CN220733096U - High light efficiency flexible circuit board - Google Patents
High light efficiency flexible circuit board Download PDFInfo
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- CN220733096U CN220733096U CN202322315464.9U CN202322315464U CN220733096U CN 220733096 U CN220733096 U CN 220733096U CN 202322315464 U CN202322315464 U CN 202322315464U CN 220733096 U CN220733096 U CN 220733096U
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- light guide
- layer
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- light
- flexible substrate
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- 238000003466 welding Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000005476 soldering Methods 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 230000002349 favourable effect Effects 0.000 abstract 2
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model relates to a flexible circuit board with high light efficiency, which comprises: the LED lamp comprises a flexible substrate layer, a circuit layer, a plurality of welding units, a white oil layer and a plurality of LED chips, wherein the circuit layer is arranged on a first face of the flexible substrate layer, each welding unit is arranged on the first face of the flexible substrate layer, the white oil layer is connected with the circuit layer, the white oil layer is provided with a plurality of light guide grooves, each light guide groove is used for enabling one welding unit to be exposed, each LED chip is arranged in one light guide groove, and the thickness of each LED chip is smaller than or equal to that of the white oil layer. The white oil layer is through having offered each light guide slot, and each LED chip one-to-one installs in each light guide slot, and the light guide slot structure of white oil layer can form white wall light guide structure, and the light that each LED chip sent can reflect through the inside wall of light guide slot and assemble, is favorable to the light that each LED sent to concentrate and send out, avoids the light source to appear scattered the condition to be favorable to improving luminous efficacy, improve luminous efficacy.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a flexible circuit board with high light efficiency.
Background
The flexible circuit board is also called FPC (Flexible Printed Circuit Board) for short, and is also called a flexible board, and the flexible circuit board is prepared from flexible insulating base materials, has the advantages that the traditional hard circuit board does not have, can be bent, rolled and folded at will, can be applied to scenes needing multi-angle bending, for example, can also be applied to preparing LED lamp strips for illumination or display, and has very wide application.
However, the existing flexible circuit board is generally used for mounting the LED chip on the surface of the flexible circuit board, so that light emitted by the LED chip is easy to scatter and cannot be gathered, the luminous efficiency is greatly reduced, the luminous efficiency is lower, and the light efficiency is influenced.
Disclosure of Invention
Based on this, it is necessary to provide a flexible wiring board with high light efficiency.
The technical scheme for solving the technical problems is as follows: a high light efficiency flexible circuit board comprising:
the flexible substrate layer is provided with a first surface and a second surface, and the first surface and the second surface of the flexible substrate layer are arranged opposite to each other;
the circuit layer is arranged on the first surface of the flexible substrate layer;
the welding units are respectively arranged on the first surface of the flexible substrate layer, are mutually arranged at intervals and are respectively connected with the circuit layer;
the white oil layer is connected with the circuit layer, the white oil layer is provided with a plurality of light guide grooves, each light guide groove is matched with one welding unit, each light guide groove is used for exposing one welding unit, and
and each LED chip is arranged in one light guide groove and connected with one welding unit, and the thickness of each LED chip is smaller than or equal to the thickness of the white oil layer.
In one embodiment, each of the soldering units includes an anode pad and a cathode pad, the anode pad and the cathode pad are disposed at intervals, the anode pad and the cathode pad are respectively connected with the circuit layer, and each of the LED chips is connected with one of the anode pad and one of the cathode pad.
In one embodiment, the cross-sectional area of the light guide groove is greater than the cross-sectional area of the LED chip.
In one embodiment, the LED chip and the inner sidewall of the light guide groove are spaced apart from each other.
In one embodiment, a groove is formed at the bottom of each light guiding groove, each groove is adapted to one welding unit, and each groove is used for exposing one welding unit.
In one embodiment, the cross-sectional area of the groove increases gradually from an end closer to the welding unit to an end farther from the welding unit.
In one embodiment, the cross-sectional area of the light guide groove gradually increases from an end near the welding unit to an end far from the welding unit.
In one embodiment, the flexible substrate layer is one of a polyimide flexible substrate layer and a polyester flexible substrate layer.
In one embodiment, each of the LED chips is arranged in a matrix shape centering on a central axis of the flexible substrate layer.
Compared with the prior art, the utility model has at least the following advantages:
the flexible substrate layer is arranged, the circuit layer and the welding units are arranged on the first surface of the flexible substrate layer, the welding units are respectively connected with the circuit layer, so that circuit communication is realized, the welding units are in one-to-one correspondence with the LED chips, the circuit communication with the LED chips is ensured, the white oil layer covers the circuit layer, the circuit layer can be protected, meanwhile, the insulating effect can be realized, the electrical safety of the high-light-efficiency flexible circuit board is ensured, meanwhile, the thickness of the white oil layer is larger than or equal to that of the LED chips, the white oil layer is provided with the light guide grooves in one-to-one correspondence with the LED chips, the light guide groove structure of the white oil layer can form a white wall light guide structure, light emitted by the LED chips can be reflected and converged through the inner side walls of the light guide grooves, the light emitted by the LEDs is prevented from being scattered, and the luminous efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a flexible circuit board with high light efficiency according to an embodiment;
FIG. 2 is a schematic diagram of an exploded perspective view of a flexible circuit board with high light efficiency according to an embodiment;
FIG. 3 is a schematic diagram of another view of a flexible circuit board with high light efficiency according to one embodiment;
fig. 4 is an enlarged schematic view of the structure at a in fig. 2.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The technical solution of the present utility model will be further described below with reference to the accompanying drawings of the embodiments of the present utility model, and the present utility model is not limited to the following specific embodiments.
It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the present utility model, it should be understood that, if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc., that indicate an azimuth or a positional relationship based on the directions or the positional relationships shown in the drawings, it is only for convenience of describing the present utility model and simplifying the description, but not for indicating or suggesting that the apparatus or element to be referred to must have a specific azimuth, be constructed and operated in a specific azimuth, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limitations of the present patent, and that the specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
Referring to fig. 1, 2 and 3, a flexible circuit board 10 with high light efficiency includes a flexible substrate layer 100, a circuit layer 200, a plurality of soldering units 300, a white oil layer 400 and a plurality of LED chips 500. The flexible substrate layer 100 has a first surface and a second surface, and the first surface and the second surface of the flexible substrate layer 100 are opposite to each other. The circuit layer 200 is disposed on the first surface of the flexible substrate layer 100. Each of the soldering units 300 is disposed on the first surface of the flexible substrate layer 100, each of the soldering units 300 is disposed at intervals, and each of the soldering units 300 is connected to the circuit layer 200. The white oil layer 400 is connected with the circuit layer 200, and the white oil layer 400 is provided with a plurality of light guide grooves 410, each light guide groove 410 is adapted to one of the welding units 300, and each light guide groove 410 is used for exposing one of the welding units 300. Each LED chip 500 is disposed in one of the light guide grooves 410 and connected to one of the welding units 300, and the thickness of each LED chip 500 is less than or equal to the thickness of the white oil layer 400.
It should be noted that, the flexible substrate layer 100 is made of a flexible material, the flexible substrate layer 100 is in a strip structure, so that the subsequent preparation is convenient to obtain the light bar, the first surface of the flexible substrate layer 100 is a working surface, the circuit layer 200 is arranged on the first surface of the flexible substrate layer 100, the circuit layer 200 is made of a copper circuit layer 200, the circuit layer 200 can be designed according to specific circuit design requirements, each welding unit 300 is arranged, each welding unit 300 is used for welding with the anode and the cathode of each LED chip 500, thereby realizing connection with the circuit layer 200, realizing circuit conduction, and the white oil layer 400 is covered on the circuit layer 200 as an insulating layer to protect the circuit layer 200, and can play an insulating role, ensure the electrical safety of the high-light-efficiency flexible circuit board in use, the white oil layer 400 is provided with the light guide grooves 410 according to the positions and the shapes of the welding units 300, the light guide grooves 410 extend to the welding units 300, which is equivalent to the opening of the windows of the light guide grooves 410 in the white oil layer 400, so that the welding units 300 are exposed, the LED chips 500 are conveniently accommodated in the light guide grooves 410 in a one-to-one correspondence manner, and are welded with the welding units 300, the circuit conduction is realized, the circuit conduction between the LED chips 500 and the circuit layer 200 is ensured, the power supply to the LED chips 500 is ensured, the normal light emission of the LED chips 500 is ensured, the thickness of the white oil layer 400 is greater than or equal to the thickness of the LED chips 500, the depth of the light guide grooves 410 is greater than or equal to the thickness of the LED chips 500, the LED chips 500 can be completely accommodated in the light guide grooves 410, the LED chips 410 can form a white wall structure, the white wall structure has good light reflection effect, the light emitted by each LED may be reflected and concentrated through the light guide groove 410.
Specifically, the first surface of the flexible substrate layer 100 is provided with the circuit layer 200 and each welding unit 300, each welding unit 300 is connected with the circuit layer 200 respectively, so as to realize circuit communication, each welding unit 300 is used for being connected with each LED chip 500 in a one-to-one correspondence manner, so that circuit communication with each LED chip 500 is ensured, the white oil layer 400 covers the upper portion of the circuit layer 200, the circuit layer 200 can be protected, meanwhile, an insulating effect can be achieved, the electrical safety of the flexible circuit board with high light efficiency is ensured, meanwhile, the thickness of the white oil layer 400 is set to be greater than or equal to that of each LED chip 500, and the white oil layer 400 is provided with each light guide groove 410 in a one-to-one correspondence manner, each LED chip 500 is installed in each light guide groove 410, the light emitted by each LED chip 500 can be reflected and converged through the inner side wall of the light guide groove 410, the light emitted by each LED chip 500 is prevented from being concentrated, the light source is prevented from being scattered, and the luminous efficiency is improved.
Referring to fig. 2 and 4, in one embodiment, each of the soldering units 300 includes a positive electrode pad 310 and a negative electrode pad 320, the positive electrode pad 310 and the negative electrode pad 320 are spaced apart from each other, the positive electrode pad 310 and the negative electrode pad 320 are respectively connected to the circuit layer 200, and each of the LED chips 500 is connected to one of the positive electrode pad 310 and the negative electrode pad 320. It can be appreciated that the welding unit 300 includes an anode pad 310 and a cathode pad 320 which are disposed at intervals, and the anode pad 310 and the cathode pad 320 are respectively connected with an anode pin and a cathode pin of the LED chip 500, so as to realize circuit communication with the LED chip 500, ensure normal power on to each LED chip 500, and ensure normal light emission of each LED chip 500.
In one embodiment, the cross-sectional area of the light guide groove 410 is greater than the cross-sectional area of the LED chip 500. The LED chip 500 is spaced apart from the inner sidewall of the light guide groove 410. It can be appreciated that, by setting the cross-sectional area of the light guiding groove 410 to be larger than that of the LED chip 500, the LED chip 500 can be guaranteed to be fully accommodated in the light guiding groove 410, meanwhile, a gap is reserved between the LED chip 500 and the inner side wall of the light guiding groove 410, so that the attachment of the LED chip 500 and the inner side wall of the light guiding groove 410 is avoided, and light emitted by the LED chip 500 can be better projected onto the inner side wall of the light guiding groove 410 and reflected by the inner side wall of the white light guiding groove 410, so that light emitted by the LED chips 500 is collected together and LED out in a concentrated manner, and the luminous light efficiency is further improved, thereby improving the quality of the finished product of the flexible circuit board with high luminous efficiency.
Referring to fig. 2 and 4, in one embodiment, a groove 411 is formed at the bottom of each light guiding slot 410, each groove 411 is adapted to one of the welding units 300, and each groove 411 is used for exposing one of the welding units 300. It can be appreciated that, since the cross-sectional area of the light guide slot 410 is larger than that of each LED, the shape and size of the groove 411 are adapted to those of the welding unit 300 by providing the groove 411 at the bottom of the light guide slot 410, so that the welding unit 300 can be ensured to be normally exposed, normal welding with the LED chip 500 can be ensured, circuit conduction can be realized, meanwhile, the circuit layer 200 can be prevented from being exposed, the occurrence of leakage can be avoided, the circuit layer 200 can be completely protected, and the electrical safety of the high-light-efficiency flexible circuit board can be ensured.
In one embodiment, the cross-sectional area of the recess 411 gradually increases from an end near the welding unit 300 to an end far from the welding unit 300. It can be appreciated that the recess 411 is configured to be an open structure that gradually increases, so that the opening area of the recess 411 can be increased, which is beneficial to better welding the LED chip 500 to the welding unit 300, and is convenient for normal operation of the welding process, thereby being beneficial to improving the yield of the flexible circuit board with high light efficiency.
In one embodiment, the cross-sectional area of the light guide groove 410 gradually increases from one end near the welding unit 300 to one end far from the welding unit 300. It can be appreciated that the light guide groove 410 is configured as an open structure, and can form an inclined light guide wall structure around the LED chip 500, so that the light guide angle is increased, and the light emitting surface of the LED chip 500 is increased, and the light emitting effect is better.
In one embodiment, the white oil layer 400 has a thickness of 100 μm to 200 μm. It can be understood that the thickness of the white oil layer 400 is set to be 100 μm-200 μm, the thickness is moderate, the thickness of the specific white oil layer 400 can be set according to the thickness of the LED chip 500, and the thickness of the LED chip is generally 90 μm-150 μm, so that the thickness of the white oil layer 400 is set to be 100 μm-200 μm, the thickness of the white oil layer 400 can be ensured to be greater than or equal to the thickness of the LED chip 500, and the thickness of the white oil layer 400 is prevented from being too thick, thereby avoiding affecting the flexibility of the flexible circuit board with high light efficiency and ensuring the normal use and quality of the flexible circuit board with high light efficiency.
In one embodiment, the flexible substrate layer 100 is one of a polyimide flexible substrate layer and a polyester flexible substrate layer. It can be appreciated that the flexible substrate layer 100 is made of polyimide or polyester flexible materials, and polyimide or polyester is a common material for preparing flexible circuit boards, and has the advantages of good mechanical strength, good flexibility and high temperature resistance, so that the flexible circuit boards with good mechanical properties and good flexibility and high light efficiency can be prepared.
In one embodiment, each of the LED chips 500 is arranged in a matrix shape centering on the central axis of the flexible substrate layer 100. It can be appreciated that, by arranging the light guide grooves 410 in a matrix with the central axis of the flexible substrate layer 100 as the center, the LED chips 500 can be arranged on the flexible substrate layer 100 in a matrix, so that the LED chips 500 can be uniformly arranged, which is beneficial to uniform light emission of the LED chips 500 and has good light emitting effect.
Compared with the prior art, the utility model has at least the following advantages:
the flexible substrate layer is arranged, the circuit layer and the welding units are arranged on the first surface of the flexible substrate layer, the welding units are respectively connected with the circuit layer, so that circuit communication is realized, the welding units are in one-to-one correspondence with the LED chips, the circuit communication with the LED chips is ensured, the white oil layer covers the circuit layer, the circuit layer can be protected, meanwhile, the insulating effect can be realized, the electrical safety of the high-light-efficiency flexible circuit board is ensured, meanwhile, the thickness of the white oil layer is larger than or equal to that of the LED chips, the white oil layer is provided with the light guide grooves in one-to-one correspondence with the LED chips, the light guide groove structure of the white oil layer can form a white wall light guide structure, light emitted by the LED chips can be reflected and converged through the inner side walls of the light guide grooves, the light emitted by the LEDs is prevented from being scattered, and the luminous efficiency is improved.
It is to be understood that the above examples of the present utility model are provided by way of illustration only and not by way of limitation of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (9)
1. A high light efficiency flexible circuit board, comprising:
the flexible substrate layer is provided with a first surface and a second surface, and the first surface and the second surface of the flexible substrate layer are arranged opposite to each other;
the circuit layer is arranged on the first surface of the flexible substrate layer;
the welding units are respectively arranged on the first surface of the flexible substrate layer, are mutually arranged at intervals and are respectively connected with the circuit layer;
the white oil layer is connected with the circuit layer, the white oil layer is provided with a plurality of light guide grooves, each light guide groove is matched with one welding unit, each light guide groove is used for exposing one welding unit, and
and each LED chip is arranged in one light guide groove and connected with one welding unit, and the thickness of each LED chip is smaller than or equal to the thickness of the white oil layer.
2. The high-light-efficiency flexible circuit board according to claim 1, wherein each of said soldering units comprises a positive electrode pad and a negative electrode pad, said positive electrode pad and said negative electrode pad being disposed at a distance from each other, said positive electrode pad and said negative electrode pad being respectively connected to said circuit layer, each of said LED chips being connected to one of said positive electrode pad and said negative electrode pad.
3. The high light efficiency flexible circuit board of claim 1, wherein the cross-sectional area of the light guide slot is greater than the cross-sectional area of the LED chip.
4. The flexible circuit board of claim 3, wherein said LED chip is spaced from said inner sidewall of said light guide channel.
5. The flexible printed circuit board of claim 3, wherein a groove is formed at a bottom of each of said light guide grooves, each of said grooves is adapted to one of said soldering units, and each of said grooves is adapted to expose one of said soldering units.
6. The high light efficiency flexible wiring board according to claim 5, wherein the cross-sectional area of the groove gradually increases from an end closer to the soldering unit to an end farther from the soldering unit.
7. The high-light-efficiency flexible wiring board according to claim 1, wherein a cross-sectional area of the light guide groove gradually increases from an end near the soldering unit to an end far from the soldering unit.
8. The high light efficiency flexible circuit board of any of claims 1-7, wherein said flexible substrate layer is one of a polyimide flexible substrate layer and a polyester flexible substrate layer.
9. The flexible wiring board according to any one of claims 1 to 7, wherein the LED chips are arranged in a matrix with a central axis of the flexible base material layer as a center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315464.9U CN220733096U (en) | 2023-08-28 | 2023-08-28 | High light efficiency flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315464.9U CN220733096U (en) | 2023-08-28 | 2023-08-28 | High light efficiency flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220733096U true CN220733096U (en) | 2024-04-05 |
Family
ID=90525154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322315464.9U Active CN220733096U (en) | 2023-08-28 | 2023-08-28 | High light efficiency flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220733096U (en) |
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2023
- 2023-08-28 CN CN202322315464.9U patent/CN220733096U/en active Active
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