CN220629650U - Patch pad structure for preventing welding cavity - Google Patents
Patch pad structure for preventing welding cavity Download PDFInfo
- Publication number
- CN220629650U CN220629650U CN202322297668.4U CN202322297668U CN220629650U CN 220629650 U CN220629650 U CN 220629650U CN 202322297668 U CN202322297668 U CN 202322297668U CN 220629650 U CN220629650 U CN 220629650U
- Authority
- CN
- China
- Prior art keywords
- soldering tin
- units
- bonding pad
- soldering
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000011800 void material Substances 0.000 claims description 10
- 230000002265 prevention Effects 0.000 claims 1
- 238000009423 ventilation Methods 0.000 abstract description 5
- 238000003491 array Methods 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a bonding pad structure for preventing welding holes, which comprises a bonding pad substrate, wherein a soldering tin layer is arranged on the bonding pad substrate, the soldering tin layer comprises a plurality of soldering tin units, and an exhaust channel is formed among the soldering tin units; the ventilation channels are distributed along the via hole arrangement paths on the bonding pad substrate; the plurality of solder cell arrays are arranged on the upper end face of the pad substrate. And a plurality of the soldering units are equally arranged in height. According to the utility model, the high-temperature gas exhaust channel is formed through the multi-unit structure of the soldering tin layer, so that high-temperature gas and the like can be rapidly exhausted during welding, welding holes are avoided, and welding quality is ensured.
Description
Technical Field
The utility model relates to the technical field of welding, in particular to a patch pad structure for preventing welding cavities.
Background
On the PCB circuit board, the chip is used as a patch element and is welded through the patch bonding pads, and as the patch bonding pads on two sides of the PCB are connected through the through holes, the through holes are formed in the bonding pads, high-temperature gas expands in the holes during welding, and as partial gas surface tension is smaller than the tension of the soldering tin layer, high-temperature gas is bound and forms bubbles in the soldering tin layer, so that welding holes are easy to form during cooling and solidification, the product quality is directly affected, and welding spots existing in the welding holes have larger potential safety hazards.
Disclosure of Invention
The utility model aims to: in order to overcome the defects in the prior art, the utility model provides the patch pad structure for preventing the welding cavity, and the high-temperature gas exhaust channel is formed through the multi-unit structure of the soldering tin layer, so that the high-temperature gas and the like generated by welding can be rapidly exhausted, the welding cavity is avoided, and the welding quality is ensured.
The technical scheme is as follows: in order to achieve the above object, the bonding pad structure for preventing soldering void of the present utility model comprises a bonding pad substrate, wherein a solder layer is provided on the bonding pad substrate, the solder layer comprises a plurality of solder units, and an exhaust channel is formed between each solder unit.
Further, the plurality of solder cell arrays are arranged on the upper end face of the pad substrate.
Further, a plurality of the solder units are arranged at equal heights.
Further, the soldering unit is provided with two.
Further, the pad substrate is a round pad, and the soldering tin unit is of a rectangular-like structure.
Further, the solder layer profile is located within the solder pad substrate profile.
Further, two soldering tin units are arranged in parallel at intervals, and the exhaust channel is formed between the two soldering tin units.
The beneficial effects are that: according to the bonding pad structure for preventing the welding void, the soldering tin layers on the bonding pad are coated to form the multi-unit structure, so that the ventilation channels are formed among soldering tin units, and the ventilation channels correspond to the through holes on the bonding pad substrate, so that high-temperature gas generated during welding can be rapidly discharged, the formation of the welding void in the welding spot is avoided, the welding quality is ensured, and the reject ratio of welding is reduced.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present utility model;
fig. 2 is a schematic view of a solder layer printing steel mesh structure according to an embodiment of the present utility model.
Detailed Description
The utility model will be further described with reference to the accompanying drawings.
The bonding pad structure for preventing soldering void as shown in fig. 1-2 comprises a bonding pad substrate 1, wherein a solder layer 2 is arranged on the bonding pad substrate 1, the solder layer 2 comprises a plurality of solder units 21, and an exhaust channel 3 is formed between each solder unit 21. The ventilation channels are arranged along the arrangement path of the through holes 11 on the bonding pad substrate. Wherein a plurality of the solder units 21 are arranged on the upper end surface of the pad substrate 1 in an array manner. And a plurality of the solder units 21 are provided at equal heights.
According to the scheme, when the solder layer is printed and coated, the non-complete coverage shape is adopted for coating, under the premise of ensuring that the solder quantity is enough, a plurality of independent solder units are formed on the solder pad substrate, an exhaust channel is formed between the solder units, through holes formed in the solder pad substrate are all located in the exhaust channel, so that a discharge space is provided for high-temperature gas and the like generated during welding, welding holes are avoided in welding spots, and the reject ratio of product welding is reduced.
Examples:
the solder unit 21 is provided with two.
The pad substrate 1 is a circular pad, and the solder unit 21 has a rectangular-like structure.
The two solder units 21 are arranged in parallel at a distance, and the exhaust channel 3 is formed between the two solder units 21.
The outline of the soldering tin layer 2 is positioned in the outline of the bonding pad substrate 1.
In this embodiment, two solder elements of rectangular-like structure are arranged at parallel intervals, so as to form a strip-shaped exhaust channel with two open ends, and the via holes 11 required by the bonding pads can be arranged in the strip-shaped exhaust channel, so that high-temperature gas generated during welding can be rapidly discharged from two ports of the ventilation channel, thereby avoiding occurrence of welding cavities and ensuring product quality. As shown in fig. 2, a steel mesh structure 4 for printing a solder layer for soldering a chip bonding pad of a PCB board is used to convert a circular hole of the same size, which corresponds to each bonding pad, into two rows of rectangular-like holes 41, thereby forming two rectangular-like solder units 21 on the bonding pad by coating solder paste;
the process size of the two rectangular-like holes cannot exceed the size of the original soldering tin disk, namely the soldering tin layer must be coated on the soldering pad, and secondly, the soldering pad area is covered as large as possible on the basis of not plugging the via hole, so that enough soldering tin amount is ensured, and the thickness of the soldering tin layer is reduced.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the utility model.
Claims (7)
1. A prevent welding cavity's paster pad structure, its characterized in that: the soldering tin comprises a soldering tin substrate (1), wherein a soldering tin layer (2) is arranged on the soldering tin substrate (1), the soldering tin layer (2) comprises a plurality of soldering tin units (21), and an exhaust channel (3) is formed among the soldering tin units (21).
2. A bonding pad structure for preventing solder void according to claim 1, wherein: the plurality of soldering tin units (21) are arranged on the upper end face of the pad substrate (1) in an array mode.
3. A bonding pad structure for preventing solder void according to claim 2, wherein: the plurality of solder units (21) are arranged at equal heights.
4. A bonding pad structure for preventing solder void according to claim 3, wherein: the number of the soldering units (21) is two.
5. The bonding pad structure for preventing solder void according to claim 4, wherein: the pad substrate (1) is a round pad, and the soldering tin unit (21) is of a rectangular-like structure.
6. The bonding pad structure for preventing solder void according to claim 5, wherein: the two soldering tin units (21) are arranged in parallel at intervals, and the exhaust channel (3) is formed between the two soldering tin units (21).
7. The solder void prevention patch pad structure of claim 6, wherein: the outline of the soldering tin layer (2) is positioned in the outline of the bonding pad substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322297668.4U CN220629650U (en) | 2023-08-25 | 2023-08-25 | Patch pad structure for preventing welding cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322297668.4U CN220629650U (en) | 2023-08-25 | 2023-08-25 | Patch pad structure for preventing welding cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220629650U true CN220629650U (en) | 2024-03-19 |
Family
ID=90221838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322297668.4U Active CN220629650U (en) | 2023-08-25 | 2023-08-25 | Patch pad structure for preventing welding cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220629650U (en) |
-
2023
- 2023-08-25 CN CN202322297668.4U patent/CN220629650U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211481596U (en) | Grounding bonding pad and chip | |
| JPH10246894A (en) | Liquid crystal display device | |
| CN103249249A (en) | Circuit board system | |
| CN220629650U (en) | Patch pad structure for preventing welding cavity | |
| US6222738B1 (en) | Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof | |
| JP2023532899A (en) | Mesh routing of printed circuit boards to reduce solder ball joint failure during reflow | |
| CN220210700U (en) | Tin printing steel mesh for welding pre-bent copper bottom plate and module | |
| CN219107753U (en) | Circuit board assembly and electronic equipment | |
| JPH08288658A (en) | Printed wiring board for bga package mount | |
| CN116985517A (en) | Steel mesh for solder paste printing and design method thereof | |
| CN211267300U (en) | Steel mesh and welded structure | |
| CN111432574A (en) | SMT (surface mount technology) multi-time printing process | |
| CN101489359B (en) | Method for avoiding solder bridge | |
| CN215581857U (en) | PCB structure for improving heat dissipation efficiency of electronic component | |
| CN202587598U (en) | Pad structure and printed circuit board (PCB) | |
| CN114843254A (en) | Mini LED backlight module and manufacturing method thereof | |
| CN114361144A (en) | Substrate, integrated packaging device and manufacturing method of integrated packaging device | |
| CN110739228B (en) | Method for quickly mounting BGA chip | |
| CN213093321U (en) | Novel radio frequency load sheet | |
| CN114980557B (en) | Preparation process capable of optimizing pin welding of USB device | |
| CN216902931U (en) | Anti-deformation core plate | |
| CN219780475U (en) | PCB structure | |
| CN217062082U (en) | SOT223 lead frame, integrated circuit and typesetting | |
| CN221150014U (en) | LED display device and LED display panel | |
| CN221041160U (en) | Mini COB substrate bonding pad, chip printing structure and chip die bonding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |