CN219476622U - Semiconductor processing device with metal ceramic - Google Patents
Semiconductor processing device with metal ceramic Download PDFInfo
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- CN219476622U CN219476622U CN202222558892.XU CN202222558892U CN219476622U CN 219476622 U CN219476622 U CN 219476622U CN 202222558892 U CN202222558892 U CN 202222558892U CN 219476622 U CN219476622 U CN 219476622U
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- lower die
- upper die
- die holder
- die
- holder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor processing device with metal ceramic, wherein an upper die holder is connected with a lower die holder through a plurality of telescopic rods, the lower surface of the upper die holder is provided with a plurality of upper die grooves for embedding and installing an upper die, the upper surface of the lower die holder is provided with a plurality of lower die grooves for embedding and installing a lower die, the top of the lower die holder is provided with a fit groove for embedding and installing the upper die holder, a metal ceramic raised line is arranged on one side surface of the upper die holder, which is close to the lower die holder, along the circumferential outer wall of the upper die, one end of the lower die, which is far away from the upper die, is provided with a plurality of positioning columns which can be correspondingly installed in the lower die grooves, one end of the lower die, which is provided with an opening, is circumferentially provided with a limiting ring, one side of the limiting ring, which is opposite to the lower die grooves, is provided with a through hole, is arranged on the top of the upper die, and communicated with a rubber injection tube. The utility model improves the position precision of the die on the basis of realizing the preliminary positioning of the upper die holder and the lower die holder, thereby improving the packaging quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor processing device with metal ceramics.
Background
Various semiconductor components exist in the electric appliance, and the quality of the semiconductor components directly influences the performance and the service life of the electric appliance. The semiconductor components have various different sizes and shapes, and are easy to damage, even if impurities in the air can damage the components, so that the semiconductor components need to be packaged outside before being used, and a protective shell is wrapped outside the whole components.
The existing packaging mold generally adopts a packaging mode of upper and lower mold closing and injection molding, but the upper and lower molds easily cause mold deviation during closing during operation, thereby influencing the packaging effect.
Disclosure of Invention
The utility model aims to provide a semiconductor processing device with metal ceramic, which improves the position accuracy of a die on the basis of realizing the preliminary positioning of an upper die holder and a lower die holder, thereby improving the packaging quality.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor processing apparatus having a cermet, comprising: the upper die holder and the lower die holder are connected through a plurality of telescopic rods;
the upper die holder is provided with a plurality of upper die grooves for embedding and installing the upper die, the upper surface of the lower die holder is provided with a plurality of lower die grooves for embedding and installing the lower die, the top of the lower die holder is provided with a fit groove for embedding and clamping the upper die holder, and a metal ceramic raised line is arranged on one side surface of the upper die holder, which is close to the lower die holder, along the circumferential outer wall of the upper die;
the one end that keeps away from the last mould of bed die is provided with a plurality of reference column that can correspond and install in the bed die groove, the bed die has open-ended one end and is provided with a spacing ring along outer wall circumference, and this spacing ring is provided with a heavy groove in the one side of bed die groove that is on the back of each other, a through-hole has been seted up at the top of bed die and has been annotated the rubber tube intercommunication.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the upper surface of the upper die holder is fixedly provided with a top plate, the lower surface of the lower die holder is fixedly provided with a bottom plate, and a plurality of telescopic rods are arranged between the top plate and the bottom plate.
2. In the scheme, the telescopic rod is a hydraulic telescopic rod.
3. In the scheme, the inner wall of the top of the lower die groove is provided with a limiting groove for embedding and installing the limiting ring.
4. In the above scheme, the positioning column is a hollow positioning column.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model has a semiconductor processing device of metal ceramic, the top of its lower die holder has a fit slot used for upper die holder to embed the matched die, the lower surface of the upper die holder has several upper die slots used for upper die to embed and mount, the upper surface of the lower die holder has several lower die slots used for lower die to embed and mount, one end far away from upper die of the lower die has several locating columns that can be installed in the lower die slots correspondingly, through installing upper die, lower die in upper die slots, lower die slots correspondingly, on the basis of realizing the preliminary positioning of upper die holder, lower die holder, have improved the position accuracy of upper die, lower die; further, it is provided with a cermet sand grip on the side surface that the upper die base is close to the die holder and along the circumference outer wall of last mould, the lower mould has open-ended one end and is provided with a spacing ring along outer wall circumference, this spacing ring be provided with a heavy groove in the side of lower mould groove that is on the back of each other, a through-hole and injecting glue pipe intercommunication have been seted up at the top of last mould, in the fit groove of embedding die holder through the upper die base, then through the cermet sand grip with spacing ring, go up mould and heavy groove surface's mutually support, go up mould and lower mould complex seal when still can guarantee the compound die state, avoid the circumstances that glue overflows at the encapsulation in-process, thereby improved encapsulation quality.
Drawings
FIG. 1 is a schematic view of the overall structure of a semiconductor processing apparatus with cermet of the present utility model;
FIG. 2 is a cross-sectional elevation view of a semiconductor processing apparatus having a cermet according to the present utility model;
fig. 3 is a partial sectional perspective view of a semiconductor processing apparatus having a cermet according to the present utility model.
In the above figures: 1. an upper die holder; 101. an upper die cavity; 2. a lower die holder; 201. a lower die cavity; 202. a fitting groove; 3. a rubber injection pipe; 4. a telescopic rod; 5. an upper die; 501. a through hole; 6. a lower die; 601. positioning columns; 602. a limiting ring; 603. sinking grooves; 7. a top plate; 8. a bottom plate; 9. a limit groove; 10. metal ceramic convex strips.
Description of the embodiments
In the description of the present patent, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships indicated based on technical solutions, are merely for convenience of describing the present patent and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as being limiting of the patent; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in this patent will be understood by those of ordinary skill in the art in a specific context.
The utility model is further described below with reference to examples:
example 1: a semiconductor processing apparatus having a cermet, comprising: the upper die holder 1 and the lower die holder 2 are connected through a plurality of telescopic rods 4, and the upper die holder 1 with a plurality of rubber injection pipes 3 is positioned above the lower die holder 2;
the upper die 5 and the lower die 6 are respectively placed in the upper die groove 101 and the lower die groove 201, and the telescopic rod 4 is controlled to shrink, so that the upper die holder 1 and the lower die holder 2 are gradually close until the die is closed.
The lower surface of the upper die holder 1 is provided with a plurality of upper die grooves 101 for embedding and installing the upper die 5, and the upper surface of the lower die holder 2 is provided with a plurality of lower die grooves 201 for embedding and installing the lower die 6;
the top of the lower die holder 2 is provided with a fit groove 202 for embedding and closing the upper die holder 1, and a metal ceramic raised line 10 is arranged on one side surface of the upper die holder 1, which is close to the lower die holder 2, along the circumferential outer wall of the upper die 5;
the upper die and the lower die are correspondingly arranged in the upper die groove and the lower die groove, so that the position accuracy of the upper die and the lower die is improved on the basis of realizing preliminary positioning of the upper die base and the lower die base.
One end of the lower die 6 far away from the upper die 5 is provided with a plurality of positioning columns 601 which can be correspondingly arranged in the lower die groove 201, one end of the lower die 6 with an opening is provided with a limiting ring 602 along the circumference of the outer wall, one side of the limiting ring 602, which is opposite to the lower die groove 201, is provided with a sinking groove 603, and the top of the upper die 5 is provided with a through hole 501 which is communicated with the rubber injection pipe 3.
A top plate 7 is fixedly arranged on the upper surface of the upper die holder 1, a bottom plate 8 is fixedly arranged on the lower surface of the lower die holder 2, and a plurality of telescopic rods 4 are arranged between the top plate 7 and the bottom plate 8; the telescopic rod 4 is a hydraulic telescopic rod; four telescopic rods 4 are arranged and are respectively positioned at the corners of the top plate 7 and the bottom plate 8.
The inner wall of the top of the lower die cavity 201 is provided with a limit groove 9 for embedding and installing a limit ring 602.
The glue solution added in the glue injection pipe 3 is resin.
Example 2: a semiconductor processing apparatus having a cermet, comprising: the upper die holder 1 and the lower die holder 2 are connected through a plurality of telescopic rods 4, and the upper die holder 1 with a plurality of rubber injection pipes 3 is positioned above the lower die holder 2;
the lower surface of the upper die holder 1 is provided with a plurality of upper die grooves 101 for embedding and installing the upper die 5, and the upper surface of the lower die holder 2 is provided with a plurality of lower die grooves 201 for embedding and installing the lower die 6;
the top of the lower die holder 2 is provided with a fit groove 202 for embedding and closing the upper die holder 1, and a metal ceramic raised line 10 is arranged on one side surface of the upper die holder 1, which is close to the lower die holder 2, along the circumferential outer wall of the upper die 5;
one end of the lower die 6 far away from the upper die 5 is provided with a plurality of positioning columns 601 which can be correspondingly arranged in the lower die groove 201, one end of the lower die 6 with an opening is provided with a limiting ring 602 along the circumference of the outer wall, one side of the limiting ring 602, which is opposite to the lower die groove 201, is provided with a sinking groove 603, and the top of the upper die 5 is provided with a through hole 501 which is communicated with the rubber injection pipe 3.
The upper die holder is embedded into the fit groove of the lower die holder, and then the metal ceramic convex strips are matched with the limiting rings and the surfaces of the upper die and the sinking groove, so that the tightness of the fit of the upper die and the lower die in a die-closing state can be ensured, the condition that glue overflows in the packaging process is avoided, and the packaging quality is improved.
A top plate 7 is fixedly arranged on the upper surface of the upper die holder 1, a bottom plate 8 is fixedly arranged on the lower surface of the lower die holder 2, and a plurality of telescopic rods 4 are arranged between the top plate 7 and the bottom plate 8.
The inner wall of the top of the lower die cavity 201 is provided with a limit groove 9 for embedding and installing a limit ring 602.
The positioning column 601 is a hollow positioning column.
The glue solution added in the glue injection pipe 3 is cold gel.
The working principle is as follows: during operation, the upper die 5 and the lower die 6 are respectively placed into the upper die groove 101 and the lower die groove 201 to be installed, and the telescopic rod 4 is controlled to shrink, so that the upper die holder 1 and the lower die holder 2 are gradually close to each other until the dies are closed;
when the upper die holder 1 and the lower die holder 2 are in a die-closing state, the bottom of the upper die 5 is embedded into the sinking groove 603 for extrusion contact, and the metal ceramic raised strips 19 are in contact with the top surfaces of the limiting rings 602, so that the tightness of the upper die 5 and the lower die 6 is improved, glue solution is introduced through the glue injection pipe 3 and flows into a cavity formed by the upper die 5 and the lower die 6 through the through holes 501 of the upper die 5.
When the semiconductor processing device with the metal ceramic is adopted, the top of the lower die holder is provided with the fit groove for embedding and closing the upper die holder, the lower surface of the upper die holder is provided with the plurality of upper die grooves for embedding and installing the upper die, the upper surface of the lower die holder is provided with the plurality of lower die grooves for embedding and installing the lower die, one end, far away from the upper die, of the lower die is provided with the plurality of positioning columns which can be correspondingly installed in the lower die grooves, and the position accuracy of the upper die and the lower die is improved on the basis of realizing the preliminary positioning of the upper die holder and the lower die by correspondingly installing the upper die and the lower die in the upper die groove and the lower die groove;
further, it is provided with a cermet sand grip on the side surface that the upper die base is close to the die holder and along the circumference outer wall of last mould, the lower mould has open-ended one end and is provided with a spacing ring along outer wall circumference, this spacing ring be provided with a heavy groove in the side of lower mould groove that is on the back of each other, a through-hole and injecting glue pipe intercommunication have been seted up at the top of last mould, in the fit groove of embedding die holder through the upper die base, then through the cermet sand grip with spacing ring, go up mould and heavy groove surface's mutually support, go up mould and lower mould complex seal when still can guarantee the compound die state, avoid the circumstances that glue overflows at the encapsulation in-process, thereby improved encapsulation quality.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (5)
1. A semiconductor processing apparatus having a cermet, comprising: the upper die holder (1) and the lower die holder (2), wherein the upper die holder (1) with a plurality of rubber injection pipes (3) is positioned above the lower die holder (2), and the upper die holder (1) is connected with the lower die holder (2) through a plurality of telescopic rods (4);
the method is characterized in that: the upper die comprises an upper die seat (1), a lower die seat (2), a lower die seat (6), a metal ceramic convex strip (10) and a metal ceramic convex strip, wherein the lower surface of the upper die seat (1) is provided with a plurality of upper die grooves (101) for embedding and installing an upper die (5), the upper surface of the lower die seat (2) is provided with a plurality of lower die grooves (201) for embedding and installing a lower die (6), the top of the lower die seat (2) is provided with a fit groove (202) for embedding and clamping the upper die seat (1), and the metal ceramic convex strip (10) is arranged on one side surface of the upper die seat (1) close to the lower die seat (2) and along the circumferential outer wall of the upper die (5);
one end of the lower die (6) far away from the upper die (5) is provided with a plurality of locating columns (601) which can be correspondingly arranged in the lower die groove (201), one end of the lower die (6) with an opening is provided with a limiting ring (602) along the circumference of the outer wall, one side of the limiting ring (602) opposite to the lower die groove (201) is provided with a sinking groove (603), and the top of the upper die (5) is provided with a through hole (501) which is communicated with the rubber injection pipe (3).
2. The semiconductor processing apparatus with cermet according to claim 1, wherein: the upper surface of upper die base (1) fixed mounting has a roof (7), the lower surface fixed mounting of die holder (2) has a bottom plate (8), be provided with a plurality of telescopic links (4) between roof (7) and bottom plate (8).
3. The semiconductor processing apparatus with cermet according to claim 2, wherein: the telescopic rod (4) is a hydraulic telescopic rod.
4. The semiconductor processing apparatus with cermet according to claim 1 or 2, characterized in that: the inner wall of the top of the lower die groove (201) is provided with a limiting groove (9) for embedding and installing a limiting ring (602).
5. The semiconductor processing apparatus with cermet according to claim 2, wherein: the positioning column (601) is a hollow positioning column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222558892.XU CN219476622U (en) | 2022-09-27 | 2022-09-27 | Semiconductor processing device with metal ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222558892.XU CN219476622U (en) | 2022-09-27 | 2022-09-27 | Semiconductor processing device with metal ceramic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219476622U true CN219476622U (en) | 2023-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222558892.XU Active CN219476622U (en) | 2022-09-27 | 2022-09-27 | Semiconductor processing device with metal ceramic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219476622U (en) |
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2022
- 2022-09-27 CN CN202222558892.XU patent/CN219476622U/en active Active
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