CN220626444U - Integrated circuit package testing device - Google Patents
Integrated circuit package testing device Download PDFInfo
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- CN220626444U CN220626444U CN202322177579.6U CN202322177579U CN220626444U CN 220626444 U CN220626444 U CN 220626444U CN 202322177579 U CN202322177579 U CN 202322177579U CN 220626444 U CN220626444 U CN 220626444U
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- integrated circuit
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- circuit package
- fixedly arranged
- rotary table
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- 238000012360 testing method Methods 0.000 title claims abstract description 64
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides an integrated circuit package testing device. The integrated circuit package testing device includes: the workbench is provided with a rotating mechanism, a material taking and placing mechanism, a compressing mechanism and a heat dissipation mechanism; the rotary mechanism comprises a circular groove, a rotary table, a slot, an annular gear, a driving motor, a circular gear and two test seats, wherein the circular groove is formed in the top of the workbench, the rotary table is rotatably installed in the circular groove, the slot is formed in the bottom of the rotary table, the annular gear is fixedly installed on the inner wall of the slot, the driving motor is fixedly installed on the inner wall of the bottom of the circular groove, and the circular gear is fixedly installed on an output shaft of the driving motor. The integrated circuit packaging testing device provided by the utility model has the advantages that the integrated circuit can be automatically fed and discharged, the pins of the integrated circuit can be downwards moved to be attached to the conducting strips, and the integrated circuit can be cooled.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit testing, and particularly relates to an integrated circuit packaging testing device.
Background
An integrated circuit is a miniature electronic device or component, which adopts a certain technology to interconnect the needed elements such as transistors, resistors, capacitors, inductors and the like in a circuit and wiring, and the elements are manufactured on a small semiconductor wafer or a medium substrate or a plurality of small semiconductor wafers or medium substrates, then the semiconductor wafers or medium substrates are packaged in a tube shell to form a miniature structure with the needed circuit function, and after the pins of the integrated circuit are welded, a testing device is needed to be used for detection.
In the related art, the utility model discloses an integrated circuit packaging testing arrangement, including test platform and mounting panel, test platform's lower extreme fixedly connected with base, the mounting panel is located test platform's top, mounting panel lower extreme fixedly connected with connecting plate, the lower extreme of mounting panel is located the avris fixedly connected with division board of connecting plate, the interval that its a plurality of division boards and connecting plate formed, make things convenient for integrated circuit's the pin to put into the interval, be convenient for the location to integrated circuit, utilize reset spring's elasticity simultaneously, spacing to conductive briquetting, thereby when integrated circuit's the pin gets into between the division board, conductive briquetting and the pin laminating each other, be convenient for the test to integrated circuit, and utilize driving motor to drive the transfer line rotatory, thereby drive two movable blocks synchronous movement, the position of convenient adjustment both sides mounting panel, the different integrated circuit of adaptation, the practicality has been improved.
However, the above structure has the disadvantage that when the integrated circuit is tested, heat emitted by the integrated circuit during the test cannot be dissipated, the integrated circuit needs to be fixed manually, and the test efficiency is low.
Accordingly, there is a need for a new integrated circuit package testing apparatus that solves the above-mentioned problems.
Disclosure of Invention
The utility model solves the technical problem of providing the integrated circuit packaging testing device which can automatically load and unload the integrated circuit, can move down the integrated circuit to enable pins of the integrated circuit to be attached to the conducting strip, and can radiate heat of the integrated circuit.
In order to solve the above technical problems, the integrated circuit package testing device provided by the present utility model includes: the workbench is provided with a rotating mechanism, a material taking and placing mechanism, a compressing mechanism and a heat dissipation mechanism;
the rotary mechanism comprises a circular groove, a rotary table, a slot, an annular gear, a driving motor, a circular gear and two test seats, wherein the circular groove is formed in the top of the workbench, the rotary table is rotatably installed in the circular groove, the slot is formed in the bottom of the rotary table, the annular gear is fixedly installed on the inner wall of the slot, the driving motor is fixedly installed on the inner wall of the bottom of the circular groove, the circular gear is fixedly installed on an output shaft of the driving motor, the circular gear is meshed with the annular gear, and the two test seats are symmetrically installed at the top of the rotary table;
get blowing mechanism and include rotating base, arm, recognition device, first telescopic link, mounting panel and sucking disc, rotating base fixed mounting is at the top of workstation, the arm is installed on rotating base, recognition device installs on the arm, first telescopic link is installed on the arm, mounting panel fixed mounting is on the output shaft of first telescopic link, sucking disc fixed mounting is in the bottom of mounting panel.
As a further scheme of the utility model, the compressing mechanism comprises an L-shaped plate, a second electric telescopic rod, a circular plate, a telescopic groove, a pressing plate and a plurality of return springs, wherein the L-shaped plate is fixedly arranged at the top of the workbench, the second electric telescopic rod is fixedly arranged on the L-shaped plate, the circular plate is fixedly arranged on an output shaft of the second electric telescopic rod, the telescopic groove is fixedly arranged at the bottom of the circular plate, the pressing plate is slidably arranged in the telescopic groove, and the return springs are fixedly arranged in the telescopic groove.
As a further scheme of the utility model, the heat dissipation mechanism comprises two cavities, a connecting air pipe, a fan and two electromagnetic valves, wherein the two cavities are respectively arranged on the two test seats, the connecting air pipe is fixedly arranged on one side of the two test seats, which is close to each other, the two cavities are communicated with the connecting air pipe, the fan is fixedly arranged at the top of the turntable, the air outlet end of the fan is fixedly connected with the connecting air pipe, and the two electromagnetic valves are fixedly arranged on the connecting air pipe.
As a further scheme of the utility model, a plurality of air outlet holes are formed in the inner wall of the top of the cavity, and a plurality of heat dissipation holes are formed in the outer wall of the test seat.
As a further scheme of the utility model, a plurality of pin grooves are formed in the test seat, and conductive sheets are arranged in the pin grooves.
As a further scheme of the utility model, two limiting sliding grooves are formed in the inner wall of the telescopic groove, limiting sliding blocks are slidably arranged in the two limiting sliding grooves, and one sides of the two limiting sliding blocks are fixedly connected with the pressing plate.
Compared with the related art, the integrated circuit package testing device provided by the utility model has the following beneficial effects:
1. according to the utility model, the rotating mechanism is arranged, so that the two test seats on the turntable can be intermodulation in position, and the integrated circuit can be conveniently put in or taken out and tested;
2. according to the utility model, the material taking and discharging mechanism is arranged, so that the tested integrated circuit can be simply and effectively taken down, and then the integrated circuit to be tested is put in;
3. according to the utility model, the integrated circuit can be compressed by arranging the compressing mechanism, so that the pins of the integrated circuit are attached to the conducting strips, and impact force generated during contact is buffered by the pressing plate, so that the pins of the integrated circuit are prevented from being damaged;
4. the utility model can radiate the heat generated in the integrated circuit testing process by arranging the radiating mechanism.
Drawings
The present utility model is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic diagram of a three-dimensional structure of an integrated circuit package testing device according to the present utility model;
FIG. 2 is a schematic diagram of an integrated circuit package testing device of the present utility model in front cross-sectional configuration;
FIG. 3 is a schematic diagram of a test socket according to the present utility model.
In the figure: 1. a work table; 2. a circular groove; 3. a turntable; 4. slotting; 5. an inner gear ring; 6. a driving motor; 7. a circular gear; 8. a test seat; 9. a rotating base; 10. a mechanical arm; 101. an identification device; 11. a first telescopic rod; 12. a mounting plate; 13. a suction cup; 14. an L-shaped plate; 15. a second electric telescopic rod; 16. a circular plate; 17. a telescopic slot; 18. a pressing plate; 19. a return spring; 20. a cavity; 21. connecting an air pipe; 22. a blower; 23. an electromagnetic valve; 24. an air outlet hole; 25. a heat radiation hole; 26. a pin slot; 27. and a conductive sheet.
Detailed Description
Referring to fig. 1, fig. 2 and fig. 3 in combination, fig. 1 is a schematic perspective view of an integrated circuit package testing device according to the present utility model; FIG. 2 is a schematic diagram of an integrated circuit package testing device of the present utility model in front cross-sectional configuration; FIG. 3 is a schematic diagram of a test socket according to the present utility model. An integrated circuit package testing apparatus includes: the workbench 1 is provided with a rotating mechanism, a material taking and placing mechanism, a compressing mechanism and a heat dissipation mechanism;
the rotary mechanism comprises a circular groove 2, a rotary table 3, a slot 4, an annular gear 5, a driving motor 6, a circular gear 7 and two test seats 8, wherein the circular groove 2 is arranged at the top of the workbench 1, the rotary table 3 is rotatably arranged in the circular groove 2, the slot 4 is arranged at the bottom of the rotary table 3, the annular gear 5 is fixedly arranged on the inner wall of the slot 4, the driving motor 6 is fixedly arranged on the inner wall of the bottom of the circular groove 2, the circular gear 7 is fixedly arranged on the output shaft of the driving motor 6, the circular gear 7 is meshed with the annular gear 5, and the two test seats 8 are symmetrically arranged at the top of the rotary table 3;
get blowing mechanism and include rotating base 9, arm 10, recognition device 101, first telescopic link 11, mounting panel 12 and sucking disc 13, rotating base 9 fixed mounting is at the top of workstation 1, arm 10 installs on rotating base 9, recognition device 101 installs on arm 10, first telescopic link 11 installs on arm 10, mounting panel 12 fixed mounting is on the output shaft of first telescopic link 11, sucking disc 13 fixed mounting is in the bottom of mounting panel 12.
As shown in fig. 1 and 2, the pressing mechanism comprises an L-shaped plate 14, a second electric telescopic rod 15, a circular plate 16, a telescopic slot 17, a pressing plate 18 and a plurality of return springs 19, wherein the L-shaped plate 14 is fixedly installed on the top of the workbench 1, the second electric telescopic rod 15 is fixedly installed on the L-shaped plate 14, the circular plate 16 is fixedly installed on an output shaft of the second electric telescopic rod 15, the telescopic slot 17 is fixedly installed at the bottom of the circular plate 16, the pressing plate 18 is slidably installed in the telescopic slot 17, and the return springs 19 are fixedly installed in the telescopic slot 17;
by arranging the pressing mechanism, the integrated circuit can be pressed, pins of the integrated circuit are attached to the conductive plates 27, impact force generated during contact is buffered through the pressing plate 18, and the pins of the integrated circuit are prevented from being damaged.
As shown in fig. 1 and 2, the heat dissipation mechanism includes two cavities 20, a connecting air pipe 21, a fan 22 and two electromagnetic valves 23, the two cavities 20 are respectively opened on the two test seats 8, the connecting air pipe 21 is fixedly installed on one side of the two test seats 8, which are close to each other, the two cavities 20 are communicated with the connecting air pipe 21, the fan 22 is fixedly installed on the top of the turntable 3, the air outlet end of the fan 22 is fixedly connected with the connecting air pipe 21, and the two electromagnetic valves 23 are fixedly installed on the connecting air pipe 21;
by arranging the heat dissipation mechanism, heat generated in the integrated circuit testing process can be dissipated.
As shown in fig. 3, the top inner wall of the cavity 20 is provided with a plurality of air outlet holes 24, and the outer wall of the test seat 8 is provided with a plurality of heat dissipation holes 25;
by providing the air outlet holes 24 and the heat dissipation holes 25, heat dissipation can be performed on the integrated circuit, and the heat is discharged out of the test seat 8 through the heat dissipation holes 25.
As shown in fig. 3, the test seat 8 is provided with a plurality of pin grooves 26, and conductive sheets 27 are installed in the pin grooves 26;
by providing the pin grooves 26 and the conductive pieces 27, it is possible to facilitate the placement of the pins of the integrated circuit, and to connect the conductive pieces 27 with the pins of the integrated circuit, to test the integrated circuit.
As shown in fig. 2, two limiting sliding grooves are formed in the inner wall of the telescopic groove 17, limiting sliding blocks are slidably mounted in the two limiting sliding grooves, and one sides of the two limiting sliding blocks are fixedly connected with the pressing plate 18;
through setting up spacing spout and spacing slider for can be simple effectual restriction to clamp plate 18, avoid clamp plate 18 to pop out flexible groove 17.
The working principle of the integrated circuit package testing device provided by the utility model is as follows:
a first step of: when the integrated circuit testing device is used, the sucker 13 is started, the integrated circuit can be sucked and identified through the identification device 101, the integrated circuit to be tested can be placed in the test seat 8 through the rotating base 9, the mechanical arm 10 and the first telescopic rod 11 after the start, and the tested integrated circuit can be taken out after the test is finished;
and a second step of: starting a driving motor 6, driving the circular gear 7 to rotate by the driving motor 6, driving the annular gear 5 to rotate by the circular gear 7, driving the rotary table 3 to rotate by the annular gear 5, so that the positions of the two test seats 8 are exchanged, the integrated circuit to be tested is positioned below the pressing plate 18, starting a second electric telescopic rod 15, driving the circular plate 16 to move downwards by the second electric telescopic rod 15, buffering impact force generated during contact after the pressing plate 18 contacts the integrated circuit, pressing the integrated circuit downwards by the pressing plate 18 through the elasticity of the reset spring 19, attaching pins of the integrated circuit to the conducting plate 27, and testing the integrated circuit;
and a third step of: during testing, the fan 22 is started, the fan 22 guides external air into the cavity 20 through the connecting air pipe 21, blows the external air onto the integrated circuit through the air outlet hole 24, dissipates heat of the integrated circuit, and discharges the external air through the heat dissipation hole 25.
It should be noted that, the device structure and the drawings of the present utility model mainly describe the principle of the present utility model, in terms of the technology of the design principle, the arrangement of the power mechanism, the power supply system, the control system, etc. of the device is not completely described, and on the premise that the person skilled in the art understands the principle of the present utility model, the specific details of the power mechanism, the power supply system and the control system can be clearly known, the control mode of the application file is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the person skilled in the art;
the standard parts used in the method can be purchased from the market, and can be customized according to the description of the specification and the drawings, the specific connection modes of the parts are conventional means such as mature bolts, rivets and welding in the prior art, the machines, the parts and the equipment are conventional models in the prior art, and the structures and the principles of the parts are all known by the skilled person through technical manuals or through conventional experimental methods.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents, and in other related technical fields, which are equally encompassed by the scope of the present utility model.
Claims (6)
1. An integrated circuit package testing apparatus, comprising:
the workbench is provided with a rotating mechanism, a material taking and placing mechanism, a compressing mechanism and a heat dissipation mechanism;
the rotary mechanism comprises a circular groove, a rotary table, a slot, an annular gear, a driving motor, a circular gear and two test seats, wherein the circular groove is formed in the top of the workbench, the rotary table is rotatably installed in the circular groove, the slot is formed in the bottom of the rotary table, the annular gear is fixedly installed on the inner wall of the slot, the driving motor is fixedly installed on the inner wall of the bottom of the circular groove, the circular gear is fixedly installed on an output shaft of the driving motor, the circular gear is meshed with the annular gear, and the two test seats are symmetrically installed at the top of the rotary table;
get blowing mechanism and include rotating base, arm, recognition device, first telescopic link, mounting panel and sucking disc, rotating base fixed mounting is at the top of workstation, the arm is installed on rotating base, recognition device installs on the arm, first telescopic link is installed on the arm, mounting panel fixed mounting is on the output shaft of first telescopic link, sucking disc fixed mounting is in the bottom of mounting panel.
2. The integrated circuit package testing apparatus of claim 1, wherein: the compressing mechanism comprises an L-shaped plate, a second electric telescopic rod, a circular plate, a telescopic groove, a pressing plate and a plurality of reset springs, wherein the L-shaped plate is fixedly arranged at the top of the workbench, the second electric telescopic rod is fixedly arranged on the L-shaped plate, the circular plate is fixedly arranged on an output shaft of the second electric telescopic rod, the telescopic groove is fixedly arranged at the bottom of the circular plate, the pressing plate is slidably arranged in the telescopic groove, and the reset springs are fixedly arranged in the telescopic groove.
3. The integrated circuit package testing apparatus of claim 1, wherein: the heat dissipation mechanism comprises two cavities, a connecting air pipe, a fan and two electromagnetic valves, wherein the two cavities are respectively arranged on the two test seats, the connecting air pipe is fixedly arranged on one side, close to the two test seats, of each other, the two cavities are communicated with the connecting air pipe, the fan is fixedly arranged at the top of the rotary table, the air outlet end of the fan is fixedly connected with the connecting air pipe, and the two electromagnetic valves are fixedly arranged on the connecting air pipe.
4. The integrated circuit package testing apparatus of claim 3, wherein: a plurality of air outlet holes are formed in the inner wall of the top of the cavity, and a plurality of heat dissipation holes are formed in the outer wall of the test seat.
5. The integrated circuit package testing apparatus of claim 1, wherein: a plurality of pin grooves are formed in the test seat, and conducting strips are arranged in the pin grooves.
6. The integrated circuit package testing apparatus of claim 2, wherein: two limiting sliding grooves are formed in the inner wall of the telescopic groove, limiting sliding blocks are slidably mounted in the limiting sliding grooves, and one sides of the limiting sliding blocks are fixedly connected with the pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322177579.6U CN220626444U (en) | 2023-08-14 | 2023-08-14 | Integrated circuit package testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322177579.6U CN220626444U (en) | 2023-08-14 | 2023-08-14 | Integrated circuit package testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220626444U true CN220626444U (en) | 2024-03-19 |
Family
ID=90226766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322177579.6U Active CN220626444U (en) | 2023-08-14 | 2023-08-14 | Integrated circuit package testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220626444U (en) |
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2023
- 2023-08-14 CN CN202322177579.6U patent/CN220626444U/en active Active
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