CN219131063U

CN219131063U - Semiconductor flip-chip reflow soldering clamp

Info

Publication number: CN219131063U
Application number: CN202223407778.3U
Authority: CN
Inventors: 周友军; 陶天宇; 刘莹; 吴道勋; 黄尔书; 江树昌; 林逢佺
Original assignee: Zhongmin Fujian Electronics Manufacturing Co ltd
Current assignee: Zhongmin Fujian Electronics Manufacturing Co ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-06-06
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a semiconductor flip-chip reflow soldering fixture, which comprises a lower horizontal bottom plate, wherein the lower surface of the lower horizontal bottom plate is fixedly connected with a supporting rod, the side surface of the supporting rod is fixedly connected with a fixing rod, the side surface of the fixing rod is fixedly connected with a second sliding plate, the upper surface of the second sliding plate is connected with a motor in a sliding manner, the output end of the motor is fixedly connected with a gear, the side surface of the motor is fixedly connected with a fan, the input end of the fan is fixedly connected with a sponge sucker, the upper surface of the lower horizontal bottom plate is provided with an opening, and the inner surface of the opening is fixedly connected with a first sliding plate. According to the structure, through the lower side movable supporting plate and the upper side movable cover plate which can move left and right, only horizontal movement can be performed after electronic elements are placed, displacement of the electronic elements is avoided, two stations can be used for placing the electronic elements when one station is welded, and use efficiency is improved.

Description

Semiconductor flip-chip reflow soldering clamp

Technical Field

The utility model relates to the technical field of reflow soldering clamps, in particular to a semiconductor flip-chip reflow soldering clamp.

Background

The reflow soldering technology is to solder the components on various boards to the circuit board in the electronic manufacturing field, and the device has a heating circuit inside to heat air or nitrogen to high enough temperature and blow the heated air or nitrogen to the circuit board to which the components are attached, so that the solder on both sides of the components is melted and then bonded to the main board. The process has the advantages that the temperature is easy to control, oxidation can be avoided in the welding process, and the manufacturing cost is easy to control. After searching, the technical scheme provided by the utility model with the application number of CN202022972128.8 is found to have the same problems.

Disclosure of Invention

The utility model aims to at least solve one of the technical problems in the prior art, and provides a semiconductor flip-chip reflow soldering clamp, which can only horizontally move after the electronic components are placed through a lower side movable supporting plate and an upper side movable cover plate which can horizontally move, so that the displacement of the electronic components is avoided, one station can be used for placing the electronic components while the other station is used for soldering, and the use efficiency is increased.

In order to achieve the above object, the present utility model further provides a flip-chip semiconductor reflow soldering jig having the above structure, comprising:

the lower side horizontal bottom plate is fixedly connected with a supporting rod, the side surface of the supporting rod is fixedly connected with a fixing rod, the side surface of the fixing rod is fixedly connected with a second sliding plate, the upper surface of the second sliding plate is slidably connected with a motor, and the output end of the motor is fixedly connected with a gear;

the side surface fixedly connected with fan of motor, the input fixedly connected with sponge sucking disc of fan, the upper surface of downside horizontal bottom plate is provided with the opening, open-ended internal surface fixedly connected with first sliding plate, the upper surface sliding connection of first sliding plate has downside movable support plate, the upper surface of first sliding plate just is located the outside sliding connection of downside movable support plate and has upside movable apron, form the cavity between the upper surface of downside movable support plate and the lower surface of upside movable cover plate, the internal surface of cavity is provided with the circuit board.

According to the semiconductor flip-chip reflow soldering clamp, the rack is arranged on the front surface of the second sliding plate and meshed with the gear, and the rack is used for driving the fan to move.

According to the semiconductor flip-chip reflow soldering clamp, the upper surface of the sponge sucker is respectively contacted with the upper side moving cover plate and the lower side moving supporting plate, and the output end of the fan is positioned on the rear surface of the fan.

According to the semiconductor flip-chip reflow soldering clamp, the number of the motors is four and distributed left and right, and the motors and the fans are connected with an external power supply.

According to the semiconductor flip-chip reflow soldering fixture, the number of the openings is two and is distributed front and back.

According to the semiconductor flip-chip reflow soldering fixture, the outer surface of the lower movable supporting plate is in contact with the inner surface of the upper movable cover plate.

According to the semiconductor flip-chip reflow soldering clamp, the top inner wall of the upper side moving cover plate is provided with an elastic layer for improving the stability of fixing the circuit board.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described below with reference to the drawings and examples;

fig. 1 is an internal structural view of a semiconductor flip-chip reflow jig according to the present utility model;

FIG. 2 is an enlarged schematic view of the structure A in FIG. 1;

FIG. 3 is a top view of a semiconductor flip-chip reflow jig according to the present utility model;

fig. 4 is a schematic view showing a part of the structure of a semiconductor flip-chip reflow jig according to the present utility model.

Legend description:

1. a lower horizontal bottom plate; 2. a support rod; 3. a fixed rod; 4. an opening; 5. a first sliding plate; 6. a second sliding plate; 7. a motor; 8. a gear; 9. a blower; 10. a sponge sucker; 11. an upper side moving cover plate; 12. a lower movable support plate; 13. a circuit board.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

Referring to fig. 1-4, the embodiment of the utility model relates to a semiconductor flip-chip reflow soldering fixture, which comprises a lower horizontal bottom plate 1, wherein a support rod 2 is fixedly connected to the lower surface of the lower horizontal bottom plate 1, a fixing rod 3 is fixedly connected to the side surface of the support rod 2, a second sliding plate 6 is fixedly connected to the side surface of the fixing rod 3, a rack is arranged on the front surface of the second sliding plate 6 and meshed with a gear 8, the rack is used for driving a fan 9 to move, a motor 7 is slidably connected to the upper surface of the second sliding plate 6 and used for moving the position, the gear 8 is fixedly connected to the output end of the motor 7, the number of the motors 7 is four and distributed left and right, and both the motor 7 and the fan 9 are connected with an external power supply.

The side surface fixedly connected with fan 9 of motor 7 for provide the negative pressure, the input fixedly connected with sponge sucking disc 10 of fan 9, the upper surface of sponge sucking disc 10 respectively with the side of upside formula apron 11, the side of downside formula backup pad 12 contacts, the surface of side of downside formula backup pad 12 and the interior surface of side of upside formula apron 11 contact, the output of fan 9 is located the rear surface of fan 9, the upper surface of downside horizontal baseplate 1 is provided with opening 4, the quantity of opening 4 is two and the back-and-forth distribution, the interior surface fixedly connected with first sliding plate 5 of opening 4, the upper surface sliding connection of first sliding plate 5 has side of downside formula backup pad 12, the upper surface of first sliding plate 5 and the outside sliding connection of being located side of downside formula backup pad 12 have side of upside formula apron 11, be used for moving the position of circuit board 13, the top inner wall of side of upside formula apron 11 is provided with the elastic layer, be used for increasing the stability to circuit board 13 is fixed, the upper surface of downside formula backup pad 12 and the interior surface of side of upside formula apron 11 form the cavity, the cavity is provided with circuit board 13.

Working principle: the circuit board 13 without electronic components is placed on the upper side of the lower movable supporting plate 12, the upper movable cover plate 11 is used for limiting, the fan 9 is started to carry out memory adsorption on the upper movable cover plate 11 and the lower movable supporting plate 12, the electronic components are mounted on the circuit board 13, after the electronic components are mounted, the motor 7 drives the gear 8 to rotate, the circuit board 13 can be moved, and the electronic components are mounted on the other circuit board 13 while welding.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims

1. A semiconductor flip-chip reflow soldering jig, comprising:

the device comprises a lower horizontal bottom plate (1), wherein the lower surface of the lower horizontal bottom plate (1) is fixedly connected with a supporting rod (2), the side surface of the supporting rod (2) is fixedly connected with a fixing rod (3), the side surface of the fixing rod (3) is fixedly connected with a second sliding plate (6), the upper surface of the second sliding plate (6) is slidably connected with a motor (7), and the output end of the motor (7) is fixedly connected with a gear (8);

the utility model discloses a motor, including motor (7), side surface fixedly connected with fan (9), the input fixedly connected with sponge sucking disc (10) of fan (9), the upper surface of downside horizontal bottom plate (1) is provided with opening (4), the internal surface fixedly connected with first sliding plate (5) of opening (4), the upper surface sliding connection of first sliding plate (5) has downside movable support board (12), the upper surface of first sliding plate (5) just is located the outside sliding connection of downside movable support board (12) has upside movable apron (11), form the cavity between the upper surface of downside movable support board (12) and the lower surface of upside movable cover board (11), the internal surface of cavity is provided with circuit board (13).

2. A semiconductor flip-chip reflow jig according to claim 1, wherein the front surface of the second slide plate (6) is provided with a rack, which is engaged with a gear (8).

3. The semiconductor flip-chip reflow soldering fixture according to claim 1, wherein the upper surface of the sponge sucker (10) is respectively contacted with the upper side movable cover plate (11) and the lower side movable support plate (12), and the output end of the fan (9) is positioned on the rear surface of the fan (9).

4. The semiconductor flip-chip reflow soldering fixture according to claim 1, wherein the number of motors (7) is four and distributed left and right, and the motors (7) and fans (9) are connected with an external power supply.

5. A semiconductor flip-chip reflow soldering fixture in accordance with claim 1, wherein the number of openings (4) is two and is distributed back and forth.

6. A semiconductor flip-chip bonding jig according to claim 1, wherein an outer surface of the lower movable supporting plate (12) is in contact with an inner surface of the upper movable cover plate (11).

7. A semiconductor flip-chip reflow soldering jig according to claim 1, wherein the top inner wall of the upper movable cover plate (11) is provided with an elastic layer.