CN220639144U - Buffer cushion - Google Patents
Buffer cushion Download PDFInfo
- Publication number
- CN220639144U CN220639144U CN202321930793.8U CN202321930793U CN220639144U CN 220639144 U CN220639144 U CN 220639144U CN 202321930793 U CN202321930793 U CN 202321930793U CN 220639144 U CN220639144 U CN 220639144U
- Authority
- CN
- China
- Prior art keywords
- buffer layer
- layer
- cushion
- buffer
- blotter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008878 coupling Effects 0.000 claims abstract description 3
- 238000010168 coupling process Methods 0.000 claims abstract description 3
- 238000005859 coupling reaction Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 91
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 239000002344 surface layer Substances 0.000 claims description 15
- 239000002655 kraft paper Substances 0.000 claims description 12
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 10
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 10
- 241001330002 Bambuseae Species 0.000 claims description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 10
- 239000011425 bamboo Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 229920006231 aramid fiber Polymers 0.000 claims description 4
- 239000002657 fibrous material Substances 0.000 claims description 3
- 238000009941 weaving Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000002103 nanocoating Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
- Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a cushion pad, comprising: from last smooth surface course, first buffer layer, second buffer layer and the fog surface course that sets gradually down, set up the enhancement layer between first buffer layer and the second buffer layer, and first buffer layer and second buffer layer body coupling, the coaxial a plurality of locating holes that set up on smooth surface course, first buffer layer, second buffer layer and the fog surface course, locating hole inner periphery side sets up the joint groove. Through the reinforcement layer that sets up between first buffer layer and second buffer layer, can strengthen the holistic tensile strength of blotter, prevent that the blotter from wholly warping at pressfitting in-process, effectively prolonged the life of blotter, ensure that the circuit board is pressed all the time and is heated evenly, improve circuit board production quality. Through the joint protruding with the joint groove corresponds the cooperation, can further strengthen the position location of blotter, prevent that the blotter from appearing the drunkenness phenomenon in pressfitting in-process to avoid the production of piece, effectively improve the production quality of circuit board.
Description
Technical Field
The utility model relates to the technical field of printing and pressing of circuit boards, in particular to a buffer pad.
Background
The multilayer circuit board needs to be subjected to hot pressing to form a multilayer structure, and for pressing of circuit boards such as thick copper multilayer circuit boards, embedded resistor multilayer circuit boards and the like which need to conduct heat in time, pressing is needed to be conducted by applying a pressing buffer pad with good heat conducting performance. The patent number is: "CN212708409U", patent name: an utility model patent of a composite cushion pad comprises a first nano coating, a high temperature resistant layer and a second nano coating; one end of the high-temperature resistant layer is provided with a first nano coating, and the other end of the high-temperature resistant layer is provided with a second nano coating; the high-temperature-resistant layer is internally provided with a first base cloth layer, a first high-polymer material layer, a second base cloth layer, a second high-polymer material layer, a third base cloth layer, a third high-polymer material layer and a fourth base cloth layer in sequence.
However, the above-mentioned cushion still has certain use drawbacks for certain use cases: on the one hand, the cushion pad is easy to deform after being repeatedly pressed for several times during use, so that the whole cushion pad is uneven in acceptance and low in high pressure resistance and has poor overall durability. Moreover, the cushion pad is not easy to position when in use, and is easy to move in the lamination process, and the cushion pad is easy to generate more scraps under the repeated lamination friction condition, so that the production quality of the circuit board is affected. Therefore, a cushion pad has been proposed which is aimed at solving the above-mentioned drawbacks.
Disclosure of Invention
The utility model overcomes the defects of the prior art and provides a cushion pad.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a cushion pad comprising: from last smooth surface course, first buffer layer, second buffer layer and the fog surface course that sets gradually down, first buffer layer and second buffer layer adopt the rubber material to make, set up the enhancement layer between first buffer layer and the second buffer layer, just first buffer layer and second buffer layer body coupling, smooth surface course first buffer layer the second buffer layer with coaxial a plurality of locating holes that set up on the fog surface course, locating hole inner periphery side sets up the joint groove.
In a preferred embodiment of the present utility model, the smooth surface layer is made of bamboo kraft paper, and the outer layer of the bamboo kraft paper is coated with a silica gel coating.
In a preferred embodiment of the present utility model, the reinforcing layer is made of alkali-free glass fibers and silane coatings coated on the upper and lower surfaces of the alkali-free glass fibers.
In a preferred embodiment of the present utility model, an adhesive layer is disposed between the first buffer layer and the reinforcing layer, and between the second buffer layer and the reinforcing layer, and the adhesive layer is made of a nano adhesive.
In a preferred embodiment of the present utility model, the fog layer is woven from aramid fiber materials.
In a preferred embodiment of the utility model, the pressing device is provided with a pressing plate, the bottom surface of the pressing plate is provided with a plurality of positioning columns, the peripheral side surfaces of the positioning columns are provided with clamping bulges, and the clamping bulges are correspondingly matched with the clamping grooves.
In a preferred embodiment of the present utility model, the clamping protrusion is made of a silica gel material.
The utility model solves the defects existing in the background technology, and has the following beneficial effects:
(1) According to the utility model, the reinforcing layer is arranged between the first buffer layer and the second buffer layer, so that the whole tensile strength of the buffer pad can be enhanced, the whole buffer pad is effectively prevented from deforming in the pressing process, the service life of the buffer pad is further effectively prolonged, and the circuit board is effectively ensured to be pressed and heated uniformly all the time. And the reinforcing layers made of the silane coating coated on the upper surface and the lower surface of the alkali-free glass fiber have better antistatic effect, prevent the circuit board from being damaged due to over-electricity, and further protect the circuit board.
(2) The light surface layer is made of the bamboo pulp kraft paper material, the bamboo pulp kraft paper has the advantage of low tightness, the low tightness can effectively improve the absorption performance and the buffering capacity of the circuit board laminated kraft paper, and the outer layer of the bamboo pulp kraft paper is coated with the silica gel coating, so that the wear resistance of the buffer backing plate is further improved.
(3) According to the utility model, the clamping protrusions are correspondingly matched with the clamping grooves, so that the position positioning of the buffer pad can be further enhanced, the phenomenon of movement of the buffer pad in the pressing process is prevented, the friction action of the pressing plate on the buffer pad is further reduced, the generation of scraps is avoided, and the production quality of the circuit board is effectively improved.
Drawings
The utility model is further described below with reference to the drawings and examples;
FIG. 1 is a perspective view of a preferred embodiment of the present utility model;
FIG. 2 is a top view of a preferred embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional view at A-A of FIG. 2;
FIG. 4 is a schematic cross-sectional view at B-B in FIG. 2;
FIG. 5 is a schematic cross-sectional view at C-C of FIG. 2;
FIG. 6 is an exploded view of a preferred embodiment of the present utility model;
FIG. 7 is an enlarged schematic view at A in FIG. 3;
fig. 8 is an enlarged schematic view at B in fig. 5.
Concretely, 1, a light surface layer; 2. a first buffer layer; 3. a second buffer layer; 4. a reinforcing layer; 5. a matte layer; 6. positioning holes; 7. an adhesive layer; 8. pressing the plate; 9. positioning columns; 10. and the clamping bulge is connected.
Detailed Description
The utility model will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the utility model, which are presented only by way of illustration, and thus show only the structures that are relevant to the utility model.
As shown in fig. 1-5, a cushion comprising: the light surface layer 1, the first buffer layer 2, the second buffer layer 3 and the fog surface layer 5 which are sequentially arranged from top to bottom, the first buffer layer 2 and the second buffer layer 3 are integrally connected, the thickness of the first buffer layer 2 and the second buffer layer 3 is 1-2mm, preferably 1.5mm, the thickness of the reinforcing layer 4 is 0.5-1mm, preferably 0.5mm, the thickness of the fog surface layer 5 is 0.1-0.5mm, preferably 0.5mm, the bonding layers 7 are arranged between the first buffer layer 2 and the reinforcing layer 4 and between the second buffer layer 3 and the reinforcing layer 4, and the fixing effect of the reinforcing layer 4 can be enhanced through the bonding layers 7 arranged between the first buffer layer 2 and the reinforcing layer 4 and between the second buffer layer 3 and the reinforcing layer 4, so that deformation and detachment of the reinforcing layer 4 after the first buffer layer 2 and the second buffer layer 3 are pressed for several times can be prevented, and the whole quality of the cushion pad is ensured.
In a preferred embodiment of the present utility model, as shown in fig. 6, the adhesive layer 7 is made of nano adhesive, and the nano adhesive is disposed on the surfaces of the first buffer layer 2 and the second buffer layer 3 in a dispensing manner, and the nano adhesive is disposed in a dispensing manner, so that the air permeability of the whole buffer pad is not affected, and the heat dissipation performance is better.
In a preferred embodiment of the present utility model, the light surface layer 1 is made of bamboo pulp kraft paper, and the bamboo pulp kraft paper has the advantage of low tightness, the low tightness can effectively improve the absorption performance and the buffering capacity of the circuit board laminated kraft paper, and the outer layer of the bamboo pulp kraft paper is coated with a silica gel coating, so that the wear resistance of the buffer backing plate can be increased. The mist surface layer 5 is formed by weaving aramid fiber materials, and the aramid fiber has ultrahigh strength, high temperature resistance and light weight, so that the compression strength and the tensile strength of the cushion pad can be further increased, and the overall quality of the cushion pad is improved.
As shown in fig. 7 and 8, in a preferred embodiment of the present utility model, a plurality of positioning holes 6 are coaxially disposed on the optical surface layer 1, the first buffer layer 2, the second buffer layer 3 and the fog surface layer 5, clamping grooves (not shown in the drawings) are disposed on inner peripheral sides of the positioning holes 6, a pressing plate is disposed on the pressing device (not shown in the drawings), a plurality of positioning columns 9 are disposed on bottom surfaces of the pressing plate 8, clamping protrusions 10 are disposed on outer peripheral sides of the positioning columns 9, and the clamping protrusions 10 are correspondingly matched with the clamping grooves. Through the corresponding cooperation of joint protruding 10 and joint groove, can further strengthen the position location of blotter, prevent that the blotter from appearing the drunkenness phenomenon at pressfitting in-process, and then reduce the friction effect of pressfitting board 8 to the blotter to avoid the production of piece, effectively improve the production quality of circuit board. It should be noted that, the clamping protrusion 10 made of silica gel material has a certain elastic deformation property, and can be better matched with the clamping groove, so that the clamping protrusion can easily enter the clamping groove to be matched with the clamping groove in a clamping way.
In a preferred embodiment of the utility model, the first buffer layer 2 and the second buffer layer 3 are made of rubber materials, the reinforcing layer 4 is arranged between the first buffer layer 2 and the second buffer layer 3, and the reinforcing layer 4 arranged between the first buffer layer 2 and the second buffer layer 3 can strengthen the whole tensile strength of the buffer pad, effectively prevent the whole buffer pad from deforming in the pressing process, further effectively prolong the service life of the buffer pad and effectively ensure that the circuit board is always pressed and heated uniformly.
In a preferred embodiment of the present utility model, the reinforcing layer 4 is made of alkali-free glass fibers and silane coatings coated on the upper and lower surfaces of the alkali-free glass fibers. The reinforcing layers 4 which are coated on the upper surface and the lower surface of the alkali-free glass fiber and made of the silane coating have better antistatic effect, prevent the circuit board from being damaged due to over-electricity, and further protect the circuit board.
The above-described preferred embodiments according to the present utility model are intended to suggest that, from the above description, various changes and modifications can be made by the person skilled in the art without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
Claims (7)
1. A cushion pad comprising: from last smooth surface layer (1), first buffer layer (2), second buffer layer (3) and fog surface layer (5) that set gradually down, its characterized in that, first buffer layer (2) and second buffer layer (3) adopt rubber material to make, set up between first buffer layer (2) and second buffer layer (3) anchor coat (4), just first buffer layer (2) and second buffer layer (3) body coupling, smooth surface layer (1) first buffer layer (2) second buffer layer (3) with on fog surface layer (5) coaxial a plurality of locating holes (6) that set up, locating hole (6) medial surface sets up the joint groove.
2. The cushion of claim 1, wherein: the smooth surface layer (1) is made of bamboo pulp kraft paper, and a silica gel coating is coated on the outer layer of the bamboo pulp kraft paper.
3. The cushion of claim 1, wherein: the reinforcing layer (4) is made of alkali-free glass fibers and silane coatings coated on the upper surface and the lower surface of the alkali-free glass fibers.
4. The cushion of claim 1, wherein: and an adhesive layer (7) is arranged between the first buffer layer (2) and the reinforcing layer (4) and between the second buffer layer (3) and the reinforcing layer (4), and the adhesive layer (7) is made of a nano adhesive.
5. The cushion of claim 1, wherein: the fog face layer (5) is formed by weaving aramid fiber materials.
6. The cushion of claim 1, wherein: be provided with the lamination board on the lamination equipment, lamination board (8) bottom surface sets up a plurality of reference columns (9), a plurality of reference column (9) periphery side all sets up joint arch (10), joint arch (10) with the joint groove corresponds the cooperation.
7. The cushion of claim 6, wherein: the clamping bulges (10) are made of silica gel materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321930793.8U CN220639144U (en) | 2023-07-21 | 2023-07-21 | Buffer cushion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321930793.8U CN220639144U (en) | 2023-07-21 | 2023-07-21 | Buffer cushion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220639144U true CN220639144U (en) | 2024-03-22 |
Family
ID=90264001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321930793.8U Active CN220639144U (en) | 2023-07-21 | 2023-07-21 | Buffer cushion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220639144U (en) |
-
2023
- 2023-07-21 CN CN202321930793.8U patent/CN220639144U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |