EP3825599A1 - Lamp - Google Patents
Lamp Download PDFInfo
- Publication number
- EP3825599A1 EP3825599A1 EP20163568.7A EP20163568A EP3825599A1 EP 3825599 A1 EP3825599 A1 EP 3825599A1 EP 20163568 A EP20163568 A EP 20163568A EP 3825599 A1 EP3825599 A1 EP 3825599A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat dissipation
- lamp
- side plate
- dissipation column
- previous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 96
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000011324 bead Substances 0.000 claims abstract description 22
- 230000004308 accommodation Effects 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present application relates to the technical field of lighting, and more particularly to a lamp.
- Existing lamps such as G9 or G4, usually include a heat dissipation base, a flexible circuit substrate surrounding the heat dissipation base, and a light source arranged on the flexible circuit substrate.
- the flexible circuit substrate is easily tilted up, which causes the temperature of the light source on the flexible circuit substrate to be too high, which affects the service life of the lamp.
- a lamp comprising: a heat dissipation base, a light source assembly, and a lampshade arranged outside the light source assembly.
- the heat dissipation base comprises: a base and a heat dissipation column arranged on the base.
- the light source assembly comprises: a flexible substrate, lamp beads, and a power driven module arranged on the flexible substrate.
- the flexible substrate comprises: a side plate wrapping outside a sidewall of the heat dissipation column, and a top plate connected to the side plate and covering a top of the heat dissipation column.
- the lamp beads are arranged on the side plate and the top plate, respectively. Connecting strips extend from a periphery of the top plate, and the connecting strips abut against an outer side of the heat dissipation column and are wrapped inside the side plate.
- the number of the connecting strips is plural, and a plurality of connecting strips are spacedly arranged along the periphery of the top plate.
- a back surface of the flexible layer is provided with an adhesive layer; and the adhesive layer is attached to the heat dissipation column for fixation.
- a contour shape of the top of the heat dissipation column is a polygon or a circle, and a contour shape of the top plate is as same as the contour shape of the top of the heat dissipation column.
- the light source assembly further comprises electrode conductive terminals electrically connected to the power driven module; and the lamp beads, the power driven module, and the electrode conductive terminals are integrated on the flexible substrate.
- the heat dissipation column is provided with an accommodation cavity configured for accommodating a power driven module; the side plate and/or the top plate defines therein first heat dissipation holes communicating with the accommodation cavity, and the base defines therein second heat dissipation holes communicating with the first heat dissipation holes and the outside, respectively.
- the number of the first heat dissipation holes is plural, and/or the number of the second heat dissipation holes is plural.
- the sidewall of the heat dissipation column defines therein a slot, and the slot communicates with the accommodation cavity and is configured for allowing the side plate to pass through, such that the power driven module is accommodated in the accommodation cavity.
- the lamp further includes a thermal conductive sleeve sleeved outside the heat dissipation column; and the side plate is wrapped outside a sidewall of the thermal conductive sleeve, and the connecting strips abut against a sidewall of the thermal conductive sleeve.
- the thermal conductive sleeve is a thermal conductive silicone rubber piece.
- the beneficial effect of the lamp according to embodiments of the present application are summarized as follows: compared with the prior art, the lamp provided by the present application has connecting strips extending from the periphery of the top plate, and the connecting strips abut against the outer side of the heat dissipation column and is wrapped inside the side plate, thereby preventing the flexible substrate from being tilted and avoiding the occurrence of high temperature of the lamp bead arranged on the flexible substrate as in prior art due to the tilting up of the flexible substrate, which affects the service life of the lamp.
- first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more features.
- the meaning of “a plurality of” is two or more, unless specifically defined otherwise.
- the meaning of “several” is one or more, unless specifically defined otherwise.
- orientations or position relationship indicated by the terms of “center”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside” are based on the orientations or position relationship as shown in the drawings, only for easing of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation or construct and operate in a specific orientation, and therefore which cannot be understood as a limitation on the present application.
- install should be understood in a broad sense unless otherwise specified and limited.
- the terms of “install”, “link”, and “connect” may be a fixed connection or a disassembly connection, or integral connection; it can be mechanical or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction between two elements.
- install may be a fixed connection or a disassembly connection, or integral connection; it can be mechanical or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction between two elements.
- the three coordinate axes that are mutually orthogonal in space are defined as X axis, Y axis, and Z axis, meanwhile, the direction along X axis is longitudinal, the direction along Y axis is lateral, and the direction along Z axis is vertical;
- X axis and Y axis are two coordinate axes perpendicular to each other on the same horizontal plane, and Z axis is a vertical coordinate axis;
- X axis, Y axis, and Z axis are located in space perpendicular to each other.
- Three planes are XY plane and YZ plane and XZ plane, where XY plane is a horizontal plane, XZ plane and YZ plane are vertical planes, and XZ plane is perpendicular to YZ plane.
- the three axes in space are X axis, Y axis, and Z axis. Moving along the three axes in space refers to moving along the three axes that are perpendicular to each other in space, especially moving along the X, Y, and Z axes in space; and plane movement refers to moving on the XY plane.
- the present application provides a lamp, including: a heat dissipation base10, a light source assembly 20, and a lampshade 30 which is arranged outside the light source assembly 20.
- the heat dissipation base 10 includes a base 11 and a heat dissipation column 12 arranged on the base 11.
- the base 11 and the heat dissipation column 12 are integrally formed and connected.
- the light source assembly 20 includes: a flexible substrate 21, lamp beads 22, and a power driven module 23 arranged on the flexible substrate 21.
- the lamp beads 22 can be LED lamp beads.
- the flexible substrate 21 includes: a side plate 211 wrapping outside a sidewall of the heat dissipation column 12, and a top plate 212 connected to the side plate 211 and covering a top of the heat dissipation column 12.
- the lamp beads 22 are arranged on the side plate 211 and the top plate 212, respectively. By arranging the lamp beads 22 on the side plate 211 and the top plate 212, the light emitting angle and the irradiation range can be further improved.
- connecting strips 213 extend from a periphery of the top plate 212, and the connecting strips 213 abut against an outer side of the heat dissipation column 12 and are wrapped inside the side plate 211.
- the side plate 211 are aligned with the sidewall of the heat dissipation column 12, the top plate 212 is aligned with the top of the heat dissipation column 12, and one end of the side plate 211 is enabled to wrap outside the sidewall of the heat dissipation column 12; then, as shown in FIG. 10 , the top plate 212 is flipped over so that the top plate 212 contacts with the top of the heat dissipation column 12, and the connecting strip 213 is flipped over to abut against the outer side of the heat dissipation column 12; finally, as shown in FIG.
- the other end of the side plate 211 is wrapped outside the connecting strip 213 and the heat dissipation column12, so as to achieve the installation of light source assembly 20. Due to the arrangement of the connecting strip 213, the flexible substrate 21 can be prevented from being tilted up, and avoiding the occurrence of excessive high temperature of the lamp beads 22 arranged on the flexible substrate 21 due to the tilting up of the flexible substrate 21 in the prior art, which thereby affects the service life of the lamp.
- the connecting strips 213 extend from the periphery of the top plate 212, abut against the outer side of the heat dissipation column 12 and are wrapped inside the side plate 211, thereby preventing the flexible substrate 21 from being tilted up and avoiding the occurrence of excessive high temperature of the lamp beads 22 arranged on the flexible substrate 21 due to the tilting up of the flexible substrate 21 in the prior art, which thereby affects the service life of the lamp.
- the side plate 211, the top plate 212, and the connecting strip 213 are integrally formed and connected, and only need to be manually bent in use, which is not only small in size, simple in structure, but also very easy and convenient to assemble.
- the number of the connecting strips 213 is plural, and a plurality of connecting strips 213 are spacedly arranged along the periphery of the top plate 212.
- the connection strength between the connecting strips 213 and the side plate 211 can be strengthened, and the flexible substrate 21 can be effectively prevented from being tilted up.
- the number of the connecting strips 213 can be arranged according to actual needs, for example, it can be one, two, four, or more.
- a back surface of the flexible layer 21 is provided with an adhesive layer 214.
- the adhesive layer 214 is attached to the heat dissipation column 12 for fixation.
- the fixation connection between the adhesive layer and the heat dissipation column 12 are achieved in an attachment manner, which is very simple and cost saving.
- a contour shape of the top of the heat dissipation column 12 is a polygon or a circle, and a contour shape of the top plate 212 is as same as the contour shape of the top of the heat dissipation column 12 in order to fit the top of the heat dissipation column12.
- the contour shape of the top of the heat dissipation column 12 may be a pentagon, a hexagon, or the like.
- the light source assembly 20 further includes electrode conductive terminals 24 electrically connected to the power driven module 23.
- the electrode conductive terminals 24 are positive electrodes and negative conductive terminals, which are used for electrical connection with an external power source.
- the lamp beads 22, the power driven module 23, and the electrode conductive terminals 24 are integrated on the flexible substrate 21.
- the conventional lamp beads 22, power driven module 23, and electrode conductive terminals 24 are usually assembled separately, and the welding and assembly are required during assembly process, making the procedures extremely complicated.
- the present application integrates the lamp beads 22, the power driven module 23, and the electrode conductive terminals 24 on the flexible substrate 21, which can greatly simplify the assembly process and improve the assembly efficiency.
- the heat dissipation column 12 is provided with an accommodation cavity 121 configured for accommodating a power driven module 23, and the top plate 212 defines therein first heat dissipation holes 2121 communicating with the accommodation cavity 121, and the base 11 defines therein second heat dissipation holes 111 communicating with the first heat dissipation holes 2121 and the outside, respectively.
- the air convection from inside to outside of the accommodation cavity 121 is achieved, so that the heat emitted by the lamp beads 22 is quickly discharged out of the lamp, thereby improving the heat dissipation effect, preventing the light source from fading, and being applicable to high power lamps.
- the way of arrangement the first heat dissipation holes 2121 is not limited to this.
- the first heat dissipation holes 2121 may be separately arranged on the side plate 211; or in order to improve the heat dissipation effect, the first heat dissipation holes 2121 can be arranged on the top plate 212 and the side plate 211, respectively.
- the number of the first heat dissipation holes 2121 is plural, for example, it can be two, three, or even up to ten
- the number of the second heat dissipation holes 111 is plural, for example, it can be two, three, or even up to ten.
- the sidewall of the heat dissipation column 12 defines therein a slot 122, and the slot 122 communicates with the accommodation cavity 121 and is configured for allowing the side plate 211 to pass through, such that the power driven module 23 is accommodated in the accommodation cavity 121, thereby saving space and volume.
- the lamp further includes a thermal conductive sleeve 40 sleeved outside the heat dissipation column 12.
- the side plate 211 is wrapped outside a sidewall of the thermal conductive sleeve 40, and the connecting strips 213 abut against a sidewall of the thermal conductive sleeve 40.
- the thermal conductive sleeve 40 is a thermal conductive silicone rubber piece.
- the use of high thermal conductivity silicone rubber material can effectively improve the heat dissipation effect.
- the shape of the thermal conductive sleeve 40 matches with the shape of the heat dissipation column 12.
- the heat dissipation base 10 is a ceramic heat dissipation mechanism.
- the heat generated by the lamp beads 22 can be quickly discharged out of the lamp, which effectively improves heat dissipation efficiency and extends lamp life.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
- The present application relates to the technical field of lighting, and more particularly to a lamp.
- Existing lamps, such as G9 or G4, usually include a heat dissipation base, a flexible circuit substrate surrounding the heat dissipation base, and a light source arranged on the flexible circuit substrate. In the process of actual use, the flexible circuit substrate is easily tilted up, which causes the temperature of the light source on the flexible circuit substrate to be too high, which affects the service life of the lamp.
- It is an object of embodiments of the present application to provide a lamp, so as to solve the technical problem that the lamp in the related art has a short service life.
- To achieve the above purpose, the technical solution adopted by an embodiment of the present application is: a lamp, comprising: a heat dissipation base, a light source assembly, and a lampshade arranged outside the light source assembly. The heat dissipation base comprises: a base and a heat dissipation column arranged on the base. The light source assembly comprises: a flexible substrate, lamp beads, and a power driven module arranged on the flexible substrate. The flexible substrate comprises: a side plate wrapping outside a sidewall of the heat dissipation column, and a top plate connected to the side plate and covering a top of the heat dissipation column. The lamp beads are arranged on the side plate and the top plate, respectively. Connecting strips extend from a periphery of the top plate, and the connecting strips abut against an outer side of the heat dissipation column and are wrapped inside the side plate.
- In an embodiment, the number of the connecting strips is plural, and a plurality of connecting strips are spacedly arranged along the periphery of the top plate.
- In an embodiment, a back surface of the flexible layer is provided with an adhesive layer; and the adhesive layer is attached to the heat dissipation column for fixation.
- In an embodiment, a contour shape of the top of the heat dissipation column is a polygon or a circle, and a contour shape of the top plate is as same as the contour shape of the top of the heat dissipation column.
- In an embodiment, the light source assembly further comprises electrode conductive terminals electrically connected to the power driven module; and the lamp beads, the power driven module, and the electrode conductive terminals are integrated on the flexible substrate.
- In an embodiment, the heat dissipation column is provided with an accommodation cavity configured for accommodating a power driven module; the side plate and/or the top plate defines therein first heat dissipation holes communicating with the accommodation cavity, and the base defines therein second heat dissipation holes communicating with the first heat dissipation holes and the outside, respectively.
- In an embodiment, the number of the first heat dissipation holes is plural, and/or the number of the second heat dissipation holes is plural.
- In an embodiment, the sidewall of the heat dissipation column defines therein a slot, and the slot communicates with the accommodation cavity and is configured for allowing the side plate to pass through, such that the power driven module is accommodated in the accommodation cavity.
- In an embodiment, the lamp further includes a thermal conductive sleeve sleeved outside the heat dissipation column; and the side plate is wrapped outside a sidewall of the thermal conductive sleeve, and the connecting strips abut against a sidewall of the thermal conductive sleeve.
- In an embodiment, the thermal conductive sleeve is a thermal conductive silicone rubber piece.
- The beneficial effect of the lamp according to embodiments of the present application are summarized as follows: compared with the prior art, the lamp provided by the present application has connecting strips extending from the periphery of the top plate, and the connecting strips abut against the outer side of the heat dissipation column and is wrapped inside the side plate, thereby preventing the flexible substrate from being tilted and avoiding the occurrence of high temperature of the lamp bead arranged on the flexible substrate as in prior art due to the tilting up of the flexible substrate, which affects the service life of the lamp.
- In order to explain technical solutions in embodiments of the present application more clearly, the drawings used in the embodiments or the exemplary technical description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without devoting creative work.
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FIG. 1 is a perspective schematic view of a lamp according to an embodiment of the present application; -
FIG. 2 is an exploded schematic view of a lamp according to an embodiment of the present application; -
FIG.3 is a sectional schematic view of a lamp according to an embodiment of the present application; -
FIG.4 is a perspective schematic view of a light source assembly according to an embodiment of the present application; -
FIG. 5 is a perspective schematic view of the light source assembly according to an embodiment of the present application from another angle; -
FIG. 6 is a sectional schematic view of a light source assembly used in an embodiment of the present application; -
FIG.7 is a partial schematic view ofFIG. 6 ; -
FIG.8 is a perspective schematic view of a heat dissipation base used in an embodiment of the present application; -
FIG. 9 is a first assemblage schematic view showing a light source assembly assembled on a heat dissipation base according to an embodiment of the present application; -
FIG. 10 is a second assemblage schematic view showing a light source assembly assembled on a heat dissipation base according to an embodiment of the present application; -
FIG. 11 is a third assemblage schematic view showing a light source assembly assembled on a heat dissipation base according to the present application. - 10- Heat dissipation base; 11- Base; 111- Second heat dissipation hole; 12- Heat dissipation column; 121-Accommodation cavity; 122- Slot; 20- Light source assembly; 21- Flexible substrate; 211- Side plate; 212- Top plate; 2121-First heat dissipation hole; 213-Connecting strip; 214-Adhesive layer; 22-Lamp bead; 23-Power driven module; 24-Electrode conductive terminals; 30-Lampshade; 40- Thermal conductive sleeve.
- In order to make the technical problems, technical solution and beneficial effects of the present application to be more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.
- It should be noted that when an element is called "fixed to" or "arranged on" another element, it may be directly on another element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
- In addition, the terms of "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless specifically defined otherwise. The meaning of "several" is one or more, unless specifically defined otherwise.
- In the description of the present application, it should be understood that the orientations or position relationship indicated by the terms of "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" are based on the orientations or position relationship as shown in the drawings, only for easing of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation or construct and operate in a specific orientation, and therefore which cannot be understood as a limitation on the present application.
- In the description of the present application, it should be noted that the terms of "install", "link", and "connect" should be understood in a broad sense unless otherwise specified and limited. For example, the terms of "install", "link", and "connect" may be a fixed connection or a disassembly connection, or integral connection; it can be mechanical or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
- Reference to "an embodiment" or "some embodiments" throughout the specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, not all the phrases of "in an embodiment" or "in some embodiments" in various places throughout the specification refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
- For the convenience of description, the three coordinate axes that are mutually orthogonal in space are defined as X axis, Y axis, and Z axis, meanwhile, the direction along X axis is longitudinal, the direction along Y axis is lateral, and the direction along Z axis is vertical; X axis and Y axis are two coordinate axes perpendicular to each other on the same horizontal plane, and Z axis is a vertical coordinate axis; X axis, Y axis, and Z axis are located in space perpendicular to each other. Three planes are XY plane and YZ plane and XZ plane, where XY plane is a horizontal plane, XZ plane and YZ plane are vertical planes, and XZ plane is perpendicular to YZ plane. The three axes in space are X axis, Y axis, and Z axis. Moving along the three axes in space refers to moving along the three axes that are perpendicular to each other in space, especially moving along the X, Y, and Z axes in space; and plane movement refers to moving on the XY plane.
- Please refer to
FIG. 1 to FIG. 3 , the lamp provided by the present application will be described. The present application provides a lamp, including: a heat dissipation base10, alight source assembly 20, and alampshade 30 which is arranged outside thelight source assembly 20. As shown inFIG. 8 , theheat dissipation base 10 includes abase 11 and aheat dissipation column 12 arranged on thebase 11. Specifically, in this embodiment, thebase 11 and theheat dissipation column 12 are integrally formed and connected. As shown inFIG. 4 to FIG. 5 , thelight source assembly 20 includes: aflexible substrate 21,lamp beads 22, and a power drivenmodule 23 arranged on theflexible substrate 21. Thelamp beads 22 can be LED lamp beads. Theflexible substrate 21 includes: aside plate 211 wrapping outside a sidewall of theheat dissipation column 12, and atop plate 212 connected to theside plate 211 and covering a top of theheat dissipation column 12. Thelamp beads 22 are arranged on theside plate 211 and thetop plate 212, respectively. By arranging thelamp beads 22 on theside plate 211 and thetop plate 212, the light emitting angle and the irradiation range can be further improved. As shown inFIGS. 6 ,7 and9 , connectingstrips 213 extend from a periphery of thetop plate 212, and the connectingstrips 213 abut against an outer side of theheat dissipation column 12 and are wrapped inside theside plate 211. When assembling, as shown inFIG. 9 , firstly, theside plate 211 are aligned with the sidewall of theheat dissipation column 12, thetop plate 212 is aligned with the top of theheat dissipation column 12, and one end of theside plate 211 is enabled to wrap outside the sidewall of theheat dissipation column 12; then, as shown inFIG. 10 , thetop plate 212 is flipped over so that thetop plate 212 contacts with the top of theheat dissipation column 12, and the connectingstrip 213 is flipped over to abut against the outer side of theheat dissipation column 12; finally, as shown inFIG. 11 , the other end of theside plate 211 is wrapped outside the connectingstrip 213 and the heat dissipation column12, so as to achieve the installation oflight source assembly 20. Due to the arrangement of the connectingstrip 213, theflexible substrate 21 can be prevented from being tilted up, and avoiding the occurrence of excessive high temperature of thelamp beads 22 arranged on theflexible substrate 21 due to the tilting up of theflexible substrate 21 in the prior art, which thereby affects the service life of the lamp. - Compared with the prior art, in the lamp provided by the present application, the connecting
strips 213 extend from the periphery of thetop plate 212, abut against the outer side of theheat dissipation column 12 and are wrapped inside theside plate 211, thereby preventing theflexible substrate 21 from being tilted up and avoiding the occurrence of excessive high temperature of thelamp beads 22 arranged on theflexible substrate 21 due to the tilting up of theflexible substrate 21 in the prior art, which thereby affects the service life of the lamp. - Optionally, as a specific embodiment of the lamp provided by the present application, the
side plate 211, thetop plate 212, and the connectingstrip 213 are integrally formed and connected, and only need to be manually bent in use, which is not only small in size, simple in structure, but also very easy and convenient to assemble. - Optionally, referring to
FIG. 4 andFIG. 9 , as a specific embodiment of the lamp provided by the present application, the number of the connectingstrips 213 is plural, and a plurality of connectingstrips 213 are spacedly arranged along the periphery of thetop plate 212. By providing a plurality of connectingstrips 213, the connection strength between the connectingstrips 213 and theside plate 211 can be strengthened, and theflexible substrate 21 can be effectively prevented from being tilted up. Specifically, the number of the connectingstrips 213 can be arranged according to actual needs, for example, it can be one, two, four, or more. - Optionally, please refer to
FIG. 9 , as a specific embodiment of the lamp provided by the present application, a back surface of theflexible layer 21 is provided with anadhesive layer 214. Theadhesive layer 214 is attached to theheat dissipation column 12 for fixation. The fixation connection between the adhesive layer and theheat dissipation column 12 are achieved in an attachment manner, which is very simple and cost saving. - Optionally, please refer to
FIG. 2 andFIG. 9 , as a specific embodiment of the lamp provided by the present application, a contour shape of the top of theheat dissipation column 12 is a polygon or a circle, and a contour shape of thetop plate 212 is as same as the contour shape of the top of theheat dissipation column 12 in order to fit the top of the heat dissipation column12. In an embodiment of the present application, the contour shape of the top of theheat dissipation column 12 may be a pentagon, a hexagon, or the like. - Optionally, referring to
FIGS. 4 to 5 , as a specific embodiment of the lamp provided by the present application, thelight source assembly 20 further includes electrodeconductive terminals 24 electrically connected to the power drivenmodule 23. Specifically, the electrodeconductive terminals 24 are positive electrodes and negative conductive terminals, which are used for electrical connection with an external power source. Thelamp beads 22, the power drivenmodule 23, and the electrodeconductive terminals 24 are integrated on theflexible substrate 21. Theconventional lamp beads 22, power drivenmodule 23, and electrodeconductive terminals 24 are usually assembled separately, and the welding and assembly are required during assembly process, making the procedures extremely complicated. The present application integrates thelamp beads 22, the power drivenmodule 23, and the electrodeconductive terminals 24 on theflexible substrate 21, which can greatly simplify the assembly process and improve the assembly efficiency. - Optionally, referring to
FIG. 4 andFIG. 8 , as a specific embodiment of the lamp provided by the present application, theheat dissipation column 12 is provided with anaccommodation cavity 121 configured for accommodating a power drivenmodule 23, and thetop plate 212 defines therein firstheat dissipation holes 2121 communicating with theaccommodation cavity 121, and thebase 11 defines therein second heat dissipation holes 111 communicating with the firstheat dissipation holes 2121 and the outside, respectively. By the arrangement of the firstheat dissipation holes 2121 and the second heat dissipation holes 111, the air convection from inside to outside of theaccommodation cavity 121 is achieved, so that the heat emitted by thelamp beads 22 is quickly discharged out of the lamp, thereby improving the heat dissipation effect, preventing the light source from fading, and being applicable to high power lamps. It should be noted that the way of arrangement the firstheat dissipation holes 2121 is not limited to this. For example, in other preferred embodiments of the present application, the firstheat dissipation holes 2121 may be separately arranged on theside plate 211; or in order to improve the heat dissipation effect, the firstheat dissipation holes 2121 can be arranged on thetop plate 212 and theside plate 211, respectively. - Optionally, referring to
FIG. 4 andFIG. 8 , as a specific embodiment of the lamp provided by the present application, the number of the firstheat dissipation holes 2121 is plural, for example, it can be two, three, or even up to ten, and the number of the second heat dissipation holes 111 is plural, for example, it can be two, three, or even up to ten. By providing a plurality of firstheat dissipation holes 2121 and second heat dissipation holes 111, the heat can be dissipated quickly and the heat dissipation effect can be improved. - Optionally, referring to
FIG. 8 andFIG. 9 , as a specific embodiment of the lamp provided by the present application, the sidewall of theheat dissipation column 12 defines therein aslot 122, and theslot 122 communicates with theaccommodation cavity 121 and is configured for allowing theside plate 211 to pass through, such that the power drivenmodule 23 is accommodated in theaccommodation cavity 121, thereby saving space and volume. - Optionally, referring to
FIG. 2 andFIG. 3 , as a specific embodiment of the lamp provided by the present application, the lamp further includes a thermalconductive sleeve 40 sleeved outside theheat dissipation column 12. Specifically, in this embodiment, theside plate 211 is wrapped outside a sidewall of the thermalconductive sleeve 40, and the connectingstrips 213 abut against a sidewall of the thermalconductive sleeve 40. By arranging the thermalconductive sleeve 40, heat dissipation can be accelerated, the heat dissipation effect can be improved, and the service life of the lamp can be extended. - Optionally, referring to
FIG. 2 andFIG. 3 , as a specific embodiment of the lamp provided by the present application, the thermalconductive sleeve 40 is a thermal conductive silicone rubber piece. The use of high thermal conductivity silicone rubber material can effectively improve the heat dissipation effect. Specifically, the shape of the thermalconductive sleeve 40 matches with the shape of theheat dissipation column 12. - Optionally, as a specific embodiment of the lamp provided by the present application, the
heat dissipation base 10 is a ceramic heat dissipation mechanism. By using a highly thermal conductive ceramic material, the heat generated by thelamp beads 22 can be quickly discharged out of the lamp, which effectively improves heat dissipation efficiency and extends lamp life. - The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement, and improvement made within the spirit and principles of the present application should be included in t the scope of the present application.
Claims (10)
- A lamp, comprising: a heat dissipation base (10), a light source assembly (20), and a lampshade (30) arranged outside the light source assembly (20); characterized in thatthe heat dissipation base (10) comprises: a base (11) and a heat dissipation column (12) arranged on the base (11);the light source assembly (20) comprises: a flexible substrate (21), lamp beads (22), and a power driven module (23) arranged on the flexible substrate (21);the flexible substrate (21) comprises: a side plate (211) wrapping outside a sidewall of the heat dissipation column (12), and a top plate (212) connected to the side plate (211) and covering a top of the heat dissipation column (12);the lamp beads (22) are arranged on the side plate (211) and the top plate (212), respectively; andconnecting strips (213) extend from a periphery of the top plate (212), and the connecting strips (213) abut against an outer side of the heat dissipation column (12) and are wrapped inside the side plate (211).
- The lamp according to claim (1), characterized in that the number of the connecting strips (213) is plural, and a plurality of connecting strips (213) are spacedly arranged along the periphery of the top plate (212).
- The lamp according to any of the previous claims, characterized in that a back surface of the flexible layer (21) is provided with an adhesive layer (214); and the adhesive layer (214) is attached to the heat dissipation column (12) for fixation.
- The lamp according to any of the previous claims, characterized in that a contour shape of the top of the heat dissipation column (12) is a polygon or a circle, and a contour shape of the top plate (212) is as same as the contour shape of the top of the heat dissipation column (12).
- The lamp according to any of the previous claims, characterized in that the light source assembly (20) further comprises electrode conductive terminals (24) electrically connected to the power driven module (23); and the lamp beads (22), the power driven module (23), and the electrode conductive terminals (24) are integrated on the flexible substrate (21).
- The lamp according to any of the previous claims, characterized in that the heat dissipation column (12) is provided with an accommodation cavity (121) configured for accommodating a power driven module (23); the side plate (211) and/or the top plate (212) defines therein first heat dissipation holes (2121) communicating with the accommodation cavity (121), and the base (11) defines therein second heat dissipation holes (111) communicating with the first heat dissipation holes (2121) and the outside, respectively.
- The lamp according to any of the previous claims, characterized in that the number of the first heat dissipation holes (2121) is plural, and/or the number of the second heat dissipation holes (111) is plural.
- The lamp according to any of the previous claims, characterized in that the sidewall of the heat dissipation column (12) defines therein a slot (122), and the slot (122) communicates with the accommodation cavity (121) and is configured for allowing the side plate (211) to pass through, such that the power driven module (23) is accommodated in the accommodation cavity (121).
- The lamp according to any of the previous claims, characterized in that the lamp further includes a thermal conductive sleeve (40) sleeved outside the heat dissipation column (12); and the side plate (211) is wrapped outside a sidewall of the thermal conductive sleeve (40), and the connecting strips (213) abut against a sidewall of the thermal conductive sleeve (40).
- The lamp according to any of the previous claims, characterized in that the thermal conductive sleeve (40) is a thermal conductive silicone rubber piece.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922027531.0U CN211260459U (en) | 2019-11-21 | 2019-11-21 | Lamp fitting |
Publications (2)
Publication Number | Publication Date |
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EP3825599A1 true EP3825599A1 (en) | 2021-05-26 |
EP3825599B1 EP3825599B1 (en) | 2021-10-06 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP20163568.7A Active EP3825599B1 (en) | 2019-11-21 | 2020-03-17 | Lamp |
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EP (1) | EP3825599B1 (en) |
CN (1) | CN211260459U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115250252A (en) * | 2022-09-22 | 2022-10-28 | 东莞英脉通信技术有限公司 | Rechargeable portable router |
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DE29923899U1 (en) * | 1999-04-19 | 2001-06-28 | Oshino Lamps Gmbh | Lighting device |
US20110204393A1 (en) * | 2008-11-06 | 2011-08-25 | Rohm Co., Ltd. | Led lamp |
US20110298371A1 (en) * | 2010-06-08 | 2011-12-08 | Cree, Inc. | Led light bulbs |
EP2650589A1 (en) * | 2012-04-12 | 2013-10-16 | Lextar Electronics Corp. | Light emitting device |
CN208846113U (en) * | 2018-09-12 | 2019-05-10 | 林华传 | A kind of G9 lamp of COB light source |
-
2019
- 2019-11-21 CN CN201922027531.0U patent/CN211260459U/en active Active
-
2020
- 2020-03-17 EP EP20163568.7A patent/EP3825599B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29923899U1 (en) * | 1999-04-19 | 2001-06-28 | Oshino Lamps Gmbh | Lighting device |
US20110204393A1 (en) * | 2008-11-06 | 2011-08-25 | Rohm Co., Ltd. | Led lamp |
US20110298371A1 (en) * | 2010-06-08 | 2011-12-08 | Cree, Inc. | Led light bulbs |
EP2650589A1 (en) * | 2012-04-12 | 2013-10-16 | Lextar Electronics Corp. | Light emitting device |
CN208846113U (en) * | 2018-09-12 | 2019-05-10 | 林华传 | A kind of G9 lamp of COB light source |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115250252A (en) * | 2022-09-22 | 2022-10-28 | 东莞英脉通信技术有限公司 | Rechargeable portable router |
Also Published As
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CN211260459U (en) | 2020-08-14 |
EP3825599B1 (en) | 2021-10-06 |
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