CN220674217U - Power amplifier module heat abstractor - Google Patents
Power amplifier module heat abstractor Download PDFInfo
- Publication number
- CN220674217U CN220674217U CN202322059262.2U CN202322059262U CN220674217U CN 220674217 U CN220674217 U CN 220674217U CN 202322059262 U CN202322059262 U CN 202322059262U CN 220674217 U CN220674217 U CN 220674217U
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- amplifier module
- module body
- ventilation
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009423 ventilation Methods 0.000 claims abstract description 48
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- 238000001816 cooling Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The utility model provides a heat dissipation device of a power amplifier module, which comprises: the power amplifier module comprises a bottom plate and a power amplifier module body, wherein the top end of the bottom plate is movably provided with the power amplifier module body, the center of the top inner wall of the power amplifier module body is fixedly provided with a storage groove, the left and right parts of the top side of the power amplifier module body are fixedly provided with radiating fins, the left and right ends of the outer surface of the top side of the power amplifier module body are respectively provided with a ventilation groove, the left and right ends of the outer surface of the top side of the bottom plate are respectively provided with a plurality of ventilation holes, the center of the outer surface of the bottom side of the bottom plate is fixedly provided with a first sliding rail, the left and right ends of the outer surface of the bottom side of the first sliding rail are respectively movably provided with a first sliding block, the other side of the first sliding block is respectively connected with a sliding rod in a rotating shaft in an embedded manner, and the bottom end of the sliding rod is respectively movably connected with a second sliding block. The power amplifier module heat abstractor further improves the heat dissipation effect on a dustproof basis, and timely cools the power amplifier module, so that the heat dissipation and cooling requirements of the high-power amplifier module can be met.
Description
Technical Field
The utility model relates to the technical field of power amplifier modules, in particular to a heat dissipation device of a power amplifier module.
Background
The power amplification module is a power amplification module integrating a switching power supply and a power amplifier. The power amplifier module well solves the interference problem of the switching power supply to the power amplifier, has the characteristics of small power amplifier volume, high efficiency and the like, and has the advantages that the application range is widened, the current power amplifier module dissipates heat by arranging the heat dissipation holes, the dust-proof plate is arranged in the heat dissipation holes to conduct dust-proof treatment, but the dust-proof plate is stained with dust to cause the blockage of the dust-proof plate after being used for a long time, and then the normal heat dissipation of the power amplifier module is impressed.
Aiming at the problems, regarding the technical problems that the power amplifier module is easy to cause the dust to cause the blockage of the dust-proof plate due to the fact that the dust-proof plate is stained with the heat-dissipating holes after being used for a long time, and then the normal heat dissipation of the power amplifier module is impression, through a large amount of searches, the solid-state microwave power amplifier module heat dissipation device with the patent number of CN210986849U is inquired, the problem that the dust-proof plate is blocked due to the fact that the dust-proof plate is stained with the dust after being used for a long time is solved, the normal heat dissipation of the solid-state microwave power amplifier module is affected is solved, the scheme comprises a power amplifier module main body, the two sides of the power amplifier module main body are respectively provided with the heat-dissipating holes, the dust-proof plates are placed in the heat-dissipating holes, the two side inner walls of the power amplifier module main body are respectively provided with bottom grooves, the same bottom plate is arranged in a sliding way, the two sides of the bottom plate are respectively welded with a first spring, the bottom end of the first spring is welded on the bottom inner wall of the bottom groove, the bottom of the bottom plate is welded with an iron block, and an electromagnet is fixedly connected on the inner wall of the bottom of the power amplifier module main body; the utility model has good practicality, the dust on the dust guard is conveniently removed, the normal heat dissipation of the power amplifier module main body is ensured, but the technical scheme provided by the patent is limited in heat dissipation effect, the power amplifier module cannot be cooled in time, and the heat dissipation and cooling requirements of the high-power amplifier module cannot be met.
The utility model further improves the heat dissipation effect on the basis of dust prevention, and timely cools the power amplifier module, so that the heat dissipation and cooling requirements of the high-power amplifier module can be met.
Disclosure of Invention
The utility model aims to solve the technical problems of the background technology and provides a heat dissipation device of a power amplifier module.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a power amplifier module heat sink comprising: the power amplifier module comprises a bottom plate and a power amplifier module body, wherein the top end of the bottom plate is movably provided with the power amplifier module body, the center of the top inner wall of the power amplifier module body is fixedly provided with a storage groove, the left and right parts of the top side of the power amplifier module body are fixedly provided with radiating fins, the left and right ends of the top side outer surface of the power amplifier module body are respectively provided with a ventilation groove, the left and right ends of the top side outer surface of the bottom plate are respectively provided with a plurality of ventilation holes, the center of the bottom side outer surface of the bottom plate is fixedly provided with a first sliding rail, the left and right ends of the bottom side outer surface of the first sliding rail are respectively movably provided with a first sliding block, the other side of the first sliding block is respectively and rotatably connected with a sliding rod, the middle part of the sliding rod is provided with a rotating shaft, the bottom end of the sliding rod is respectively and movably connected with a second sliding block, the bottom end of the second sliding rod is fixedly provided with a second sliding rail, the bottom side outer surface of the second sliding rail is fixedly provided with a fixing seat, the left and right parts of the top side outer surface of the bottom plate are respectively and movably provided with a first dust screen, and one end of the first dust screen is far away from the second dust screen.
Further preferred embodiments are as follows: the inside of the storage groove is used for placing a semiconductor refrigerating sheet.
Further preferred embodiments are as follows: the number of the radiating fins is 16, the radiating fins are inclined radiating fins with axisymmetric structures, and the thickness of each inclined radiating fin is 5mm.
Further preferred embodiments are as follows: the positions of the ventilation grooves are positioned at the bottom ends of the cooling fins, and the number of the ventilation grooves is equal to the number of the cooling fins.
Further preferred embodiments are as follows: and the two sides of the left end and the right end of the first sliding rail and the second sliding rail, which are close to the rotating shaft, are provided with stop blocks.
Further preferred embodiments are as follows: the ventilation holes are positioned right below the ventilation grooves, the distribution length of the ventilation holes is equal to the length of the ventilation grooves, and the maximum aperture of the ventilation holes is equal to the width of the ventilation grooves.
Further preferred embodiments are as follows: the density and the aperture of the second dustproof net are smaller than those of the first dustproof net.
The beneficial effects are that:
1. the heat dissipation device is provided with the radiating fins, the ventilation grooves and the ventilation holes, the ventilation grooves are formed in the bottom ends of the radiating fins, the two sides of the radiating fins dissipate heat together, the ventilation holes are formed right below the ventilation grooves, and the range of dust accumulation inside can be reduced when the radiating fins are matched with the ventilation grooves to dissipate heat;
2. the second dust screen and the first dust screen are arranged, the first dust screen intercepts larger dust particles for the first time in the heat dissipation process, the larger dust particles are intercepted above the air holes, and the smaller dust particles are further intercepted by the second dust screen for the second time, so that the possibility that dust enters the power amplifier module is reduced;
3. the power amplifier module comprises a power amplifier module, a first sliding rail, a second sliding rail, a first sliding block, a second sliding block, a first sliding rail, a second sliding rail, a rotating shaft, a first sliding rail and a second sliding rail, wherein the sliding rod is arranged in a crossing manner through the rotating shaft;
4. in summary, according to the power amplifier module heat dissipation device, the heat dissipation effect is further improved on a dustproof basis through the structures of the heat dissipation fin, the ventilation groove, the ventilation holes, the second dustproof net, the first dustproof net, the sliding rod, the rotating shaft, the first sliding block, the second sliding block, the first sliding rail and the second sliding rail and the like, and the power amplifier module is cooled in time, so that the heat dissipation and cooling requirements of the high-power amplifier module can be met.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic diagram of a power amplifier module body structure according to the present utility model.
Fig. 3 is a schematic side view of a power amplifier module according to the present utility model.
Fig. 4 is an enlarged schematic view of the structure of fig. 1 a according to the present utility model.
In fig. 1-4: the power amplifier comprises a 1-bottom plate, a 2-power amplifier module body, a 3-storage groove, 4-radiating fins, 5-ventilation grooves, 6-ventilation holes, 7-first sliding rails, 8-first sliding blocks, 9-sliding rods, 10-rotating shafts, 11-second sliding blocks, 12-second sliding rails, 13-fixing seats, 14-first dustproof nets and 15-second dustproof nets.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to fig. 1 to fig. 4 in the embodiments of the present utility model.
Referring to fig. 1 to 4, in an embodiment of the present utility model, a heat dissipation device for a power amplifier module includes: the power amplifier module comprises a base plate 1 and a power amplifier module body 2, wherein the power amplifier module body 2 is movably arranged at the top end of the base plate 1, a storage groove 3 is fixedly arranged at the center of the top inner wall of the power amplifier module body 2, radiating fins 4 are fixedly arranged at the left and right parts of the top side of the power amplifier module body 2, ventilation grooves 5 are formed in the left and right ends of the top side outer surface of the power amplifier module body 2, a plurality of ventilation holes 6 are formed in the left and right ends of the top side outer surface of the base plate 1, a first sliding rail 7 is fixedly arranged at the center of the bottom side outer surface of the base plate 1, a first sliding block 8 is movably arranged at the left and right ends of the bottom side outer surface of the first sliding rail 7, a sliding rod 9 is rotatably connected to the other side of the first sliding block 8, a rotating shaft 10 is embedded in the middle of the sliding rod 9, a second sliding block 11 is movably connected to the bottom end of the sliding rod 9, a second sliding rail 12 is fixedly arranged at the bottom end of the second sliding rod 11, a fixing seat 13 is fixedly arranged at the bottom end of the second sliding rail 12, a first dust screen 14 is movably arranged at the left and right parts of the top side outer surface of the base plate 1, a second dust screen 15 is movably arranged at one end of the first dust screen 14, and a second dust screen 15 is movably arranged at the end far away from the ventilation holes 6.
In the embodiment of the utility model, the semiconductor refrigerating sheet is arranged in the object placing groove 3, no refrigerant is needed for the semiconductor refrigerating sheet, no pollution source exists, the accurate temperature control is in the range of 0.1 ℃, the installation is convenient, and the service life is long.
In the embodiment of the utility model, the number of the radiating fins 4 is 16, the radiating fins 4 are inclined radiating fins with axisymmetric structures, the thickness of each inclined radiating fin is 5mm, and the radiating fins can be arranged in two directions, so that the radiating effect is good.
In the embodiment of the utility model, the positions of the ventilation grooves 5 are positioned at the bottom ends of the cooling fins 4, the number of the ventilation grooves 5 is equal to that of the cooling fins 4, the ventilation effect is good, and the ventilation grooves can circulate with air, thereby being beneficial to cooling and heat dissipation inside.
In the embodiment of the utility model, the two sides of the left and right ends of the first slide rail 7 and the second slide rail 12, which are close to the rotating shaft 10, are respectively provided with a stop block for limiting the moving range of the first slide block 8 and the second slide block 11 and ensuring the normal use of the rotating shaft 10 and the slide rod 9.
In the embodiment of the utility model, the ventilation holes 6 are positioned right below the ventilation grooves 5, the distribution length of the ventilation holes 6 is equal to the length of the ventilation grooves 5, the maximum aperture of the ventilation holes 6 is equal to the width of the ventilation grooves 5, and dust entering from the ventilation grooves 5 directly falls from the ventilation holes 6 in the falling process, so that dust accumulation is avoided.
In the embodiment of the utility model, the density and the aperture of the second dust screen 15 are smaller than those of the first dust screen 14, so that dust in air is trapped, and the dust is prevented from entering the power amplifier module body 2 to influence the normal operation of equipment.
Working principle: this kind of device, in the in-process that uses, fin 4 carries out daily heat dissipation operation with ventilation groove 5, the steam rises, circulate from fin 4 and ventilation groove 5's direction, when the inside temperature of power amplifier module body 2 is too high, the semiconductor refrigeration piece in the thing groove 3 begins refrigeration work, the inside of power amplifier module body 2 carries out the cooling treatment, simultaneously, slide bar 9 is under the drive of axis of rotation 10, first slider 8 and second slider 11 are in the inside of first slide rail 7 and second slide rail 12, the direction of axis of rotation 10 is removed, bottom plate 1 rises gradually, along with the refrigeration operation of semiconductor refrigeration piece, the cold air begins to sink, the air flows from bleeder vent 6's direction, the dust also drops along with it from bleeder vent 6, the in-process of air circulation, cold and hot air is in turn, in order to prevent dust entering power amplifier module body 2's inside, first dust screen 14 and second dust screen 15 can hold back the dust in the air, avoid the dust to get into the inside of power amplifier module body 2.
Claims (7)
1. A power amplifier module heat sink comprising: bottom plate (1) and power amplifier module body (2), the top movable mounting of bottom plate (1) has power amplifier module body (2), its characterized in that: the utility model discloses a dustproof device, including power amplifier module body (2), including top inner wall central authorities fixed mounting of power amplifier module body (2), top inner wall central authorities fixed mounting of power amplifier module body (2) has put thing groove (3), both sides all fixed mounting has fin (4) about the top side of power amplifier module body (2), ventilation groove (5) have all been seted up at both ends about the top side surface of power amplifier module body (2), a plurality of bleeder vent (6) have all been seted up at both ends about the top side surface of bottom plate (1), bottom side surface central authorities fixed mounting of bottom plate (1) has first slide rail (7), both ends all movable mounting have first slider (8 about the bottom side surface of first slide rail (7), the opposite side of first slider (8) is all rotated and is connected with slide bar (9), the mid-mounting of slide bar (9) has axis of rotation (10), the equal swing joint of bottom of slide bar (9) has second slider (11), the bottom fixed mounting of second slider (11) has second slide rail (12), bottom side surface fixed mounting of second slide rail (12) has bottom side surface fixed mounting (13), first end (14) are kept away from on the left and right side surface of first end (14) is kept away from first end (14).
2. The power amplifier module heat sink of claim 1, wherein: the inside of the storage groove (3) is used for placing a semiconductor refrigerating sheet.
3. The power amplifier module heat sink of claim 1, wherein: the number of the radiating fins (4) is 16, the radiating fins (4) are inclined radiating fins with axisymmetric structures, and the thickness of each inclined radiating fin is 5mm.
4. The power amplifier module heat sink of claim 1, wherein: the positions of the ventilation grooves (5) are located at the bottom ends of the radiating fins (4), and the number of the ventilation grooves (5) is equal to the number of the radiating fins (4).
5. The power amplifier module heat sink of claim 1, wherein: and one side, close to the rotating shaft (10), of the left end and the right end of the first sliding rail (7) and the second sliding rail (12) is provided with a stop block.
6. The power amplifier module heat sink of claim 1, wherein: the ventilation holes (6) are positioned right below the ventilation grooves (5), the distribution length of the ventilation holes (6) is equal to the length of the ventilation grooves (5), and the maximum aperture of the ventilation holes (6) is equal to the width of the ventilation grooves (5).
7. The power amplifier module heat sink of claim 1, wherein: the density and the pore diameter of the second dustproof net (15) are smaller than those of the first dustproof net (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322059262.2U CN220674217U (en) | 2023-08-02 | 2023-08-02 | Power amplifier module heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322059262.2U CN220674217U (en) | 2023-08-02 | 2023-08-02 | Power amplifier module heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220674217U true CN220674217U (en) | 2024-03-26 |
Family
ID=90328099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322059262.2U Active CN220674217U (en) | 2023-08-02 | 2023-08-02 | Power amplifier module heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220674217U (en) |
-
2023
- 2023-08-02 CN CN202322059262.2U patent/CN220674217U/en active Active
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| GR01 | Patent grant |