CN220652009U - Power module and frequency converter - Google Patents
Power module and frequency converter Download PDFInfo
- Publication number
- CN220652009U CN220652009U CN202322253207.7U CN202322253207U CN220652009U CN 220652009 U CN220652009 U CN 220652009U CN 202322253207 U CN202322253207 U CN 202322253207U CN 220652009 U CN220652009 U CN 220652009U
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- Prior art keywords
- single tube
- substrate
- power
- power single
- power module
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 21
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 34
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a power module and a frequency converter, wherein the power module comprises: at least one power single tube; the power single tube mounting device comprises a substrate, wherein the substrate is provided with mounting areas for mounting the power single tubes, each power single tube corresponds to one mounting area, the mounting areas are provided with a glue dispensing position for gluing and a material loading position for gluing solder, and the power single tubes are mounted on the substrate through the gluing glue and the solder. The technical scheme of the utility model solves the technical problem of poor welding quality of a single tube in the existing power module.
Description
Technical Field
The present disclosure relates to power modules, and particularly to a power module and a frequency converter.
Background
In order to reduce the cost, some power modules generally use a single tube instead of an integrated module, and the single tube is mounted on a substrate and then connected to a driving board through a solder tail. When the single tube is attached to the substrate, the solder paste needs to be printed on the substrate by using a steel mesh, a limiting cover plate is placed on the substrate on which the solder paste is printed, and the single tube is attached to the substrate by using the limiting cover plate. However, due to assembly tolerance, the welding assembly of the single tube and the substrate may be interfered by the limiting cover plate, which adversely affects the welding quality of the single tube and easily causes the device to warp or deviate.
Disclosure of Invention
The utility model mainly aims to provide a power module and a frequency converter, and aims to solve the technical problem that a device is easy to warp or deviate due to poor welding quality of a single tube in the existing power module.
To achieve the above object, an embodiment of the present utility model provides a power module, including:
at least one power single tube;
the power single tube mounting device comprises a substrate, wherein the substrate is provided with mounting areas for mounting the power single tubes, each power single tube corresponds to one mounting area, the mounting areas are provided with a glue dispensing position for gluing and a material loading position for gluing solder, and the power single tubes are mounted on the substrate through the gluing glue and the solder.
Optionally, in an embodiment of the present utility model, the dispensing position is rectangular; the length of the rectangle is in the range of 1-2 mm, and/or the width of the rectangle is in the range of 1-1.5 mm.
Optionally, in an embodiment of the present utility model, two dispensing positions are provided; the two glue dispensing positions are arranged on the mounting area in a diagonal mode, or the two glue dispensing positions are arranged on the edge position of the mounting area and are opposite to each other.
Optionally, in an embodiment of the present utility model, the adhesive is a heat-conducting adhesive.
Optionally, in an embodiment of the present utility model, a thickness of the adhesive on the dispensing position ranges from 0.1 to 0.12 mm.
Optionally, in an embodiment of the present utility model, a plurality of the loading levels are provided, and a plurality of the loading levels are disposed in the mounting area array.
Optionally, in an embodiment of the present utility model, the power single tube is a metal-oxide semiconductor field effect tube; and/or the substrate is an aluminum substrate; and/or the solder is solder paste.
Optionally, in an embodiment of the present utility model, the power module further includes a circuit board, and the circuit board is located on a side of the power single tube away from the substrate, and a pin of the power single tube is bent toward the circuit board and soldered with the circuit board.
To achieve the above object, an embodiment of the present utility model provides a frequency converter, which includes the above-described power module.
Optionally, in an embodiment of the present utility model, the frequency converter further includes a heat dissipation unit, and the heat dissipation unit is in contact with and fixedly connected to the substrate.
Compared with the prior art, in the technical scheme provided by the utility model, the power single tube is subjected to reflow soldering with the substrate through the solder on the feeding position, so that the power single tube is attached to the substrate. Because the solder can cause the drift of power single tube position after melting, for this reason has set up the some glue positions in the subsides of base plate, fixes the power single tube through gluing the position at some glue positions, can prevent that the power single tube from drifting on molten solder, improves the positioning accuracy of power single tube and base plate when welding, has promoted the welding quality of power single tube and base plate and the position accuracy after welding, prevents that the power single tube from appearing unable plug-in components because of the pin skew after welding. According to the technical scheme of spot bonding glue on the substrate, the use of the limiting cover plate in welding of the power single tube is eliminated, the problems of tilting, offset and the like caused by interference of the power single tube and the limiting cover plate can be reduced, the position precision of the power single tube after welding is improved, the welding yield of the power single tube is improved, the probability that the welding void rate exceeds the standard and needs to be scrapped due to tilting of welding is reduced, and the manufacturing cost is saved. In addition, the limiting cover plate does not need to be placed manually, and the automatic dispensing of the dispensing position can be realized through the dispensing machine, so that the automatic assembly of the power single tube and the substrate is realized, the manufacturing cost is further reduced, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a power module according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a second embodiment of a power module according to the present utility model.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 10 | Power single tube | 20 | Substrate board |
| 21 | Mounting area | 211 | Dispensing position |
| 212 | Feeding level | 30 | Circuit board |
| 213 | Solder material |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the present utility model without making any inventive effort, are intended to be within the scope of the embodiments of the present utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like in the embodiments of the present utility model are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is at least two, for example, two, three, etc., unless explicitly defined otherwise.
In embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be either fixedly attached, detachably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, it should be considered that the combination of the technical solutions does not exist, and is not within the protection scope of the embodiments of the present utility model.
At present, the welding of the power single tube and the substrate is positioned through a limiting cover plate. Specifically, a proper amount of solder paste is printed on a position of a substrate, on which a power single tube is mounted, by a printer, then a limiting cover plate is manually placed on the substrate, the power single tube is mounted on the substrate, on which the limiting cover plate is placed, and the movement of the power single tube in the width direction is limited by the limiting cover plate.
However, in the design process of actual products, errors exist in the size of the power single tubes of all factories, and in addition, errors exist in the limiting space of the limiting cover plate on the power single tubes, so that interference warping problem or device drifting problem can be caused, the welding void rate exceeds the standard and is scrapped, the relative position deviation of the power single tubes after welding is large, and the tolerance of the subsequent assembly hole site is exceeded, so that the subsequent assembly alignment is influenced. In addition, the limiting cover plate can not limit the movement of the power single tube in the length direction, the power single tube can possibly deviate in the length direction, the relative positions of the pins of the power single tube and the substrate are changed, and the relative position deviation of the power single tube after welding is also caused to be large, so that the subsequent assembly alignment is affected.
From the above, it can be seen that the positioning of the power single tube by the limiting cover plate may have an adverse effect on the welding quality of the power single tube. Moreover, the efficiency of manual placement of the limiting cover plate is low, and the automatic assembly of the power single tube is not facilitated.
In view of this, the embodiment of the utility model provides a power module and a frequency converter, in which a power single tube is soldered to a substrate by reflow soldering with solder on a loading level, so that the power single tube is mounted on the substrate. Because the solder can cause the drift of power single tube position after melting, for this reason has set up the some glue positions in the subsides of base plate, fixes the power single tube through gluing the position at some glue positions, can prevent that the power single tube from drifting on molten solder, improves the positioning accuracy of power single tube and base plate when welding, has promoted the welding quality of power single tube and base plate and the position accuracy after welding, prevents that the power single tube from appearing unable plug-in components because of the pin skew after welding.
In order to better understand the above technical solutions, the following describes the above technical solutions in detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, an embodiment of the present utility model provides a power module, including:
at least one power single tube 10 provided with a plurality of;
the substrate 20, the substrate 20 is provided with a mounting area 21 for mounting the power single tubes 10, each power single tube 10 corresponds to one mounting area 21, the mounting area 21 is provided with a dispensing position 211 for applying adhesive and a loading position 212 for applying solder 213, and the power single tubes 10 are mounted on the substrate 20 through the adhesive and the solder 213.
In the technical solution adopted in this embodiment, the power single tube 10 is soldered to the substrate 20 by reflow soldering with the solder 213 on the loading level 212, so that the power single tube 10 is mounted on the substrate 20. Because the solder 213 may cause the drift of the position of the power single tube 10 after melting, the glue dispensing position 211 is set in the mounting area 21 of the substrate 20, and the power single tube 10 is fixed by glue dispensing at the glue dispensing position 211, so that the drift of the power single tube 10 on the melted solder 213 can be prevented, the positioning accuracy of the power single tube 10 and the substrate 20 during welding is improved, the welding quality of the power single tube 10 and the substrate 20 and the position accuracy after welding are improved, and the problem that the power single tube 10 cannot be plugged due to pin drift after welding is prevented. According to the technical scheme of spot bonding glue on the substrate 20, the use of the limiting cover plate of the power single tube 10 during welding is eliminated, the problems of tilting, offset and the like caused by interference of the power single tube 10 and the limiting cover plate can be reduced, the position precision of the power single tube 10 after welding is improved, the welding yield of the power single tube 10 is improved, the probability that the welding void ratio exceeds the standard and needs to be scrapped due to tilting during welding is reduced, and the manufacturing cost is saved. Moreover, the limiting cover plate does not need to be placed manually, and the automatic dispensing of the dispensing position 211 of the dispensing machine is realized, so that the automatic assembly of the power single tube 10 and the substrate 20 is realized, the manufacturing cost is further reduced, and the production efficiency is improved.
Illustratively, in one embodiment of the present utility model, the power single tube 10 is a metal-oxide semiconductor field effect tube; and/or the substrate 20 is an aluminum substrate 20; and/or the solder 213 is a solder paste.
In one embodiment, the dispensing locations 211 are provided with a plurality of dispensing locations. The plurality of dispensing positions 211 are disposed in a dispersed manner and can be bonded to a plurality of different positions of the power single tube 10, thereby improving the fixing firmness of the power single tube 10 on the substrate 20.
Referring to fig. 1, in an embodiment of the present utility model, the dispensing position 211 is rectangular in shape; the length of the rectangle is in the range of 1-2 mm and/or the width of the rectangle is in the range of 1-1.5 mm.
Specifically, the shape of the dispensing position 211 is rectangular, and the rectangular geometric structure extends in the length and width directions, so that sufficient space can be provided for contact with the power single tube 10, and then the contact area with the power single tube 10 is increased, so that the physical bonding effect between the power single tube 10 and the substrate 20 is firmer and more stable, and the bonding firmness of the power single tube 10 is improved. In addition, the rectangular geometric structure is simple and clear in design and convenient to set, the process flow can be simplified, and the production efficiency is improved. As an alternative, the length of the rectangle may be in the range of 1 to 2 mm, for example, the length of the rectangle may be 1 mm, may be 2 mm, may be 1.5 mm, and is not limited herein; and/or the width of the rectangle is in the range of 1 to 1.5 mm, for example, the width of the rectangle is 1 mm, can be 1.5 mm, can be 1.3 mm, and is not limited herein. Thus, the use of adhesive can be reduced and the production cost can be reduced on the basis of ensuring the reliable adhesion of the power single tube 10.
Illustratively, in an embodiment of the present utility model, the power single tube 10 includes a plastic package, a tube socket connected to the plastic package, and a lead connected to the tube socket, and the mounting area 21 is disposed corresponding to the plastic package. So arranged, the header may be soldered with solder 213 on the loading level 212 to secure the header to the substrate 20. Meanwhile, the plastic package body is bonded with the adhesive on the adhesive dispensing position 211, so that the positioning of the power single tube 10 during assembly is realized. In addition, the bonding on the plastic package body does not affect the effective welding area of the tube seat of the power single tube 10 and the feeding position 212, thereby guaranteeing the heat dissipation effect of the power single tube 10.
Referring to fig. 1, in an embodiment of the present utility model, two dispensing positions 211 are provided; the two dispensing locations 211 are diagonally disposed on the mounting area 21, or the two dispensing locations 211 are located at the edges of the mounting area 21 and are disposed opposite to each other, for example, near the edges of two opposite sides of the mounting area 21. By this arrangement, the dispensing positions 211 can be provided on both sides of the single power tube 10, so that the single power tube 10 can obtain the maximum adhesion force, thereby improving the adhesion reliability.
Illustratively, in one embodiment of the present utility model, the thickness of the adhesive on the dispensing location 211 is in the range of 0.1 mm to 0.12 mm. Thus, the bonding surface of the power single tube 10 can be effectively contacted with the bonding adhesive, and the bonding firmness of the power single tube 10 is improved.
In an embodiment of the present utility model, the bonding glue is a heat-conducting glue, so that the heat transfer efficiency between the power single tube 10 and the substrate 20 can be improved while the bonding fixation is realized, so that the surface heat of the power single tube 10 is transferred to the substrate 20 as much as possible for heat dissipation, and the temperature of the power single tube 10 is effectively reduced.
Illustratively, referring to FIG. 1, in one embodiment of the present utility model, a plurality of the loading levels 212 are provided, and a plurality of the loading levels 212 are disposed in an array in the mounting area 21. In order to improve the welding quality between the power single tube 10 and the substrate 20, a plurality of loading positions 212 are provided in the mounting region 21 of the substrate 20, and the power single tube 10 can be welded to different positions by the plurality of loading positions 212, so that the welding reliability of the power single tube 10 on the substrate 20 is improved. It should be noted that the solder 213 on the loading level 212 is arranged in an array on the mounting area 21, i.e. corresponding to the steel mesh openings, before the reflow is not performed. But after reflow the solder 213 on the feed level 212 melts and diffuses outwards, typically the solder 213 on the different feed levels 212 is joined together.
Illustratively, referring to fig. 2, in an embodiment of the present utility model, the power module further includes a circuit board 30, the circuit board 30 is located on a side of the power single tube 10 facing away from the substrate 20, and the pins of the power single tube 10 are bent toward the circuit board 30 and soldered to the circuit board 30. In this way, the power single tube 10 can be supplied with power by the circuit board 30, and the operation state of the power single tube 10 can be controlled.
To achieve the above objective, an embodiment of the present utility model provides a frequency converter, which includes the above-described power module. Specifically, the specific structure of the power module refers to the above embodiment, and since the frequency converter adopts all the technical solutions of the above embodiment, the frequency converter has at least all the beneficial effects brought by the technical solutions of the above embodiment.
Illustratively, the frequency converter further includes a heat dissipating unit in contact with and fixedly coupled to the substrate 20. In this way, the heat dissipation unit can dissipate heat of the substrate 20, so that more heat on the surface of the power single tube 10 is transferred to the substrate 20 for heat dissipation, and the heat dissipation effect of the power single tube 10 is improved. In an embodiment, the heat dissipating unit may be a heat sink. Of course, the solution of the embodiment of the present utility model is not limited thereto, and the heat dissipating unit may be a liquid cooling plate, which is not limited thereto.
The foregoing description is only the preferred embodiments of the present utility model, and is not intended to limit the scope of the embodiments of the present utility model, and all the equivalent structural changes made by the descriptions of the embodiments of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the embodiments of the present utility model.
Claims (10)
1. A power module, the power module comprising:
at least one power single tube;
the power single tube mounting device comprises a substrate, wherein the substrate is provided with mounting areas for mounting the power single tubes, each power single tube corresponds to one mounting area, the mounting areas are provided with a glue dispensing position for gluing and a material loading position for gluing solder, and the power single tubes are mounted on the substrate through the gluing glue and the solder.
2. The power module of claim 1, wherein the dispensing location is rectangular in shape; the length of the rectangle is in the range of 1-2 mm, and/or the width of the rectangle is in the range of 1-1.5 mm.
3. The power module according to claim 1 or 2, wherein two dispensing positions are provided; the two glue dispensing positions are arranged on the mounting area in a diagonal mode, or the two glue dispensing positions are arranged on the edge position of the mounting area and are opposite to each other.
4. The power module of claim 1 wherein the adhesive is a thermally conductive adhesive.
5. The power module of claim 1 wherein said adhesive on said dispensing location has a thickness in the range of 0.1 to 0.12 mm.
6. The power module of claim 1, wherein a plurality of said loading levels are provided, and wherein a plurality of said loading levels are disposed in said mounting area array.
7. The power module of claim 1, wherein the power single tube is a metal-oxide semiconductor field effect tube; and/or the substrate is an aluminum substrate; and/or the solder is solder paste.
8. The power module of claim 1, further comprising a circuit board positioned on a side of the power single tube facing away from the substrate, the pins of the power single tube being bent toward and soldered to the circuit board.
9. A frequency converter, characterized in that it comprises a power module according to any of claims 1-8.
10. The frequency converter of claim 9, further comprising a heat sink unit in contact with and fixedly coupled to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322253207.7U CN220652009U (en) | 2023-08-18 | 2023-08-18 | Power module and frequency converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322253207.7U CN220652009U (en) | 2023-08-18 | 2023-08-18 | Power module and frequency converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220652009U true CN220652009U (en) | 2024-03-22 |
Family
ID=90292955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322253207.7U Active CN220652009U (en) | 2023-08-18 | 2023-08-18 | Power module and frequency converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220652009U (en) |
-
2023
- 2023-08-18 CN CN202322253207.7U patent/CN220652009U/en active Active
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