CN110919960A - Sealing forming method and system for bendable outdoor LED soft module - Google Patents

Sealing forming method and system for bendable outdoor LED soft module Download PDF

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Publication number
CN110919960A
CN110919960A CN201911056843.2A CN201911056843A CN110919960A CN 110919960 A CN110919960 A CN 110919960A CN 201911056843 A CN201911056843 A CN 201911056843A CN 110919960 A CN110919960 A CN 110919960A
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CN
China
Prior art keywords
display panel
unit display
mold
glue
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911056843.2A
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Chinese (zh)
Inventor
程丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Meiyadi Photoelectric Co Ltd
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Shenzhen Meiyadi Photoelectric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Meiyadi Photoelectric Co Ltd filed Critical Shenzhen Meiyadi Photoelectric Co Ltd
Priority to CN201911056843.2A priority Critical patent/CN110919960A/en
Publication of CN110919960A publication Critical patent/CN110919960A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B29C2045/14245Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/747Lightning equipment

Abstract

The invention relates to a sealing forming method and a sealing forming system of a bendable outdoor LED soft module, wherein the sealing forming method specifically selects a flexible PCB (printed Circuit Board) as a substrate of an LED lamp panel, so that the formed LED lamp panel can be bent; processing the substrate into a unit display panel through SMT (surface mount technology) paster; carrying out aging test on the unit display panel, wherein the unit display panel passing the test is taken as a good unit display panel; the display panel of the good unit is fixedly installed in the cavity of the mold, the injection molding machine injects glue in liquid state into the cavity of the mold, the injection molding machine is utilized to complete the glue injection process, the glue injection efficiency is greatly improved, the glue is transparent silica gel, the molding hardness is 40-60 degrees, and the transparent soft silica gel is adopted as a glue injection material, so that the glue can be bent along with the substrate after being solidified.

Description

Sealing forming method and system for bendable outdoor LED soft module
Technical Field
The invention relates to the technical field of LED display, in particular to a sealing forming method and a sealing forming system of a bendable outdoor LED soft module.
Background
Current LED lamp mainly has support cut straightly LED lamp, paster LED lamp and modularization LED lamp, and these lamps need carry out the encapsulating to lamp plate and the module of constituteing by the lamp when using outdoors and seal.
The sealing method of the LED module in the prior art scheme is mainly characterized in that glue is filled on the surface of the LED lamp, the glue filling component is A, B glue or resin glue, and any kind of glue filling method is used for effectively sealing the LED module and protecting components on the module. The prior art adopts the machine encapsulating to replace the artifical encapsulating of more old-fashioned to the lamp plate encapsulating, adopts the form of drying naturally behind the encapsulating to solidify, and curing time reaches several hours, and is long consuming time, has seriously influenced production efficiency, and moreover, the module behind the prior art encapsulating is inflexible.
Disclosure of Invention
Technical problem to be solved
The invention provides a sealing forming method and a sealing forming system for a bendable outdoor LED soft module, and aims to solve the problems that an LED module after glue pouring cannot be bent and the production efficiency is low in the prior art.
(II) technical scheme
In order to solve the above problems, the invention provides a sealing and forming method of a bendable outdoor LED flexible module, which includes the following steps:
s1: selecting a flexible PCB as a substrate of the LED lamp panel, wherein the thickness of the substrate is 0.4-0.6 mm;
s2: processing the substrate into a unit display panel through SMT, mounting the lamp beads on one side of the substrate, and mounting the IC and the connector on the other side of the substrate;
s3: carrying out aging test on the unit display panel, wherein the unit display panel passing the test is used as a good unit display panel;
s4: fixedly mounting the good unit display panel in a cavity of a mold, wherein the cavity of the mold is a closed cavity, injecting glue in a liquid state into the closed cavity of the mold by an injection molding machine, heating and curing, wherein the glue is transparent silica gel, and the molding hardness is 40-60 ℃;
s5: and after solidification is finished, taking the good unit display panel out of the mold, cooling the good unit display panel, and taking the cooled good unit display panel as the LED lamp panel.
Preferably, in step S4, before the injection molding machine injects the glue in liquid state into the closed cavity of the mold, the injection molding machine further includes: and vacuumizing the closed cavity by using a vacuumizing machine.
Preferably, the step S4 is specifically:
firstly: adding the sealed liquid silica gel into a charging barrel of an injection molding machine;
then: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
then: after the vacuumizing is finished, injecting glue into the mold for 100-120S;
and finally: heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
Preferably, in the step S5, the cooling of the good unit display panel is specifically: and cooling the display panel of the good product unit by using an air cooler for 5-10S.
Preferably, the present invention further provides a flexible outdoor LED flexible module sealing and forming system, including:
a selecting module: selecting a flexible PCB as a substrate of the LED lamp panel, wherein the thickness of the substrate is 0.4-0.6 mm;
a patch module: processing the substrate into a unit display panel through SMT, mounting the lamp beads on one side of the substrate, and mounting the IC and the connector on the other side of the substrate;
an aging module: carrying out aging test on the unit display panel, wherein the unit display panel passing the test is used as a good unit display panel;
an injection molding machine: after the good product unit display panel is fixedly arranged in the cavity of the mold, the injection molding machine injects glue in a liquid state into the closed cavity of the mold, and the glue is heated and cured;
a cooling system: and after solidification is finished, taking the good unit display panel out of the mold, cooling the good unit display panel, and taking the cooled good unit display panel as the LED lamp panel.
Preferably, the seal molding system further comprises a vacuum extractor;
before the injection molding machine injects glue in liquid state into the closed cavity of the mold, the vacuumizing machine carries out vacuumizing treatment on the closed cavity provided with the good unit display panel.
Preferably, the injection molding machine comprises: the device comprises a glue filling device, a mould mounting device, a glue injection device and a curing device;
the glue injection device comprises: adding the sealed liquid silica gel into a charging barrel of an injection molding machine;
the die mounting device comprises: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
the glue injection device comprises: after the vacuumizing is finished, injecting glue into the mold, wherein the glue injection is 100S to 120S;
the curing device: heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
Preferably, the mold comprises an upper mold plate and a lower mold plate which can be attached to each other.
Preferably, the upper die plate is provided with a guide pillar, the lower die plate is provided with a guide pillar hole matched with the guide pillar, the upper die plate is provided with a glue inlet, and the glue inlet is connected with the closed cavity.
(III) advantageous effects
According to the flexible outdoor LED soft module sealing forming method and system, the flexible PCB is selected as the substrate, the transparent silica gel is used as the glue filling glue, the glue filling of the flexible LED module is achieved, meanwhile, the injection molding machine is used for glue filling, the cooling system of the injection molding machine is used for cooling the mould after glue filling, the time required by cooling is shortened, and the production efficiency is greatly improved.
Drawings
Fig. 1 is a flow chart of a sealing and forming method of a bendable outdoor LED soft module according to the present invention;
FIG. 2 is a structural diagram of a sealing and forming system of a bendable outdoor LED soft module according to the present invention;
FIG. 3 is an internal structural view of an injection molding machine of the present invention;
FIG. 4 is a structural diagram of the mold in the open state of the mold in the present invention;
fig. 5 is an assembly view of the mold of the present invention in mold clamping.
[ description of reference ]
1: selecting a module; 2: a patch module; 3: an aging module; 4: a vacuum extractor; 5: an injection molding machine; 51: a glue filling device; 52: a die mounting device; 53: a glue injection device; 54: a curing device; 6: a cooling system; 7: mounting a template; 71: a guide post; 72: a glue inlet; 73: the LED lamp beads avoid vacant positions; 8: a lower template; 81: a guide post hole; 82: reserving a magnet; 83: avoiding vacant positions of the IC; 84: the connector keeps away the vacancy.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, the method for sealing and forming a bendable outdoor LED flexible module provided by the present invention comprises the following steps:
s1: the flexible PCB is selected as a substrate of the LED lamp panel, and the thickness of the substrate is 0.4-0.6 mm. In the preferred embodiment, the PCB is made of flexible glass fiber materials with the thickness of 0.6mm, so that the PCB is good in flexibility and large in bending radian.
S2: processing a substrate into a unit display panel through SMT, mounting a lamp bead on one side of the substrate, and mounting an IC and a connector on the other side of the substrate;
s3: performing aging test on the unit display panel for 62-82 hours, wherein the unit display panel passing the test is used as a good unit display panel; and the unit display panel which does not pass the aging test is used as a defective product, and the aging test is carried out again after the defective product is maintained.
S4: with yields unit display panel fixed mounting in the die cavity of mould, the die cavity of this mould is closed die cavity, the injection molding machine pours into the closed die cavity of mould with glue under the liquid, the curing by heating, utilize this technical scheme of injection molding machine completion encapsulating process, can effectual improvement encapsulating efficiency, the cooling system that injection molding machine self carried simultaneously also can facilitate for subsequent cooling process, production efficiency has greatly been improved, glue is transparent silica gel, the shaping hardness is 40-60 degrees, the base plate and the glue that use in the forming process all are flexible material, make the LED lamp plate after the shaping can be crooked by a wide margin.
In a preferred embodiment, the glue is highly transparent, UV resistant, acid and alkali resistant, non-yellowing (two years shelf life), and non-cracking on bending. And the mould adopts 8407 mould steel CNC processing, and the precision is less than 5 silks, and the numerical control processing of mould adoption high accuracy for reach the installation accuracy requirement between mould and the yields unit display panel, make the shaping of LED lamp plate in the closed type intracavity of high accuracy accomplish, the LED lamp plate size precision after the shaping is high.
S5: after solidification is completed, the good product unit display panel is taken out of the mold, the good product unit display panel is cooled for 5S-10S by an air cooler, the cooled good product unit display panel serves as an LED lamp panel, the good product unit display panel is subjected to glue pouring molding in the cavity, all-dimensional glue sealing is conducted on the good product unit display panel, and the molded LED lamp panel can be waterproof and dustproof.
Furthermore, the matching surfaces for placing the good unit display panels are designed inside the upper template and the lower template, the positions of the transparent silica gel are reserved on the matching surfaces, and the transparent silica gel is attached to the upper surfaces of the unit display panels after being molded.
And finally, at least one good unit display panel can be placed in the closed cavity.
In step S4, before the injection molding machine injects the glue in the liquid state into the closed cavity of the mold, the method further includes: and (4) vacuumizing the closed cavity by using a vacuumizing machine. The vacuumizing machine pumps out the air in the closed cavity to form internal negative pressure, so that air bubbles can be effectively avoided in the glue filling process, and the phenomenon of poor packaging is caused.
Step S4 specifically includes:
firstly: adding the sealed liquid silica gel into a charging barrel of an injection molding machine; (ii) a
Then: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
then: after the vacuumizing is finished, injecting glue into the mold for 100-120S;
finally, heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
As shown in fig. 2, the present invention further provides a sealing and molding system for a bendable outdoor LED flexible module, comprising:
selecting a module 1: selecting a flexible PCB as a substrate of the LED lamp panel, wherein the thickness of the substrate is 0.4-0.6 mm;
the patch module 2: processing the substrate into a unit display panel by SMT, namely mounting the lamp beads on one side of the substrate, and mounting the IC and the connector on the other side of the substrate;
and an aging module 3: carrying out aging test on the unit display panel, wherein the unit display panel passing the test is taken as a good unit display panel;
and (3) injection molding machine 5: after the display panel of the unit to be qualified is fixedly arranged in the cavity of the mold, the cavity of the mold is a closed cavity, and the injection molding machine 5 injects glue in a liquid state into the closed cavity of the mold, and heats and cures the glue;
cooling system 6: and after solidification is finished, taking the good unit display panel out of the mold, cooling the good unit display panel, and taking the cooled good unit display panel as the LED lamp panel.
As shown in fig. 2, the sealing and forming system of the bendable outdoor LED flexible module further includes: a vacuum extractor 4;
before the injection molding machine 5 injects the glue in the liquid state into the closed cavity of the mold, the vacuumizing machine carries out vacuumizing treatment on the closed cavity provided with the good unit display panel.
As shown in fig. 3, the injection molding machine 5 includes: a glue filling device 51, a mould mounting device 52, a glue filling device 53 and a curing device 54;
glue filling device 51: adding the sealed liquid silica gel into a charging barrel of an injection molding machine;
mold mounting device 52: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
glue injection device 53: after the vacuumizing is finished, injecting glue into the mold, wherein the glue injection is 100S to 120S;
the curing device 54: heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
Wherein, as shown in fig. 4 and 5, the mold comprises an upper template and a lower template which can be jointed with each other, a closed cavity is formed after the upper template and the lower template are jointed, a good unit display board is arranged in the closed cavity,
the upper template 7 is provided with guide posts 71, the lower template 8 is provided with guide post holes 81 matched with the guide posts 71, and the guide posts 71 are matched with the guide post holes 81 to complete the quick positioning and installation of the upper template 7 and the lower template 8. The upper template 7 is provided with a glue inlet 72, and the glue inlet 72 is connected with the closed cavity.
In addition, a plurality of LED lamp beads have still been seted up on cope match-plate pattern 7 and have been kept away vacancy 73, and LED lamp bead keeps away vacancy 73 and inwards caves in, and LED lamp bead keeps away the sunken degree of depth that vacancy 73 was greater than the height of LED lamp bead on the non-defective unit display panel, and LED lamp bead has certain clearance when keeping away vacancy 73 and LED lamp bead cooperation installation, has avoided cope match-plate pattern 7 to crush LED lamp bead promptly, is favorable to the encapsulating of non-defective unit display panel again.
Similarly, the lower template 8 is provided with an IC clearance space 83, a connector clearance space 84 and a magnet reserved position 82, the IC clearance space 83 is formed by inwards sinking, and the sinking depth is greater than the height of the IC on the display panel of the good unit. The connector clearance space 84 is also formed by an inward recess having a depth greater than the height of the connector on the display panel of the good unit. When the IC and the connector are mounted in the IC clearance space 83 and the connector clearance space 84, respectively, the lower board 8 is prevented from crushing the IC and the connector. Position 82 is reserved for the bellied boss that makes progress to magnet, and the back is accomplished to the injecting glue, and the position that the position corresponds is reserved at magnet to the good products unit display panel can form an inside sunken magnet seat, and the magnet seat can be used for installing magnet.
It should be understood that the above description of specific embodiments of the present invention is only for the purpose of illustrating the technical lines and features of the present invention, and is intended to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, but the present invention is not limited to the above specific embodiments. It is intended that all such changes and modifications as fall within the scope of the appended claims be embraced therein.

Claims (9)

1. A sealing and forming method of a bendable outdoor LED soft module comprises the following steps:
s1: selecting a flexible PCB as a substrate of the LED lamp panel, wherein the thickness of the substrate is 0.4-0.6 mm;
s2: processing the substrate into a unit display panel through SMT, mounting the lamp beads on one side of the substrate, and mounting the IC and the connector on the other side of the substrate;
s3: carrying out aging test on the unit display panel, wherein the unit display panel passing the test is used as a good unit display panel;
s4: fixedly mounting the good unit display panel in a cavity of a mold, wherein the cavity of the mold is a closed cavity, injecting glue in a liquid state into the closed cavity of the mold by an injection molding machine, heating and curing, wherein the glue is transparent silica gel, and the molding hardness is 40-60 ℃;
s5: and after solidification is finished, taking the good unit display panel out of the mold, cooling the good unit display panel, and taking the cooled good unit display panel as the LED lamp panel.
2. The method for hermetically forming a bendable outdoor LED flexible module according to claim 1, wherein the step S4, before the step S4, the step S further includes: and vacuumizing the closed cavity by using a vacuumizing machine.
3. The method for sealing and forming a bendable outdoor LED soft module according to claim 2, wherein the step S4 specifically comprises:
firstly: adding the sealed liquid silica gel into a charging barrel of an injection molding machine;
then: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
then: after the vacuumizing is finished, injecting glue into the mold for 100-120S;
and finally: heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
4. The method as claimed in any one of claims 1 to 3, wherein the step S5 of cooling the good unit display panel includes: and cooling the display panel of the good product unit by using an air cooler for 5-10S.
5. A flexible outdoor LED soft module sealing and forming system is characterized in that the system comprises:
a selecting module: selecting a flexible PCB as a substrate of the LED lamp panel, wherein the thickness of the substrate is 0.4-0.6 mm;
a patch module: processing the substrate into a unit display panel through SMT, mounting the lamp beads on one side of the substrate, and mounting the IC and the connector on the other side of the substrate;
an aging module: carrying out aging test on the unit display panel, wherein the unit display panel passing the test is used as a good unit display panel;
an injection molding machine: after the good product unit display panel is fixedly arranged in the cavity of the mold, the injection molding machine injects glue in a liquid state into the closed cavity of the mold, and the glue is heated and cured;
a cooling system: and after solidification is finished, taking the good unit display panel out of the mold, cooling the good unit display panel, and taking the cooled good unit display panel as the LED lamp panel.
6. The system of claim 5, wherein the system further comprises a vacuum extractor;
before the injection molding machine injects glue in liquid state into the closed cavity of the mold, the vacuumizing machine carries out vacuumizing treatment on the closed cavity provided with the good unit display panel.
7. The system of claim 6, wherein the injection molding machine comprises: the device comprises a glue filling device, a mould mounting device, a glue injection device and a curing device;
the glue injection device comprises: adding the sealed liquid silica gel into a charging barrel of an injection molding machine;
the die mounting device comprises: fixedly mounting a good unit plate in the closed cavity of the mold, waiting for 3S after the closed cavity is closed and sealed, and vacuumizing the closed cavity by using a vacuumizing machine;
the glue injection device comprises: after the vacuumizing is finished, injecting glue into the mold, wherein the glue injection is 100S to 120S;
the curing device: heating the mold to 110-120 ℃ to cure the silica gel for 80-120S.
8. The system for hermetically sealing and molding the bendable outdoor LED flexible module according to any one of claims 5 to 7, wherein the mold comprises an upper mold plate and a lower mold plate which can be attached to each other.
9. The system of any one of claims 5-7, wherein the upper mold plate is provided with a guide post, the lower mold plate is provided with a guide post hole matching with the guide post, the upper mold plate is provided with a glue inlet, and the glue inlet is connected to the closed cavity.
CN201911056843.2A 2019-10-31 2019-10-31 Sealing forming method and system for bendable outdoor LED soft module Pending CN110919960A (en)

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CN111469318A (en) * 2020-04-23 2020-07-31 大连集思特科技有限公司 Injection type manufacturing method of flexible transparent display screen protective layer

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