CN220643303U - Electroplating device with function of stabilizing concentration of metal ions in plating solution - Google Patents
Electroplating device with function of stabilizing concentration of metal ions in plating solution Download PDFInfo
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- CN220643303U CN220643303U CN202321802224.5U CN202321802224U CN220643303U CN 220643303 U CN220643303 U CN 220643303U CN 202321802224 U CN202321802224 U CN 202321802224U CN 220643303 U CN220643303 U CN 220643303U
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- 238000007747 plating Methods 0.000 title claims abstract description 249
- 238000009713 electroplating Methods 0.000 title claims abstract description 148
- 229910021645 metal ion Inorganic materials 0.000 title claims abstract description 27
- 230000000087 stabilizing effect Effects 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 15
- 230000001502 supplementing effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010924 continuous production Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 41
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 22
- 229910001431 copper ion Inorganic materials 0.000 description 22
- 230000005611 electricity Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000003113 dilution method Methods 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides an electroplating device with a function of stabilizing the concentration of metal ions in a plating solution, which comprises: a plating front-end assembly comprising at least one front-end plating unit; cathode conductive mechanisms arranged on two sides of the electroplating film; the front-stage plating unit includes: an electroplating bath, in which an electroplating anode is arranged; the electroplating anode comprises an insoluble anode and a soluble anode; the insoluble anode is arranged on one side of the electroplating film; the soluble anode is arranged on the other side of the electroplating film; the electroplating back section assembly is arranged at the downstream of the electroplating front section assembly and comprises at least one back section electroplating unit; cathode conductive mechanisms arranged on two sides of the electroplating film; the rear-stage plating unit includes: a plating tank in which a soluble anode is provided in pairs; the soluble anodes are arranged on two sides of the electroplating film, and the insoluble anodes are arranged in the electroplating line, so that the effect of stabilizing the metal ion content in the plating solution, ensuring continuous production, improving production efficiency and reducing production cost is achieved.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to an electroplating device with a function of stabilizing the concentration of metal ions in a plating solution.
Background
In the process of copper electroplating by using a composite film, a phosphorus copper anode is generally used for providing copper ions for a plating solution, the quantity of copper ions formed by the phosphorus copper ball anode in the production process is larger than the quantity consumed by the copper ions, so that the copper ions in the plating solution slowly rise, and the content of the copper ions in the plating solution exceeds the process requirement along with the time, therefore, the plating solution needs to be diluted by pumping part of the plating solution containing high-concentration copper ions from a plating tank and then adding pure water, sulfuric acid and other liquid medicines into the plating tank to reformulate the plating solution, and the plating is required to be stopped in the process of diluting the plating solution.
In summary, the following problems exist in the prior art: in the process of electroplating copper by using the composite film, the concentration of copper ions in the plating solution is reduced due to the need of diluting the plating solution, the electroplating line stops working in the dilution process, the utilization rate and the production efficiency of equipment are reduced, and meanwhile, a liquid storage container is also required to be added, so that the production cost is increased.
Disclosure of Invention
The utility model provides an electroplating device with a function of stabilizing the concentration of metal ions in a plating solution, which solves the problems that in the existing composite film copper electroplating process, the concentration of copper ions in the plating solution is required to be reduced by diluting the plating solution, and an electroplating line stops working in the dilution process, so that the utilization rate and the production efficiency of equipment are reduced, and meanwhile, a liquid storage container is required to be added, so that the production cost is increased.
The utility model provides an electroplating device with a function of stabilizing the concentration of metal ions in a plating solution, which comprises:
a plating front-end assembly comprising at least one front-end plating unit;
cathode conductive mechanisms arranged on two sides of the electroplating film 1 in a contact manner;
the front-stage plating unit includes:
the electroplating device comprises an electroplating bath 5, wherein an electroplating anode is arranged in the electroplating bath 5;
the electroplating anode comprises an insoluble anode 3 and a soluble anode 4;
the insoluble anode 3 is arranged on one side of the electroplating film 1 in a non-contact manner;
the soluble anode 4 is arranged on the other side of the electroplating film 1 in a non-contact manner;
the electroplating back section assembly is arranged at the downstream of the electroplating front section assembly and comprises at least one back section electroplating unit;
cathode conductive mechanisms arranged on two sides of the electroplating film 1 in a contact manner;
the rear-stage plating unit includes:
a plating tank 5, wherein a soluble anode 4 is arranged in pairs in the plating tank 5;
the soluble anode 4 is disposed on both sides of the plating film 1 without contact.
Further, the cathode conductive mechanism comprises a conductive belt 12 with an annular travelling belt, the conductive belt 12 is arranged on two side surfaces of the electroplating film 1 which is vertically arranged, and the conductive belt 12 drives the electroplating film 1 to horizontally travel the film.
Further, the cathode conductive mechanism further comprises conductive rollers 2, and the conductive rollers 2 are arranged in pairs between two adjacent front-stage electroplating units or rear-stage electroplating units.
Further, the insoluble anode 3 is disposed above the plating film 1.
Further, the plating apparatus further includes a submerged roller 9, and the plating film 1 is wound around from the left side contact of the submerged roller 9 and wound out from the right side contact of the submerged roller 9.
Further, the plated anodes are provided on both left and right sides of the submerged roller 9.
Further, the plating apparatus further includes a barrier film 10, the insoluble anode 3 is disposed outside the plating film 1 without contact, and the barrier film 10 is disposed between the insoluble anode 3 and the plating film 1.
Further, the conductive rollers 2 are arranged in pairs on the side of the plating anode away from the submerged roller 9; in each pair of the conductive rollers 2, the plating film 1 is wound in from one side of one conductive roller 2 of the conductive rollers 2 and wound out from one side of the other conductive roller 2.
Further, a liquid storage tank 6 is arranged below the plating tank 5, and a liquid supplementing pump is arranged between the liquid storage tank 6 and the plating tank 5 and used for supplementing plating solution to the plating tank 5.
Further, the plating film 1 is arranged vertically.
The technical scheme has the following beneficial technical effects: the insoluble anode and the soluble anode are arranged at the electroplating front section of the electroplating device for use together, and the insoluble anode consumes newly increased copper ions, so that the concentration of copper ions in the plating solution accords with the process standard, the electroplating process of an electroplating line is not influenced, and the effects of improving the production efficiency and reducing the production cost are achieved.
Drawings
FIG. 1 is a front view showing a first configuration of an electroplating apparatus having a function of stabilizing a concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 2 is a front view showing a second construction of an electroplating apparatus having a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 3 is a front view showing a third configuration of an electroplating apparatus with a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 4 is a front view showing a fourth configuration of an electroplating apparatus having a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 5 is a schematic top view showing a fourth configuration of an electroplating apparatus with a function of stabilizing a concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 6 is a front view showing a fifth configuration of an electroplating apparatus having a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 7 is a schematic top view showing a fifth configuration of an electroplating apparatus with a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the present utility model;
FIG. 8 is a schematic top view showing a sixth configuration of an electroplating apparatus with a function of stabilizing the concentration of metal ions in a plating solution according to an embodiment of the utility model.
Reference numerals illustrate:
1. electroplating a film; 2. a conductive roller; 201. a rear conductive roller; 202. a front conductive roller; 3. an insoluble anode; 4. a soluble anode; 5. plating bath; 6. a liquid storage tank; 7. an unreeling device; 8. a winding device; 9. a submerged roller; 10. a barrier film; 11. a pinch roller; 12. a conductive tape; 13. a belt pulley; 14. a connecting frame; 15. passing through a roller; 16. tension roller.
Detailed Description
The present utility model will now be described for a clearer understanding of technical features, objects, and effects of the present utility model.
As shown in fig. 1, an embodiment of the present utility model provides an electroplating apparatus having a function of stabilizing a concentration of metal ions in a plating solution, the electroplating apparatus comprising:
a plating front-end assembly comprising at least one front-end plating unit; cathode conductive mechanisms arranged on two sides of the electroplating film 1 in a contact manner; the front-stage plating unit includes: the electroplating device comprises an electroplating bath 5, wherein an electroplating anode is arranged in the electroplating bath 5; the electroplating anode comprises an insoluble anode 3 and a soluble anode 4; the insoluble anode 3 is arranged on one side of the electroplating film 1 in a non-contact manner; the soluble anode 4 is arranged on the other side of the electroplating film 1 in a non-contact manner;
the electroplating back section assembly is arranged at the downstream of the electroplating front section assembly and comprises at least one back section electroplating unit; cathode conductive mechanisms arranged on two sides of the electroplating film 1 in a contact manner; the rear-stage plating unit includes: a plating tank 5, wherein a soluble anode 4 is arranged in pairs in the plating tank 5; the soluble anode 4 is disposed on both sides of the plating film 1 without contact.
In the production process, the electroplating front-stage component in the electroplating device is arranged in a low current density area of the electroplating line, and the electroplated component is arranged in a medium current density area and a high current density area of the electroplating line. In the pre-plating assembly, if the plating anode is a soluble anode 4, for example, the plating anode is a phosphorus copper ball anode, in the plating process, the amount of copper ions formed by the phosphorus copper ball anode is larger than the amount of copper ions consumed, so that the concentration of copper ions in the plating solution can rise, when the concentration of copper ions in the plating solution rises to a certain value, the content of copper ions in the plating solution exceeds the process requirement and normal plating cannot be performed, therefore, in the pre-plating assembly, the plating anode in the same plating tank 5 adopts a mode of combining the insoluble anode 3 and the soluble anode 4, namely, each pair of plating anode in one plating tank 5 comprises one insoluble anode 3 and one soluble anode 4, the amount of copper ions newly added in each plating tank 5 is calculated, the pre-plating assembly is arranged according to the amount of the insoluble anode 3, as shown in fig. 1-3, in the plating line comprising six plating tanks 5, the left two other components form the pre-plating assembly from left to right, and the other components form the four components in the left-to-right plating assembly comprising the plating tank 5, and the other plating assembly comprising the four components shown in the left-to-right 4 and the other plating assembly, as shown in the left-to the plating assembly, the left-to the plating assembly and the left-right component 4 form the left-to the plating assembly and the left-to the left component 5 and the plating assembly comprising the left-to form the plating assembly and the left component 4 in the plating assembly. In the post-plating assembly, the plating film 1 in the plating line is carried along from the pre-plating assembly to the post-plating assembly, the plating film 1 is plated when passing through each plating tank 5, the plating layer on the plating film 1 is thicker and thicker, as the plating layer is thicker and thicker, the plating film 1 enters a medium current density area and a high current density area of the post-plating assembly, and more copper ions are consumed during plating, so that in the post-plating assembly, the plating anode adopts the soluble anode 4, and if the plating anode 4 and the insoluble anode 3 are combined with each other to form the plating anode in the plating tank 5, the consumption of copper ions in the plating solution in the plating tank 5 is large, so that the copper ions in the plating tank 5 are insufficient, and finally, the problem of influencing the plating efficiency is generated.
The electroplating anode is connected to the side wall or the bottom wall of the electroplating tank 5 through a connecting structure. As shown in fig. 5, 7 and 8, the plating anode is connected to the tank wall by a connecting frame 14, and the tank wall may be a tank side wall or a tank bottom wall.
The insoluble anode 3 can be a titanium mesh; the soluble anode 4 can be a titanium basket, a copper ball is placed in the titanium basket, or a phosphor copper plate.
Further, the cathode conductive mechanism comprises a conductive belt 12 with an annular travelling belt, the conductive belt 12 is arranged on two side surfaces of the electroplating film 1 which is vertically arranged, and the conductive belt 12 drives the electroplating film 1 to horizontally travel the film.
As shown in fig. 4 and 5, the cathode conductive mechanism of the embodiment of the utility model adopts a conductive belt 12 with an annular travelling belt to provide cathode electricity, an electroplating anode provides anode electricity, and the conductive belt 12 drives an electroplating film 1 to horizontally travel. The vertical arrangement of the plating film 1 can save the horizontal space of the plating device, wherein four conductive strips 12 are respectively arranged on the front and the back above the plating film 1 and the front and the back below the plating film 1, and the conductive strips 12 are in contact with the plating film 1, so that the plating layers on two sides of the plating film 1 in the width direction are uniform, the plating film 1 is clamped and removed, and the smooth removal of the plating film 1 is ensured.
The cathode conductive mechanism provides cathode electricity through the conductive belt 12, and in order to support the conductive belt 12 of the endless traveling belt and play a role in tensioning and driving the conductive belt 12, a belt pulley 13 is arranged at four corners of the conductive belt 12. Three guide rollers are arranged between two adjacent front-stage electroplating units or between two adjacent rear-stage electroplating units and between the front-stage electroplating units and the rear-stage electroplating units at preset intervals for guiding the electroplating film 1, the first two are the passing rollers 15 and the third are the tension rollers 16 in sequence from left to right, the passing rollers 15 are used for guiding the electroplating film 1, and the tension rollers 16 are not only used for guiding the electroplating film 1, but also can be used for detecting the tension of the electroplating film 1 passing through the tension rollers and adjusting the tension according to detection results. Too much tension, decreasing tension (i.e., decreasing compression of the film), and too little tension increases tension (i.e., increasing compression of the film).
Further, the cathode conductive mechanism further comprises conductive rollers 2, and the conductive rollers 2 are arranged in pairs between two adjacent front-stage electroplating units or rear-stage electroplating units.
As shown in fig. 1 to 3, fig. 6 to 8, the cathode conductive mechanism supplies cathode electricity through the conductive rollers 2, the plating anode supplies anode electricity, the conductive rollers 2 are arranged in pairs, and each pair of conductive rollers 2 is arranged in contact on both sides of the plating film 1. The conductive roller 2 conducts the cathode electricity to the electroplating film 1, so that the electroplating film 1 conducts the cathode electricity, and after the electroplating film 1 enters the tank body of the electroplating tank 5 in the film feeding process, the anode electricity of the electroplating anode in the electroplating tank 5, the cathode electricity of the electroplating film 1 and the plating solution in the electroplating tank 5 form an electroplating loop, and metal cations are deposited on the electroplating film 1.
As shown in fig. 1, the plating film 1 is horizontally disposed, and each pair of conductive rollers 2 is disposed on both upper and lower sides of the plating film 1, respectively, and as shown in fig. 1, on the horizontal plating line, two conductive rollers 2 of each pair of conductive rollers 2 are alternately disposed, that is, the plating film 1 is wound in from one conductive roller 2 and wound out from the other conductive roller 2.
As shown in fig. 2 and 3, in the embodiment of the present utility model, the plating film 1 is horizontally disposed on the V-shaped plating line, two conductive rollers 2 of each pair of conductive rollers 2 are disposed at both sides of the plating film 1 up and down at one end of the V-shaped plating line, the plating film 1 is wound in from the left side of the conductive roller 2 disposed above, wound out from the right side, then is contacted with the upper side of the other conductive roller 2 disposed below and wound out from the left side thereof, and the plating film 1 is wound in from the right side of the conductive roller 2 disposed below, wound in from the upper side, and then is wound in contact with the lower side of the other conductive roller 2 disposed above at the other end of the V-shaped plating line.
As shown in fig. 6 to 8, on the horizontal plating line of the embodiment of the present utility model, the plating film 1 is vertically disposed, the conductive rollers 2 are disposed between the plating tanks 5 in a pair-wise interval, and as in the embodiment of the present utility model shown in fig. 7 to 8, the conductive rollers 2 include a front conductive roller 202 disposed in a pair-wise and horizontal interval and a rear conductive roller 201 disposed in a pair-wise and horizontal interval; the front conductive roller 202 includes a front conductive roller left roller and a front conductive roller right roller, and the rear conductive roller 201 includes a rear conductive roller left roller and a rear conductive roller right roller. The conductive roller conducts cathode electricity to the plating film 1 in the electroplating process, so that an electroplating loop is formed between the conductive roller and an electroplating anode and between the conductive roller and the plating solution. In order to ensure uniform plating thickness on both sides of the plated film 1 after plating, cathode electricity is conducted on both sides of the plated film 1, and by providing two pairs of conductive rollers 2, the plated film 1 is made to sufficiently and uniformly conduct electricity on both sides of the plated film 1 in a manner of detouring between the two pairs of conductive rollers 2.
After being wound from the left side contact winding right side of the left roller of the rear conductive roller, the electroplated film 1 is contacted with the front of the left roller of the front conductive roller and the right roller of the front conductive roller and is wound from the right roller of the front conductive roller. Two pairs of conductive rollers 2 are vertically arranged to conduct cathode electricity to the front and the back of the vertically arranged electroplating film 1, and the electroplating film 1 bypasses a gap between the conductive rollers 2, so that uniform cathode electricity is obtained on the front and the back of the electroplating film 1.
Further, the insoluble anode 3 is disposed above the plating film 1. The insoluble anode 3 generates bubbles by oxygen evolution during operation, the bubbles rise upwards, and when the insoluble anode 3 is arranged above the plating film 1, the generated bubbles do not reach the film surface of the plating film 1, so that the plating film 1 is not affected. If the insoluble anode 3 is provided below the plating film 1 so that bubbles do not affect the plating film 1, a barrier film 10 for blocking the bubbles from rising to the film surface of the plating film 1 needs to be provided between the plating film 1 and the insoluble anode 3.
Further, the plating apparatus further includes a submerged roller 9, and the plating film 1 is wound around from the left side contact of the submerged roller 9 and wound out from the right side contact of the submerged roller 9. The submerged roller 9 is arranged at the middle position of the plating bath 5 in the transverse direction, and is longitudinally close to the bottom wall of the plating bath 5 or the side wall of the front tank, in order to realize the tensioning of the film, the submerged roller 9 in the plating bath 5 is contacted and wound on the left side of the submerged roller 9, and the plated film 1 is contacted and wound on the right side of the submerged roller 9, so that the plated film 1 forms a certain angle with the submerged roller 9 in the film feeding process, the tension of the plated film 1 is increased, the plated film 1 is smoother and is not easy to wrinkle in the film feeding process. When the plating film 1 in the plating line is vertically arranged, the submerged roller 9 in the plating line is also vertically arranged.
Further, plating anodes are provided on both left and right sides of the submerged roller 9. As shown in fig. 2, the plating anode in the plating front-stage assembly of the V-shaped plating line according to the embodiment of the utility model is an insoluble anode 3 and a soluble anode 4, and the insoluble anode 3 is disposed on the inner side of the plating film 1 without contact, so that bubbles generated by the insoluble anode 3 will not affect the plating film 1.
Further, the plating apparatus further includes a barrier film 10, the insoluble anode 3 is disposed outside the plating film 1 without contact, and the barrier film 10 is disposed between the insoluble anode 3 and the plating film 1.
As shown in fig. 3, in the plating front section assembly of the V-shaped plating line, the insoluble anode 3 may be disposed outside the plating film 1, but if the insoluble anode 3 is disposed outside the plating film 1, bubbles are generated by oxygen evolution during operation of the insoluble anode, and rise to the plating film 1, the plating film 1 is lifted up, and the distances between the plating film 1 and the anodes on both sides thereof are made different, so that the plating thickness is different, and therefore, a barrier film 10 is disposed between the plating film 1 and the insoluble anode 3, the barrier film 10 blocks the plating film 1, the bubbles cannot pass through the barrier film 10, and can bypass the barrier film 10 only, and the bubbles are prevented from rising to the film surface of the plating film 1, thereby lifting up the film. The barrier film 10 does not affect the plating film on the lower surface of the plating film 1, and since the barrier film 10 is not conductive, the barrier film 10 is not plated either, and the barrier film 10 may be a separator or a semipermeable film.
Further, the conductive rollers 2 are arranged in pairs on the side of the plating anode away from the submerged roller 9; in each pair of the conductive rollers 2, the plating film 1 is wound in from one side of one conductive roller 2 of the conductive rollers 2 and wound out from one side of the other conductive roller 2.
The electroplating film 1 bypasses the gaps between the conductive rollers 2, so that the electric conduction of the front and back surfaces of the electroplating film 1 is sufficient, and uniform cathode electricity is obtained on the front and back surfaces of the electroplating film 1.
Further, a liquid storage tank 6 is arranged below the plating tank 5, and a liquid supplementing pump is arranged between the liquid storage tank 6 and the plating tank 5 and used for supplementing plating solution to the plating tank 5.
As shown in fig. 1, fig. 4-fig. 8, the plating film 1 passes through two sides of the plating tank 5, so that the plating tank 5 has a gap through which the plating film 1 passes, the plating solution can flow outwards, a liquid storage tank 6 is arranged below the plating tank 5, then the plating solution will flow into the liquid storage tank 6, a liquid supplementing pump is arranged between the liquid storage tank 6 and the plating tank 5 and is connected with the liquid storage tank 6 and the plating tank 5, when the plating solution in the plating tank 5 is insufficient, the liquid supplementing pump is started to convey the plating solution in the liquid storage tank 6 into the plating tank 5, thereby replenishing the plating solution in time, and the plating solution does not need to be prepared again by supplementing pure water, sulfuric acid and other liquid medicines in the plating tank 5, and a liquid storage container is also increased, so that the production cost is reduced.
Further, the plating film 1 is arranged vertically. As shown in fig. 6-8, the embodiment of the utility model adopts the conductive roller 2 to provide cathode electricity, wherein the electroplating film 1 is vertically arranged, the conductive roller 2 is also vertically arranged, and the horizontal space of a production workshop is saved.
As shown in fig. 1 to 3, the electroplating device according to the embodiment of the utility model further comprises an unreeling device 7 and a reeling device 8; the unreeling device 7 is connected with one end of the electroplated film 1 and used for unreeling the electroplated film 1, and the reeling device 8 is connected with the other end of the electroplated film 1 and used for reeling the electroplated film 1.
In the embodiment of the present utility model, the pinch rollers 11 are disposed on two sides of the plating film 1, in the embodiment of the conductive mechanism of the cathode being the conductive belt 12, as shown in fig. 5, a plurality of pinch rollers 11 are disposed on two sides of the plating film 1 in contact, the pinch roller 11 on one side presses the conductive belt 12 on the same side against the plating film 1, and tightens the conductive belt 12 to make the conductive belt 12 fully contact with the plating film 1, and electrically conducts the cathode of the conductive belt 12 to the plating film 1, the pinch rollers 11 on two sides of the plating film 1 also play a limiting role, since the conductive belt 12 is a ring-shaped travelling belt, if the pinch rollers 11 are disposed on only the left and right sides of the plating anode, the force of the pinch rollers 11 on the conductive belt 12 is limited, which is insufficient to make the conductive belt 12 fully contact with the plating film 1 all the time, therefore in the embodiment of providing the cathode electricity on the conductive belt 12, a greater number of pinch rollers 11 are required to be disposed. In the embodiment in which the cathode conductive mechanism is the conductive roller 2, pinch rollers 11 are respectively arranged at the left side and the right side of the electroplating anode in pairs, and each pair of pinch rollers 11 is respectively arranged at two sides of the electroplating film 1 and used for guiding the horizontal running of the electroplating film 1 and more accurate limiting guiding of the electroplating film 1.
According to the embodiment of the utility model, the electroplating front-section assembly is arranged in the electroplating line, the electroplating anode arranged in pairs in the electroplating front-section assembly consists of the insoluble anode 3 and the soluble anode 4, copper ions cannot be generated in the electroplating process of the insoluble anode 3, the concentration of copper ions in the plating solution cannot exceed the standard and exceed the process requirement, and the electroplating anode arranged in pairs in the electroplating tank 5 in the electroplating rear-section assembly in the electroplating line is the soluble anode 4, so that the sufficiency of metal ions in the electroplating rear-section assembly can be ensured, and the electroplating efficiency is ensured. The electroplating anode in the electroplating device is arranged in a mode that the insoluble anode 3 and the soluble anode 4 coexist, so that the aim of stabilizing the copper ion content in the plating solution is fulfilled, continuous production is guaranteed, the equipment utilization rate and the production efficiency are improved, and meanwhile, the production cost is reduced.
The foregoing is illustrative of the present utility model and is not to be construed as limiting the scope of the utility model. In order that the components of the utility model may be combined without conflict, any person skilled in the art shall make equivalent changes and modifications without departing from the spirit and principles of the utility model.
Claims (10)
1. An electroplating device with a function of stabilizing a concentration of metal ions in a plating solution, the electroplating device comprising:
a plating front-end assembly comprising at least one front-end plating unit;
cathode conductive mechanisms arranged on two sides of the electroplating film (1) in a contact manner;
the front-stage plating unit includes:
an electroplating bath (5), wherein an electroplating anode is arranged in the electroplating bath (5);
the electroplating anode comprises an insoluble anode (3) and a soluble anode (4);
the insoluble anode (3) is arranged on one side of the electroplating film (1) in a non-contact manner;
the soluble anode (4) is arranged on the other side of the electroplating film (1) in a non-contact manner;
the electroplating back section assembly is arranged at the downstream of the electroplating front section assembly and comprises at least one back section electroplating unit;
cathode conductive mechanisms arranged on two sides of the electroplating film (1) in a contact manner;
the rear-stage plating unit includes:
a plating tank (5), wherein a soluble anode (4) is arranged in a pair in the plating tank (5);
the soluble anode (4) is arranged on both sides of the electroplating film (1) in a non-contact manner.
2. The electroplating device with the function of stabilizing the concentration of metal ions in a plating solution according to claim 1, wherein the cathode conductive mechanism comprises a conductive belt (12) which is in an annular shape and is arranged on two side surfaces of the electroplating film (1) which are vertically arranged, and the conductive belt (12) drives the electroplating film (1) to horizontally move.
3. The plating apparatus having a function of stabilizing a metal ion concentration in a plating solution according to claim 1, wherein said cathode conductive mechanism further comprises conductive rollers (2), said conductive rollers (2) being disposed in pairs between two adjacent ones of said front-stage plating units or said rear-stage plating units.
4. A plating apparatus having a function of stabilizing a metal ion concentration in a plating solution according to claim 3, wherein said insoluble anode (3) is disposed above said plating film (1).
5. A plating apparatus having a function of stabilizing a concentration of metal ions in a plating solution according to claim 3, characterized in that said plating apparatus further comprises a submerged roller (9), and said plating film (1) is wound around from the left side contact of said submerged roller (9) and is wound out from the right side contact of said submerged roller (9).
6. The plating apparatus having a function of stabilizing a metal ion concentration in a plating solution according to claim 5, wherein said plating anode is provided on both left and right sides of said submerged roller (9).
7. The plating apparatus having a function of stabilizing a concentration of metal ions in a plating solution according to claim 6, further comprising a barrier film (10), wherein the insoluble anode (3) is disposed outside the plating film (1) without contact, and wherein the barrier film (10) is disposed between the insoluble anode (3) and the plating film (1).
8. Electroplating device with the function of stabilizing the concentration of metal ions in a plating solution according to claim 7, characterized in that the conductive rollers (2) are arranged in pairs on the side of the electroplating anode remote from the submerged roller (9); in each pair of the conductive rollers (2), the plating film (1) is wound in from one side of one conductive roller (2) of the conductive rollers (2) and wound out from one side of the other conductive roller (2).
9. The electroplating device with the function of stabilizing the concentration of metal ions in the plating solution according to claim 1, wherein a liquid storage tank (6) is arranged below the electroplating bath (5), and a liquid supplementing pump is arranged between the liquid storage tank (6) and the electroplating bath (5) and used for supplementing the plating solution to the electroplating bath (5).
10. A plating apparatus having a function of stabilizing a metal ion concentration in a plating solution according to claim 3, wherein said plating film (1) is vertically arranged.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321802224.5U CN220643303U (en) | 2023-07-10 | 2023-07-10 | Electroplating device with function of stabilizing concentration of metal ions in plating solution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321802224.5U CN220643303U (en) | 2023-07-10 | 2023-07-10 | Electroplating device with function of stabilizing concentration of metal ions in plating solution |
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| CN220643303U true CN220643303U (en) | 2024-03-22 |
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| CN202321802224.5U Active CN220643303U (en) | 2023-07-10 | 2023-07-10 | Electroplating device with function of stabilizing concentration of metal ions in plating solution |
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| Country | Link |
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| CN (1) | CN220643303U (en) |
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