherein the spacing structure (15; 115; 215) at least partially laterally defines a cavity (18; 118; 218) and the membrane (16; 116; 216) extends over the cavity (18; 118; 218) at a distance from the support structure (3, 5;103, 105;203, 205); and wherein the MEMS die (7; 107; 207) is connected to the membrane (16; 116; 216) over the cavity (18; 118; 218).

The film (16; 116; 216) may be a dry resist.

The MEMS die (7; 107; 207) may extend over the cavity (18; 118; 218) without overlapping the spacer structure (15; 115; 215) surrounding the cavity (18; 118; 218).

The membrane (16; 116) may define a land (21; 121) extending over the cavity (18; 118), and the micro-electromechanical system die (7; 107) may be bonded to the land (21; 121).

The cavity (18; 118) may be filled with a sealing gel (25; 125).

The platform (21; 121) may be held suspended by anchors (20; 120).

The anchor (20; 120) may be defined by an anchor portion (20; 120) of the spacer structure (15; 115).

The platform (21) may be centrally supported by an anchor (20).

The platform (21) may include a central anchor portion (21 a) supported by the anchors (20), an outer frame (21 b), and arms (21 c) may protrude from the anchors (20; 120) and connect the central anchor portion (21 a) to the outer frame (21 b).

The platform (121) may be laterally supported by anchors (120).

The membrane (116) may include an anchor portion (116 a) supported by an anchor (120), and at least one arm (116 b) may connect the anchor portion (116 a) to the platform (121).

The platform (121) may be frame-shaped and an outer side of the platform (121) may be connected to an anchor portion (116 a) of the membrane (116) by at least one arm (116 b).

The support structure (3, 5;103, 105;203, 205) may comprise a substrate (3; 103; 203) and a control die (5; 105; 205) bonded to the substrate and functionally coupled to the microstructure (12; 112; 212) of the microelectromechanical system die (7; 107; 207), and the connection structure (13; 113; 213) may bond the microelectromechanical system die (7; 107; 207) to the control die (5; 105; 205).

The electronic system may be summarized as including a processing unit (402) and a microelectromechanical device (1).

The microelectromechanical device (1) may be a thin-film device, in particular one of a pressure sensor and an electroacoustic transducer.

A process for fabricating a microelectromechanical device may be summarized as including depositing a spacer layer (301) of resist on a semiconductor wafer (300); forming a spacer structure (15) from the spacer layer (301) at least partially laterally defining a cavity (18); applying the film (16) to the semiconductor wafer (300) such that it adheres to the spacer structure (15); and bonding the mems die (7) incorporating the mems structure to the membrane (16) over the cavity (18).

The film (16) may be a dry resist and may be defined by a photolithographic process prior to connecting the mems die (7).

The various embodiments described above may be combined to provide further embodiments. Aspects of the embodiments can be modified, if necessary, to employ concepts of the various patents, applications and publications to provide yet further embodiments.

These and other changes can be made to the embodiments in light of the above detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the present disclosure.

Claims (13)

1. An electronic device, comprising:

a support structure;

a microelectromechanical system die comprising a microstructure; and

a connection structure between the microelectromechanical system die and the support structure, the connection structure comprising:

a spacing structure coupled to the support structure; and

a membrane on a face of the spacer structure opposite the support structure, the membrane being spaced apart from the support structure by the spacer structure, and the membrane being coupled to the microelectromechanical system die,

a cavity at least partially defined by the spacer structure.

2. The electronic device of claim 1, wherein the film is a dry resist.

3. The electronic device of claim 1, wherein the microelectromechanical system die overlaps the cavity and does not overlap the spacer structure around the cavity.

4. The electronic device of claim 1, wherein the membrane defines a platform that overlaps the cavity and the microelectromechanical system die is coupled to the platform.

5. The electronic device of claim 4, wherein the cavity is filled with a sealing gel.

6. The electronic device of claim 4, wherein the platform is suspended by an anchor.

7. The electronic device of claim 6, wherein the anchor is defined by an anchor portion of the spacer structure.

8. The electronic device of claim 6, wherein the platform is centrally supported by the anchor.

9. The electronic device of claim 6, wherein the platform includes a central anchor portion supported by the anchor, an outer frame, and an arm protruding from the anchor and connecting the central anchor portion to the outer frame.

10. The electronic device of claim 6, wherein the platform is laterally supported by the anchors.

11. The electronic device of claim 6, wherein the membrane comprises an anchor portion supported by the anchor and at least one arm connecting the anchor portion to the platform.

12. The electronic device of claim 11, wherein the platform is frame-shaped, and wherein an outer side of the platform is connected to the anchor portion of the membrane by the at least one arm.

13. The electronic device of claim 1, wherein:

the support structure includes a substrate and a control die coupled to the substrate and in electrical communication with the microstructure of the microelectromechanical system die; and is also provided with

The connection structure couples the microelectromechanical system die to the control die.