CN220672585U

CN220672585U - LED display device

Info

Publication number: CN220672585U
Application number: CN202321762187.XU
Authority: CN
Inventors: 方璋文; 吴子鑫; 纪洋; 钟柏达; 于沛泳; 李泽林; 王洪彬; 黄玉萍; 植富梅; 何加劲
Original assignee: Dongguan Fanyuan Electronic Technology Co ltd
Current assignee: Dongguan Fanyuan Electronic Technology Co ltd
Priority date: 2023-07-06
Filing date: 2023-07-06
Publication date: 2024-03-26
Anticipated expiration: 2033-07-06

Abstract

The utility model relates to an LED display device, which comprises a transparent film, wherein a plurality of groups of circuits are arranged on the transparent film, and O European resistors are connected among the groups of circuits to realize a cross circuit; connecting a plurality of LED chips on a plurality of groups of the circuits; and coating a transparent silica gel protective layer on the transparent film to cover the circuit, the O European resistor and the LED chip. The utility model aims to overcome the defects of the prior art and provide an LED display device which realizes portable, bendable and foldable and transparent display.

Description

LED display device

Technical Field

The present utility model relates to an LED display device.

Background

The flexible transparent display screen is accompanied with the development of OLED (organic light emitting diode) technology, but the cost cannot be reduced due to the complex manufacturing process, and the flexible transparent display screen is displayed by adopting organic materials, so that the service life is short and the application range is narrow. An LED display device is therefore proposed in view of the above problems.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide an LED display device which realizes portable, bendable and foldable and transparent display.

The technical scheme for achieving the purpose is as follows: an LED display device comprises a transparent film, wherein a plurality of groups of circuits are arranged on the transparent film, and O European resistors are connected among the groups of circuits to realize a cross circuit; connecting a plurality of LED chips on a plurality of groups of the circuits; and coating a transparent silica gel protective layer on the transparent film to cover the circuit, the O European resistor and the LED chip.

Preferably, each set of said circuits comprises a connection terminal electrode and a conductive electrode.

Preferably, the transparent film is made of PET.

Preferably, the O ohm resistor is welded with the circuit.

Preferably, the LED chip is soldered to the circuit.

The beneficial effects of the utility model are as follows: the LED (light emitting diode) chip is fixedly crystallized on the flexible film electrode by utilizing an integrated packaging technology of Micro LEDs (LED miniaturization and matrixing technology), and then is encapsulated by glue filling, so that the flexible Micro LED array device with the characteristics of transparency, thinness, high brightness and the like is formed.

Drawings

FIG. 1 is a schematic illustration of a transparent film of the present utility model;

FIG. 2 is a schematic diagram of the circuit of the present utility model;

FIG. 3 is a schematic diagram of the connection of the O European resistor of the present utility model;

FIG. 4 is a schematic diagram of the connection of the LED chips of the present utility model;

FIG. 5 is a schematic view of a transparent silica gel protective layer according to the present utility model.

In the figure: 1. a transparent film; 2. a circuit; 3. an O ohm resistor; 4. an LED chip; 5. a transparent silica gel protective layer; 21. connecting terminal electrodes; 22. and a conductive electrode.

Detailed Description

The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying positive importance.

The utility model will be further described with reference to the accompanying drawings.

As shown in fig. 1-5, an LED display device includes a transparent film 1, a plurality of groups of circuits 2 are disposed on the transparent film 1, a conductive layer is fabricated on the transparent film 1 by electroplating, sputtering, evaporating and other processes, patterns of the circuits 2 are fabricated by photolithography, laser, etching and other devices, an O ohm resistor 3 is connected between the plurality of groups of circuits 2 to realize a cross circuit, and a die bonding technique is used to weld the 0 ohm resistor 3 to the circuit; connecting a plurality of LED chips 4 on a plurality of groups of circuits 2, and welding the LED chips 4 to the circuits by using a die bonding technology; a transparent silicone protective layer 5 is coated on the transparent film 1, covering the circuit 2, the O-ohm resistor 3 and the LED chip 4. Each group of circuits 2 includes one connection terminal electrode 21 and a conductive electrode 22. The transparent film 1 is made of PET (polyethylene terephthalate); the Polyimide (PI) material may be used. The O European resistor 3 is connected with the circuit 2 in a welding way. The LED chip 4 is soldered to the circuit 2.

The LED display device utilizes Micro LED (light emitting diode) integration packaging technology to fix LED (light emitting diode) chips on a flexible film electrode, and then the flexible Micro LED array device with the characteristics of transparency, thinness, high brightness and the like is formed through glue filling packaging.

The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims

1. An LED display device is characterized by comprising a transparent film (1), wherein a plurality of groups of circuits (2) are arranged on the transparent film (1), and O ohm resistors (3) are connected among the groups of circuits (2) to realize a cross circuit; connecting a plurality of LED chips (4) to a plurality of groups of the circuits (2); and a transparent silica gel protective layer (5) is coated on the transparent film (1) to cover the circuit (2), the O ohm resistor (3) and the LED chip (4).

2. LED display device according to claim 1, characterized in that each set of said circuits (2) comprises a connection terminal electrode (21) and a conductive electrode (22).

3. The LED display device according to claim 1, characterized in that the transparent film (1) is PET material.

4. LED display device according to claim 1, characterized in that the O-ohm resistor (3) is soldered to the circuit (2).

5. LED display device according to claim 1, characterized in that the LED chip (4) is soldered to the circuit (2).