CN214522367U - Cushion pad for pressing process - Google Patents
Cushion pad for pressing process Download PDFInfo
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- CN214522367U CN214522367U CN202120346460.5U CN202120346460U CN214522367U CN 214522367 U CN214522367 U CN 214522367U CN 202120346460 U CN202120346460 U CN 202120346460U CN 214522367 U CN214522367 U CN 214522367U
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Abstract
The utility model discloses a blotter for pressfitting technology, this blotter include the backing plate, set up at least one through-hole on this backing plate, fixed silica gel pad, fixed the first antiseized layer of locating the first face of this backing plate and silica gel pad, fixed the antiseized layer of second of locating this backing plate and silica gel pad of covering in this through-hole of packing. When the cushion pad for the press-fit process is used, the cushion pad can play the effects of elastic buffering, even pressurization or heating and the like in the press-fit molding process of the circuit board by arranging the cushion pad. Through setting up the through-hole on the backing plate to at through-hole internal fixation packing silica gel pad, when fixing a position the blotter, can beat the locating hole on silica gel pad, because the silica gel material does not exist the problem of falling the bits, consequently can play the effect that prevents the blotter and fall the bits. Further, through set up first antiseized layer and the antiseized layer of second respectively outermost at the blotter, can play and prevent the effect of circuit board pressfitting molding in-process viscose adhesion on the blotter.
Description
Technical Field
The utility model relates to a pressfitting technology field, more specifically say, relate to a blotter for pressfitting technology.
Background
In the process of solar hot press molding or hot press molding of a printed circuit board, a cushion pad is usually required to be arranged between a pressing die and a board to be pressed in order to achieve the purpose of uniform pressing or heating. Meanwhile, in order to achieve a better positioning effect, a positioning hole is usually formed in the cushion pad.
The existing cushion pad is usually made of materials such as a felt plate, after the positioning holes are formed in the materials such as the felt plate, due to friction between the positioning holes and the positioning piece, the problem that chips fall off easily occurs in the content (inner wall) of the positioning holes, and the products are easily made badly if the chips fall onto the formed products.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to prior art's above-mentioned defect, provide a blotter for pressfitting technology.
The utility model provides a technical scheme that its technical problem adopted is: the cushion pad for the pressing process comprises a cushion plate, at least one through hole arranged on the cushion plate, a silica gel pad fixedly filled in the through hole, a first anti-sticking layer fixedly covered on the first surfaces of the cushion plate and the silica gel pad, and a second anti-sticking layer fixedly covered on the second surfaces of the cushion plate and the silica gel pad.
In the cushion pad for the pressing process of the utility model, the cushion pad is a glass fiber board, a resin board, a felt board, a rubber board or an engineering plastic board;
or the base plate is a composite plate formed by compounding at least two of a glass fiber plate, a resin plate, a felt plate, a rubber plate and an engineering plastic plate. In the cushion pad for lamination process of the present invention, the first anti-sticking layer is a first non-woven fabric layer, the outer side surface and/or the inner side surface of the first non-woven fabric layer is coated or impregnated with an anti-sticking coating, and the inner side surface of the first non-woven fabric layer is fixedly bonded with the first surface of the backing plate and the silica gel pad;
or the first anti-sticking layer is a first textile fabric layer, the outer side surface and/or the inner side surface of the first textile fabric layer are coated or soaked with anti-sticking coatings, and the inner side surface of the first textile fabric layer is fixedly bonded with the first surfaces of the backing plate and the silica gel pad.
In the cushion pad for lamination process of the present invention, the second anti-sticking layer is a second non-woven fabric layer, the outer side surface and/or the inner side surface of the second non-woven fabric layer is coated or impregnated with an anti-sticking coating, and the inner side surface of the second non-woven fabric layer is fixedly bonded with the second surface of the cushion pad and the silica gel pad;
or the second anti-sticking layer is a second textile fabric layer, the outer side surface and/or the inner side surface of the second textile fabric layer are/is coated or soaked with anti-sticking coatings, and the inner side surface of the second textile fabric layer is fixedly bonded with the second surfaces of the backing plate and the silica gel pad.
In the cushion pad for lamination process, the first anti-sticking layer is a first teflon cloth layer, and the second anti-sticking layer is a second teflon cloth layer.
In the cushion pad for the pressing process of the utility model, the first anti-sticking layer comprises a first cloth layer and a first film layer adhered on the inner side surface of the first cloth layer, the outer side surface of the first cloth layer is coated with a Teflon coating, and the first film layer is adhered with the backing plate and the silica gel pad;
the second anti-sticking layer comprises a second fabric layer and a second thin film layer stuck to the inner side face of the second fabric layer, a Teflon coating is coated on the outer side face of the second fabric layer, and the second thin film layer is stuck to the base plate and the silica gel pad.
In the cushion pad for press-fitting process of the present invention, the through hole is a circular hole or a polygonal hole.
In the cushion pad for lamination process, the backing plate is a polygonal backing plate or a circular backing plate, and the shape and size of the first anti-sticking layer and the second anti-sticking layer are the same as those of the backing plate.
In the blotter for lamination process, this through-hole lateral wall is equipped with the caulking groove sunken to this through-hole lateral wall, this silica gel pad lateral wall is equipped with the bulge of protrusion in this silica gel pad lateral wall, this bulge can imbed to this caulking groove in.
In the blotter for lamination process, the through-hole position department that is located on this blotter is equipped with the locating hole that runs through this first antiseized layer, silica gel pad and the antiseized layer of second, the aperture of this locating hole is less than the aperture of this through-hole.
Implement the utility model discloses a blotter for lamination process has following beneficial effect: when the cushion pad for the press-fit process is used, the cushion pad can play the effects of elastic buffering, even pressurization or heating and the like in the press-fit molding process of the circuit board by arranging the cushion pad. Through setting up the through-hole on the backing plate to at through-hole internal fixation packing silica gel pad, when fixing a position the blotter, can beat the locating hole on silica gel pad, the locating hole passes first antiseized layer and the antiseized layer of second, because the silica gel material does not have the problem of falling the bits, consequently can play the effect that prevents the blotter and fall the bits. Further, through set up first antiseized layer and the antiseized layer of second respectively outermost at the blotter, can play and prevent the effect of circuit board pressfitting molding in-process viscose adhesion on the blotter.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
FIG. 1 is a schematic view of a first exploded structure of a cushion pad for a lamination process according to the present invention;
FIG. 2 is a schematic view of a second exploded structure of the cushion pad for lamination process of the present invention;
fig. 3 is a schematic structural view of the cushion pad for lamination process in use.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1, in the first embodiment of the cushion pad for lamination process of the present invention, the cushion pad 100 includes a pad plate 101, at least one through hole 102 disposed on the pad plate 101, a silica gel pad 103 fixedly filled in the through hole 102, a first anti-sticking layer 104 fixedly covered on the first surface of the pad plate 101 and the silica gel pad 103, and a second anti-sticking layer 105 fixedly covered on the second surface of the pad plate 101 and the silica gel pad 103.
Further, as shown in fig. 2, a positioning hole 106 is formed on the cushion pad 100 at the position of the through hole 102 and penetrates through the first anti-adhesion layer 104, the silicone pad 103 and the second anti-adhesion layer 105, and the diameter of the positioning hole 106 is smaller than that of the through hole 102.
Preferably, the cushion 100 is used in a molding press process for printed circuit boards. In other embodiments, the cushion 100 can also be used in a molding and pressing process for solar cells or other materials.
In the present embodiment, the pad plate 101 is made of a material having thermal conductivity and elasticity to achieve a better thermal conductivity and elastic buffer effect, which will be described in detail later.
When the utility model is used, the cushion pad 100 for the press-fit process is pressed on the circuit board by the cushion plate 101, and the cushion plate 101 can play the effects of elastic buffering and uniform pressurization. Through set up through-hole 102 on backing plate 101 to at the fixed silica gel pad 103 that fills in through-hole 102, when fixing a position blotter 100, can beat locating hole 106 on silica gel pad 103, because the silica gel material does not have the problem that falls the bits, consequently can play the effect that prevents blotter 100 and fall the bits. Further, the first anti-sticking layer 104 and the second anti-sticking layer 105 are respectively disposed on the outermost layers of the cushion pad 100, so that the function of preventing the adhesive from sticking to the cushion pad 100 during the circuit board laminating process can be achieved.
Preferably, the cushion pad 100 in the present embodiment is a rectangular cushion pad 100, and the at least one through hole 102 is a plurality of through holes 102 and is disposed at four peripheral corner positions of the rectangular cushion pad 100. It is understood that in other embodiments, the cushion pad 100 can be circular or other shapes, and the through holes 102 can be disposed at any position of the pad 101, and the position can be set according to the pin positions on the circuit board.
Specifically, the backing plate 101 is a glass fiber plate, a resin plate, a felt plate, a rubber plate, or an engineering plastic plate. In other embodiments, the backing plate 101 may also be a composite plate formed by combining multiple materials. Such as a composite board formed by compounding at least two of a glass fiber board, a resin board, a felt board, a rubber board and an engineering plastic board. Such as: the glass fiber board and the resin board are bonded and hot pressed to form the composite board.
In one embodiment, the first release layer 104 is a first non-woven fabric layer, the outer side and/or inner side of the first non-woven fabric layer is coated or impregnated with teflon coating, and the inner side of the first non-woven fabric layer is fixedly bonded to the first surfaces of the backing plate 101 and the silicone pad 103.
Or, the first anti-sticking layer 104 is a first textile fabric layer, the outer side surface and/or the inner side surface of the first textile fabric layer is coated or impregnated with a teflon coating, and the inner side surface of the first textile fabric layer is fixedly bonded with the first surfaces of the backing plate 101 and the silica gel pad 103.
In another embodiment, the second release layer 105 is a second non-woven fabric layer coated or impregnated with teflon coating on the outer side and/or inner side, and the inner side of the second non-woven fabric layer is fixedly bonded to the second side of the backing plate 101 and the silicone pad 103.
Or, the second anti-sticking layer 105 is a second textile fabric layer, the outer side and/or inner side of the second textile fabric layer is coated or impregnated with a teflon coating, and the inner side of the second textile fabric layer is fixedly bonded with the second surfaces of the backing plate 101 and the silica gel pad 103.
In another embodiment, the first release layer 104 is a first Teflon cloth layer and the second release layer 105 is a second Teflon cloth layer.
In another embodiment, the first anti-sticking layer 104 includes a first fabric layer and a first film layer adhered to an inner side of the first fabric layer, the outer side of the first fabric layer is coated with a teflon coating, and the first film layer is adhered to the backing plate 101 and the silicone pad 103. The second anti-sticking layer 105 comprises a second fabric layer and a second film layer stuck on the inner side of the second fabric layer, a teflon coating is coated on the outer side of the second fabric layer, and the second film layer is stuck with the backing plate 101 and the silica gel pad 103.
Preferably, the first and second release layers 104 and 105 are first and second heat-resistant release layers.
It is understood that the through hole 102 may be a circular hole or a polygonal hole. The backing plate 101 may be a polygonal backing plate 101 or a circular backing plate 101, and the first and second release layers 104 and 105 have the same shape and size as the backing plate 101.
As shown in fig. 3, in order to prevent the silicone rubber pad 103 from shifting or being loosely fixed in the through hole 102, the sidewall of the through hole 102 is provided with an embedding groove 107 recessed into the sidewall of the through hole 102, the outer sidewall of the silicone rubber pad 103 is provided with a protrusion 108 protruding from the outer sidewall of the silicone rubber pad 103, and the protrusion 108 can be embedded into the embedding groove 107.
When filling the silicone, the liquid silicone may flow into the caulking groove 107 to form the protrusion 108, so as to realize the fixed engagement of the silicone pad 103 and the through hole 102, thereby realizing the embedding connection relationship. Preferably, the through hole 102 is a circular hole, and the caulking groove 107 is an annular groove provided on a side wall of the through hole 102.
It is understood that the shape and size of the bumper pad 100 is not limited in this application, and can be adjusted according to the needs of the laminating process. Similarly, the shapes and sizes of the through holes 102 and the positioning holes 106 are not limited, and the shapes and sizes can be adjusted according to the needs of the pressing process.
Furthermore, in the present invention, unless otherwise expressly specified or limited, the terms "connected," "stacked," and the like are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a blotter for lamination process, its characterized in that, blotter (100) include backing plate (101), set up in at least one through-hole (102) on backing plate (101), fixed fill in silica gel pad (103) in through-hole (102), fixed the covering locate first antiseized layer (104) of backing plate (101) and silica gel pad (103) first face, fixed the covering locate backing plate (101) and silica gel pad (103) second face's antiseized layer (105).
2. The cushion pad for a press-fitting process according to claim 1, wherein the backing plate (101) is a glass fiber plate, a resin plate, a felt plate, a rubber plate or an engineering plastic plate;
or the base plate (101) is a composite plate formed by compounding at least two of a glass fiber plate, a resin plate, a felt plate, a rubber plate and an engineering plastic plate.
3. The cushion pad for lamination process according to claim 1 or 2, wherein the first anti-sticking layer (104) is a first non-woven fabric layer, the outer side and/or inner side of the first non-woven fabric layer is coated or impregnated with an anti-sticking coating, and the inner side of the first non-woven fabric layer is fixedly bonded with the first surfaces of the backing plate (101) and the silicone pad (103);
or, first antiseized layer (104) are first weaving cloth layer, the coating of first weaving cloth layer outside face and/or medial surface or the infiltration has antiseized coating, first weaving cloth layer inside face with the fixed bonding of first face of backing plate (101) and silica gel pad (103).
4. The cushion pad for lamination process according to claim 1 or 2, wherein the second release layer (105) is a second non-woven fabric layer, the outer side and/or the inner side of the second non-woven fabric layer is coated or impregnated with a release coating, and the inner side of the second non-woven fabric layer is fixedly bonded with the second surfaces of the backing plate (101) and the silicone rubber pad (103);
or the second anti-sticking layer (105) is a second woven fabric layer, the outer side face and/or the inner side face of the second woven fabric layer are coated or soaked with anti-sticking coatings, and the inner side face of the second woven fabric layer is fixedly bonded with the second faces of the backing plate (101) and the silica gel pad (103).
5. The cushion pad for lamination process according to claim 1 or 2, wherein the first anti-sticking layer (104) is a first Teflon cloth layer, and the second anti-sticking layer (105) is a second Teflon cloth layer.
6. The cushion pad for the lamination process according to claim 1 or 2, wherein the first anti-sticking layer (104) comprises a first cloth layer and a first film layer adhered to the inner side of the first cloth layer, the outer side of the first cloth layer is coated with a teflon coating, and the first film layer is adhered to the cushion plate (101) and the silica gel pad (103);
the antiseized layer of second (105) include the second bed of cloth and glue and locate the second thin layer of second bed of cloth medial surface, the second bed of cloth lateral surface is scribbled and is equipped with the teflon coating, the second thin layer with backing plate (101) and silica gel pad (103) bond.
7. The cushion pad for press-fitting process according to claim 1, wherein the through-hole (102) is a circular hole or a polygonal hole.
8. The cushion pad for press-fitting process according to claim 7, wherein the pad plate (101) is a polygonal pad plate (101) or a circular pad plate (101), and the first and second release layers (104, 105) have the same shape and size as the pad plate (101).
9. The cushion pad for pressing process according to claim 1, wherein the sidewall of the through hole (102) is provided with an embedding groove (107) which is recessed into the sidewall of the through hole (102), the outer sidewall of the silicone rubber pad (103) is provided with a protrusion (108) which protrudes from the outer sidewall of the silicone rubber pad (103), and the protrusion (108) can be embedded into the embedding groove (107).
10. The cushion pad for press-fitting process according to claim 1, wherein a positioning hole (106) penetrating through the first anti-sticking layer (104), the silicone pad (103) and the second anti-sticking layer (105) is provided at the position of the through hole (102) on the cushion pad (100), and the diameter of the positioning hole (106) is smaller than that of the through hole (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120346460.5U CN214522367U (en) | 2021-02-05 | 2021-02-05 | Cushion pad for pressing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120346460.5U CN214522367U (en) | 2021-02-05 | 2021-02-05 | Cushion pad for pressing process |
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| Publication Number | Publication Date |
|---|---|
| CN214522367U true CN214522367U (en) | 2021-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120346460.5U Active CN214522367U (en) | 2021-02-05 | 2021-02-05 | Cushion pad for pressing process |
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| CN (1) | CN214522367U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117863706A (en) * | 2024-01-19 | 2024-04-12 | 广东硕成科技股份有限公司 | Preparation process and application of lamination buffer cushion with positioning holes in fluorine-containing rubber wet process |
-
2021
- 2021-02-05 CN CN202120346460.5U patent/CN214522367U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117863706A (en) * | 2024-01-19 | 2024-04-12 | 广东硕成科技股份有限公司 | Preparation process and application of lamination buffer cushion with positioning holes in fluorine-containing rubber wet process |
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