CN211481746U

CN211481746U - Integrated circuit board with good heat dissipation performance

Info

Publication number: CN211481746U
Application number: CN202020021882.0U
Authority: CN
Inventors: 阳明
Original assignee: Shenzhen Huashike Industry Co ltd
Current assignee: Shenzhen Huashike Industry Co ltd
Priority date: 2020-01-06
Filing date: 2020-01-06
Publication date: 2020-09-11
Anticipated expiration: 2030-01-06

Abstract

The utility model discloses an integrated circuit board that heat dispersion is good, including mount pad and integrated circuit board body, the standing groove has been seted up on the top of integrated circuit board body, the integrated circuit board body sets up in the standing groove, be equipped with a plurality of first backup pads that are located integrated circuit board body bottom in the standing groove, first backup pad is connected through a plurality of bracing pieces with the bottom inner wall of standing groove, the mounting hole has been seted up to the bottom inner wall symmetry of standing groove, be equipped with the heat dissipation fan in the mounting hole, the bilateral symmetry of integrated circuit board body is equipped with the curb plate. A integrated circuit board that heat dispersion is good, can accelerate the air flow of integrated circuit board body top and bottom, and then dispel the heat simultaneously to the top and the bottom of integrated circuit board body, improve the radiating effect, the dismouting of completion integrated circuit board body that can be convenient, and then the convenience is overhauld the integrated circuit board body.

Description

Integrated circuit board with good heat dissipation performance

Technical Field

The utility model relates to an integrated circuit field, in particular to integrated circuit board that heat dispersion is good.

Background

The integrated circuit board is a carrier for loading an integrated circuit, but the integrated circuit is usually carried on the integrated circuit, the integrated circuit board is mainly formed by silica gel, so the integrated circuit board is generally green, the integrated circuit board adopts a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a smaller single crystal silicon chip, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method. The existing integrated circuit board can not simultaneously dissipate heat from the top end and the bottom end, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide an integrated circuit board with good heat dissipation performance, which can effectively solve the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an integrated circuit board that heat dispersion is good, includes mount pad and integrated circuit board body, the standing groove has been seted up on the top of integrated circuit board body, the integrated circuit board body sets up in the standing groove, be equipped with a plurality of first backup pads that are located integrated circuit board body bottom in the standing groove, first backup pad is connected through a plurality of bracing pieces with the bottom inner wall of standing groove, the mounting hole has been seted up to the bottom inner wall symmetry of standing groove, be equipped with the heat dissipation fan in the mounting hole, the bilateral symmetry of integrated circuit board body is equipped with the curb plate, the curb plate is connected through a plurality of connecting rods with the inner wall of standing groove. The novel integrated circuit board is characterized in that movable plates are symmetrically arranged on two sides of the top end of the integrated circuit board body, a pressing plate located on the top end of the integrated circuit board body is arranged below the movable plates, the pressing plate is connected with the movable plates through a plurality of first springs, the movable plates are connected with the mounting seat through limiting mechanisms, and guide plates are symmetrically arranged on the inner walls of two sides of the placing groove.

Preferably, stop gear sets up in the second backup pad of mount pad both sides outer wall including the symmetry, the top of fly leaf is equipped with the baffle, the baffle contacts with the fly leaf, just one side of baffle extends to the top of mount pad, the top fixedly connected with fixed plate of second backup pad, the baffle is close to a plurality of movable rods of one side fixedly connected with of fixed plate, the movable rod runs through the fixed plate, just the one end of movable rod and the limiting plate fixed connection who is located fixed plate one side, the outside cover of movable rod is equipped with the second spring that is located between limiting plate and the fixed plate, a plurality of hinge swing joint are passed through on top one side of fly leaf and the top of mount pad.

Preferably, one end of the second spring is fixedly connected with the fixing plate, the other end of the second spring is fixedly connected with the limiting plate, and the cross section of the second supporting plate is of an L-shaped structure.

Preferably, the pressing plate and the side plate are fixedly connected with elastic pads on one sides close to the integrated circuit board body.

Preferably, the guide plate is fixedly connected with the inner wall of the placing groove, and the guide plate is positioned above the integrated circuit board body.

Preferably, the heat dissipation fan is externally connected with a control switch and a power supply.

Compared with the prior art, the utility model discloses following beneficial effect has: through the cooperation that sets up mount pad, standing groove, bracing piece, first backup pad, heat dissipation fan, curb plate, connecting rod, guide plate, can accelerate the air flow of integrated circuit board body top and bottom, and then dispel the heat simultaneously to the top and the bottom of integrated circuit board body, improve the radiating effect, through the cooperation that sets up fly leaf, first spring, pressing plate and stop gear, the dismouting of completion integrated circuit board body that can be convenient, and then the convenience is overhauld the integrated circuit board body.

Drawings

Fig. 1 is a schematic view of an overall structure of an integrated circuit board with good heat dissipation performance according to the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is a top view of the integrated circuit board with good heat dissipation performance.

In the figure: 1. a mounting seat; 2. an integrated circuit board body; 3. a placement groove; 4. a support bar; 5. a first support plate; 6. a heat dissipation fan; 7. a side plate; 8. a connecting rod; 9. a movable plate; 10. a first spring; 11. A pressing plate; 12. a hinge; 13. a second support plate; 14. a baffle plate; 15. a fixing plate; 16. a movable rod; 17. a limiting plate; 18. a second spring; 19. a baffle.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-3, an integrated circuit board with good heat dissipation performance comprises a mounting base 1 and an integrated circuit board body 2, a placing groove 3 is formed in the top end of the integrated circuit board body 2, the integrated circuit board body 2 is arranged in the placing groove 3, a plurality of first supporting plates 5 located at the bottom end of the integrated circuit board body 2 are arranged in the placing groove 3, the first supporting plates 5 are connected with the inner wall of the bottom end of the placing groove 3 through a plurality of supporting rods 4, mounting holes are symmetrically formed in the inner wall of the bottom end of the placing groove 3, heat dissipation fans 6 are arranged in the mounting holes, side plates 7 are symmetrically arranged on two sides of the integrated circuit board body 2, and the side plates 7 are connected with the. The two sides of the top end of the integrated circuit board body 2 are symmetrically provided with movable plates 9, a pressing plate 11 positioned at the top end of the integrated circuit board body 2 is arranged below the movable plates 9, the pressing plate 11 is connected with the movable plates 9 through a plurality of first springs 10, the movable plates 9 are connected with the mounting seat 1 through a limiting mechanism, and the inner walls of the two sides of the placing groove 3 are symmetrically provided with guide plates 19;

the limiting mechanism comprises second supporting plates 13 symmetrically arranged on the outer walls of two sides of the mounting seat 1, a baffle 14 is arranged at the top end of the movable plate 9, the baffle 14 is in contact with the movable plate 9, one side of the baffle 14 extends to the top end of the mounting seat 1, a fixing plate 15 is fixedly connected to the top end of the second supporting plate 13, a plurality of movable rods 16 are fixedly connected to one side, close to the fixing plate 15, of the baffle 14, the movable rods 16 penetrate through the fixing plate 15, one ends of the movable rods 16 are fixedly connected with limiting plates 17 located on one sides of the fixing plate 15, second springs 18 located between the limiting plates 17 and the fixing plate 15 are sleeved outside the movable rods 16, and one side of the top end of the movable plate 9 is movably connected; one end of a second spring 18 is fixedly connected with the fixing plate 15, the other end of the second spring 18 is fixedly connected with the limiting plate 17, and the cross section of the second supporting plate 13 is of an L-shaped structure; elastic pads are fixedly connected to one sides of the pressing plate 11 and the side plate 7 close to the integrated circuit board body 2; the guide plate 19 is fixedly connected with the inner wall of the placing groove 3, and the guide plate 19 is positioned above the integrated circuit board body 2; the heat dissipation fan 6 is externally connected with a control switch and a power supply.

It should be noted that, when the integrated circuit board with good heat dissipation performance of the present invention is used, the baffle plate 14 is pushed to make the baffle plate 14 move towards the fixing plate 15, and then the movable rod 16 drives the limit plate 17 to move away from the fixing plate 15, the second spring 18 is in a stretching state, when the baffle plate 14 is not in contact with the movable plate 9, the movable plate 9 is rotated to make the movable plate 9 no longer located in the placing groove 3, and then the integrated circuit board body 2 is placed between the two side plates 7, after the placing is finished, the movable plate 9 is reset to the initial position, and then the pressing plate 11 is moved to the top end of the integrated circuit board body 2, meanwhile, the first spring 10 is in a compressing state, and then the pressing plate 11 elastically presses the integrated circuit board body 2, when the top end of the movable plate 9 and the bottom end of the baffle plate 14 are located at the same horizontal line, the, and then one side of the movable rod 16 driving baffle 14 moves to the top of the movable plate 9, position through the spacing movable plate 9 of baffle 14, prevent the movable plate 9 from moving, and then accomplish the installation of integrated circuit board body 2, integrated circuit board body 2 is in the use, heat dissipation fan 6 is taken out the outside air to between integrated circuit board body 2 bottom and the 3 bottom inner walls of standing groove, and then the air current is to the both sides of integrated circuit board body 2, finally through the water conservancy diversion of guide plate 19, the air current is to the top of integrated circuit board body 2, accelerate the air current of integrated circuit board body 2 top and bottom, and then dispel the heat simultaneously to the top and the bottom of integrated circuit board body 2, and the heat dissipation effect is improved.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an integrated circuit board that heat dispersion is good which characterized in that: the integrated circuit board comprises a mounting seat (1) and an integrated circuit board body (2), wherein a placing groove (3) is formed in the top end of the integrated circuit board body (2), the integrated circuit board body (2) is arranged in the placing groove (3), a plurality of first supporting plates (5) located at the bottom end of the integrated circuit board body (2) are arranged in the placing groove (3), the first supporting plates (5) are connected with the inner wall of the bottom end of the placing groove (3) through a plurality of supporting rods (4), mounting holes are symmetrically formed in the inner wall of the bottom end of the placing groove (3), heat dissipation fans (6) are arranged in the mounting holes, side plates (7) are symmetrically arranged on two sides of the integrated circuit board body (2), the side plates (7) are connected with the inner wall of the placing groove (3) through a plurality of connecting rods (8), and movable plates (9) are symmetrically arranged on two, the integrated circuit board is characterized in that a pressing plate (11) located at the top end of the integrated circuit board body (2) is arranged below the movable plate (9), the pressing plate (11) is connected with the movable plate (9) through a plurality of first springs (10), the movable plate (9) is connected with the mounting seat (1) through a limiting mechanism, and guide plates (19) are symmetrically arranged on the inner walls of the two sides of the placing groove (3).

2. The integrated circuit board with good heat dissipation performance according to claim 1, wherein: the limiting mechanism comprises second supporting plates (13) which are symmetrically arranged on the outer walls of the two sides of the mounting seat (1), a baffle (14) is arranged at the top end of the movable plate (9), the baffle (14) is in contact with the movable plate (9), one side of the baffle (14) extends to the top end of the mounting seat (1), the top end of the second supporting plate (13) is fixedly connected with a fixing plate (15), one side of the baffle (14) close to the fixed plate (15) is fixedly connected with a plurality of movable rods (16), the movable rods (16) penetrate through the fixed plate (15), one end of the movable rod (16) is fixedly connected with a limit plate (17) positioned at one side of the fixed plate (15), a second spring (18) positioned between the limiting plate (17) and the fixed plate (15) is sleeved outside the movable rod (16), one side of the top end of the movable plate (9) is movably connected with the top end of the mounting seat (1) through a plurality of hinges (12).

3. The integrated circuit board with good heat dissipation performance according to claim 2, wherein: one end of the second spring (18) is fixedly connected with the fixing plate (15), the other end of the second spring (18) is fixedly connected with the limiting plate (17), and the cross section of the second supporting plate (13) is of an L-shaped structure.

4. The integrated circuit board with good heat dissipation performance according to claim 1, wherein: the pressing plate (11) and the side plate (7) are fixedly connected with elastic pads on one sides close to the integrated circuit board body (2).

5. The integrated circuit board with good heat dissipation performance according to claim 1, wherein: the guide plate (19) is fixedly connected with the inner wall of the placing groove (3), and the guide plate (19) is positioned above the integrated circuit board body (2).

6. The integrated circuit board with good heat dissipation performance according to claim 1, wherein: the heat dissipation fan (6) is externally connected with a control switch and a power supply.