CN220711707U - High-frequency high-speed anti-interference circuit board for artificial intelligence - Google Patents
High-frequency high-speed anti-interference circuit board for artificial intelligence Download PDFInfo
- Publication number
- CN220711707U CN220711707U CN202322141704.8U CN202322141704U CN220711707U CN 220711707 U CN220711707 U CN 220711707U CN 202322141704 U CN202322141704 U CN 202322141704U CN 220711707 U CN220711707 U CN 220711707U
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- circuit board
- mounting hole
- frequency
- substrate
- interference
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- 238000013473 artificial intelligence Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000012545 processing Methods 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model relates to the technical field of circuit boards and discloses a high-frequency high-speed anti-interference circuit board for artificial intelligence, which comprises a substrate provided with a printed circuit, wherein square mounting holes are formed in the substrate, parallel conducting wires are arranged on one side of each mounting hole, an anti-interference module is arranged on each conducting wire, each anti-interference module comprises a plate-shaped unit plate, the unit plates extend out from the positions of the mounting holes to the rear parts and are perpendicular to the substrate, high-frequency elements are arranged on the unit plates, and metal nets for wrapping the high-frequency elements are arranged on the unit plates. The circuit board utilizes the vertical mounting hole structure to assemble the high-frequency high-speed module on the unit board, so that interference is avoided. The heating element is located the back, increases the radiating effect through penetrating type mounting hole design, increase of service life. The plug connection is convenient to maintain, and the maintenance cost is low. The metal net wraps the high-frequency element, so that the anti-interference capability of the circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-frequency high-speed anti-interference circuit board for artificial intelligence.
Background
The circuit board is often called a Printed Circuit Board (PCB), electronic components are arranged on a board surface according to the design, and are connected through a printed circuit, and the circuit can be directly attached to the surface of the circuit board in a printed circuit mode, so that the connection mode of the circuit board is simple and convenient. However, when some high-frequency or high-speed electronic components are used, the external electromagnetic infection is easily received, and the electronic components are also easily influenced by other adjacent wires or electronic components on the circuit board. In addition, the components on the traditional circuit board are mostly directly welded and connected, so that when the circuit components are damaged, the circuit components are very inconvenient to replace. In addition, in circuit boards such as artificial intelligence, high-frequency or other circuit board elements running at high speed are often used, the heat productivity of the circuit elements is large, the heat dissipation effect of the traditional circuit board structure is poor, and the use of the circuit board is easy to cause interference.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides the high-frequency high-speed anti-interference circuit board for artificial intelligence, which has the advantages that the hollowed-out structure is arranged on the circuit board, the high-frequency element can be assembled on the back of the circuit board, and the high-frequency anti-interference circuit board has a good heat dissipation and ventilation structure.
(II) technical scheme
In order to solve the problems, the utility model provides the following technical scheme: the utility model provides an artificial intelligence is with high-frequency high-speed anti-interference circuit board includes the base plate that is equipped with printed wiring, processing has square mounting hole on the base plate, one side design of mounting hole has the conducting wire side by side, be equipped with anti-interference module on the conducting wire, anti-interference module includes platelike cell board, cell board stretches out from mounting hole position to rear portion perpendicular to base plate, be equipped with high frequency component on the cell board, be equipped with the metal mesh of parcel high frequency component on the cell board. The unit plates are connected in a circuit manner in a plug-in mode through clamping strips for clamping the conductive wires.
Preferably, a notch for clamping is formed in the middle of the clamping strip, and the unit plate is clamped at the edge of the substrate mounting hole provided with the conductive wire through the clamping strip.
Preferably, the conductive wires extend out of the mounting holes, the extending conductive wires are overturned from one side of the mounting holes and attached to the back surface of the substrate, and parallel connecting wires are respectively designed on two sides of the notch of the clamping strip. When the clamping strips are clamped on the edge substrate of the mounting hole, the parallel connecting wires are correspondingly clamped and contacted with the conductive wires.
Preferably, the mounting hole is internally provided with a processing plate before the anti-interference module is assembled, and the conductive wire extending out of the position of the mounting hole is assembled with
Preferably, the connecting wire is attached to the inner side of the clamping strip through an elastic strip.
Preferably, a processing plate is designed in the mounting hole before the anti-interference module is assembled, during processing, a through cutting line is cut on the substrate along the edge of the processing plate, then a conductive wire extending into the processing plate is printed on the substrate, then an insulating film is attached to the surface of the substrate, and finally a tearing edge is processed on the insulating film along the processing plate and the conductive wire part close to the processing plate; when the mounting hole is used, the insulating film is torn, the processing plate is knocked out of the substrate along the cutting line, the conductive wire extends out of the mounting hole, and then the conductive wire is turned from the inside of the mounting hole to the rear part of the substrate.
Preferably, a conductive groove corresponding to the upper conductive wire is designed at the lower part of the edge of the mounting hole of the substrate, a cleaning film is attached in the conductive groove through double-sided adhesive tape, and when the mounting hole is used, the cleaning film is torn, the conductive wire is turned from the mounting hole into the conductive groove and is attached on the double-sided adhesive tape.
(III) beneficial effects
Compared with the prior art, the utility model provides the high-frequency high-speed anti-interference circuit board for artificial intelligence, which has the following beneficial effects:
1. the high-frequency high-speed anti-interference circuit board for artificial intelligence uses a mounting hole structure, and high-frequency or other modules needing high-speed operation are assembled on a vertical unit board, so that high-frequency high-speed electronic components cannot be influenced by electronic components on other circuit substrates.
2. The high-frequency high-speed electronic component is assembled on the vertical unit board at the position of the mounting hole, and the heating element such as high frequency is positioned on the back surface of the base plate and far away from the front element 65 of the base plate; meanwhile, due to the penetrating design of the mounting holes, ventilation is better, so that heat dissipation of the high-frequency high-speed heating elements is facilitated, the use effect of the electric appliance is improved, and the service life of the electric appliance is prolonged.
3. The unit board is connected with the conducting wires of the base plate in a plug-in mode, so that the unit board can be conveniently disassembled, when the components are damaged, the whole circuit board does not need to be replaced, only the unit board and the components on the upper portion of the unit board need to be replaced, and the maintenance and repair cost of equipment can be reduced.
4. The metal net wrapping the high-frequency element is arranged on the unit board, so that external interference electromagnetic can be effectively prevented, and the anti-interference capability of the high-frequency module on the circuit board is greatly improved.
Drawings
Fig. 1 is a schematic diagram of the structure of the front direction of a high-frequency and high-speed anti-interference circuit board for artificial intelligence.
FIG. 2 is a schematic view of the structure of section A-A in FIG. 1.
Fig. 3 is a schematic diagram of the structure of the high-frequency and high-speed anti-interference circuit board for artificial intelligence before use of the mounting hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 and 2, the high frequency and high speed anti-interference circuit board for artificial intelligence includes a substrate 1 having printed wiring thereon, which is similar to a conventional circuit board structure and will not be described in detail herein. Square mounting hole 2 has been processed on the base plate 1, one side of mounting hole 2 is designed to have side by side electric wire 3, be equipped with anti-interference module on the electric wire 3, anti-interference module passes through side by side electric wire 3 inserts the circuit of base plate 1. The anti-interference module comprises a plate-shaped unit plate 4, wherein the unit plate 4 extends out of the mounting hole 2 towards the rear part and is perpendicular to the base plate 1, a high-frequency element 41 is assembled on the unit plate 4, and a metal net 42 for wrapping the high-frequency element is arranged on the unit plate 4; the unit boards 4 are electrically connected in a plug-in manner by means of clamping bars 43 which clamp the conductive wires 3.
The high-frequency high-speed anti-interference circuit board for artificial intelligence is designed with a mounting hole 2 structure, and high-frequency or other modules needing high-speed operation are assembled on a vertical unit board 4 through the mounting hole 2, so that high-frequency high-speed electronic components cannot be influenced by electronic components on other circuit substrates 1. The whole anti-interference performance of the circuit board is improved. Due to the penetrating design of the mounting holes, the ventilation effect is better during ventilation and cooling, the heat dissipation of the high-frequency high-speed heating elements is more convenient, the use effect of the electric appliance is improved, and the service life of the electric appliance is prolonged. In this embodiment, the unit board 4 is connected with the conductive wires 3 of the substrate 1 in a plug-in manner by the clamping strips 43, so that the unit board can be conveniently disassembled, when the high-frequency components 41 are damaged, the whole circuit board does not need to be replaced, only the unit board 4 and the components on the upper part of the unit board need to be replaced, and the maintenance and repair cost of equipment can be reduced. In this embodiment, the metal mesh for wrapping the high-frequency element is mounted on the unit board 4, so that interference of external electromagnetic on the high-frequency element can be effectively prevented, and the anti-interference capability of the high-frequency module on the circuit board is greatly improved.
In a specific design, as shown in fig. 1 and 2, a notch for clamping is designed in the middle of the clamping strip 43, and the unit board 4 is clamped at the edge of the mounting hole 2 of the substrate 1 provided with the conductive wire 3 through the clamping strip 43. The clamping strip 43 clamps the edge of the mounting hole 2 through the upper plate surface and the lower plate surface, and simultaneously wraps the side by side conductive wires 3 integrally, so that the part is not exposed, and the use is safer. Specifically, when the conductive wire 3 is used, the conductive wire 3 extends out from the mounting hole 2, the conductive wire 3 extending out is turned over from one side of the mounting hole 2 and is attached to the back surface of the substrate 1, and two sides of the notch of the clamping strip 43 are respectively provided with a connecting wire 44. Therefore, contact connection of the conductive wires 3 can be simultaneously realized on two sides of the notch of the clamping strip 43, the electric connection is more firm, and the whole use effect of the circuit board is better. In a specific design, as shown in fig. 2, the connecting wire 44 is attached to the inner side of the notch of the clamping strip 43 through an elastic strip 45. In this way, the connecting wire 44 can be elastically pressed against the conductive wire 3 by the elastic strip 45, so that the circuit of the connecting part is ensured to be contacted all the time.
In the specific processing of the structure of this embodiment, as shown in fig. 3, a processing board 21 is designed before the installation hole 2 is assembled with the anti-interference module, during processing, a through cutting line 11 is cut along the edge of the processing board 21 on the substrate 1, then a conductive wire 3 extending into the processing board 21 is printed on the substrate 1, then an insulating film is attached to the surface of the substrate 1, and finally a tearing edge 12 is processed on the insulating film along the processing board 21 and the portion of the conductive wire near the processing board 21. The design makes the substrate 1 convenient to process by adopting the traditional circuit board printing mode. Meanwhile, when the high-frequency module is not needed on the substrate, the processing plate 21 fills the mounting hole 2, so that the substrate 1 can be used as a common circuit board. When the high-frequency circuit in the mounting hole 2 needs to be assembled, the method can be conveniently realized by firstly tearing the insulating film along the tearing edge 12, then knocking the processing board 21 out of the substrate 1 along the cutting line 11, enabling the conductive wire 3 to extend into the mounting hole 2, and finally turning the conductive wire 3 from the mounting hole 2 to the rear part of the substrate 1.
Specifically, a conductive groove 13 corresponding to the conductive wire at the upper part is designed at the lower part of the edge of the mounting hole 2 of the substrate 1, a cleaning film is adhered in the conductive groove 13 through double-sided adhesive tape, when the mounting hole 2 is used, the cleaning film is torn, the conductive wire 3 is turned from the inside of the mounting hole 2 to the inside of the conductive groove 13, and the cleaning film is adhered on the double-sided adhesive tape. At this time, the substrate 1 forms a double-sided electrical terminal structure at the edge of the mounting hole 2, and the connecting circuit of the double-sided electrical terminal structure is also arranged in the notch of the matching clamping strip 43, so that the whole circuit connection is more stable.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an artificial intelligence is with high-frequency high-speed anti-interference circuit board, it includes base plate (1) that is equipped with printed wiring, processing has square mounting hole (2), its characterized in that on base plate (1): a side-by-side conductive wire (3) is arranged on one side of the mounting hole (2), an anti-interference module is assembled on the conductive wire (3), the anti-interference module comprises a plate-shaped unit plate (4), the unit plate (4) extends out of the mounting hole (2) towards the rear part and is perpendicular to the substrate (1), a high-frequency element (41) is assembled on the unit plate (4), and a metal net (42) for wrapping the high-frequency element (41) is assembled on the unit plate (4); the unit plates (4) are connected in a circuit manner in a plug-in manner through clamping strips (43) for clamping the conductive wires (3).
2. The high-frequency and high-speed anti-interference circuit board for artificial intelligence according to claim 1, wherein the circuit board comprises: the middle of the clamping strip (43) is provided with a notch for clamping, and the unit plate (4) is clamped at the edge of the mounting hole (2) of the substrate (1) provided with the conductive wire (3) through the clamping strip (43).
3. The high-frequency and high-speed anti-interference circuit board for artificial intelligence according to claim 1, wherein the circuit board comprises: the conducting wires (3) extend out of the mounting holes (2), the extending conducting wires (3) are overturned from one side of the mounting holes (2) and attached to the back surface of the substrate (1), and the two sides of the notch of the clamping strip (43) are respectively provided with a connecting wire (44).
4. The high-frequency and high-speed anti-interference circuit board for artificial intelligence according to claim 3, wherein the circuit board comprises: the connecting wire (44) is attached to the inner side of the notch of the clamping strip (43) through an elastic strip (45).
5. The high-frequency and high-speed anti-interference circuit board for artificial intelligence according to claim 1, wherein the circuit board comprises: the mounting hole (2) is internally provided with a processing plate (21) before the anti-interference module is assembled, when in processing, a through cutting line (11) is cut on the substrate (1) along the edge of the processing plate (21), then a conductive wire (3) extending into the processing plate (21) is printed on the substrate (1), then an insulating film is attached to the surface of the substrate (1), and finally a tearing edge (12) is processed on the insulating film along the processing plate and a conductive wire part close to the processing plate (21); when the mounting hole (2) is used, the insulating film is torn, the processing plate (21) is knocked out of the substrate (1) along the cutting line (11), the conductive wire (3) extends into the mounting hole (2), and then the conductive wire (3) is turned from the inside of the mounting hole (2) to the rear part of the substrate (1).
6. The high-frequency and high-speed anti-interference circuit board for artificial intelligence according to claim 1, wherein the circuit board comprises: the lower part of the edge of the mounting hole (2) of the substrate (1) is provided with a conductive groove (13) corresponding to the conductive wire at the upper part, a cleaning film is attached in the conductive groove (13) through double-sided adhesive tape, when the mounting hole (2) is used, the cleaning film is torn, and the conductive wire (3) is turned from the inside of the mounting hole (2) to the inside of the conductive groove (13) and is attached on the double-sided adhesive tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322141704.8U CN220711707U (en) | 2023-08-10 | 2023-08-10 | High-frequency high-speed anti-interference circuit board for artificial intelligence |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322141704.8U CN220711707U (en) | 2023-08-10 | 2023-08-10 | High-frequency high-speed anti-interference circuit board for artificial intelligence |
Publications (1)
Publication Number | Publication Date |
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CN220711707U true CN220711707U (en) | 2024-04-02 |
Family
ID=90439062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202322141704.8U Active CN220711707U (en) | 2023-08-10 | 2023-08-10 | High-frequency high-speed anti-interference circuit board for artificial intelligence |
Country Status (1)
Country | Link |
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CN (1) | CN220711707U (en) |
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2023
- 2023-08-10 CN CN202322141704.8U patent/CN220711707U/en active Active
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