CN218645804U - Refrigeration water tank - Google Patents
Refrigeration water tank Download PDFInfo
- Publication number
- CN218645804U CN218645804U CN202222776259.8U CN202222776259U CN218645804U CN 218645804 U CN218645804 U CN 218645804U CN 202222776259 U CN202222776259 U CN 202222776259U CN 218645804 U CN218645804 U CN 218645804U
- Authority
- CN
- China
- Prior art keywords
- water tank
- copper bars
- cold
- fin
- thermoelectric elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a refrigeration water tank, which comprises a cold water tank, a semiconductor refrigeration piece and radiating fins; the wall of the cold water tank is provided with a mounting opening, the mounting opening is internally injected with plastic coating to seal a cold guide fin, and the fin of the cold guide fin is positioned in the inner cavity of the cold water tank; the semiconductor refrigeration piece comprises a plurality of thermoelectric elements and copper bars, wherein the plurality of thermoelectric elements are welded with the copper bars in series connection with the adjacent thermoelectric elements, the copper bars are divided into cold-surface copper bars and hot-surface copper bars, the hot-surface copper bars are attached to the ceramic plate, and the cold-surface copper bars are attached to the cold-conducting fins; through leading cold fin and water tank integrated into one piece of moulding plastics to reduce the equipment step, improve the semiconductor difference in temperature, solve the problem of leaking, improve the packaging efficiency simultaneously.
Description
Technical Field
The utility model relates to a cold water storage cistern field especially involves a refrigeration water storage cistern.
Background
In the water dispenser in the market, a cold water tank is usually adopted for supplying cold water, but the existing cold water tank has a complex structure and high water leakage rate, and the assembly speed is influenced; meanwhile, the cold water tank usually adopts a semiconductor refrigeration mode, but the existing semiconductor refrigeration piece is usually of a sandwich structure, and usually a hot-surface ceramic plate and a cold-surface end ceramic plate are usually pasted with copper sheets, so that the production cost is high, and the technical problems need to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the refrigeration water tank of the utility model comprises a cold water tank, a semiconductor refrigeration piece and radiating fins; the wall of the cold water tank is provided with a mounting opening, a cold guide fin is arranged in the mounting opening, and the fin of the cold guide fin is positioned in the inner cavity of the cold water tank; the semiconductor refrigeration piece comprises a plurality of thermoelectric elements and copper bars, wherein the plurality of thermoelectric elements are welded with the copper bars, the copper bars are connected with the adjacent thermoelectric elements in series, the copper bars are divided into cold-surface copper bars and hot-surface copper bars, the hot-surface copper bars are attached to the ceramic plate, and the cold-surface copper bars are attached to the cold-conducting fins; the radiating fins are attached to the ceramic plate.
According to some embodiments of the invention, a cooling fan is mounted on the cooling fin.
According to some embodiments of the invention, the tank wall of the cold water tank is recessed to form a slot, and a temperature sensing element is inserted into the slot.
The utility model discloses following beneficial effect has at least:
1. a plurality of thermoelectric elements are connected in series through copper bars and attached to the cold-conducting fins, so that the thermal resistance is reduced, and the temperature difference of the semiconductor is improved.
2. Through leading cold fin and water tank integrated into one piece of moulding plastics to reduce the equipment step, solve the problem of leaking, improve the packaging efficiency simultaneously.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a refrigeration water tank according to an embodiment of the present invention;
fig. 2 is a schematic view of a semiconductor refrigeration device according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 2, a refrigeration water tank includes a refrigeration water tank 100, a semiconductor refrigeration member 200, and heat radiating fins 300; a mounting opening is formed in the wall of the cold water tank 100, a cold guide fin 400 is sealed in the mounting opening through injection molding and encapsulation, and the fin of the cold guide fin 400 is positioned in the inner cavity of the cold water tank 100; the semiconductor refrigeration piece 200 comprises a plurality of thermoelectric elements 210 and copper bars 220, wherein the thermoelectric elements 210 are connected in series, the copper bars 220 are welded with the thermoelectric elements 210 which are adjacent in series, the copper bars 220 are divided into cold-surface copper bars 221 and hot-surface copper bars 222, the hot-surface copper bars 222 are attached to a ceramic plate 230, and the cold-surface copper bars 221 are attached to cold-conducting fins 400; through leading cold fin 400 and water tank integrated into one piece of moulding plastics to reduce the equipment step, improve the semiconductor difference in temperature, solve the problem of leaking, improve the packaging efficiency simultaneously.
In the present embodiment, the heat dissipating fan 500 is mounted on the heat dissipating fin 300.
In this embodiment, the wall of the cold water tank 100 is recessed to form a slot 110, and a temperature sensing element is inserted into the slot 110.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (3)
1. A refrigeration water tank, comprising:
the cooling water tank (100) is characterized in that a mounting opening is formed in the wall of the cooling water tank (100), a cooling guide fin (400) is arranged in the mounting opening, and the fin of the cooling guide fin (400) is positioned in the inner cavity of the cooling water tank (100);
the semiconductor refrigeration piece (200) comprises a plurality of thermoelectric elements (210) and copper bars (220), the thermoelectric elements (210) are connected in series, the copper bars (220) are welded with the thermoelectric elements (210) which are adjacent to each other in series, the copper bars (220) are divided into cold-surface copper bars (221) and hot-surface copper bars (222), the hot-surface copper bars (222) are attached to a ceramic plate (230), and the cold-surface copper bars (221) are attached to the cold guide fins (400);
the heat dissipation fins (300), the heat dissipation fins (300) are pasted on the ceramic plate (230).
2. A refrigeration water tank as claimed in claim 1, wherein the radiating fins (300) are provided with a radiating fan (500).
3. A refrigeration water tank according to claim 1, characterized in that the wall of the tank (100) is recessed to form a socket (110), and a temperature sensing element is inserted into the socket (110).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222776259.8U CN218645804U (en) | 2022-10-20 | 2022-10-20 | Refrigeration water tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222776259.8U CN218645804U (en) | 2022-10-20 | 2022-10-20 | Refrigeration water tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218645804U true CN218645804U (en) | 2023-03-17 |
Family
ID=85493938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222776259.8U Active CN218645804U (en) | 2022-10-20 | 2022-10-20 | Refrigeration water tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218645804U (en) |
-
2022
- 2022-10-20 CN CN202222776259.8U patent/CN218645804U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107437594B (en) | Battery pack | |
| CN211831654U (en) | Efficient liquid cooling plate and equipment | |
| CN218645804U (en) | Refrigeration water tank | |
| CN111741646A (en) | Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell | |
| CN108925124B (en) | Module immersion type cooling body and frequency converter | |
| CN202749364U (en) | Annular heat pipe section material superconducting radiator | |
| CN201773834U (en) | Cooling mechanism of integrated power module | |
| KR20160093744A (en) | A heat dissipating enclosure with integrated cooling fins | |
| CN209812972U (en) | Circulating diode injection molding machine mould | |
| CN114976356A (en) | Battery module and energy storage container | |
| CN213082187U (en) | Injection mold with thermal compensation function | |
| CN220569657U (en) | Semiconductor insulation packaging piece | |
| CN218399239U (en) | Injection mold easy to dissipate heat | |
| CN215864281U (en) | Small-sized quick icer | |
| CN209105543U (en) | Module immersion type cooling body and frequency converter | |
| CN218721329U (en) | Novel waterproof heat dissipation apron and power shell | |
| CN218731225U (en) | Battery module and energy storage container | |
| CN219686306U (en) | Plastic product mould temperature machine | |
| CN218429806U (en) | Circulating diode injection molding machine mould | |
| CN219718902U (en) | Integral expansion plate type heat radiation module | |
| CN217955023U (en) | Cooling device for chip design | |
| CN114203655B (en) | Chip packaging structure | |
| CN214820653U (en) | Double-sided cooling plastic injection mold | |
| CN219178359U (en) | Superconductive heat dissipation combined unit | |
| CN216901563U (en) | Heat radiation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |