CN220697533U - Silicon wafer detecting and removing device - Google Patents

Abstract

The utility model provides a silicon wafer detection and rejection device, and aims to solve the technical problems of low efficiency and high cost when the rear end is rejected by independent equipment in the existing silicon wafer production. The device comprises: the detection mechanism and the rejection mechanism are sequentially arranged according to the silicon wafer transmission direction; a material box component for receiving unqualified silicon wafers is arranged at the discharge end of the rejecting mechanism; the rejecting mechanism comprises: the device comprises a bracket, a transmission frame and an air cylinder; one end of the transmission frame is rotationally connected with the bracket through a rotating shaft, and the other end of the transmission frame is connected with the working end of the air cylinder; the transmission frame can rotate around the rotating shaft within a preset angle range under the drive of the air cylinder, so that unqualified silicon wafers detected by the detection mechanism are poured into the material box assembly. The utility model can simplify the working procedure, improve the production efficiency, save the equipment cost and reduce the fragment rate.

Description

Silicon wafer detecting and removing device

Technical Field

The utility model relates to the technical field of silicon wafer transmission, in particular to a silicon wafer detection and removal device.

Background

On a silicon wafer production line, the silicon wafer needs to be transferred from one station to another station, in the transmission process, the silicon wafer is cracked or greatly offset due to various uncontrollable factors, at present, the silicon wafer is usually transmitted to the rearmost end, and the unqualified silicon wafer is removed independently through unqualified silicon wafer removing equipment arranged at the rearmost end, so that the efficiency is low, the cost is high, and the risk of crushing a product exists when the silicon wafer with a large offset (large angle) reaches the rearmost end and is processed, and the qualification rate of the product is reduced.

Disclosure of Invention

Aiming at the situation, in order to overcome the defects of the prior art, the utility model aims to provide the silicon wafer detection and rejection device, which solves the technical problems of low efficiency and high cost when the rear end is rejected by independent equipment in the existing silicon wafer production.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

a silicon wafer detecting and rejecting device comprises: the detection mechanism and the rejection mechanism are sequentially arranged according to the silicon wafer transmission direction; a material box component for receiving unqualified silicon wafers is arranged at the discharge end of the rejecting mechanism; the rejecting mechanism comprises: the device comprises a bracket, a transmission frame and an air cylinder; one end of the transmission frame is rotationally connected with the bracket through a rotating shaft, and the other end of the transmission frame is connected with the working end of the air cylinder; the transmission frame can rotate around the rotating shaft within a preset angle range under the drive of the air cylinder, so that unqualified silicon wafers detected by the detection mechanism are poured into the material box assembly.

By arranging the rejecting mechanism, unqualified products can be directly rejected in the product transmission process, and independent detection rejecting treatment is not needed to be carried out in the next process, so that the process can be simplified, the production efficiency can be improved, and the equipment cost can be saved. Meanwhile, the large-angle products can be removed into the material box assembly at the front end of transmission, the risk that the large-angle products are damaged in the transmission process is reduced, and the fragmentation rate is reduced.

Optionally, the rejecting mechanism further comprises a second transmission belt and a motor; the second conveying belt and the motor are arranged on the conveying frame, and the second conveying belt is in transmission connection with the motor.

Optionally, the second conveyor belt includes two groups of belts parallel to each other and arranged at intervals, the belts are wound on a plurality of conveying rollers, the conveying rollers are arranged outside the conveying frame, and the belts are driven by a motor arranged below the conveying frame.

Optionally, the support is close to detection mechanism sets up, the lower extreme department of support is provided with the cylinder mount pad.

Optionally, the transmission frame comprises two installation frames which are parallel to each other and are arranged at intervals, one ends of the two installation frames in the same side direction are connected with the rotating shaft, and a connecting rod is connected between the other ends of the two installation frames; the middle part position department of connecting rod is provided with the connecting seat, the movable end of cylinder with the connecting seat is connected.

Optionally, a reinforcing cross plate is connected between the two mounting frames.

Optionally, the cartridge assembly has a cartridge body, and flexible gaskets are provided on the inner side walls and/or the bottom wall of the cartridge body. The flexible gasket arranged on the inner side of the material box assembly can protect the product from being scratched, and the product can be continuously used only by being replaced by front-end equipment, so that the fragment rate is reduced.

Optionally, the magazine subassembly includes the supporting seat and installs the box body on the supporting seat, the box body includes the bottom plate and sets up in the first curb plate of bottom plate both sides, and one end between two first curb plates is connected with the second curb plate, the bottom plate is from being close to the one end downward sloping setting of rejecting mechanism, the second curb plate is located lower one end.

Optionally, the detection mechanism includes a frame, a first conveyor belt mounted on the frame, and a detection assembly.

Optionally, the detection assembly includes a plurality of pick-up boards and sets up the sensor in pick-up board one end, and the sensor is at least four, corresponds with the four angles of the silicon chip on the first conveyer belt respectively. The output end of the sensor is electrically connected with the input end of the controller, and the controller receives the sensor communication data and regulates and controls the action of the cylinder. Through the setting of detecting assembly, can reject the product of wide-angle, there is the risk of breaking up the product when the rear end is handled to avoid the wide-angle product, reduces the fragment rate.

Optionally, the number of the detecting mechanism and the removing mechanism is multiple, the detecting mechanism and the removing mechanism are in butt joint with each other in a group, the running directions of the detecting mechanism and the removing mechanism are consistent, and the length of the material box component is matched with the multiple removing mechanisms. Through the arrangement of a plurality of transmission lines, the transmission efficiency of the silicon wafer is improved, broken and large-angle silicon wafers are removed in the transmission process, and the production efficiency of the silicon wafer is improved.

Compared with the prior art, the utility model has the beneficial effects that:

by arranging the rejecting mechanism, unqualified products can be directly rejected in the product transmission process, and independent detection rejecting treatment is not needed to be carried out in the next process, so that the process can be simplified, the production efficiency can be improved, and the equipment cost can be saved. Meanwhile, the large-angle products can be removed into the material box assembly at the front end of transmission, the risk that the large-angle products are damaged in the transmission process is reduced, and the fragmentation rate is reduced. The flexible gasket arranged on the inner side of the material box assembly can protect the product from being scratched, and the fragment rate is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a side view of the present utility model.

Fig. 2 is a top view of the present utility model.

Fig. 3 is a schematic perspective view of a rejecting mechanism in the present utility model.

Fig. 4 is a top view of the culling mechanism of the present utility model.

Reference numerals:

1. a detection mechanism; 11. a frame; 111. a connecting block; 112. a cross plate; 12. a first conveyor belt; 13. a detection assembly; 131. a detection plate; 132. a sensor;

2. a rejecting mechanism; 21. a bracket; 211. a rotating shaft; 212. a connecting plate; 22. a transmission rack; 221. a mounting frame; 222. a connecting rod; 223. a connecting seat; 224. reinforcing the transverse plate; 23. a second conveyor belt; 231. a belt; 232. a conveying roller; 233. a motor; 24. a cylinder; 241. a cylinder mounting seat; 25. a position sensor;

3. a cartridge assembly; 31. a support base; 32. a case body; 321. a bottom plate; 322. a first side plate; 323. and a second side plate.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in numerous different ways without departing from the spirit or scope of the embodiments of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

In the description of the embodiments of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," "end," "side," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of describing the embodiments of the present application and for simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

In the examples of the present application, unless explicitly specified and limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different implementations, or examples, for implementing different configurations of embodiments of the present utility model. In order to simplify the disclosure of embodiments of the present application, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the embodiments of the present application. Furthermore, the present application embodiments may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed.

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 4, an embodiment of the present utility model provides a silicon wafer detecting and rejecting device, which includes a detecting mechanism 1, a rejecting mechanism 2 and a magazine assembly 3.

The detection mechanism 1 is arranged at the upstream of the rejection mechanism 2 in the material conveying direction, and correspondingly, the material box assembly 3 is arranged at the downstream of the rejection mechanism 2, namely, the feeding end of the rejection mechanism 2 is butted with the discharging end of the detection mechanism 1, the detection mechanism 1 is used for detecting whether the silicon wafer on the silicon wafer conveying belt is qualified, and the rejection mechanism 2 rejects the unqualified silicon wafer detected by the detection mechanism 1 from the conveying belt into the material box assembly 3. In particular, the method comprises the steps of,

the detection mechanism 1 includes a frame 11, a first conveyor belt 12 mounted on the frame 11, and a detection assembly 13. When the silicon wafer removing device is used, one end of the first conveying belt 12, which is far away from the removing mechanism 2, is in butt joint with the silicon wafer assembly line, and when the silicon wafer is conveyed onto the first conveying belt 12 from the silicon wafer assembly line, the detecting component 13 detects whether the silicon wafer on the conveying belt is qualified or not.

The rejecting mechanism 2 comprises a bracket 21, a transmission frame 22, a second transmission belt 23 and a cylinder 24, wherein a rotating shaft 211 is fixedly arranged at one end of the bracket 21, and one end of the transmission frame 22 is rotatably connected with the bracket 21 through the rotating shaft 211, namely, the transmission frame 22 can rotate around the rotating shaft 211. The transmission frame 22 can rotate around the rotating shaft 211 in a preset angle range under the drive of the air cylinder 24 so as to pour the unqualified silicon wafers detected by the detection mechanism 1 into the material box assembly 3.

The second conveying belt 23 is installed on the conveying frame 22, one end of the second conveying belt 23, which is close to the support 21, is in butt joint with the discharging end of the detection mechanism 1, and the discharging end of the second conveying belt 23 is in butt joint with the rear conveying belt or the material box assembly 3. The cylinder 24 is disposed below the transmission frame 22, the working end of the cylinder 24 can drive the transmission frame 22 and the second transmission belt 23 to rotate around the rotation shaft 211 in an integral manner, so that one end of the second transmission belt 23 away from the bracket 21 is in butt joint with the rear transmission belt or the material box assembly 3, that is, when the cylinder 24 does not act, the second transmission belt 23 is in a horizontal position and is in butt joint with the rear transmission belt, and when the cylinder 24 acts, the cylinder 24 drives the second transmission belt 23 to rotate downwards around the rotation shaft 211 to be in an inclined state and is in butt joint with the material box assembly 3. The rear conveyor belt is not shown in the drawing, and is erected above the magazine assembly 3 by a frame, and the upstream end of the rear conveyor belt is butted with the downstream end of the rear end of the second conveyor belt 23.

In actual use, the output end of the detecting component 13 is electrically connected with the input end of the controller, the output end of the controller is electrically connected with the input end of the air cylinder 24, the detecting component 13 transmits a detecting signal to the controller, and the controller judges whether the silicon wafer is qualified or not and regulates and controls the air cylinder 24 according to preset information. When the silicon chip on the detection mechanism 1 is qualified, the rejection mechanism 2 does not act, namely the discharge end of the rejection mechanism 2 is in butt joint with the rear section conveying belt, and the rejection mechanism 2 conveys the qualified silicon chip to the rear section conveying belt; when the silicon wafer on the detected mechanism 1 is unqualified, the discharging end of the rejecting mechanism 2 is in butt joint with the material receiving box assembly 3, and the rejecting mechanism 2 conveys the unqualified silicon wafer into the material receiving box assembly 3.

Optionally, when the silicon chip on many assembly lines needs to be detected, the quantity of detection mechanism 1 and rejection mechanism 2 is a plurality of, and detection mechanism 1 and rejection mechanism 2 are two by two for a set of butt joint, its quantity and the number looks adaptation of assembly line, the discharge end of detection mechanism 1 and the feed end of rejection mechanism 2 butt joint promptly, detection mechanism 1 and the direction of operation of rejection mechanism 2 are unanimous, the length of magazine subassembly 3 and a plurality of rejection mechanism 2 looks adaptations, when cylinder 24 descends, the discharge end of a plurality of rejection mechanism 2 all dock with magazine subassembly 3.

In an embodiment, the transmission frame 22 includes two mounting frames 221 parallel to each other and disposed at intervals, one end of each mounting frame 221 is connected with the bracket 21 through the rotating shaft 211, a connecting rod 222 is connected between the two mounting frames 221 at the other end, and a connecting seat 223 is disposed at the middle position of the connecting rod 222. A connecting plate 212 is installed on one side of the bracket 21, which is located on the transmission frame 22, the cylinder body of the cylinder 24 is connected with the connecting plate 212 through a cylinder installation seat 241, the movable end (piston rod) of the cylinder 24 is connected with a connecting seat 223 at the middle position of the connecting rod 222, and the cylinder 24 drives the transmission frame 22 to rotate around the rotating shaft 211.

Alternatively, the mounting bracket 221 is of a T-shaped configuration.

Further, the second conveyor belt 23 includes two sets of belts 231 disposed parallel to each other and spaced apart, the belts 231 being wound around a plurality of conveyor rollers 232, the belts 231 being driven to revolve around the plurality of conveyor rollers 232 by motors 233 to convey the silicon wafer on the belts 231. Alternatively, the two sets of belts 231 are respectively located outside the two mounting frames 221, i.e., the conveying roller 232 is disposed outside the mounting frame 221 away from the conveying frame 22.

In one embodiment, a reinforcing cross plate 224 is connected between the two mounting brackets 221. The motor 233 is positioned under the reinforcing cross plate 224, and biaxial output ends of the motor 233 are respectively connected with main conveying rollers installed at the lower portion of the mounting frame 221.

In one embodiment, a position sensor 25 is further disposed between the two belts, and the position sensor 25 is electrically connected to the controller, and is used for detecting whether the unqualified silicon wafer is in place. Alternatively, the position sensor 25 is mounted to the upper surface of the reinforcing cross plate 224 by a sensing plate.

In one embodiment, the cartridge assembly 3 includes a support base 31 and a cartridge 32 mounted on the support base 31.

Specifically, the box body 32 includes the bottom plate 321 and sets up in the first side plate 322 of bottom plate 321 both sides, and the one end between two first side plates 322 is connected with the second curb plate 323, and the bottom plate 321 is followed the one end downward sloping setting that is close to the rejection mechanism 2 to the unqualified silicon chip that the rejection mechanism 2 transported smoothly slides into the box body 32 in promptly: one end near the rejecting mechanism 2 is higher than the opposite end, and the second side plate 323 is fixed to the lower end of the bottom plate 321.

Optionally, flexible gaskets are provided on the inner side walls and/or bottom wall of the case 32, i.e., on the side panels and/or bottom panel 321. Preferably, the gasket is a sponge. The sponge gasket can protect the product from being scratched.

Optionally, the bottom plate 321 of the box body 32 is slidably connected with the supporting seat 31, that is, two sliding rails are installed on the supporting seat 31, the two sliding rails are distributed in a slope shape, and the high end and the low end of the bottom plate 321 are slidably connected with the high end and the low end sliding rails respectively.

In an embodiment, the operation principle of the first conveyor belt 12 is basically identical to that of the second conveyor belt 23, that is, the first conveyor belt 12 is also composed of a belt wound on a plurality of conveying rollers and a motor for driving the belt to operate, and the conveying rollers drive the two groups of belts to synchronously move to the prior art, so that the implementation process and the operation principle thereof are not repeated here. It should be noted that the belt of the first conveyor belt 12 is butted with the belt of the second conveyor belt 23.

In an embodiment, the detecting assembly 13 includes a plurality of detecting boards 131 and at least four sensors 132 disposed at one end of the detecting boards 131, where the at least four sensors 132 respectively correspond to four corners of the silicon wafer, that is, the detecting boards 131 are disposed on the outer sides of the first conveying belt 12 in a group, that is, the detecting sensors 132 are disposed on the outer sides of two ends of two belts of the first conveying belt 12.

Specifically, the two sides of the frame 11 are respectively fixed with a connecting block 111, the connecting blocks 111 protrude from the belt of the first conveying belt 12, two adjustable detecting plates 131 are respectively connected to each connecting block 111, one end of each detecting plate 131 is connected with each connecting block 111, the other end of each detecting plate extends to two ends of the belt of the first conveying belt 12, a sensor 132 is arranged at the end part of the detecting plate 131 far away from the connecting block 111, and the sensor 132 is located outside the end part of the first conveying belt 12.

In an embodiment, a transverse plate 112 is fixed between the frames 11, two detection plates 131 are disposed on the transverse plate 112, and sensors 132 are disposed at one ends of the two detection plates 131 far away from the transverse plate 112, where the two sensors 132 are disposed far away from each other, that is: two sensors 132 are located at both ends of the inside of the frame 11.

Optionally, the sensing plate 131 may be adjustable. Specifically, an adjusting groove is formed in the detecting plate 131, positioning holes matched with the adjusting groove are formed in the connecting block 111 and the transverse plate 112 respectively, and the detecting plate 131 passes through the adjusting groove and the positioning holes through the positioning piece to be fixed.

When the silicon wafer processing device is used, the output ends of the sensors 132 are electrically connected with the input end of the controller, the controller receives signals and regulates and controls the air cylinder 24 to act, whether the four corners of the silicon wafer are cracked or the offset is large (large angle) is detected by arranging the sensors at the four corner positions of the silicon wafer, if fragments or large angles occur, the sensor 132 with one corner does not recognize, at the moment, the controller judges that the product needs to be removed, when the unqualified silicon wafer arrives at the second conveying belt 23, the air cylinder 24 descends to convey the silicon wafer into the material box assembly, then the air cylinder 24 ascends, and the second conveying belt 23 returns to horizontal conveying. When the silicon wafer is qualified, the air cylinder 24 is kept motionless, and the rejecting mechanism 2 horizontally transmits the qualified silicon wafer to the rear section conveying belt.

The details of this embodiment are not described in detail, and are known in the art.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that various changes and substitutions are possible within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a silicon chip detects removing devices which characterized in that includes:

the detection mechanism (1) and the rejection mechanism (2) are sequentially arranged according to the silicon wafer transmission direction;

a material box assembly (3) for receiving unqualified silicon wafers is arranged at the discharge end of the rejecting mechanism (2);

the rejecting mechanism (2) comprises: a bracket (21), a transmission frame (22) and a cylinder (24);

one end of the transmission frame (22) is rotationally connected with the bracket (21) through a rotating shaft (211), and the other end of the transmission frame is connected with the working end of the air cylinder (24);

the conveying frame (22) can rotate around the rotating shaft (211) in a preset angle range under the drive of the air cylinder (24) so as to pour the unqualified silicon wafers detected by the detection mechanism (1) into the material box assembly (3).

2. The silicon wafer detecting and removing device according to claim 1, wherein;

the rejecting mechanism (2) further comprises a second conveying belt (23) and a motor (233);

the second transmission belt (23) and the motor (233) are respectively arranged on the transmission frame (22), and the second transmission belt (23) is in transmission connection with the motor (233).

3. The silicon wafer inspection and removal device according to claim 2, wherein the second conveyor belt (23) comprises two groups of belts (231) which are parallel to each other and are arranged at intervals, the belts (231) are wound on a plurality of conveying rollers (232), the conveying rollers (232) are arranged outside the conveying frame (22), and the belts (231) are driven by a motor (233) arranged below the conveying frame (22).

4. The silicon wafer detecting and removing device according to claim 1, wherein the bracket (21) is arranged close to the detecting mechanism (1), and a cylinder mounting seat (241) is arranged at the lower end of the bracket (21).

5. The silicon wafer detecting and removing device according to claim 1, wherein:

the transmission frame (22) comprises two installation frames (221) which are parallel to each other and are arranged at intervals, one ends of the two installation frames (221) in the same side direction are connected with the rotating shaft (211), and a connecting rod (222) is connected between the other ends of the two installation frames (221);

a connecting seat (223) is arranged at the middle position of the connecting rod (222), and the movable end of the air cylinder (24) is connected with the connecting seat (223).

6. The silicon wafer inspection and removal device according to claim 5, wherein a reinforcing cross plate (224) is connected between the two mounting frames (221).

7. The silicon wafer detecting and removing device according to claim 1, wherein the material box assembly (3) is provided with a box body (32), and flexible gaskets are arranged on the inner side wall and/or the bottom wall of the box body (32).

8. The silicon wafer detecting and removing device according to claim 1, wherein the material box assembly (3) comprises a supporting seat (31) and a box body (32) arranged on the supporting seat (31), the box body (32) comprises a bottom plate (321) and first side plates (322) arranged on two sides of the bottom plate (321), one end between the two first side plates (322) is connected with a second side plate (323), the bottom plate (321) is arranged obliquely downwards from one end close to the removing mechanism (2), and the second side plate (323) is arranged at the lower end.

9. The silicon wafer inspection and removal device according to claim 1, wherein the inspection mechanism (1) comprises a frame (11), and a first conveyor belt (12) and an inspection assembly (13) mounted on the frame (11).

10. The silicon wafer detecting and removing device according to claim 9, wherein the detecting assembly (13) comprises a plurality of detecting plates (131) and at least four sensors (132) arranged at one ends of the detecting plates (131), and the sensors (132) respectively correspond to four corners of the silicon wafer on the first conveying belt (12).