CN220741925U

CN220741925U - Glue injection mold

Info

Publication number: CN220741925U
Application number: CN202322249656.4U
Authority: CN
Inventors: 杨运清; 李兵; 陈松; 夏祖毅
Original assignee: Shenzhen Longli Technology Co Ltd
Current assignee: Shenzhen Longli Technology Co Ltd
Priority date: 2023-08-21
Filing date: 2023-08-21
Publication date: 2024-04-09
Anticipated expiration: 2033-08-21

Abstract

The utility model discloses a glue injection mould, which comprises: the lower die is provided with a lower die core; the upper die is provided with an upper die core, and a containing cavity for containing the screen component is formed between the upper die core and the lower die core; the upper die core is also provided with a glue injection groove, a glue injection hole and a glue overflow hole which are communicated with the glue injection groove, and the glue injection groove is communicated with the accommodating cavity; when the mold is closed, the upper mold core and the lower mold core are used for clamping the screen assembly, and the bending part of the screen assembly is sealed in the glue injection groove, so that glue is filled in the inner side and the outer side of the outer side wall of the bending part to form a glue sealing structure during glue injection. According to the utility model, the bending part of the screen assembly is sealed in the glue injection groove, so that glue can be injected at the same time to form a glue sealing structure on the inner side and the outer side of the outer side wall of the bending part when glue is injected, the use and the operation are simple, the glue injection procedure is optimized, and the production efficiency is improved; the utility model can precisely control the glue injection quantity and the glue flowing range so as to protect the complex and precise structure of the product, thereby improving the structural strength of the product and ensuring quality control.

Description

Glue injection mold

Technical Field

The utility model relates to the technical field of display screen production, in particular to a glue injection mold.

Background

With the continuous development of display screen technology, flexible screens are adopted for the screens of terminal equipment at present, and the terminal equipment such as mobile phones, tablet computers, notebook computers, intelligent wearing and the like. To increase the duty ratio of the display area, a COP (chip on plastic) screen packaging process has emerged. The COP screen package is applied to a flexible screen, as shown in fig. 5, and the principle of the COP screen package is to directly bend a portion of the screen to form a bending portion 41, and fill supports on both inner and outer sides of an outer side wall of the bending portion 41 (i.e., in a hollow space formed by bending and between the outer side wall of the bending portion 41 and a frame), where the supports are typically colloid, so as to increase the structural strength of the bending portion 41, and provide strength support for reducing the frame of the terminal device, thereby improving the screen occupation ratio.

In order to improve the structural strength of the bending part 41, one method is to glue in advance in the area to be bent, then bend the area to form the bending part 41, glue between the bending part 41 and the frame, and then solidify the glue, so as to improve the overall strength of the bending part 41; another method is to glue and solidify the inner and outer sides of the outer side wall of the bent part 41 after bending. However, the above solution is complicated in steps, needs to perform dispensing and curing on the inner side and the outer side of the outer side wall of the bending portion 41, and has long time consumption, low production efficiency, difficulty in controlling the dispensing amount and the flowing range of the colloid, and difficulty in ensuring quality control.

Disclosure of Invention

In order to overcome at least one of the above-mentioned drawbacks of the prior art, the present utility model provides a glue injection mold comprising: the lower die is provided with a lower die core; the upper die is provided with an upper die core, and a containing cavity for containing the screen component is formed between the upper die core and the lower die core; the upper die core is also provided with a glue injection groove, a glue injection hole and a glue overflow hole which are communicated with the glue injection groove, and the glue injection groove is communicated with the accommodating cavity; when the mold is closed, the upper mold core and the lower mold core are used for clamping the screen assembly, and the bending part of the screen assembly is sealed in the glue injection groove, so that glue is filled in the inner side and the outer side of the outer side wall of the bending part to form a glue sealing structure during glue injection.

According to the utility model, the bending part of the screen assembly is sealed in the glue injection groove, so that glue can be injected at the same time to form a glue sealing structure on the inner side and the outer side of the outer side wall of the bending part when glue is injected, the use and the operation are simple, the glue injection procedure is optimized, and the production efficiency is improved; the utility model can precisely control the glue injection quantity and the glue flowing range so as to protect the complex and precise structure of the product, thereby improving the structural strength of the product and ensuring quality control.

The utility model can form glue sealing structures on the inner side and the outer side of the outer side wall of the bending part, provides structural support for further reducing the distance between the bending part of the screen component and the terminal frame, and is beneficial to further improving the screen occupation ratio of terminal equipment, thereby increasing the competitiveness of the product.

In some embodiments, the glue injection groove is positioned at the edge of the accommodating cavity, so that the circumferential edge of the screen assembly is sealed and arranged in the glue injection groove.

In some embodiments, the gel is at least one of a UV gel or an epoxy gel.

In some embodiments, the lower mold core is made of copper.

In some embodiments, the upper and lower molds are provided with a plurality of first light holes.

In some embodiments, the mold further comprises a light transmissive insert disposed between the upper mold and the upper mold core.

In some embodiments, the upper mold core and the light-transmitting insert are both detachably disposed on the glue injection mold.

In some embodiments, the glue injection mold is provided with a sealing structure for sealing a glue disabled area in the screen assembly.

In some embodiments, the sealing structure is a dam groove arranged on the upper die core, the dam groove is communicated with the glue injection groove, and the groove depth of the dam groove extends along the direction away from the glue forbidden area; and a side wall of the dam groove, which is close to the glue forbidden area, is a pre-dispensing area, wherein the pre-dispensing area is used for dispensing glue before die assembly, and is solidified after die assembly to seal the glue forbidden area.

In some embodiments, the upper mold is provided with a second light hole corresponding to the dam groove.

In some embodiments, a locking structure is further included, by which the upper and lower molds are clamped or unclamped.

In some embodiments, the locking structure comprises: the locking frame comprises a connecting part and a locking part which are connected with each other, and the connecting part is rotatably arranged on the lower die; the locking piece is adjustably arranged on the locking part; when the glue injection mold is in a mold closing state, the locking part is positioned at one side of the upper mold, which is away from the lower mold.

In some embodiments, the locking member is threadably coupled to the lock bracket.

In some embodiments, the locking member is a ball screw.

In some embodiments, the device further comprises a pin for demolding, wherein the pin is detachably arranged in the glue injection hole and the glue overflow hole.

In some embodiments, the pins are made of a transparent material.

In summary, the glue injection mold provided by the utility model has the following technical effects:

(1) According to the utility model, the bending part of the screen assembly is sealed in the glue injection groove, so that glue can be injected at the same time to form a glue sealing structure on the inner side and the outer side of the outer side wall of the bending part when glue is injected, the use and the operation are simple, the glue injection procedure is optimized, and the production efficiency is improved; the utility model can precisely control the glue injection quantity and the glue flowing range so as to protect the complex and precise structure of the product, thereby improving the structural strength of the product and ensuring quality control.

(2) The utility model can form glue sealing structures on the inner side and the outer side of the outer side wall of the bending part, provides structural support for further reducing the distance between the bending part of the screen component and the terminal frame, and is beneficial to further improving the screen occupation ratio of terminal equipment, thereby increasing the competitiveness of the product.

(3) According to the utility model, glue is dispensed in the pre-dispensing area of the dam tank before die assembly, and after die assembly, the glue in the area is quickly solidified to play a sealing and seepage-proofing role on the glue forbidden area, so that the glue is limited to enter the screen display area through the glue forbidden area, thereby ensuring the purity and definition of the screen display area, improving the display quality and viewing experience, and being beneficial to maintaining the stability of the screen assembly structure. So set up, can protect the screen display district to maintain good display quality, avoid the colloid to cause negative effect to the screen.

(4) The utility model adopts the pin demolding of transparent materials, does not influence the colloid curing effect, does not cause severe impact and extrusion on the upper die core, can effectively protect the integrity of the upper die core, prolongs the service life of the upper die core, improves the resource utilization efficiency, has high demolding speed and improves the production efficiency.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a schematic diagram of the explosive structure of FIG. 1;

FIG. 3 is a bottom view of the screen assembly;

FIG. 4 is a schematic diagram of the structure of the screen assembly and the upper mold core;

fig. 5 is a schematic structural diagram of glue injection at a bending part.

Wherein the reference numerals have the following meanings:

1. injecting glue into the mold; 2. an upper die; 21. an upper die core; 211. a glue injection groove; 212. a glue injection hole; 213. a glue overflow hole; 3. a lower die; 32. a receiving chamber; 4. a screen assembly; 41. a bending part; 42. a screen display area; 43. a connection region; 44. a logic board; 45. the glue forbidden area; 51. a first light hole; 52. a second light hole; 6. a light-transmitting insert; 7. a locking structure; 71. a lock frame; 72. a locking member; 8. a lower die core; 91. a dam tank.

Detailed Description

For a better understanding and implementation, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model.

In the description of the present utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

Referring to fig. 2, 3, 4 and 5, an injection mold 1 includes: the lower die 3 is provided with a lower die core 8; the upper die 2 is provided with an upper die core 21, and a containing cavity 32 for containing the screen component 4 is formed between the upper die core 21 and the lower die core 8; the upper die core 21 is also provided with a glue injection groove 211, a glue injection hole 212 and a glue overflow hole 213 which are communicated with the glue injection groove 211, and the glue injection groove 211 is communicated with the accommodating cavity 32; when the mold is closed, the upper mold core 21 and the lower mold core 8 are used for clamping the screen assembly 4, and the bending part 41 of the screen assembly 4 is sealed in the glue injection groove 211, so that glue is filled in the inner side and the outer side of the outer side wall of the bending part 41 to form a glue sealing structure during glue injection.

It should be noted that the glue injection mold 1 provided by the present utility model is used for injecting glue into the screen assembly 4.

Specifically, the screen assembly 4 includes a screen display area 42, a connection area 43, and a logic board 44, wherein the connection area 43 is bent to form a bent portion 41 with a hollow space, and one end of the connection area 43 is connected to the screen display area 42, and the other end is connected to the logic board 44, so that the logic board 44 is at least partially projected on the screen display area 42.

When the screen assembly 4 is assembled between the upper die core 21 and the lower die 3 in use, glue is injected into the glue injection groove 211 through the glue injection holes 212, and flows to the inner side and the outer side of the outer side wall of the bending part 41 along the glue injection groove 211 so as to fully and completely fill the area with the glue, thereby forming a glue sealing structure for reinforcing the bending part 41, ensuring the structural stability of the screen assembly 4 after bending, and providing strength support for reducing the distance between the bending part 41 of the screen assembly 4 and the frame of the terminal.

According to the utility model, the bending part 41 of the screen assembly 4 is arranged in the glue injection groove 211 in a sealing way, so that glue can be injected at the same time to form a glue sealing structure by filling glue on the inner side and the outer side of the outer side wall of the bending part 41 during glue injection, the use and the operation are simple, the glue injection procedure is optimized, and the production efficiency is improved; the utility model can precisely control the glue injection quantity and the glue flowing range so as to protect the complex and precise structure of the product, thereby improving the structural strength of the product and ensuring quality control.

The utility model can form glue sealing structures on the inner side and the outer side of the outer side wall of the bending part 41, provides structural support for further reducing the distance between the bending part 41 of the screen assembly 4 and the terminal frame, and is beneficial to further improving the screen occupation ratio of terminal equipment, thereby increasing the competitiveness of the product.

Referring to fig. 1 and 2, the glue injection groove 211 is located at the edge of the accommodating cavity 32, so that the peripheral edge of the screen assembly 4 is sealed in the glue injection groove 211.

By the arrangement, the peripheral edge of the screen assembly 4 can be injected with glue while the inner side and the outer side of the outer side wall of the bending part 41 are filled, so that the structural strength of the screen assembly 4 is further enhanced, and the screen occupation ratio of terminal equipment is further improved.

The colloid is at least one of UV glue and epoxy resin glue.

It should be noted that, can cover and fill complicated, vulnerable product structure through injecting glue, play the guard action. In the present utility model, the glue injected into the glue injection groove 211 includes, but is not limited to, at least one of UV glue and epoxy resin glue.

In the actual production process, when the colloid is UV (ultraviolet) colloid, light source equipment is arranged on the periphery and the upper side of the glue injection mould 1, 365nm-500nm wavelength light is selected, and the irradiation time is 10S-200S, so that the glue injection curing process of the complex structure can be realized. When the colloid is epoxy resin colloid, the glue injection mould 1 after being clamped is placed in heating equipment for low-temperature heating, the temperature is preferably 65 degrees, and the curing time is 30-60 min.

The utility model protects the complex and precise structure of the product by injecting glue for solidification, has high solidification efficiency, low cost and simple use and operation, and can effectively improve the structural strength of the product, thereby increasing the competitiveness of the product.

Referring to fig. 2, the lower mold core 8 is made of copper.

In some embodiments, the glue injected into the glue injection cavity needs to be cured by heating, for example, the epoxy resin glue needs to be cured by heating at a low temperature, and the epoxy resin glue after curing at the low temperature has higher strength and compression resistance and can protect products more effectively. Therefore, the lower core 8 and the lower mold 3 are made of a material with good thermal conductivity, which includes but is not limited to at least one of copper, gold, aluminum, zinc, and teflon. Preferably, in the present embodiment, the lower mold core 8 and the lower mold 3 are made of copper, which is the most common metal for manufacturing the heat conduction device, and copper has a high melting point and moderate corrosion speed, and can effectively reduce energy loss in the heat transfer process. In addition, in the present embodiment, the upper mold 2 is made of steel, and the upper mold core 21 is made of silica gel.

Referring to fig. 1 and 2, the upper and lower molds 2 and 3 are provided with a plurality of first light-transmitting holes 51.

In other embodiments, the glue injected into the glue injection cavity requires photo-curing, e.g., UV glue requires photo-curing. In the process, a light source is arranged outside the glue injection mold 1, and a plurality of first light holes 51 are formed in the upper mold 2 and the lower mold 3 in a penetrating manner so that light beams enter the inside of the glue injection mold 1, and the glue in the glue injection cavity is irradiated and cured.

In this embodiment, light sources are disposed at the top and circumferential direction of the glue injection mold 1, and a plurality of first light holes 51 are disposed at the circumferential direction of the upper mold 2, the lower mold 3, and the top of the upper mold 2. In other embodiments, the distribution of the first light holes 51 on the upper mold 2 and the upper mold 2 is different according to the light source arrangement.

Referring to fig. 2, the mold further includes a light-transmitting insert 6 disposed between the upper mold 2 and the upper mold core 21.

Preferably, in the present embodiment, the light-transmitting insert 6 is quartz, and the glue injection hole 212 penetrates through the quartz and the upper mold 2. The quartz has the advantages of high temperature resistance, corrosion resistance, good thermal stability, easy processing and high light transmittance, and has certain flatness and hardness during injection molding of the quartz and the silica gel, and can play a role in shaping, fixing and protecting the upper die core 21.

In other embodiments, the light transmissive insert 6 can be other materials that meet light transmission and hardness requirements, such as a PVC clear plastic sheet or the like.

Referring to fig. 2, the upper mold core 21 and the light-transmitting insert 6 are detachably disposed on the glue injection mold 1.

In the production process, the upper mold core 21 is subjected to low-temperature heating for many times, and the upper mold core 21 is subjected to contact demolding with epoxy resin/UV adhesive, so that the upper mold core 21 needs to be replaced with a new upper mold core 21 regularly in order to ensure the adhesive injection quality, and therefore, the upper mold core 21 and the light-transmitting insert 6 can be detachably arranged on the adhesive injection mold 1, and the replacement is convenient.

In actual production, when the glue dispensing colloid of the dam tank 91 adopts UV glue and the glue injection colloid of the glue injection tank 211 adopts epoxy resin glue, the glue injection using time of the upper die core 21 is 15-25 times; when the rubber of the dam tank 91 and the rubber injection tank 211 are made of epoxy resin, the number of times of rubber injection of the upper die core 21 is 15-20. It can be seen that the number of times the upper core 21 is used is determined by the specific process.

Referring to fig. 3 and 5, the glue injection mold 1 is provided with a sealing structure for sealing the glue inhibiting area 45 in the screen assembly 4.

Specifically, the screen assembly 4 includes a screen display area 42, a connection area 43, and a logic board 44, where the connection area 43 is bent to form a bending portion 41, and one end of the connection area 43 is connected to the screen display area 42, and the other end is connected to the logic board 44, so that the logic board 44 is at least partially projected on the screen display area 42. It will be appreciated that the shapes of the logic board 44 and the display area 42 are not completely consistent, so that there is a height difference between the logic board 44 and the display area 42, and a gap must be generated at the junction between the display area 42 and the logic board 44 after the upper mold core 21 is attached to the screen assembly 4 due to a certain hardness of the upper mold core 21, so that the junction is defined as the glue forbidden area 45.

In some embodiments, at least a portion of the glue-inhibiting region 45 is disposed in the glue injection groove 211, and a sealing structure is required to seal the glue-inhibiting region 45 to prevent glue from entering the screen display region 42 from the glue-inhibiting region 45, so as to damage or affect the display pixels and circuits of the screen, thereby affecting the quality and reliability of the product.

Referring to fig. 3, 4 and 5, the sealing structure is a dam groove 91 disposed on the upper mold core 21, the dam groove 91 is communicated with the glue injection groove 211, and the groove depth of the dam groove 91 extends along the direction away from the glue forbidden area 45; a side wall of the dam tank 91, which is close to the glue-forbidden area 45, is a pre-dispensing area, and the pre-dispensing area is used for dispensing glue before die assembly, and curing after die assembly to seal the glue-forbidden area 45.

During assembly, glue is dispensed in the pre-dispensing area of the dam tank 91 in advance, and then the pre-dispensing area is installed corresponding to the glue-forbidden area 45, at this time, glue in the pre-dispensing area flows to fill the glue-forbidden area 45, and the glue-forbidden area 45 is solidified by solidifying equipment so as to seal the glue-forbidden area 45. It should be noted that, the glue in the pre-dispensing area is selected to have a short curing time (e.g., UV glue, its light curing time: 10-200S), so that the glue in the pre-dispensing area is quickly cured, and the glue is prevented from flowing into the glue-forbidden area 45, which negatively affects the screen assembly. Then, when glue is injected into the glue injection groove 211 and the box dam groove 91 through the glue injection holes 212, the solidified glue in the pre-glue injection area can form a barrier for the unset flowing glue so as to prevent the glue from entering the screen display area 42 from the glue forbidden area 45.

The utility model is convenient for installing the box dam groove 91 and the glue forbidden area 45 in a aligned way by arranging the box dam groove 91; and glue the glue-pre-dispensing area of the dam tank 91 before the die assembly, make this area colloid solidify fast in order to play sealed prevention of seepage to the forbidden glue area 45 after the die assembly, in order to limit the colloid to enter the screen display area 42 through forbidden glue area 45, thus guarantee the purity and definition of the screen display area 42, improve the display quality and watch and experience, help maintaining the stability of the screen assembly 4 structure. Thus, the screen display area 42 can be protected to maintain good display quality, and the negative effect of the colloid on the screen is avoided.

Referring to fig. 1 and 4, the upper mold 2 is provided with a second light hole 52 corresponding to the dam groove 91.

It will be appreciated that the amount of glue at the dam slot 91 is relatively large, and in some embodiments, when the curing condition of the glue is light, in order to facilitate curing of the glue in this area, the upper mold 2 is provided with a second light hole 52 corresponding to the dam slot 91.

Referring to fig. 1 and 2, the mold further comprises a locking structure 7, and the upper mold 2 and the lower mold 3 are clamped or unclamped by the locking structure 7.

Specifically, during the assembly process, the lower die core 8 is firstly installed on the lower die 3, the screen component 4 is placed on the lower die core 8 and is provided with the upper die core 21, then the upper die 2 is installed on the lower die 3 and is fixed by the locking structure 7 in a die closing manner, and then the glue injection and the solidification are started; after the glue is solidified, the locking structure 7 releases the locking state, so that the screen assembly 4 after glue injection and solidification is taken out. It should be noted that, the locking structure 7 may be a fastening structure, a clamping structure, a riveting structure, or other mechanical structures capable of realizing the detachable connection between the upper mold 2 and the lower mold 3, which are not described herein.

Referring to fig. 1 and 2, the locking structure 7 includes: a lock frame 71 including a connecting portion and a locking portion connected to each other, the connecting portion being rotatably mounted to the lower die 3; a locking member 72 adjustably provided to the locking portion; when the glue injection mould 1 is in a mould closing state, the locking part is positioned at one side of the upper mould 2, which is away from the lower mould 3. The locking member 72 is screwed with the lock bracket 71. The locking member 72 is a beaded screw.

It will be appreciated that the locking member 72 may be a bolt or a bi-directional screw or other structure capable of being threadably coupled to the lock bracket 71. Preferably, the locking member 72 in this embodiment is a ball screw. The wave bead screw is a specially designed screw, and the wave bead screw is also called a positioning bead screw, a wave screw and a spring plunger. The working principle of the ball screw is that the ball body is pushed to move by a spring with certain pressure, so that the locking piece can smoothly run. When the ball screw is installed, the bare spring can be randomly moved after bearing pressure, and the ball screw is used as a component for providing pressure and accurately positioning, so that the ball screw has the effects of quick positioning and simple installation. The ball screw is mainly locked by a thread, and the thread is provided with a straight slot and an inner hexagon. The end part of the wave bead screw is provided with a bead matched spring, so that the locked structure is buffered and locked.

The device also comprises pins for demolding, wherein the pins are detachably arranged in the glue injection holes 212 and the glue overflow holes 213. The pin is made of transparent material.

The product demolding mode is related to product quality and mold life. In this embodiment, the product is demolded using pins, and in other embodiments, pneumatic demolding may be used.

The pin demolding is adopted, the pin is required to be inserted into the glue injection hole 212 after the upper die core 21 is injected, the pin is convenient to be demolded by means of the adhesive force of the pin and the glue after the glue is solidified, and particularly, the pin is pulled out by twisting the pin clockwise or anticlockwise through a special jig, because the adhesive force between the upper die core 21 and the pin is smaller, the pin can be detached relatively easily, the repeated use of the upper die core 21 is facilitated, the production cost is saved, and the resource utilization efficiency is improved. It should be noted that the pin is designed to match the diameter of the injection hole 212 so as to prevent air from entering the upper mold core 21 to form bubbles.

The utility model adopts pin demoulding, only the pin is required to be removed, and the severe impact and extrusion on the upper die core 21 are not caused, so that the integrity of the upper die core 21 can be effectively protected, the service life of the upper die core 21 is prolonged, the resource utilization efficiency is improved, the demoulding speed is high, and the production efficiency is improved.

When the glue in the glue injection groove 211 is UV glue, the pin made of transparent material does not affect the light curing, and in this embodiment, the pin is made of transparent PC material. When the glue in the glue injection groove 211 is epoxy resin glue, no requirement is made on the color of the pin.

The technical means disclosed by the scheme of the utility model is not limited to the technical means disclosed by the embodiment, and also comprises the technical scheme formed by any combination of the technical features. It should be noted that modifications and adaptations to the utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be within the scope of the present utility model.

Claims

1. An injection mold, comprising:

the lower die (3) is provided with a lower die core (8);

the upper die (2) is provided with an upper die core (21), and a containing cavity (32) for containing the screen component (4) is formed between the upper die core (21) and the lower die core (8);

the upper die core (21) is further provided with a glue injection groove (211), and a glue injection hole (212) and a glue overflow hole (213) which are communicated with the glue injection groove (211), wherein the glue injection groove (211) is communicated with the accommodating cavity (32);

when the mold is closed, the upper mold core (21) and the lower mold core (8) are used for clamping the screen assembly (4), and the bending part (41) of the screen assembly (4) is arranged in the glue injection groove (211) in a sealing mode, so that glue is filled in the inner side and the outer side of the outer side wall of the bending part (41) to form a glue sealing structure during glue injection.

2. A glue injection mould according to claim 1, wherein the glue injection groove (211) is located at the edge of the receiving cavity (32) such that the peripheral edge of the screen assembly (4) is sealingly located within the glue injection groove (211).

3. The glue injection mold of claim 2, wherein the glue is at least one of a UV glue or an epoxy glue.

4. A glue injection mould according to claim 3, characterized in that the lower mould core (8) is made of copper material.

5. A glue injection mould according to claim 3 or 4, characterized in that the upper mould (2) and the lower mould (3) are provided with a plurality of first light transmission holes (51).

6. The glue injection mold of claim 5, further comprising a light transmissive insert (6) disposed between the upper mold (2) and the upper mold core (21).

7. The glue injection mold according to claim 6, wherein the upper mold core (21) and the light-transmitting insert (6) are detachably disposed on the glue injection mold (1).

8. A glue injection mold according to any one of claims 1 to 4 or 6 or 7,

the glue injection mould (1) is provided with a sealing structure for sealing a glue forbidden area (45) in the screen assembly (4).

9. The glue injection mold according to claim 8, wherein the sealing structure is a dam groove (91) arranged on the upper mold core (21), the dam groove (91) is communicated with the glue injection groove (211), and the groove depth of the dam groove (91) extends along the direction away from the glue forbidden area (45);

a side wall of the dam groove (91) close to the glue forbidden area (45) is a pre-dispensing area, and the pre-dispensing area is used for dispensing glue before die assembly, and curing is performed after die assembly to seal the glue forbidden area (45).

10. The glue injection mold according to claim 9, wherein the upper mold (2) is provided with second light holes (52) corresponding to the dam grooves (91).

11. A glue injection mould according to any of claims 1-4, 6, 7, 9 or 10, further comprising a locking structure (7), by means of which locking structure (7) the upper mould (2) and the lower mould (3) are clamped or unclamped.

12. An injection mould according to claim 11, wherein the locking structure (7) comprises:

a lock frame (71) comprising a connecting portion and a locking portion connected to each other, the connecting portion being rotatably mounted to the lower die (3);

a locking member (72) adjustably provided to the locking portion;

when the glue injection mold (1) is in a mold clamping state, the locking part is positioned at one side of the upper mold (2) away from the lower mold (3).

13. A glue injection mould according to claim 12, wherein the locking member (72) is threadedly connected to the locking bracket (71).

14. A glue injection mould according to claim 13, wherein the locking member (72) is a beaded screw.

15. The glue injection mold of claim 14, further comprising pins for demolding, the pins being removably disposed in the glue injection hole (212) and the glue overflow hole (213).

16. The glue injection mold of claim 15, wherein the pins are made of a transparent material.