CN214821585U - High polymer material buffer pad for printed circuit board - Google Patents
High polymer material buffer pad for printed circuit board Download PDFInfo
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- CN214821585U CN214821585U CN202121671775.3U CN202121671775U CN214821585U CN 214821585 U CN214821585 U CN 214821585U CN 202121671775 U CN202121671775 U CN 202121671775U CN 214821585 U CN214821585 U CN 214821585U
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Abstract
The utility model discloses a high molecular material buffer cushion for a printed circuit board, which belongs to the technical field of the lamination of the printed circuit board, and comprises a release film layer, wherein the release film layer comprises a smooth surface at one side and a rough surface at the other side; the high temperature resistant layer, two it is located two to leave the type rete be provided with between the mat surface the high temperature resistant layer, the high temperature resistant layer includes that two outer layers are aramid fiber gauze, is located two-layerly two-layer high heat conduction fibre between the aramid fiber gauze and is located two-layerly one deck base cloth layer between the high heat conduction fibre. The utility model discloses a what set up includes the smooth surface of one side and the mat surface of opposite side from the type rete, avoids using the back for a long time through the smooth surface and produce the side effect of fluff, adhesion, and the high temperature resistant layer that sets up has improved the holistic heat resistance of blotter including base cloth layer, high thermal conductivity fibre, aramid fiber gauze limitedly, also need not often change the blotter, is favorable to long-term use, raises the efficiency.
Description
Technical Field
The utility model relates to a printed circuit board lamination technical field specifically is macromolecular material blotter for printed circuit board.
Background
In the hot pressing process of the multilayer circuit board, a pressing machine with a steel structure is generally adopted for pressing, and steel plates are required to be arranged on the upper surface and the lower surface of the circuit board, so that the pressing smoothness of the multilayer circuit board is ensured. However, since the steel plate is hard, the flowing and the molding of the prepreg of the multilayer circuit board are affected during the pressing process, and therefore, a cushion pad needs to be arranged between the steel plate and the multilayer circuit board to provide the cushioning and molding of the multilayer circuit board by hot pressing. Currently, in a general manufacturing process, a layer of kraft paper is used for realizing the function of buffering and covering.
However, since the kraft paper has a high hardness and is likely to have a side effect of fuzzing and adhesion with the copper surface if the kraft paper is in direct contact with the copper surface of the multi-layer circuit board during the thermocompression bonding process, the kraft paper adheres to the steel plate even after the thermocompression bonding, and the flatness of the steel plate is affected by the kraft paper after a long-term use, and the conventional kraft paper has limited heat resistance and needs to be frequently developed, a polymer cushion pad for a printed circuit board is required.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
In view of the problems existing in the prior art, the utility model discloses.
Therefore, the utility model aims at providing a macromolecular material blotter for printed circuit board, what set up includes the smooth surface of one side from the type rete, and the mat surface of opposite side, avoid long-time use back and produce the side effect of fluff, adhesion through the smooth surface, and the high temperature resistant layer that sets up has improved the holistic heat resistance of blotter including base cloth layer, high heat conduction fibre, aramid fiber gauze limitedly limited, also need not often to change the blotter, be favorable to long-term use, raise the efficiency.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a polymer material cushion pad for a printed circuit board, comprising:
the release film layer comprises a smooth surface on one side and a rough surface on the other side;
the high temperature resistant layer, two it is located two to leave the type rete be provided with between the mat surface the high temperature resistant layer, the high temperature resistant layer includes that two outer layers are aramid fiber gauze, is located two-layerly two-layer high heat conduction fibre between the aramid fiber gauze and is located two-layerly one deck base cloth layer between the high heat conduction fibre.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the two release film layers and the high-temperature resistant layer are laminated.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the release film layer is made of one of PTFE, PFA, ETFE and FEP.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the thickness of the release film layer is 5-40 μm.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the thickness of the high temperature resistant layer is 200-300 μm.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the base cloth layer is prepared from aramid 1313 fibers, aramid 1414 fibers, glass fibers and polybenzoxazole fibers.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the high-thermal-conductivity fiber is one of graphene fiber, silicon nitride fiber, silicon carbide fiber, aluminum nitride fiber, aluminum oxide fiber and zinc oxide fiber.
As a preferred scheme of macromolecular material blotter for printed circuit board, wherein: the aramid fiber gauze is prepared from aramid 1313 fibers and aramid 1414 fibers.
Compared with the prior art, the beneficial effects of the utility model are that: set up from the rough surface of type rete including the smooth surface of one side and opposite side, avoid long-time after using through the smooth surface and produce the side effect of fluff, adhesion, and the high temperature resistant layer that sets up has improved the holistic heat resistance of blotter including base cloth layer, high heat conduction fibre, aramid fiber gauze limitedly, also need not often to change the blotter, is favorable to long-term use, raises the efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the high temperature resistant layer of the present invention;
in the figure: release film layer 100, smooth surface 110, rough surface 120, high temperature resistant layer 200, base cloth layer 210, high thermal conductivity fiber 220, aramid fiber gauze 230.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
Fig. 1-2 are schematic structural diagrams illustrating an embodiment of the polymer material cushion for printed circuit board of the present invention, please refer to fig. 1-2, the polymer material cushion for printed circuit board of the present embodiment includes:
the release film comprises a release film layer 100, wherein the release film layer 100 comprises a smooth surface 110 on one side and a rough surface 120 on the other side, the release film layer 100 is made of one of PTFE, PFA, ETFE and FEP, and the thickness of the release film layer 100 is 5-40 μm.
A high temperature resistant layer 200, the high temperature resistant layer 200 is arranged between the two rough surfaces 120 of the two release film layers 100, the high temperature resistant layer 200 comprises two outer layers of aramid fiber tissue 230, two layers of high thermal conductivity fibers 220 positioned between the two layers of aramid fiber tissue 230, and a base fabric layer 210 positioned between the two layers of high thermal conductivity fibers 220, the thickness of the high temperature resistant layer 200 is 200-300 μm, the two release film layers 100 and the high temperature resistant layer 200 are pressed together, the base cloth layer 210 is made of one of aramid 1313 fiber, aramid 1414 fiber, glass fiber and polybenzoxazole fiber, the high thermal conductivity fiber 220 is one of graphene fiber, silicon nitride fiber, silicon carbide fiber, aluminum nitride fiber, aluminum oxide fiber and zinc oxide fiber, the aramid fiber gauze 230 is made of one of aramid 1313 fiber and aramid 1414 fiber.
In specific use, as needs the utility model discloses at the in-process that uses, the setting is including the smooth surface 110 of one side from type rete 100, and the mat surface 120 of opposite side, avoid long-time after using through smooth surface 110 and produce the fluff, the side effect of adhesion, and the high temperature resistant layer 200 of setting is including base cloth layer 210, high thermal conductivity fibre 220, aramid fiber gauze 230 has improved the holistic heat resistance of blotter limited, also need not often to change the blotter, be favorable to long-term use, and the efficiency is improved.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. Macromolecular material blotter for printed circuit board, its characterized in that includes:
a release film layer (100), the release film layer (100) comprising a smooth surface (110) on one side and a rough surface (120) on the other side;
high temperature resistant layer (200), two it is located two to leave type rete (100) be provided with between rough surface (120) high temperature resistant layer (200), high temperature resistant layer (200) include that two outer layers are aramid fiber gauze (230), are located two-layerly two-layer high heat conduction fibre (220) between aramid fiber gauze (230) and be located two-layerly one deck base cloth layer (210) between high heat conduction fibre (220).
2. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the two release film layers (100) and the high temperature resistant layer (200) are pressed together.
3. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the release film layer (100) is made of one of PTFE, PFA, ETFE and FEP.
4. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the thickness of the release film layer (100) is 5-40 μm.
5. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the thickness of the high temperature resistant layer (200) is 200-300 mu m.
6. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the base cloth layer (210) is made of aramid 1313 fibers, aramid 1414 fibers, glass fibers and polybenzoxazole fibers.
7. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the high-thermal-conductivity fibers (220) are one of graphene fibers, silicon nitride fibers, silicon carbide fibers, aluminum nitride fibers, aluminum oxide fibers and zinc oxide fibers.
8. The polymer material cushion pad for printed circuit board according to claim 1, wherein: the aramid fiber gauze (230) is prepared from aramid 1313 fibers and aramid 1414 fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121671775.3U CN214821585U (en) | 2021-07-22 | 2021-07-22 | High polymer material buffer pad for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121671775.3U CN214821585U (en) | 2021-07-22 | 2021-07-22 | High polymer material buffer pad for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214821585U true CN214821585U (en) | 2021-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121671775.3U Active CN214821585U (en) | 2021-07-22 | 2021-07-22 | High polymer material buffer pad for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214821585U (en) |
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2021
- 2021-07-22 CN CN202121671775.3U patent/CN214821585U/en active Active
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