CN221292556U - Reusable high-temperature-resistant high-molecular buffer release pad - Google Patents
Reusable high-temperature-resistant high-molecular buffer release pad Download PDFInfo
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- CN221292556U CN221292556U CN202322400899.3U CN202322400899U CN221292556U CN 221292556 U CN221292556 U CN 221292556U CN 202322400899 U CN202322400899 U CN 202322400899U CN 221292556 U CN221292556 U CN 221292556U
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- temperature resistant
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- fiber cloth
- high temperature
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- 239000010410 layer Substances 0.000 claims abstract description 189
- 239000004744 fabric Substances 0.000 claims abstract description 107
- 239000000835 fiber Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 230000003139 buffering effect Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 239000011247 coating layer Substances 0.000 claims description 15
- 239000012792 core layer Substances 0.000 claims description 11
- 229920001973 fluoroelastomer Polymers 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229920006231 aramid fiber Polymers 0.000 claims description 5
- 239000004760 aramid Substances 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 238000005524 ceramic coating Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 3
- 229920005560 fluorosilicone rubber Polymers 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000002655 kraft paper Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 8
- 238000003475 lamination Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 1
- 210000000438 stratum basale Anatomy 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Abstract
The utility model discloses a reusable high-temperature-resistant high-molecular buffer release pad, which is of a laminated structure; the fiber cloth comprises a first release layer, a first substrate layer, a fiber cloth layer, a second substrate layer and a second release layer which are sequentially arranged; a high-temperature resistant adhesive layer is arranged between the first substrate layer and the fiber cloth layer as well as between the first substrate layer and the second substrate layer; through setting up each layer structure that can laminate to use high temperature resistant glue film as the filler, form and regard stratum basale, fibre cloth layer as buffer action layer, from the type layer for from the type action layer, high temperature resistant glue film is bonding effect and the whole repeatedly usable's of filling action layer high temperature resistant polymer buffering from the type pad, forms and can use on automation equipment, and the effectual effect is the repeatedly usable's of the kraft paper of replace the multilayer lamination buffering from the type pad, and the number of times of repeatedly using is nearly hundred, has effectively promoted auxiliary material's reliability and functional characteristic.
Description
Technical Field
The utility model relates to the field of composite polymer buffer cushions, in particular to a reusable high-temperature-resistant high-polymer buffer release cushion.
Background
In the hot press working process of the industries of smart cards, bakelite boards, aluminum substrates, FPC pressing, PCB pressing, CCL pressing and the like, kraft paper is required to be used as an auxiliary pressing material layer, and the kraft paper plays roles of buffering, heat preservation, heat transfer, pressure equalization and the like in the pressing process, and is generally used in a multi-sheet multi-layer lamination mode.
However, kraft paper is easy to fall off scraps in the process of transferring and pressing, and is attached to a pressed workpiece, so that the surface defect or the problem of open and short circuit of a product can be caused; the service life of kraft paper is difficult to meet the application requirements of the current high-quality, high-efficiency and high-reliability to-be-machined parts, and the application mode of the multi-layer lamination makes the problems of abrasion, tearing and the like in the machining process more remarkable, the service life is more difficult to control, and the hidden danger of machining quality is increased; in addition, kraft paper is soft in texture, thinner, is difficult to use sucking disc or tongs to cooperate the arm to carry out automatic getting and putting, and multilayer lamination's application mode needs manual work to repeat stack, demolish, causes the work piece of waiting to process to be difficult to form the automated processing of flow, influences degree of automation and machining efficiency.
Based on the above problems, there is a need to provide a reusable high temperature resistant high molecular weight buffer release pad.
Disclosure of utility model
The utility model mainly aims to solve the problems that in the prior art, multilayer kraft paper is used as an auxiliary lamination material layer for lamination of a smart card, a bakelite plate, an aluminum substrate and FPC, PCB, CCL, scraps are easy to be dropped, the service life is difficult to control, and automatic processing is difficult to form, and provides a reusable high-temperature-resistant high-molecular buffer release pad, which is characterized in that: the high-temperature-resistant high-molecular buffer release pad is of a laminated structure; the laminated structure comprises a first release layer, a first substrate layer, a fiber cloth layer, a second substrate layer and a second release layer which are sequentially arranged; and high-temperature resistant adhesive layers are arranged between the first substrate layer and the fiber cloth layer and between the first substrate layer and the second substrate layer.
Further, the first release layer and the second release layer are both one of a nano ceramic coating layer, a graphene coating layer, a carbon black coating layer, a PTFE coating layer or a fluororubber mixing rubber coating layer.
Further, the first substrate layer and the second substrate layer are both one of a glass fiber cloth layer, an aramid cloth layer, a basalt cloth layer or a PTFE cloth layer.
Further, the high-temperature resistant adhesive layer is one of a silicone rubber layer, a fluororubber layer, a fluorosilicone rubber layer, a Teflon emulsion layer or a fluororubber mixing adhesive layer.
Further, the fiber cloth layer is one of glass fiber cloth, aramid fiber cloth or polyester fiber cloth.
Further, the thickness of the fiber cloth layer is 0.3mm to 1.0mm, and the gram weight is 600 g/square meter to 900 g/square meter.
Optionally, the high-temperature-resistant high-molecular buffer release pad is also provided with an electronic cloth layer; the electronic cloth layer is arranged between the fiber cloth layer and the second substrate layer; the high-temperature-resistant adhesive layers are arranged between the fiber cloth layer and the electronic cloth layer and between the electronic cloth layer and the second substrate layer.
Optionally, the electronic cloth layer is one of glass fiber cloth, aramid fiber cloth or polyester fiber cloth; the thickness of the material is 0.08mm to 0.3mm, and the gram weight is 100 g/square meter to 300 g/square meter.
Optionally, the fiber cloth layer and the electronic cloth layer are all multi-layered, the multi-layered fiber cloth layer and the multi-layered electronic cloth layer are sequentially and alternately arranged to form a core layer, and the high-temperature-resistant adhesive layer is arranged between each two layers of the core layer.
Optionally, the electronic cloth layer of the core layer is less than the fiber cloth layer 1.
According to the utility model, the first release layer, the first substrate layer, the fiber cloth layer, the second substrate layer and the second release layer which can be stacked are arranged, the high-temperature resistant adhesive layer is used as a material for bonding each layer and filling meshes and gaps of each layer, the substrate layer and the fiber cloth layer are used as a buffer action layer, the release layer is a release action layer, the high-temperature resistant adhesive layer is a bonding action and filling the whole reusable high-temperature resistant high-molecular buffer release pad of the action layer, and the high-temperature resistant high-molecular buffer release pad has certain strength and can be applied to automatic processing performance of adsorption, grabbing and picking of automatic equipment, has more effective function of replacing kraft paper of a plurality of layers, can not easily generate the problems of chip falling, abrasion, tearing and the like, has long service life, can be repeatedly used for approximately 1000 times, and effectively improves the reliability and functional characteristics of auxiliary materials.
Drawings
FIG. 1 is a schematic diagram of a laminated structure of a high-temperature-resistant high-molecular-weight buffer release pad of the utility model;
FIG. 2 is a schematic diagram of a laminated structure of a high temperature resistant high molecular weight buffer release pad with an electronic cloth layer according to the present utility model;
FIG. 3 is a schematic view of a laminated structure of a high temperature resistant high molecular weight buffer release liner according to the present utility model having a plurality of fiber cloth layers and a plurality of electronic cloth layers less than 1 layer of the fiber cloth layers.
Reference numerals illustrate:
10-a first release layer, 20-a first substrate layer, 100-a high-temperature resistant adhesive layer, 30-a fiber cloth layer, 40-a second substrate layer, 50-a second release layer, 60-an electronic cloth layer and 200-a core layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the embodiments of the present disclosure.
Referring to fig. 1, fig. 1 is a schematic diagram of a laminated structure of a high temperature resistant high molecular buffer release pad according to the present utility model.
The high temperature resistant high molecular buffer release liner laminate structure provided in fig. 1; comprises a first release layer 10, a first basal layer 20, a fiber cloth layer 30, a second basal layer 40 and a second release layer 50 which are arranged in sequence; wherein, a high temperature resistant adhesive layer 100 is disposed between the first substrate layer 20 and the fiber cloth layer 30, and between the fiber cloth layer 30 and the second substrate layer 40.
By providing the first release layer 10 and the second release layer 50, a good release capability is provided for the buffer release pad, so that the buffer release pad will not adhere to the surface of a workpiece or equipment to be processed during the hot pressing application process and after the application is removed, and the first substrate layer 20 and the second substrate layer 40 can provide an attachable surface condition for the release layer, and can provide a surface condition for adhering to the high temperature resistant adhesive layer 100, and provide a certain buffer effect; the fiber cloth layer 30 provides the high strength performance of compression resistance and tensile resistance required by the whole cushion release pad, and dimensional stability, and provides the cushion performance for replacing the traditional kraft paper; the high temperature resistant adhesive layer 100 provides effective adhesion between the internal layers, so that each layer can form a reliable and durable integral buffer release pad structure; the integral film structure has the characteristics of good buffering effect, release effect, high temperature resistance and high reliability, and can be repeatedly used as an auxiliary pressing material layer in hot pressing processing.
In the present embodiment, the first release layer 10 and the second release layer 50 are both a nano ceramic coating layer, a graphene coating layer, a carbon black coating layer, a PTFE coating layer, or a fluororubber coating layer.
The first release layer 10 and the second release layer 50 need to have a release effect that does not adhere to the workpiece (or the surface of the processing device), especially FPC, PCB, CCL, so that a material with a higher inertia than the material of the workpiece (or the surface of the processing device) is selected as the release layer, thereby achieving a good release effect.
In this embodiment, both the first and second substrate layers 20 and 40 are one of a fiberglass cloth layer or an aramid cloth layer or a basalt cloth layer or a PTFE cloth layer.
The materials are selected to provide attachable surface material conditions for the release layer, form good bonding effect with the high-temperature resistant adhesive layer 100, provide good binding effect for the whole buffer release pad, control transition expansion and contraction of each layer inside, and improve the dimensional stability of the whole buffer release pad.
In the present embodiment, the fiber cloth layer 30 is one of a glass fiber cloth or an aramid fiber cloth or a polyester fiber cloth; the thickness of the fiber cloth layer is 0.3mm to 1.0mm, and the gram weight is 600 g/square meter to 900 g/square meter.
The fiber cloth layer 30 needs to have a larger buffering property, and a fiber cloth layer with a larger gram weight and a smaller mesh number can be selected, so that the buffering effect in the plane direction is provided by the warp and weft yarns in the plane direction of the fiber cloth layer 30, and the longitudinal buffering effect is provided by the mesh and staggered structure formed by weaving the warp and weft yarns, so that the buffering release pad has the buffering property similar to kraft paper.
In the present embodiment, the high temperature resistant adhesive layer 100 is one of a silicone rubber layer, a fluororubber layer, a fluorosilicone rubber layer, a teflon emulsion layer, and a fluororubber compound layer.
Because the high-temperature-resistant high-molecular buffer release pad of the embodiment is applied under high-temperature and high-pressure conditions, the high-temperature resistance generally needs to reach at least 200 ℃, and the application life of the buffer release pad can be ensured under special conditions, and the high-temperature-resistant adhesive layer 100 needs to have good high-temperature resistance and adhesion, is not easy to deglue, decompose and deteriorate under the conditions of high temperature and high pressure, and can provide reliable adhesion for a film layer.
FIG. 2 is a schematic diagram of a laminated structure of a high temperature resistant high molecular weight buffer release pad with an electronic cloth layer according to the present utility model;
In one embodiment, the high temperature resistant high molecular buffer release pad is further provided with an electronic cloth layer 60; the electronic cloth layer 60 is disposed between the fiber cloth layer and the second substrate layer; a high temperature resistant adhesive layer 100 is disposed between the fabric layer 30 and the electronic fabric layer 60 and between the electronic fabric layer 60 and the second substrate layer 40.
In this embodiment, the electronic cloth layer 60 is one of a glass fiber cloth or an aramid fiber cloth or a polyester fiber cloth; the thickness of the material is 0.08mm to 0.3mm, and the gram weight is 100 g/square meter to 300 g/square meter.
The electronic cloth layer 60 which is thinner and has smaller gram weight than the thickness of the fiber cloth layer 30 is arranged in the buffer release pad, the characteristics of finer fiber wires and larger mesh number of the electronic cloth layer 60 are utilized, and the filling of the high-temperature resistant adhesive layer 100 is combined to form the functional layer with stronger reliability, so that the strength and the reliability of the buffer release pad are enhanced, and the thermal conductivity, the flatness, the adsorbability and the grabbing automation operation performance of the buffer release pad are improved.
FIG. 3 is a schematic view of a laminate structure of a high temperature resistant high molecular weight buffer release liner comprising a plurality of fiber cloth layers and a plurality of electronic cloth layers according to the present utility model.
In this embodiment, the fiber cloth layer 30 and the electronic cloth layer 60 are all multi-layered, the multi-layered fiber cloth layer 30 and the multi-layered electronic cloth layer 60 are sequentially and alternately arranged to form the core layer 200, and the high temperature resistant adhesive layer 100 is disposed between each layer of the core layer 200.
The core layer 200 structure of the fiber cloth layers 30 and the electronic cloth layers 60 which are sequentially and alternately arranged is arranged, so that the requirements of application scenes that the buffer amplitude is larger, the strength is stronger, the automatic processing and use are more convenient, the laminated auxiliary structure of the multilayer kraft paper is more effectively replaced, the material leveling of the circuit board processing is realized, the repeated use times of the integral buffer release pad are further increased, and the repeated service life is prolonged.
In this embodiment, the core layer 200 has fewer electronic cloth layers than the fiber cloth layer 1.
In order to make the whole buffering from the pad more level and smooth, the function is more symmetrical, can not appear warping, the problem of bow, then can set up the lamination structure that the buffering from the pad and be upper and lower symmetrical structure, namely the structure of sandwich layer 200, two-layer that finally forms upper and lower surface is fiber cloth layer 30, realizes the structure planarization that the whole buffering is from the pad to indirectly promote the life that the whole buffering is from the pad.
The foregoing description of the preferred embodiments of the present utility model and the accompanying drawings should not be taken as limiting the scope of the embodiments of the present utility model, but rather should be understood to cover all modifications, variations and adaptations of the embodiments of the present utility model as may come within the scope of the embodiments of the present utility model and their equivalents as may be desired to be further or more specific to the particular application or subject matter of the utility model.
Claims (10)
1. The utility model provides a repeatedly usable's high temperature resistant polymer buffering is from type pad which characterized in that: the high-temperature-resistant high-molecular buffer release pad is of a laminated structure;
The laminated structure comprises a first release layer, a first substrate layer, a fiber cloth layer, a second substrate layer and a second release layer which are sequentially arranged;
And high-temperature resistant adhesive layers are arranged between the first substrate layer and the fiber cloth layer and between the first substrate layer and the second substrate layer.
2. The reusable high temperature resistant polymer buffer release liner of claim 1, wherein the first release layer and the second release layer are both one of a nano ceramic coating layer or a graphene coating layer or a carbon black coating layer or a PTFE coating layer or a fluororubber compound coating layer.
3. The reusable high temperature resistant polymer buffer release liner of claim 1, wherein the first and second substrate layers are both fiberglass cloth layers or aramid cloth layers or basalt cloth layers or PTFE cloth layers.
4. The reusable high temperature resistant polymer buffer release liner of claim 1, wherein the high temperature resistant adhesive layer is one of a silicone rubber layer or a fluororubber or a fluorosilicone rubber layer or a teflon emulsion layer or a fluororubber compound layer.
5. The reusable high temperature resistant polymer buffer release pad of claim 1, wherein the fiber cloth layer is one of a fiberglass cloth or an aramid cloth or a polyester cloth.
6. The reusable high temperature resistant polymer buffer release liner of claim 1, wherein the fibrous cloth layer has a thickness of 0.3mm to 1.0mm and a grammage of 600 g/square meter to 900 g/square meter.
7. The reusable high temperature resistant high molecular weight buffer release pad according to claim 1, wherein the high temperature resistant high molecular weight buffer release pad is further provided with an electronic cloth layer; the electronic cloth layer is arranged between the fiber cloth layer and the second substrate layer; the high-temperature-resistant adhesive layers are arranged between the fiber cloth layer and the electronic cloth layer and between the electronic cloth layer and the second substrate layer.
8. The reusable high-temperature-resistant high-molecular-weight buffer release pad according to claim 7, wherein the electronic cloth layer is one of glass fiber cloth or aramid fiber cloth or polyester fiber cloth; the thickness of the material is 0.08mm to 0.3mm, and the gram weight is 100 g/square meter to 300 g/square meter.
9. The reusable high-temperature resistant polymer buffer release pad according to claim 7, wherein the fiber cloth layer and the electronic cloth layer are all multi-layered, the fiber cloth layer and the electronic cloth layer are sequentially and alternately arranged to form a core layer, and the high-temperature resistant adhesive layer is arranged between each two layers of the core layer.
10. The reusable high temperature resistant polymer buffer release liner of claim 9, wherein the electronic cloth layer of the core layer is less than the fiber cloth layer 1.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221292556U true CN221292556U (en) | 2024-07-09 |
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| GR01 | Patent grant |