CN112099268B - Quantum dot film, cutting method thereof and backlight module - Google Patents
Quantum dot film, cutting method thereof and backlight module Download PDFInfo
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- CN112099268B CN112099268B CN202011049328.4A CN202011049328A CN112099268B CN 112099268 B CN112099268 B CN 112099268B CN 202011049328 A CN202011049328 A CN 202011049328A CN 112099268 B CN112099268 B CN 112099268B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/34—Means for performing other operations combined with cutting for applying a coating, such as butter, to cut product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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Abstract
The invention discloses a quantum dot film, a cutting method thereof and a backlight module, wherein the method comprises the following steps: manufacturing a cutting die, and arranging a gummosis groove on the cutting die; connecting the cutting die with an automatic glue injection device in which liquid glue is stored; controlling the cutting die to move in a direction vertical to the quantum dot film to cut the quantum dot film, and controlling the automatic glue injection device to inject liquid glue, wherein the liquid glue flows from the glue flowing groove of the cutting die to the cut edge of the quantum dot film in the process of cutting the quantum dot film by the cutting die; controlling the cutting die to move away, and simultaneously controlling the automatic glue injection device to stop injecting; and curing the liquid glue on the quantum dot film. According to the scheme of the invention, the exposure time of the cut edge of the quantum dot film in the air is reduced as much as possible, so that the possibility of oxidation failure of the quantum dots at the edge of the quantum dot film is reduced as much as possible, and the edge blue light phenomenon of the backlight module is avoided as much as possible.
Description
Technical Field
The invention relates to the technical field of display, in particular to a quantum dot film, a cutting method thereof and a backlight module.
Background
The quantum dot film is a nano material with unique optical characteristics, and is a wide-color-gamut special optical film which is prepared by taking quantum dots, barrier resin and an optical-grade water-oxygen barrier film as main raw materials and combining a high-precision coating technology, and can accurately and efficiently convert high-energy blue light into red light and green light. The quantum dots can form a layer of film on the LED backlight of the LCD display screen, the blue LED is used for irradiating to emit full-spectrum light, and the backlight is finely adjusted, so that the color gamut expression can be greatly improved, and the color is more vivid. The quantum dot display technology has been comprehensively upgraded in various dimensions such as color gamut coverage, color control accuracy, red, green and blue color purity, and the like, is regarded as an improvement point of the global display technology, and is also regarded as a display technology revolution affecting the world.
In the manufacturing process of the quantum dot film raw material, the barrier resin is added to wrap the quantum dots, so that the quantum dot failure phenomenon cannot occur. The quantum dot film is required to be cut before being applied to the backlight module, at present, a cutting die is mostly adopted for cutting, and then sealant is sprayed on the cut edge of the backlight module. However, after the cutting die is used for cutting and before sealant is sprayed, quantum dots on the cut edge are exposed in the environment, so that the quantum dots at the position of about 1mm of the cut edge lose effectiveness after the quantum dot film is used for a period of time, the blue light of the LED is emitted to the position, the blue light cannot be converted into full-spectrum light, the blue light is directly emitted from the cut edge, and the blue edge phenomenon can occur in the backlight module.
Disclosure of Invention
The invention discloses a quantum dot film, a cutting method thereof and a backlight module, which are used for solving the problem that quantum dots near the cutting edge of the quantum dot film are easy to lose efficacy in the prior art.
In order to solve the problems, the invention adopts the following technical scheme:
provided is a cutting method of a quantum dot film, comprising the steps of:
manufacturing a cutting die with the same shape as the quantum dot film of a finished product to be formed, and arranging glue flowing grooves on two sides of the cutting die;
connecting the cutting die with an automatic glue injection device, and installing the cutting die in the cutting device, wherein liquid glue is stored in a storage tank of the automatic glue injection device;
placing the quantum dot film to be cut in a cutting device, controlling a cutting die to move in a direction vertical to the quantum dot film, cutting the quantum dot film, and controlling an automatic glue injection device to inject liquid glue, wherein the liquid glue flows from a glue flowing groove of the cutting die to a cutting edge of the quantum dot film in the process of cutting the quantum dot film by the cutting die;
after the quantum dot film is cut, controlling the cutter die to move away, and simultaneously controlling the automatic glue injection device to stop injecting;
and curing the liquid glue on the quantum dot film to finish the cutting of the quantum dot film.
Optionally, all be equipped with a plurality of gummosis grooves in the both sides of cutting die at the interval side by side, each gummosis groove extends along the direction of perpendicular cutting die cutting edge, then offers gummosis groove in the both sides of cutting die, specifically includes the step:
and (4) arranging glue flowing grooves on two sides of the cutting die one by utilizing a cutter.
Optionally, link the cutting die with automatic injecting glue device, specifically include the step:
a plurality of glue flowing pipes are arranged at one end of the cutting die, which is far away from the cutting edge, wherein each glue flowing pipe extends along the direction vertical to the cutting edge, and each glue flowing groove corresponds to one glue flowing pipe;
and connecting the glue flowing pipe with a glue injection pipe of the automatic glue injection device.
Optionally, a plurality of glue flowing tubes are installed at one end of the cutting die, which is far away from the cutting edge, and the method specifically comprises the following steps:
cutting the cutting die, wherein the thickness of the cutting die at the part for mounting the rubber flowing pipe is smaller than that of the part for arranging the rubber flowing groove, and the cutting die forms a boss at the inlet end of the rubber flowing groove;
and installing the rubber flowing pipe to enable the rubber flowing pipe to be abutted against the boss.
Optionally, curing the liquid glue on the quantum dot film specifically includes the steps of:
and solidifying the liquid glue on the quantum dot film at a discharge hole of the cutting device.
Optionally, the cutting die includes:
the cutting die body is used for cutting the quantum dot film;
the glue flowing grooves are formed in the two sides of the cutting die body, and liquid glue flows to the cutting edges of the quantum dot films from the glue flowing grooves in the process of cutting the quantum dot films by the cutting die body.
Optionally, a plurality of the glue flowing grooves are arranged on two sides of the cutting die body side by side at intervals, and each glue flowing groove extends along a direction perpendicular to the cutting edge of the cutting die body.
Optionally, the cutting die further includes a plurality of glue flowing pipes disposed on the cutting die body, a first end of each glue flowing groove is provided with one glue flowing pipe, each glue flowing pipe extends in a direction perpendicular to the cutting edge of the cutting die body, and the first end of each glue flowing groove is far away from the cutting edge of the cutting die body.
Optionally, the thickness of the cutting die body at the position where the rubber flow pipe is installed is smaller than the thickness of the rubber flow groove, and the rubber flow pipe abuts against a boss located at the first end of the rubber flow groove.
There is also provided a quantum dot film produced by the cutting method of any one of the above, comprising:
a quantum dot film body;
and the solidified liquid glue seals the cut edges of the quantum dot film body.
Still provide a backlight unit, including lamp plate, quantum dot membrane and the optics diaphragm that sets gradually, wherein the quantum dot membrane is the aforesaid the quantum dot membrane.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the realization is cutting the quantum dot membrane simultaneously, glues the liquid and injects the limit that cuts at the quantum dot membrane to glue the solidification to the liquid, realize that the quantum dot membrane cuts the sealed of limit, reduce the exposure time of the limit that cuts of quantum dot membrane in the air as far as possible, thereby reduce the quantum dot oxidation failure's at quantum dot membrane edge possibility as far as possible, and then avoid backlight unit's marginal blue light phenomenon as far as possible.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof illustrate the present invention and do not constitute a limitation of the present invention. In the drawings:
FIG. 1 is a schematic flow chart of a cutting method of a quantum dot film disclosed by the invention;
FIG. 2 is a schematic diagram of a front structure of a quantum dot film disclosed in the present invention;
FIG. 3 is a side view of a quantum dot film as disclosed herein;
FIG. 4 is an enlarged view of portion A of FIG. 3;
FIG. 5 is a perspective view of one of the cutting dies of the present disclosure;
FIG. 6 is a perspective view of another embodiment of the cutting die of the present disclosure;
FIG. 7 is a schematic front view of a cutting die according to the present disclosure;
FIG. 8 is a side view of a cutting die in accordance with the present disclosure;
FIG. 9 is a top view of a cutting die of the present disclosure;
fig. 10 is an exploded view of a backlight module according to the present invention.
Wherein the following reference numerals are specifically included in figures 1-10:
quantum dot film-1; a cutting die-2; a lamp panel-3; an optical film sheet-4; quantum dot film body-11; liquid glue-12; a cutting die body-21; a gummosis bath-22; a rubber flowing pipe-23; boss-24; a blade-25; LED lamp pearl-31.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the invention, as shown in fig. 2 to 9, the cutting edge of the quantum dot film 1 is injected with the liquid glue 12 while the quantum dot film 1 is cut, and the liquid glue 12 is cured, so that the sealing of the cutting edge of the quantum dot film 1 is realized, and the exposure time of the cutting edge of the quantum dot film 1 in the air is reduced as much as possible, thereby reducing the possibility of oxidation failure of the quantum dots at the edge of the quantum dot film 1 as much as possible, and further avoiding the edge blue light phenomenon of the backlight module as much as possible.
The cutting method of the quantum dot film 1 of the present invention, as shown in fig. 1, includes the steps of:
step S10, manufacturing a cutting die 2 with the same shape as the quantum dot film 1 of a finished product to be formed, and arranging gummosis grooves 22 on two sides of the cutting die 2;
step S20, connecting the cutting die 2 with an automatic glue injection device, and installing the cutting die 2 in a cutting device, wherein liquid glue 12 is stored in a storage tank of the automatic glue injection device;
step S30, placing the quantum dot film 1 to be cut in a cutting device, controlling a cutting die 2 to move in a direction vertical to the quantum dot film 1, cutting the quantum dot film 1, controlling an automatic glue injection device to inject liquid glue 12, and enabling the liquid glue 12 to flow from a glue flowing groove 22 of the cutting die 2 to a cutting edge of the quantum dot film 1 in the process that the cutting die 2 cuts the quantum dot film 1;
s40, after the quantum dot film 1 is cut, controlling the cutting die 2 to move away, and simultaneously controlling the automatic glue injection device to stop injecting;
and S50, curing the liquid glue 12 on the quantum dot film 1 to finish cutting the quantum dot film 1.
In step S10, the shape of the cutting die 2 is the same as the shape of the quantum dot film 1 to be formed into a finished product, for example, when the quantum dot film 1 to be formed into a finished product is circular, the cutting die 2 is cylindrical. A plurality of gummosis baths 22 are arranged on both sides of the cutting die 2 at intervals side by side, and each gummosis bath 22 extends along the direction vertical to the cutting edge 25 of the cutting die 2. The glue grooves 22 can be formed by cutting tools one by one. The arrangement distance of the glue flowing grooves 22 can be calculated according to the thickness, the glue injection speed and the cutting speed of the quantum dot film 1 to be cut. So set up, be convenient for accurately calculate the time that liquid glue 12 flowed to quantum dot membrane 1, for going on simultaneously, cutting and the sealed of quantum dot membrane 1 edge of quantum dot membrane 1, these two different technologies provide the possibility.
The thickness of the cutting die 2 may be about 1mm and the depth of the runner groove 22 may be, for example, 0.2mm. One end far away from the cutting edge 25 can be also provided with glue flowing pipes 23 respectively corresponding to the glue flowing grooves 22, the glue flowing pipes 23 can be adhered to the cutting die 2, the glue flowing pipes 23 extend along the direction vertical to the cutting edge 25 of the cutting die 2, and the liquid glue 12 flowing out of the glue flowing pipes 23 directly enters the glue flowing grooves 22. By arranging the glue flowing pipe 23, the flowing time of the liquid glue 12 in the glue flowing groove 22 is reduced, so that the risk that the liquid glue 12 overflows the glue flowing groove 22 is reduced, the time that the liquid glue 12 flows to the quantum dot film 1 is accurately calculated, and the advantage is ensured, and in the step S20, the glue injecting pipe of the automatic glue injecting device can be directly connected with the glue flowing pipe 23, so that the connection between the knife mold 2 and the automatic glue injecting device is conveniently realized.
The automatic glue injection device can be fixed in the cutting device and also can be arranged outside the cutting device. The automatic glue injection device can extend out of a main pipe, then glue injection pipes with the same number as the glue flow pipes 23 are divided at the tail end of the main pipe, and each glue flow pipe 23 is connected with different glue injection pipes. Other structures of the automatic glue injection device are the same as those of a general automatic glue injection device, for example, the other structures include a storage tank for storing the liquid glue 12, and details are not described herein.
Before the glue flowing tube 23 is installed, the length of the glue flowing groove 22, that is, the distance between the glue flowing tube 23 and the cutting edge 25 of the cutting die 2 needs to be calculated, so as to reduce the risk of interference between the glue flowing tube 23 and the quantum dot film 1. Wherein, the length of the gummosis bath 22 can be calculated according to the thickness and the cutting speed of the quantum dot film 1 to be cut. When the quantum dot film 1 to be cut is thick, the length of the gummosis groove 22 is long; when the quantum dot film 1 to be cut is thin, the length of the gummosis bath 22 is short.
Furthermore, the cutting die 2 can be cut at the position for installing the glue flowing pipe 23, so that the thickness of the cutting die 2 at the position for installing the glue flowing pipe 23 is smaller than that of the position for arranging the glue flowing groove 22, and the cutting die 2 forms a boss 24 at the inlet end of the glue flowing groove 22. Therefore, when the rubber flow pipe 23 is installed, the rubber flow pipe 23 can be directly abutted against the boss 24 of the cutting die 2, so that the boss 24 has a limiting effect, and the installation efficiency of the rubber flow pipe 23 is improved; and the flow velocity of the liquid glue 12 can be slowed down through the boss 24, and the liquid glue 12 is ensured to flow from the glue flowing groove 22 to the quantum dot film 1.
In step S30, it is most preferable that the liquid glue 12 flows onto the quantum dot film 1 at the same time point when the knife mold 2 contacts the quantum dot film 1. Therefore, the starting time point of the cutting die 2 and the glue injection time point of the automatic glue injection device can be determined according to the cutting time of the cutting die 2 and the injection time of the liquid glue 12. In a specific operation, an automatic recognition device, such as an infrared recognition device, can be arranged in the cutting device, and the position of the cutting die 2 is recognized through the automatic recognition device, so that the opening and closing of the automatic glue injection device are controlled, namely when the automatic recognition device monitors that the distance between the cutting die 2 and the quantum dot film 1 reaches a set distance, the automatic glue injection device is opened, and the liquid glue 12 is injected into the cutting edge of the quantum from the storage tank; when the automatic identification device identifies that the quantum dot film 1 is cut completely and the cutting die 2 leaves the product, the automatic injection molding device stops injection.
In step S50, the liquid glue 12 on the quantum dot film 1 may be cured at the discharge port of the cutting device. The widths of the solidified liquid glue 12 on the front surface and the back surface of the quantum dot film 1 are not less than 1mm. The liquid glue 12 may be a liquid optical resin glue, and specifically may be, for example, a silica gel or a UV (Ultra-Violet Ray) glue. The curing temperature and time of the liquid glue 12 may be set according to the properties of the glue, for example, when the liquid glue 12 is a silicone glue, the curing temperature is 130-150 ℃, and the curing time is less than twenty minutes. The curing equipment that is located the cutting device discharge gate can specifically set for according to the demand, for example when liquid glue 12 is silica gel, is equipped with air-dry mouth at the discharge gate of cutting device, and air-dry mouth can be followed the hoop setting of discharge gate, is equipped with the air dryer in the casing of cutting device, and the hot-blast air-dry mouth that blows off of air dryer is followed, treats that quantum dot membrane 1 passes through, air-dries silica gel. When the liquid glue 12 is UV glue, an ultraviolet lamp is arranged at the discharge hole of the cutting device. Other structures of the cutting device are the same as those of a common cutting device, and detailed description is omitted here.
The cutting die 2 used in the present invention includes a cutting die body 21 and a gummosis groove 22. The cutting die body 21 is used for cutting the quantum dot film 1, and the shape of the cutting die body 21 is the same as the shape of the quantum dot film 1 to be formed into a finished product, for example, when the quantum dot film 1 to be formed into a finished product is circular, the cutting die body 21 is cylindrical. The glue flowing grooves 22 are formed in two sides of the cutter die body 21, and in the process that the cutter die body 21 cuts the quantum dot film 1, the liquid glue 12 injected from the automatic glue injection device flows to the cutting edge of the quantum dot film 1 through the glue flowing grooves 22. Through improving the structure of cutting die 2, realize cutting quantum dot membrane 1 simultaneously, glue 12 with the liquid and inject the limit of cutting at quantum dot membrane 1 to glue 12 solidification to the liquid, realize quantum dot membrane 1 and cut the sealed of limit, reduce the exposure time of the limit of cutting of quantum dot membrane 1 in the air as far as possible, thereby reduce the quantum dot probability of losing efficacy at quantum dot membrane 1 edge as far as possible.
A plurality of gummosis grooves 22 are arranged on two sides of the cutting die body 21 side by side at intervals, and each gummosis groove 22 extends along the direction perpendicular to the cutting edge 25 of the cutting die body 21, so as to control the time for the liquid glue 12 to flow to the quantum dot film 1. The knife die body 21 is further provided with a plurality of glue flowing pipes 23, the first end of each glue flowing groove 22 is provided with one glue flowing pipe 23, each glue flowing pipe 23 extends along the direction perpendicular to the cutting edge 25 of the knife die body 21, the first end of each glue flowing groove 22 is far away from the cutting edge 25 of the knife die body 21 and is a glue inlet of the glue flowing groove 22, so that the knife die 2 is connected with the automatic glue injection device, and the risk that the liquid glue 12 overflows from the glue flowing groove 22 is reduced.
Further, the thickness of the cutting die body 21 at the position where the glue flowing pipe 23 is installed is smaller than that of the position where the glue flowing groove 22 is arranged, and the glue flowing pipe 23 abuts against the boss 24 at the first end of the glue flowing groove 22. Thus, the glue tube 23 can be positioned by the boss 24 to facilitate installation of the glue tube 23; and the flow velocity of the liquid glue 12 can be reduced through the boss 24, and the liquid glue 12 is ensured to flow from the glue flowing groove 22 to the quantum dot film 1.
The quantum dot film 1 comprises a quantum dot film body 11 and liquid glue 12 for sealing the cut edges of the quantum dot film body 11. The liquid glue 12 may be a liquid optical resin glue, and in the process of cutting the quantum dot film body 11 by the cutting die 2, the liquid glue 12 flows to the quantum dot film body 11 through the cutting die 2, and then is cured and fixed on the quantum dot film body 11. When the quantum dot film body 11 is cut, the liquid glue 12 is injected into the cut edge of the quantum dot film body 11, so that the cut edge of the quantum dot film body 11 is sealed, the exposure time of the cut edge of the quantum dot film body 11 in the air is reduced as much as possible, and the probability of quantum dot failure at the edge of the quantum dot film body 11 is reduced as much as possible.
As shown in fig. 10, the backlight module of the present invention includes a lamp panel 3, a quantum dot film 1 and an optical film 4, which are sequentially disposed, wherein the lamp panel 3 is provided with LED lamp beads 31, and the quantum dot film 1 is the quantum dot film 1, so that the risk of edge failure of the quantum dot film 1 is greatly reduced, thereby effectively ensuring the product performance of the backlight module.
While the present invention has been described with reference to the particular illustrative embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various modifications, equivalent arrangements, and equivalents thereof, which may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A cutting method of a quantum dot film is characterized by comprising the following steps:
manufacturing a cutting die with the same shape as the quantum dot film of a finished product to be formed, and arranging a plurality of gummosis grooves on two sides of the cutting die at intervals side by side, wherein each gummosis groove extends along a direction vertical to the cutting edge of the cutting die; the method comprises the following steps of: respectively forming glue flowing grooves on two sides of the cutting die by using a cutter;
connecting the cutting die with an automatic glue injection device, and installing the cutting die in the cutting device, wherein liquid glue is stored in a storage tank of the automatic glue injection device; wherein, the cutting die is even gone up automatic injecting glue device, specifically includes the step:
a plurality of glue flowing pipes are arranged at one end of the cutting die, which is far away from the cutting edge, wherein each glue flowing pipe extends along the direction vertical to the cutting edge, and each glue flowing groove corresponds to one glue flowing pipe; connecting the glue flowing pipe with a glue injection pipe of an automatic glue injection device;
placing the quantum dot film to be cut in a cutting device, controlling a cutting die to move in a direction vertical to the quantum dot film, cutting the quantum dot film, and controlling an automatic glue injection device to inject liquid glue, wherein the liquid glue flows from a glue flowing groove of the cutting die to a cutting edge of the quantum dot film in the process of cutting the quantum dot film by the cutting die;
after the quantum dot film is cut, controlling the cutter die to move away, and simultaneously controlling the automatic glue injection device to stop injecting;
curing the liquid glue on the quantum dot film to finish the cutting of the quantum dot film;
wherein, the cutting die includes: the cutting die body is used for cutting the quantum dot film; the glue flowing grooves are formed in two sides of the cutting die body, and liquid glue flows to the cutting edge of the quantum dot film from the glue flowing grooves in the process that the quantum dot film is cut by the cutting die body; the cutting edge is arranged on the cutting die body; the glue flowing pipes are arranged on the cutting die body, the first end of each glue flowing groove is provided with one glue flowing pipe, each glue flowing pipe extends along the direction vertical to the cutting edge of the cutting die body, and the first end of each glue flowing groove is far away from the cutting edge of the cutting die body; the boss is arranged at the inlet end of the gummosis groove, the boss is the part of the cutting die body, which is provided with the gummosis groove, and the thickness of the part of the cutting die body, which is provided with the gummosis pipe, is smaller than that of the part, which is provided with the gummosis groove, so that the boss is formed; the boss and the gummosis pipe set up relatively, the gummosis pipe is close to one end butt in the gummosis groove in the boss.
2. The cutting method of the quantum dot film according to claim 1, wherein a plurality of flow tubes are installed at one end of the cutting die away from the cutting edge, and the method specifically comprises the steps of:
cutting the cutting die, wherein the thickness of the cutting die at the part for mounting the rubber flowing pipe is smaller than that of the part for arranging the rubber flowing groove, and the cutting die forms a boss at the inlet end of the rubber flowing groove;
and installing the rubber flowing pipe to enable the rubber flowing pipe to be abutted against the boss.
3. The quantum dot film cutting method according to claim 1, wherein curing the liquid glue on the quantum dot film specifically comprises the steps of:
and solidifying the liquid glue on the quantum dot film at a discharge hole of the cutting device.
4. The cutting method of the quantum dot film as claimed in claim 1, wherein the thickness of the knife die body at the position where the glue flowing groove is arranged is smaller than that of the position where the glue flowing groove is arranged, and the glue flowing pipe abuts against a boss at the first end of the glue flowing groove.
5. A quantum dot film produced by the cutting method according to any one of claims 1 to 4, comprising:
a quantum dot film body;
and the solidified liquid glue seals the cut edges of the quantum dot film body.
6. A backlight module is characterized by comprising a lamp panel, a quantum dot film and an optical diaphragm which are sequentially arranged, wherein the quantum dot film is the quantum dot film in claim 5.
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| CN114952034A (en) * | 2022-06-23 | 2022-08-30 | 义乌清越光电技术研究院有限公司 | Cutting control method, device and system of quantum dot film and display device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1094514A (en) * | 1953-11-25 | 1955-05-20 | Advanced band saw blades | |
| FR2625702A1 (en) * | 1988-01-12 | 1989-07-13 | Lectra Systemes Sa | Device for cutting out mats of meltable materials in sheet form |
| US6352465B1 (en) * | 2000-08-25 | 2002-03-05 | Kirk D. Heymann | Toy knife |
| CN207696208U (en) * | 2018-01-03 | 2018-08-07 | 建湖县富马电子设备有限公司 | A kind of wire machine tool cutting oil filter plant |
| CN108501057A (en) * | 2018-04-02 | 2018-09-07 | 蚌埠市优乃德自动化机械设备制造有限公司 | It is a kind of to be used for disconnecting device of the rice with cutting machine |
| CN108890709A (en) * | 2018-06-29 | 2018-11-27 | 遵义市石佛洞牛肉干厂 | A kind of beef chopping equipment |
| CN109262674A (en) * | 2018-08-24 | 2019-01-25 | 安徽佳谷豆食品有限公司 | A kind of rice cake section machine of antisticking type |
| DE102018117194A1 (en) * | 2018-07-17 | 2020-01-23 | Lesyk Gmbh | Knife and method of separating material |
| CN110861131A (en) * | 2019-11-12 | 2020-03-06 | 西安兰鑫工业自动化工程有限公司 | Industrial automation cuts mucilage binding and puts |
| KR102094380B1 (en) * | 2020-01-31 | 2020-03-27 | 정영택 | An Automatic Cake Cutting Device |
| CN111227013A (en) * | 2020-01-10 | 2020-06-05 | 连佳彬 | Novel food processor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20003120U1 (en) * | 2000-02-21 | 2000-04-20 | Kolb Wellpappe Hans | Punching device |
| DE20215642U1 (en) * | 2002-01-25 | 2003-02-06 | Heidel Gmbh & Co Kg Werkzeug U | Cutting tool for cutting softer polymers e.g. polyurethane elastomers, has a blade fed with release agent or quality control materials |
| DE102005050940B3 (en) * | 2005-10-21 | 2006-12-14 | Frimo Group Gmbh | Foil cutting device for cutting along weakened line has blade holder supporting blades at end facing away from cutting direction in region of blade tip |
| US9163353B2 (en) * | 2013-06-25 | 2015-10-20 | Michael Lin | Method and apparatus for cutting and sealing |
| CN108240609A (en) * | 2018-03-15 | 2018-07-03 | 京东方科技集团股份有限公司 | A kind of quantum dot film and preparation method thereof, backlight, display device |
| CN108687816B (en) * | 2018-05-18 | 2019-08-02 | 合肥京东方显示光源有限公司 | Membrane material cutting method, cutting means, compound film material, backlight module and display device |
-
2020
- 2020-09-29 CN CN202011049328.4A patent/CN112099268B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1094514A (en) * | 1953-11-25 | 1955-05-20 | Advanced band saw blades | |
| FR2625702A1 (en) * | 1988-01-12 | 1989-07-13 | Lectra Systemes Sa | Device for cutting out mats of meltable materials in sheet form |
| US6352465B1 (en) * | 2000-08-25 | 2002-03-05 | Kirk D. Heymann | Toy knife |
| CN207696208U (en) * | 2018-01-03 | 2018-08-07 | 建湖县富马电子设备有限公司 | A kind of wire machine tool cutting oil filter plant |
| CN108501057A (en) * | 2018-04-02 | 2018-09-07 | 蚌埠市优乃德自动化机械设备制造有限公司 | It is a kind of to be used for disconnecting device of the rice with cutting machine |
| CN108890709A (en) * | 2018-06-29 | 2018-11-27 | 遵义市石佛洞牛肉干厂 | A kind of beef chopping equipment |
| DE102018117194A1 (en) * | 2018-07-17 | 2020-01-23 | Lesyk Gmbh | Knife and method of separating material |
| CN109262674A (en) * | 2018-08-24 | 2019-01-25 | 安徽佳谷豆食品有限公司 | A kind of rice cake section machine of antisticking type |
| CN110861131A (en) * | 2019-11-12 | 2020-03-06 | 西安兰鑫工业自动化工程有限公司 | Industrial automation cuts mucilage binding and puts |
| CN111227013A (en) * | 2020-01-10 | 2020-06-05 | 连佳彬 | Novel food processor |
| KR102094380B1 (en) * | 2020-01-31 | 2020-03-27 | 정영택 | An Automatic Cake Cutting Device |
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