CN211152602U - Electromechanical device heat abstractor - Google Patents
Electromechanical device heat abstractor Download PDFInfo
- Publication number
- CN211152602U CN211152602U CN202020121824.5U CN202020121824U CN211152602U CN 211152602 U CN211152602 U CN 211152602U CN 202020121824 U CN202020121824 U CN 202020121824U CN 211152602 U CN211152602 U CN 211152602U
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- Prior art keywords
- heat
- cover plate
- electromechanical device
- mounting frame
- plate body
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Abstract
The utility model discloses an electromechanical device heat abstractor of electromechanical device technical field, include: a mounting frame; the heat conducting plate assembly is arranged in the inner cavity of the mounting frame; the heat pipes are vertically and uniformly arranged at the top of the heat conducting plate assembly; the cover plate is mounted on the top of the mounting frame through bolts and sleeved on the outer walls of the heat pipes; two drive assembly, two install a left side right side drive assembly the top left and right sides middle-end of apron, drive assembly's bottom is run through the bottom of apron is pegged graft on the installation frame, drive assembly with heat-conducting plate subassembly is connected, the utility model discloses can adapt to the electromechanical device of different models, to the electromechanical device of different models heat dissipation of cooling down, reduce electromechanical device's use cost.
Description
Technical Field
The utility model relates to an electromechanical device technical field specifically is an electromechanical device heat abstractor.
Background
The electromechanical equipment generally refers to machinery, electrical equipment and electrical automation equipment, and in a building, the electromechanical equipment is generally called machinery and pipeline equipment except for earthwork, carpentry, reinforcing steel bars and muddy water. Different from hardware, the product can realize certain functions.
The existing electromechanical equipment needs heat dissipation equipment to dissipate heat of the electromechanical equipment in the using process so as to ensure the normal work of the electromechanical equipment.
The heat dissipation devices on the existing electromechanical equipment are all customized according to the electromechanical equipment, and different heat dissipation devices need to be customized for electromechanical equipment of different models, so that the use cost of the electromechanical equipment is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electromechanical device heat abstractor to solve the heat abstractor on the current electromechanical device who provides in the above-mentioned background art and all customize according to electromechanical device, the electromechanical device of different models needs the different heat abstractor of customization, has improved electromechanical device's use cost's problem.
In order to achieve the above object, the utility model provides a following technical scheme: an electromechanical device heat sink comprising:
a mounting frame;
the heat conducting plate assembly is arranged in the inner cavity of the mounting frame;
the heat pipes are vertically and uniformly arranged at the top of the heat conducting plate assembly;
the cover plate is mounted on the top of the mounting frame through bolts and sleeved on the outer walls of the heat pipes;
the two transmission assemblies are arranged at the middle ends of the left side and the right side of the top of the cover plate in a left-right mode, the bottom of each transmission assembly penetrates through the bottom of the cover plate and is inserted into the mounting frame, and the transmission assemblies are connected with the heat conducting plate assemblies;
the thermoelectric refrigerating piece is embedded at the bottom of the inner cavity of the mounting frame;
four shock pads, four the shock pad is installed the bottom four corners of installation frame.
Preferably, the mounting frame comprises:
mounting a frame body;
the two moving grooves are arranged at the middle ends of the left side and the right side of the inner cavity of the mounting frame body in a left-right mode;
the four sliding grooves are formed in the front end and the rear end of the left side and the right side of the inner cavity of the installation frame body;
four screw holes, four the screw hole is seted up and is being established the top four corners of installation frame body.
Preferably, the heat-conducting plate assembly comprises:
a heat conducting plate body;
the two moving blocks are arranged at the middle ends of the left side and the right side of the heat-conducting plate body from left to right;
four sliding blocks, four the sliding block sets up the front and back both ends of the left and right sides of heat-conducting plate body.
Preferably, the cover plate includes:
a cover plate body;
the four first mounting holes are formed in four corners of the top of the cover plate body and penetrate through the bottom of the cover plate body;
the first two second mounting holes are arranged at the middle ends of the left side and the right side of the top of the cover plate body in a left-right mode, and the second mounting holes penetrate through the bottom of the cover plate body;
the positioning holes are evenly formed in the top of the cover plate body, the positioning holes are formed in the inner sides of the four first mounting holes and the two second mounting holes, and the positioning holes penetrate through the bottom of the cover plate body.
Preferably, the transmission assembly comprises:
the rotating piece is a T-shaped rotating piece;
the spring balls are uniformly embedded on the outer wall of the rotating piece in an annular shape;
and the screw rod is vertically welded at the bottom of the rotating piece.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses can adapt to the electromechanical device of different models, the electromechanical device to different models cools down the heat dissipation, the use cost of electromechanical device has been reduced, electromechanical device places in the inner chamber of installation frame body, manual rotatory rotating member, it is rotatory to drive the screw rod through the rotating member, it reciprocates to drive the movable block through the screw rod, it removes to drive the heat-conducting plate body through the movable block, make the top and the electromechanical device contact of heat-conducting plate body, so as to adapt to the electromechanical device's of different models height, the heat transfer that produces in the electromechanical device course of operation is to the heat-conducting plate body, the heat passes through the heat-conducting plate body and transmits on the heat pipe, dispel the heat through the heat pipe, derive the heat on the electromechanical device and dispel in.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the structure of the mounting frame of the present invention;
FIG. 3 is a schematic structural view of the heat conducting plate assembly of the present invention;
FIG. 4 is a schematic view of the cover plate structure of the present invention;
fig. 5 is a schematic structural view of the transmission assembly of the present invention.
In the figure: 100 mounting frames, 110 mounting frame bodies, 120 moving grooves, 130 sliding grooves, 140 threaded holes, 200 heat conducting plate components, 210 heat conducting plate bodies, 220 moving blocks, 230 sliding blocks, 300 heat pipes, 400 cover plates, 410 cover plate bodies, 420 first mounting holes, 430 second mounting holes, 440 positioning holes, 500 transmission components, 510 rotating parts, 520 spring balls and 530 screws.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides an electromechanical device heat abstractor can adapt to electromechanical devices of different models, cools down and dissipates heat to electromechanical devices of different models, reduces the use cost of electromechanical devices, please refer to fig. 1, which comprises an installation frame 100, a heat conducting plate component 200, a heat pipe 300, a cover plate 400 and a transmission component 500;
referring to fig. 1-2, the mounting frame 100 includes:
the mounting frame body 110 is stainless steel;
the two moving grooves 120 are arranged at the middle ends of the left side and the right side of the inner cavity of the mounting frame body 110, and the two moving grooves 120 are symmetrical and parallel;
the four sliding chutes 130 are arranged at the front end and the rear end of the left side and the right side of the inner cavity of the mounting frame body 110, the two sliding chutes 130 on the left side of the inner cavity of the mounting frame body 110 are symmetrical and parallel to the two sliding chutes 130 on the right side of the inner cavity of the mounting frame body 110, the two sliding chutes 130 on the left side of the inner cavity of the mounting frame body 110 are symmetrical and parallel to the moving chute 120 on the left side of the inner cavity of the mounting frame body 110, the two sliding chutes 130 on the right side of the inner cavity of the mounting frame body 110 are symmetrical and parallel to the moving chute 120 on the right side of the inner cavity of the mounting frame;
four screw holes 140 are formed at four corners of the top of the mounting frame body 110;
referring to fig. 1 to 3, a heat-conducting plate assembly 200 is installed in an inner cavity of the mounting frame 100, the heat-conducting plate assembly 200 including:
the outer periphery of the heat-conducting plate body 210 is in contact with the inner four walls of the mounting frame body 110;
the two moving blocks 220 are arranged at the middle ends of the left side and the right side of the heat-conducting plate body 210 one by one, the top of the moving block 220 is provided with a thread groove, the thread groove penetrates through the bottom of the moving block 220, the two moving blocks 220 correspond to the two moving grooves 120 one by one, the moving blocks 220 are matched with the moving grooves 120, the moving blocks 220 are inserted into the inner side of the moving grooves 120, and the heat-conducting plate body 210 moves up and down in the inner side of the mounting frame body 110 through the matching of the moving blocks 220 and the moving grooves 120;
the four sliding blocks 230 are arranged at the front and rear ends of the left and right sides of the heat conducting plate body 210, the four sliding blocks 230 correspond to the four sliding grooves 130 one by one, the sliding blocks 230 are matched with the sliding grooves 130, the sliding blocks 230 are inserted into the inner side of the sliding grooves 130, and the heat conducting plate body 210 is movably mounted on the inner side of the mounting frame body 110 by the matching use of the sliding blocks 230 and the sliding grooves 130;
referring to fig. 1, 3 and 4 again, a plurality of heat pipes 300 are vertically and uniformly installed on the top of the thermal conductive plate body 210, and the thermal conductive plate body 210 drives the heat pipes 300 to move up and down;
referring to fig. 1 to 4, a cover plate 400 is mounted on the top of the mounting frame 100 by bolts, the cover plate 400 is sleeved on the outer wall of the plurality of heat pipes 300, and the cover plate 400 includes:
the bottom of the cover plate body 410 is in contact with the top of the mounting frame body 110, and the cover plate body 410 is at the upper end of the heat conductive plate body 210;
four first mounting holes 420 are formed in four corners of the top of the cover plate body 410, the first mounting holes 420 penetrate through the bottom of the cover plate body 410, the four first mounting holes 420 correspond to the four threaded holes 140 one by one, the four first mounting holes 420 penetrate through the first mounting holes 420 through bolts and are screwed in the inner sides of the threaded holes 140 through threaded connection, and the cover plate body 410 is fixedly mounted on the top of the mounting frame body 110 through the matching use of the bolts, the first mounting holes 420 and the threaded holes 140;
the two second mounting holes 430 are arranged at the middle ends of the left side and the right side of the top of the cover plate body 410 one by one, the second mounting holes 430 penetrate through the bottom of the cover plate body 410, and the two second mounting holes 430 correspond to the two moving grooves 120 one by one;
the plurality of positioning holes 440 are uniformly formed in the top of the cover plate body 410, the plurality of positioning holes 440 are formed in the inner sides of the four first mounting holes 420 and the two second mounting holes 430, the positioning holes 440 penetrate through the bottom of the cover plate body 410, the plurality of positioning holes 440 correspond to the plurality of heat pipes 300 one by one, and the heat pipes 300 are inserted into the inner sides of the positioning holes 440 and penetrate through the positioning holes 440;
referring to fig. 1 to 5, two driving members 500 are installed at the middle ends of the left and right sides of the top of the cover plate 400, the bottom of the driving member 500 penetrates the bottom of the cover plate 400 and is inserted into the mounting frame 100, the driving member 500 is connected to the heat conducting plate assembly 200, and the driving member 500 includes:
the rotating member 510 is a T-shaped rotating member, the rotating member 510 is matched with the second mounting hole 430, and the rotating member 510 is inserted into the inner side of the second mounting hole 430 and penetrates through the second mounting hole 430;
the spring balls 520 are uniformly embedded on the outer wall of the rotating piece 510 in an annular shape, the spring balls 520 are clamped at the inner side of the second mounting hole 430, the rotating piece 510 is mounted at the inner side of the second mounting hole 430 through the spring balls 520, and the rotating piece 510 can rotate at the inner side of the second mounting hole 430 through the spring balls 520;
the screw 530 is vertically welded at the bottom of the rotating member 510, the screw 530 is fixedly installed at the inner side of the moving groove 120 through the rotating member 510, the screw 530 is matched with a thread groove on the moving block 220, the moving block 220 is installed on the outer wall of the screw 530 through thread connection, the screw 530 is driven to rotate through the rotating member 510, the moving block 220 is driven to move up and down through the rotation of the screw 530 (lead screw transmission principle), and the heat-conducting plate body 210 is driven to move up and down through the moving block 220 so as to adapt to the heights of electromechanical devices of different models;
referring to fig. 1 again, the thermoelectric cooling plate 600 is embedded at the bottom of the inner cavity of the mounting frame 100, and the electromechanical device can be cooled more quickly by the thermoelectric cooling plate 600;
referring back to fig. 1, four shock absorbing pads 700 are mounted at the four corners of the bottom of the mounting frame 100.
When the heat pipe heat dissipation device is used specifically, the electromechanical device is placed in the inner cavity of the installation frame body 110, the rotating part 510 is rotated manually, the rotating part 510 drives the screw 530 to rotate, the screw 530 drives the moving block 220 to move up and down, the heat conduction plate body 210 is driven to move through the moving block 220, the top of the heat conduction plate body 210 is in contact with the electromechanical device, heat generated in the working process of the electromechanical device is transferred to the heat conduction plate body 210, the heat is transferred to the heat pipe 300 through the heat conduction plate body 210, the heat is dissipated through the heat pipe 300, heat on the electromechanical device is conducted out and dissipated into the air, and therefore the temperature on the electromechanical.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides an electromechanical device heat abstractor which characterized in that: the method comprises the following steps:
a mounting frame (100);
a heat conducting plate assembly (200), wherein the heat conducting plate assembly (200) is installed in an inner cavity of the installation frame (100);
a plurality of heat pipes (300), wherein the plurality of heat pipes (300) are vertically and uniformly arranged on the top of the heat conducting plate assembly (200);
the cover plate (400), the cover plate (400) is installed on the top of the installation frame (100) through bolts, and the cover plate (400) is sleeved on the outer wall of the heat pipes (300);
the two transmission assemblies (500) are arranged at the middle ends of the left side and the right side of the top of the cover plate (400) one by one, the bottom of each transmission assembly (500) penetrates through the bottom of the cover plate (400) and is inserted into the mounting frame (100), and the transmission assemblies (500) are connected with the heat conducting plate assembly (200);
the thermoelectric refrigerating sheet (600), the thermoelectric refrigerating sheet (600) is embedded at the bottom of the inner cavity of the mounting frame (100);
four shock pads (700), four shock pads (700) are installed in the bottom four corners of installation frame (100).
2. The electromechanical device heat sink of claim 1, wherein: the mounting frame (100) comprises:
a mounting frame body (110);
the two moving grooves (120) are arranged at the middle ends of the left side and the right side of the inner cavity of the mounting frame body (110) in a left-right mode;
the four sliding grooves (130) are formed in the front end and the rear end of the left side and the right side of the inner cavity of the mounting frame body (110);
the four threaded holes (140) are formed in four corners of the top of the mounting frame body (110).
3. The electromechanical device heat sink of claim 1, wherein: the heat conducting plate assembly (200) comprises:
a heat-conductive plate body (210);
the two moving blocks (220) are arranged at the middle ends of the left side and the right side of the heat-conducting plate body (210) in a left-right mode;
four sliding blocks (230), four sliding blocks (230) are arranged at the front end and the rear end of the left side and the right side of the heat conducting plate body (210).
4. The electromechanical device heat sink of claim 1, wherein: the cover plate (400) includes:
a cover body (410);
the four first mounting holes (420) are formed in four corners of the top of the cover plate body (410), and the first mounting holes (420) penetrate through the bottom of the cover plate body (410);
the two second mounting holes (430), one of the two second mounting holes (430) is arranged at the middle ends of the left side and the right side of the top of the cover plate body (410), and the second mounting holes (430) penetrate through the bottom of the cover plate body (410);
the positioning holes (440) are uniformly formed in the top of the cover plate body (410), the positioning holes (440) are formed in the inner sides of the four first mounting holes (420) and the two second mounting holes (430), and the positioning holes (440) penetrate through the bottom of the cover plate body (410).
5. The electromechanical device heat sink of claim 1, wherein: the transmission assembly (500) comprises:
a rotating member (510), the rotating member (510) being a T-shaped rotating member;
a plurality of spring beads (520), wherein the spring beads (520) are uniformly embedded on the outer wall of the rotating piece (510) in a ring shape;
a screw (530), wherein the screw (530) is vertically welded at the bottom of the rotating member (510).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020121824.5U CN211152602U (en) | 2020-01-19 | 2020-01-19 | Electromechanical device heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020121824.5U CN211152602U (en) | 2020-01-19 | 2020-01-19 | Electromechanical device heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211152602U true CN211152602U (en) | 2020-07-31 |
Family
ID=71754802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020121824.5U Expired - Fee Related CN211152602U (en) | 2020-01-19 | 2020-01-19 | Electromechanical device heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211152602U (en) |
-
2020
- 2020-01-19 CN CN202020121824.5U patent/CN211152602U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200731 Termination date: 20210119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |