CN220651954U - TiCN hard alloy jig for semiconductor - Google Patents
TiCN hard alloy jig for semiconductor Download PDFInfo
- Publication number
- CN220651954U CN220651954U CN202223160187.0U CN202223160187U CN220651954U CN 220651954 U CN220651954 U CN 220651954U CN 202223160187 U CN202223160187 U CN 202223160187U CN 220651954 U CN220651954 U CN 220651954U
- Authority
- CN
- China
- Prior art keywords
- lower die
- die holder
- air
- air pump
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 239000000956 alloy Substances 0.000 title abstract description 22
- 229910045601 alloy Inorganic materials 0.000 title abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 abstract description 45
- 238000004806 packaging method and process Methods 0.000 abstract description 13
- 238000001816 cooling Methods 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 29
- 238000009826 distribution Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000495 cryogel Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Abstract
The utility model discloses a TiCN hard alloy jig for a semiconductor, wherein the lower surface of an upper die holder is provided with a plurality of upper die grooves for embedding and installing an upper die, the upper surface of a lower die holder is provided with a plurality of lower die grooves for embedding and installing a lower die, one side of the outer wall of the lower die holder is provided with an air pump, the air pump is respectively connected with a heating box and a refrigerating box, a first valve is arranged between the air pump and the heating box, a second valve is arranged between the air pump and the refrigerating box, an annular duct is arranged along the circumferential outer wall of the lower die groove, the annular duct is connected with the air outlet end of the air pump through a first air duct, a plurality of strip-shaped air grooves are arranged between the lower die grooves and the annular duct, and the strip-shaped air grooves extend along the length direction of the lower die grooves; the pressure relief hole is positioned on one side of the lower die holder and is communicated with the annular conduit through a second air duct. The utility model can realize heating of the glue solution, and can also realize cooling of the glue solution, thereby improving the packaging efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a TiCN hard alloy jig for a semiconductor.
Background
With the development of technology and the advancement of electronic information technology, semiconductors have become an important part of people's life. Semiconductors have been widely used in the fields of home appliances, communications, industrial manufacturing, aviation, aerospace, and the like. In the production process of semiconductor devices, after the steps of attaching and fixing devices, arranging wires and the like are completed on a substrate, the devices are often packaged, namely, the devices are packaged by adopting molding materials such as epoxy resin molding compound and the like. On one hand, the device is isolated from the outside, so that the electric performance of the device is prevented from being reduced due to corrosion of impurities in the air to a circuit of the device; on the other hand, the packaged device is also more convenient to install and transport.
After the preparation of the semiconductor is finished, plastic packaging is needed, the work of the semiconductor wafer is prevented from being influenced by external dust and the like, the jig in the prior art does not have the temperature changing function of heating glue solution and cooling the glue solution, and the heat distribution is uneven.
Disclosure of Invention
The utility model aims to provide a TiCN hard alloy jig for a semiconductor, which can heat glue solution, so that the glue solution keeps good fluidity, the glue solution can be uniformly distributed in a die, the glue solution can be cooled, the solidification of the glue solution is accelerated, the demolding is convenient, and the uniformity of heat distribution is improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme: tiCN carbide tool for semiconductor includes: the upper die holder is positioned above the lower die holder, and a plurality of telescopic rods are arranged between the upper die holder and the lower die holder;
the lower surface of the upper die holder is provided with a plurality of upper die grooves for embedding and installing the upper die, and the upper surface of the lower die holder is provided with a plurality of lower die grooves for embedding and installing the lower die;
an air pump is arranged at one side of the outer wall of the lower die holder, the air pump is respectively connected with a heating box and a refrigerating box, a first valve is arranged between the air pump and the heating box, and a second valve is arranged between the air pump and the refrigerating box;
an annular duct is arranged along the circumferential outer wall of the lower die groove, the annular duct is connected with the air outlet end of the air pump through a first air duct, a plurality of strip-shaped air grooves are formed between the lower die groove and the annular duct, and the strip-shaped air grooves extend along the length direction of the lower die groove; and the pressure relief hole is positioned at one side of the lower die holder and is communicated with the annular guide pipe through a second air duct.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the telescopic rod is a hydraulic telescopic rod.
2. In the scheme, the upper die holder and the lower die holder are TiCN metal seats.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the TiCN hard alloy jig for the semiconductor is characterized in that an air pump is arranged on one side of the outer wall of a lower die holder, the air pump is respectively connected with a heating box and a refrigerating box, a first valve is arranged between the air pump and the heating box, a second valve is arranged between the air pump and the refrigerating box, an annular duct is arranged along the circumferential outer wall of a lower die cavity, and the annular duct is connected with the air outlet end of the air pump through a first air duct, so that glue solution can be heated, the glue solution can keep good fluidity, uniform distribution in the die is realized, the encapsulation effect is ensured, the glue solution can be cooled, solidification of the glue solution is accelerated, the demolding is facilitated, the encapsulation efficiency is improved, in addition, the packaging requirement under different temperatures can be met, and the applicability of the device is improved; and a plurality of strip-shaped air grooves are formed between the lower die groove and the annular guide pipe, the strip-shaped air grooves extend along the length direction of the lower die groove, heat is transferred up and down along the outer wall of the lower die groove, and the uniformity of heat distribution is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a TiCN carbide jig for a semiconductor of the present utility model;
FIG. 2 is an overall cross-sectional elevation view of a TiCN carbide jig for use with the semiconductor of the present utility model;
fig. 3 is a partial cutaway perspective view of a TiCN cemented carbide jig for semiconductors of the present utility model.
In the above figures: 1. an upper die holder; 101. an upper die cavity; 2. a lower die holder; 201. a lower die cavity; 202. a receiving groove; 3. sealing the rubber tube; 4. a telescopic rod; 5. an air pump; 6. a heating box; 7. a refrigeration box; 81. a first valve; 82. a second valve; 9. an annular air tube; 10. a first air duct; 11. a strip-shaped air groove; 12. a pressure relief hole; 13. and a second air guide hole.
Detailed Description
In the description of the present patent, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships indicated based on technical solutions, are merely for convenience of describing the present patent and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as being limiting of the patent; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in this patent will be understood by those of ordinary skill in the art in a specific context.
The utility model is further described below with reference to examples:
example 1: tiCN carbide tool for semiconductor includes: the injection molding machine comprises an upper die holder 1 and a lower die holder 2, wherein the upper die holder 1 with a plurality of injection pipes 3 is positioned above the lower die holder 2, and a plurality of telescopic rods 4 are arranged between the upper die holder 1 and the lower die holder 2;
a plurality of upper die grooves 101 for embedding and installing an upper die are formed in the lower surface of the upper die holder 1, and a plurality of lower die grooves 201 for embedding and installing a lower die are formed in the upper surface of the lower die holder 2;
an air pump 5 is arranged at one side of the outer wall of the lower die holder 2, the air pump 5 is respectively connected with a heating box 6 and a refrigerating box 7, a first valve 81 is arranged between the air pump 5 and the heating box 6, and a second valve 82 is arranged between the air pump 5 and the refrigerating box 7;
an annular duct 9 is arranged along the circumferential outer wall of the lower die groove 201, the annular duct 9 is connected with the air outlet end of the air pump 5 through a first air duct 10, a plurality of strip-shaped air grooves 11 are arranged between the lower die groove 201 and the annular duct 9, and the strip-shaped air grooves 11 extend along the length direction of the lower die groove 201; a pressure relief hole 12 is located at one side of the lower die holder 2, and the pressure relief hole 12 is communicated with the annular conduit 9 through a second air duct 13.
The alloy upper die and the lower die are respectively arranged in an upper die groove and a lower die groove, a device to be packaged is arranged in the lower die, and the telescopic rod is contracted, so that the upper die holder and the lower die holder are gradually close to each other until the die is closed;
3 upper and lower cavities 101 and 201 are provided; the upper and lower cavities 101 and 201 are disposed at equal intervals.
The upper die holder 1 and the lower die holder 2 are TiCN metal seats.
When the cold gel is adopted for packaging, only the refrigerating box is required to be opened, when the upper die holder and the lower die holder are in a die closing state, the bottom of the alloy upper die is in extrusion contact with the limiting ring, the glue injection pipe starts to inject glue, the glue solution flows into the cavities in the alloy upper die and the TiCN metal ceramic lower die from the glue injection pipe through the through holes of the alloy upper die, after the glue injection is completed, the second valve is opened, low-temperature air of the refrigerating box is led into the connecting pipe, and the TiCN metal ceramic lower die in the lower die cavity is cooled, so that the cold gel can be solidified, and packaging of a semiconductor device is realized.
Example 2: tiCN carbide tool for semiconductor includes: the injection molding machine comprises an upper die holder 1 and a lower die holder 2, wherein the upper die holder 1 with a plurality of injection pipes 3 is positioned above the lower die holder 2, and a plurality of telescopic rods 4 are arranged between the upper die holder 1 and the lower die holder 2;
a plurality of upper die grooves 101 for embedding and installing an upper die are formed in the lower surface of the upper die holder 1, and a plurality of lower die grooves 201 for embedding and installing a lower die are formed in the upper surface of the lower die holder 2;
an air pump 5 is arranged at one side of the outer wall of the lower die holder 2, the air pump 5 is respectively connected with a heating box 6 and a refrigerating box 7, a first valve 81 is arranged between the air pump 5 and the heating box 6, and a second valve 82 is arranged between the air pump 5 and the refrigerating box 7;
an annular duct 9 is arranged along the circumferential outer wall of the lower die groove 201, the annular duct 9 is connected with the air outlet end of the air pump 5 through a first air duct 10, a plurality of strip-shaped air grooves 11 are arranged between the lower die groove 201 and the annular duct 9, and the strip-shaped air grooves 11 extend along the length direction of the lower die groove 201; a pressure relief hole 12 is located at one side of the lower die holder 2, and the pressure relief hole 12 is communicated with the annular conduit 9 through a second air duct 13.
The glue solution can be heated, so that the glue solution keeps good fluidity, the glue solution is distributed uniformly in the die, the cooling of the glue solution can be realized while the packaging effect is ensured, the solidification of the glue solution is accelerated, the demolding is convenient, and the packaging efficiency is also improved;
and a plurality of strip-shaped air grooves are formed between the lower die groove and the annular guide pipe, the strip-shaped air grooves extend along the length direction of the lower die groove, heat is transferred up and down along the outer wall of the lower die groove, and the uniformity of heat distribution is improved.
The glue solution is resin; when the thermal injection molding packaging mode is adopted, the heating box and the cooling box are opened, the bottom of the alloy upper die is in extrusion contact with the limiting ring when the upper die holder and the lower die holder are in a die closing state, the glue injection pipe starts to inject glue, the glue solution flows into the cavities in the alloy upper die and the lower die from the glue injection pipe through the through holes of the alloy upper die, the first valve and the air pump are opened, hot air of the heating box is led into the connecting pipe through the air guide pipe, and the lower die in the lower die groove is heated, so that the glue solution keeps good fluidity and is uniformly distributed.
The telescopic rod 4 is a hydraulic telescopic rod.
The number of the upper and lower cavities 101 and 201 is 3.
The upper die holder 1 and the lower die holder 2 are TiCN metal seats.
The working principle is as follows: during operation, the alloy upper die and the alloy lower die are respectively placed in the upper die groove and the lower die groove for installation, the device to be packaged is placed in the lower die, and the telescopic rod is contracted, so that the upper die holder and the lower die holder are gradually close until the die is closed;
when a thermal injection molding packaging mode is adopted, a heating box and a cooling box are opened, when an upper die holder and a lower die holder are in a die closing state, the bottom of an alloy upper die is in extrusion contact with a limiting ring, a glue injection pipe starts to inject glue, the glue solution flows into cavities in the alloy upper die and the lower die from the glue injection pipe through a through hole of the alloy upper die, a first valve and an air pump are opened, hot air of the heating box is led into a connecting pipe through an air duct, and the lower die in a lower die groove is heated, so that the glue solution keeps good fluidity and is uniformly distributed;
after the glue injection is completed, the first valve is closed, the second valve is opened, cold air of the refrigeration box is led into the connecting pipe, and the lower die in the lower die cavity is cooled, so that the packaged device is convenient to demould;
in addition, when adopting the cryogel to encapsulate, only need open the refrigeration case, upper die base and die holder are in the compound mode, the bottom of alloy upper die and spacing ring extrusion contact, and the injecting glue pipe begins the injecting glue, and the glue solution flows into the cavity in alloy upper die, tiCN cermet bed die by the injecting glue pipe through the through-hole of alloy upper die, after the injecting glue is accomplished, opens the second valve, and the low temperature air of refrigeration case is imported in the connecting pipe, cools off TiCN cermet bed die in the lower die groove for the cryogel can solidify, realizes the encapsulation of semiconductor device.
When the TiCN hard alloy jig for the semiconductor is adopted, the air pump is arranged at one side of the outer wall of the lower die holder and is respectively connected with the heating box and the cooling box, the first valve is arranged between the air pump and the heating box, the second valve is arranged between the air pump and the cooling box, the annular conduit is arranged along the circumferential outer wall of the lower die cavity, and the annular conduit is connected with the air outlet end of the air pump through the first air duct, so that the glue solution can be heated, the glue solution can keep good fluidity, the glue solution is distributed uniformly in the die, the packaging effect is ensured, the glue solution can be cooled, the solidification of the glue solution is accelerated, the demoulding is convenient, the packaging efficiency is also improved, the packaging requirements at different temperatures can be met, and the applicability of the device is improved;
and a plurality of strip-shaped air grooves are formed between the lower die groove and the annular guide pipe, the strip-shaped air grooves extend along the length direction of the lower die groove, heat is transferred up and down along the outer wall of the lower die groove, and the uniformity of heat distribution is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (3)
1. TiCN carbide tool for semiconductor includes: the upper die holder (1) and die holder (2), its characterized in that: an upper die holder (1) with a plurality of rubber injection pipes (3) is positioned above a lower die holder (2), and a plurality of telescopic rods (4) are arranged between the upper die holder (1) and the lower die holder (2);
a plurality of upper die grooves (101) for embedding and installing the upper die are formed in the lower surface of the upper die holder (1), and a plurality of lower die grooves (201) for embedding and installing the lower die are formed in the upper surface of the lower die holder (2);
an air pump (5) is arranged on one side of the outer wall of the lower die holder (2), the air pump (5) is respectively connected with a heating box (6) and a refrigerating box (7), a first valve (81) is arranged between the air pump (5) and the heating box (6), and a second valve (82) is arranged between the air pump and the refrigerating box (7);
an annular duct (9) is arranged along the circumferential outer wall of the lower die groove (201), the annular duct (9) is connected with the air outlet end of the air pump (5) through a first air duct (10), a plurality of strip-shaped air grooves (11) are formed between the lower die groove (201) and the annular duct (9), and the strip-shaped air grooves (11) extend along the length direction of the lower die groove (201); a pressure relief hole (12) is positioned at one side of the lower die holder (2), and the pressure relief hole (12) is communicated with the annular conduit (9) through a second air duct (13).
2. The TiCN cemented carbide jig for semiconductors according to claim 1, wherein: the telescopic rod (4) is a hydraulic telescopic rod.
3. The TiCN cemented carbide jig for semiconductors according to claim 1, wherein: the upper die holder (1) and the lower die holder (2) are TiCN metal seats.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223160187.0U CN220651954U (en) | 2022-11-28 | 2022-11-28 | TiCN hard alloy jig for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223160187.0U CN220651954U (en) | 2022-11-28 | 2022-11-28 | TiCN hard alloy jig for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220651954U true CN220651954U (en) | 2024-03-22 |
Family
ID=90292137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223160187.0U Active CN220651954U (en) | 2022-11-28 | 2022-11-28 | TiCN hard alloy jig for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220651954U (en) |
-
2022
- 2022-11-28 CN CN202223160187.0U patent/CN220651954U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105026000B (en) | Motor and its manufacture method with cooling device | |
| CN210969819U (en) | Plastic mold capable of efficiently cooling | |
| CN220651954U (en) | TiCN hard alloy jig for semiconductor | |
| CN117021515A (en) | Cooling device and method for plastic injection mold | |
| CN219040412U (en) | Semiconductor packaging device | |
| CN220651955U (en) | High-precision TiCN ceramic jig | |
| CN215511994U (en) | Bluetooth headset battery protective layer forming die | |
| CN214448072U (en) | High-precision glue position semiconductor die | |
| CN213082187U (en) | Injection mold with thermal compensation function | |
| CN117790334A (en) | Metal ceramic packaging jig for semiconductor | |
| CN213944797U (en) | Mounting structure of plug-in nozzle | |
| CN209233686U (en) | A kind of stator module epoxy casting tool | |
| CN215750602U (en) | Heat exchange structure in thermoplastic plastic forming die | |
| CN219476622U (en) | Semiconductor processing device with metal ceramic | |
| CN216968585U (en) | Automobile parts production is with mould that is equipped with cooling structure | |
| CN213958915U (en) | Packaging device for new material of semiconductor chip | |
| CN213006401U (en) | Quick cooling device of mould for injection molding machine | |
| CN218963987U (en) | Sprue bush structure of die casting die | |
| CN218286619U (en) | High-precision production mold with anti-corrosion coating | |
| CN218645804U (en) | Refrigeration water tank | |
| CN110901105A (en) | RTM (resin transfer molding) mold structure capable of being heated or cooled rapidly and using method thereof | |
| CN220219512U (en) | Four-side sliding block injection mold for injection molding of motor shell | |
| CN213704335U (en) | Mold capable of being cooled rapidly | |
| CN215040019U (en) | A quick accuse temperature injection mold for plastic production | |
| CN219239510U (en) | Glass preform forming die |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |