CN220619169U

CN220619169U - Electroplating equipment

Info

Publication number: CN220619169U
Application number: CN202322200297.3U
Authority: CN
Inventors: 江泽军
Original assignee: Guangde Dongwei Technology Co ltd
Current assignee: Guangde Dongwei Technology Co ltd
Priority date: 2023-08-14
Filing date: 2023-08-14
Publication date: 2024-03-19
Anticipated expiration: 2033-08-14

Abstract

The utility model relates to the technical field of electroplating, and discloses electroplating equipment which comprises a cleaning tank, an electroplating tank and a vacuum pump. The cleaning tank is suitable for containing liquid medicine, the electroplating tank is suitable for containing electroplating liquid, the anode piece and the cathode piece are arranged in the electroplating tank, the vacuum pump is respectively connected with the cleaning tank and the electroplating tank, and the cleaning tank and the electroplating tank are suitable for pumping out gas. The vacuum pump can be used for pumping out air in the cleaning groove, so that the cleaning process of the cathode piece is completed in a vacuum state, bubbles generated on the surface of the cathode piece in the cleaning process can be avoided, and the cleaning effect of the surface of the cathode piece can be improved. In the electroplating process, the vacuum pump can also pump out the air in the electroplating bath, so that the cathode part is electroplated in a vacuum environment, and bubbles are prevented from adhering to the surface of the cathode part in the electroplating process, and the electroplating quality of the cathode part is further affected.

Description

Electroplating equipment

Technical Field

The utility model relates to the technical field of electroplating, in particular to electroplating equipment.

Background

Electroplating is to plate metal or alloy on the surface of the product to be electroplated by utilizing the electrolysis principle, and the electroplating can enhance the corrosion resistance and hardness of the product to be electroplated and improve the conductivity, smoothness, heat resistance and the like of the product. The existing electroplating equipment is affected by air during electroplating, so that the problems of uneven thickness of the electroplated product and the like can occur, and the electroplating efficiency and the electroplating quality of the product to be electroplated are affected.

Disclosure of Invention

In view of the above, the present utility model provides an electroplating apparatus to solve the problem that the existing electroplating apparatus is affected by air to cause poor electroplating quality.

The present utility model provides an electroplating apparatus comprising:

a cleaning tank adapted to contain a liquid medicine;

an electroplating bath suitable for containing electroplating liquid, wherein an anode part and a cathode part are arranged in the electroplating bath;

and the vacuum pump is respectively connected with the cleaning tank and the electroplating tank and is suitable for pumping out the gas in the cleaning tank and the electroplating tank.

The beneficial effects are that: the vacuum pump can be used for pumping out air in the cleaning groove, so that the cleaning process of the cathode piece is completed in a vacuum state, bubbles generated on the surface of the cathode piece in the cleaning process can be avoided, and the cleaning effect of the surface of the cathode piece can be improved. In the electroplating process, the vacuum pump can also pump out the air in the electroplating bath, so that the cathode part is electroplated in a vacuum environment, and bubbles are prevented from adhering to the surface of the cathode part in the electroplating process, and the electroplating quality of the cathode part is further affected.

In an alternative embodiment, the electroplating apparatus further comprises a water rinse tank disposed between the cleaning tank and the electroplating tank.

The beneficial effects are that: before electroplating, the cathode part can be put into a washing tank for washing, and the liquid medicine attached to the surface of the cathode part is washed away, so that the residual liquid medicine is prevented from adversely affecting the subsequent electroplating process, and the electroplating quality of the cathode part is guaranteed.

In an alternative embodiment, the electroplating apparatus further includes a first circulation line, a first circulation pump, and a first filter cartridge, the first circulation line connecting the cleaning tank, the first circulation pump, and the first filter cartridge.

The beneficial effects are that: the first filter cartridge can filter impurities in the liquid medicine, so that the damage to the cathode part or secondary pollution to the cathode part caused by the impurities in the liquid medicine is avoided, and the cleaning effect to the cathode part is improved.

In an alternative embodiment, the electroplating apparatus further comprises a second circulation line, a second circulation pump, and a second filter cartridge, wherein the second circulation line connects the electroplating bath, the second circulation pump, and the second filter cartridge.

The beneficial effects are that: electroplating solution in the electroplating bath circulates between the second cartridge filter and the electroplating bath under the action of the second circulating pump, and impurities in the electroplating solution can be filtered by the second cartridge filter, so that the electroplating quality of the cathode part is prevented from being influenced.

In an alternative embodiment, the electroplating apparatus further comprises a connection pipe, a first cover body and a second cover body, wherein the first cover body covers the top of the cleaning tank, and the second cover body covers the top of the electroplating tank; the first cover body is provided with a first through hole, and the second cover body is provided with a second through hole; one end of the connecting pipe is connected with the vacuum pump, the other end of the connecting pipe comprises a first connecting branch pipe and a second connecting branch pipe, the first connecting branch pipe is connected with the first through hole, and the second connecting branch pipe is connected with the second through hole.

The beneficial effects are that: the vacuum pump can be used for pumping out the gas in the cleaning tank and the electroplating tank, so that the cleaning tank and the electroplating tank are kept in a negative pressure state, and the cleaning or electroplating process of the cathode part is prevented from being influenced by air. The end of the connecting pipe is provided with two branch pipes, so that the air inside the cleaning tank and the electroplating tank can be pumped by only one vacuum pump, and the structure of the electroplating equipment is simplified.

In an alternative embodiment, the electroplating apparatus further comprises a first pipeline, a second pipeline, a first cover body and a second cover body, wherein the first cover body covers the top of the cleaning tank, and the second cover body covers the top of the electroplating tank; the first cover body is provided with a first through hole, and the second cover body is provided with a second through hole; one end of the first pipeline is connected with the vacuum pump, the other end of the first pipeline is connected with the first through hole, one end of the second pipeline is connected with the vacuum pump, and the other end of the second pipeline is connected with the second through hole.

The beneficial effects are that: the electroplating apparatus may include two vacuum pumps, one vacuum pump being connected to the first pipe and the other vacuum pump being connected to the second pipe, so that the air inside the cleaning tank or the electroplating tank, respectively, can be separately extracted.

In an alternative embodiment, a transmission mechanism is arranged in the electroplating tank, the cathode part is fixed on the transmission mechanism, and the transmission mechanism is suitable for driving the cathode part to move.

The beneficial effects are that: the transmission mechanism can drive the cathode part to carry out continuous electroplating, thereby being beneficial to improving the electroplating quality of the cathode part, improving the electroplating efficiency of the cathode part and improving the automation degree of electroplating equipment.

In an alternative embodiment, the plating cell includes an anode separator box, and the anode member is disposed within the anode separator box.

The beneficial effects are that: in the electroplating process, the electroplating solution in the electroplating tank can flow in from the top of the anode isolation box and flow out from the outlet close to the bottom, and the electroplating solution flows from top to bottom to enable the electroplating solution to be fully contacted with the anode part for reaction, so that the situation that the electroplating solution is directly discharged from the anode part without participating in the reaction is avoided, and the utilization efficiency of the electroplating solution is improved.

In an alternative embodiment, a spray tray is further disposed in the electroplating tank, and a plurality of water spraying ports are disposed on a side wall of the spray tray, and the water spraying ports face the cathode member.

The beneficial effects are that: the electroplating solution which does not participate in the reaction is sprayed out through the water spraying port of the spray disc after being introduced into the electroplating bath, so that the electroplating solution which does not participate in the reaction can timely contact with the cathode part, the quality of a plating layer formed on the surface of the cathode part is improved, and the electroplating quality of the cathode part is ensured.

In an alternative embodiment, the electroplating apparatus further comprises a pressure measuring device adapted to detect the pressure in the cleaning tank and the electroplating tank.

The beneficial effects are that: the pressure measuring device can monitor and adjust the pressure in the cleaning tank and the electroplating tank in real time, so that the cleaning tank and the electroplating tank can continuously maintain a negative pressure state.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a front view of an electroplating apparatus according to an embodiment of the present utility model;

FIG. 2 is a top view of the electroplating apparatus shown in FIG. 1;

fig. 3 is a side view of the electroplating apparatus shown in fig. 1.

Reference numerals illustrate:

1. a cleaning tank; 11. a first circulation line; 12. a first circulation pump; 13. a first filter cartridge; 14. a first cover; 141. a first through hole; 2. plating bath; 21. an anode member; 211. an anode isolation box; 22. a cathode member; 23. a second circulation line; 24. a second circulation pump; 25. a second filter cartridge; 26. a second cover; 261. a second through hole; 3. a vacuum pump; 4. a washing tank; 5. a connecting pipe; 51. a first connecting branch pipe; 52. a second connecting branch pipe; 6. a transmission mechanism; 7. a spray plate; 8. and a pressure measuring device.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiments of the present utility model are described below with reference to fig. 1 to 3.

According to an embodiment of the present utility model, there is provided an electroplating apparatus comprising a cleaning tank 1, an electroplating tank 2, and a vacuum pump 3, wherein the cleaning tank 1 is adapted to contain a chemical solution, the electroplating tank 2 is adapted to contain an electroplating solution, an anode member 21 and a cathode member 22 are disposed in the electroplating tank 2, and the vacuum pump 3 is connected to the cleaning tank 1 and the electroplating tank 2, respectively, and is adapted to pump out gas in the cleaning tank 1 and the electroplating tank 2.

The cathode member 22 may be a printed circuit board or a silicon wafer. The surface of the printed circuit board or silicon wafer needs to be cleaned before it is electroplated. The cathode member 22 can be placed in the cleaning tank 1, and the surface of the cathode member 22 can be cleaned by using the liquid medicine in the cleaning tank 1, so that the influence of impurities on the cathode member 22 on subsequent consent can be avoided. The vacuum pump 3 can pump out the air in the cleaning tank 1, so that the cleaning process of the cathode member 22 is completed in a vacuum state, and thus, bubbles generated on the surface of the cathode member 22 in the cleaning process can be avoided, and the cleaning effect of the surface of the cathode member 22 can be improved. In the electroplating process, the vacuum pump 3 can also pump out the air in the electroplating bath 2, so that the cathode piece 22 is electroplated in a vacuum environment, and bubbles are prevented from adhering to the surface of the cathode piece 22 in the electroplating process, thereby influencing the electroplating quality of the cathode piece 22.

In one embodiment, the electroplating apparatus further comprises a water washing tank 4, the water washing tank 4 being disposed between the cleaning tank 1 and the electroplating tank 2. After the cathode member 22 is cleaned in the cleaning tank 1, part of the liquid medicine remains on the surface of the cathode member 22, and before electroplating, the cathode member 22 can be put into the water washing tank 4 for water washing, and the liquid medicine attached to the surface of the cathode member 22 is washed away, so that adverse effects of the residual liquid medicine on the subsequent electroplating process are avoided, and the electroplating quality of the cathode member 22 is guaranteed.

The water washing tank 4 is arranged between the cleaning tank 1 and the electroplating tank 2, and the cathode piece 22 can be timely turned into the water washing tank 4 to be washed after the cleaning tank 1 is cleaned, and is timely arranged in the electroplating tank 2 to be electroplated after the water washing is completed, so that the operation of the whole process flow is rapid and convenient.

In one embodiment, the electroplating apparatus further comprises a first circulation line 11, a first circulation pump 12 and a first filter cartridge 13, wherein the first circulation line 11 connects the cleaning tank 1, the first circulation pump 12 and the first filter cartridge 13. The liquid medicine in the cleaning tank 1 circulates between the cleaning tank 1 and the first filter cartridge 13 under the action of the first circulating pump 12, so that the cathode piece 22 can be cleaned for a plurality of times, the first filter cartridge 13 can filter impurities in the liquid medicine, the damage to the cathode piece 22 or secondary pollution to the cathode piece 22 caused by the impurities in the liquid medicine is avoided, and the cleaning effect to the cathode piece 22 is improved.

In one embodiment, the electroplating apparatus further includes a second circulation line 23, a second circulation pump 24, and a second filter cartridge 25, and the second circulation line 23 connects the electroplating tank 2, the second circulation pump 24, and the second filter cartridge 25. The electroplating solution in the electroplating tank 2 circulates between the second filter cartridge 25 and the electroplating tank 2 under the action of the second circulating pump 24, and the second filter cartridge 25 can filter impurities in the electroplating solution to avoid the influence on the electroplating quality of the cathode piece 22.

In one embodiment, the electroplating apparatus further comprises a connecting pipe 5, a first cover 14 and a second cover 26, the first cover 14 is covered on the top of the cleaning tank 1, the second cover 26 is covered on the top of the electroplating tank 2, the first cover 14 is provided with a first through hole 141, the second cover 26 is provided with a second through hole 261, one end of the connecting pipe 5 is connected with the vacuum pump 3, the other end of the connecting pipe comprises a first connecting branch pipe 51 and a second connecting branch pipe 52, the first connecting branch pipe 51 is connected with the first through hole 141, and the second connecting branch pipe 52 is connected with the second through hole 261.

The first cover 14 can seal the cleaning tank 1, the second cover 26 can seal the plating tank 2, and the vacuum pump 3 can pump out the gas in the cleaning tank 1 and the plating tank 2, so that the cleaning tank 1 and the plating tank 2 are kept in a negative pressure state, and the cleaning or plating process of the cathode member 22 is prevented from being influenced by air. The end of the connecting pipe 5 is provided with two branch pipes, so that the air inside the cleaning tank 1 and the electroplating tank 2 can be pumped by only one vacuum pump 3, which is beneficial to simplifying the structure of the electroplating equipment.

Valves can be respectively arranged on the first connecting branch pipe 51 and the second connecting branch pipe 52, and when the cleaning tank 1 is only required to be vacuumized, the valve of the first connecting branch pipe 51 can be opened, and the valve of the second connecting branch pipe 52 can be closed; when only the plating vessel 2 needs to be evacuated, the valve of the second connecting branch pipe 52 may be opened, and the valve of the second connecting branch pipe 52 may be opened.

In one embodiment, the electroplating apparatus further includes a first pipe, a second pipe, a first cover 14 and a second cover 26, where the first cover 14 covers the top of the cleaning tank 1, the second cover 26 covers the top of the electroplating tank 2, the first cover 14 is provided with a first through hole 141, the second cover 26 is provided with a second through hole 261, one end of the first pipe is connected with the vacuum pump 3, the other end is connected with the first through hole 141, one end of the second pipe is connected with the vacuum pump 3, and the other end is connected with the second through hole 261. The plating apparatus may include two vacuum pumps 3, one vacuum pump 3 being connected to the first pipe and the other vacuum pump 3 being connected to the second pipe, so that the air inside the cleaning tank 1 or the plating vessel 2 can be separately extracted, respectively.

In some embodiments, the plating apparatus may also include three, four, five, etc. vacuum pumps 3. Specifically, the vacuum pumps 3 may be arranged in a distributed manner according to the volumes of the cleaning tank 1 and the plating tank 2, for example, the cleaning tank 1 may be evacuated by two vacuum pumps 3, and the plating tank 2 may be evacuated by four vacuum pumps 3. The efficiency of vacuum extraction can be improved by using a plurality of vacuum pumps 3, the specific number of which is not limited here.

In one embodiment, the plating tank 2 is provided with a transmission mechanism 6, and the cathode member 22 is fixed to the transmission mechanism 6, and the transmission mechanism is adapted to drive the cathode member 22 to move. The transmission mechanism 6 can drive the cathode piece 22 to carry out continuous electroplating, thereby being beneficial to improving the electroplating quality of the cathode piece 22, improving the electroplating efficiency of the cathode piece 22 and improving the automation degree of electroplating equipment. In some embodiments, the length of the plating tank 2 is longer, and the driving mechanism 6 may drive the cathode member 22 to move along the length direction of the plating tank 2. As shown in the drawing, when the plating tank 2 is smaller, the transmission mechanism 6 drives the cathode member 22 to swing left and right in the plating tank 2.

In one embodiment, plating cell 2 includes an anode isolation box 211, and anode member 21 is disposed within anode isolation box 211. In the electroplating process, the electroplating solution in the electroplating tank 2 can flow in from the top of the anode isolation box 211 and flow out from the outlet close to the bottom, and the electroplating solution flows from top to bottom to enable the electroplating solution to be fully contacted with the anode piece 21 and react, so that the electroplating solution is prevented from being directly discharged at the position of the anode piece 21 without participating in the reaction, and the utilization efficiency of the electroplating solution is improved.

In one embodiment, a spray tray 7 is further disposed within the plating tank 2, and a plurality of water jets are disposed on a sidewall of the spray tray 7, the water jets facing the cathode member 22. The water spray openings are uniformly distributed on the side wall of the spray disc 7 and face the cathode part 22, and the unreacted electroplating solution is sprayed out through the water spray openings of the spray disc 7 after being introduced into the electroplating bath 2, so that the unreacted electroplating solution can timely contact with the cathode part 22, the quality of a plating layer formed on the surface of the cathode part 22 is improved, and the electroplating quality of the cathode part 22 is ensured.

In one embodiment, the electroplating apparatus further comprises a pressure measuring device 8, the pressure measuring device 8 being adapted to detect the pressure in the cleaning tank 1 and the electroplating tank 2. The pressure measuring device 8 can monitor and adjust the pressure in the cleaning tank 1 and the plating tank 2 in real time, so that the cleaning tank 1 and the plating tank 2 can keep a negative pressure state continuously. The embodiment shown in the figures comprises two pressure measuring devices 8, the two pressure measuring devices 8 being used for monitoring the pressure inside the cleaning tank 1 and the plating tank 2, respectively.

Although embodiments of the present utility model have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations fall within the scope of the utility model as defined by the appended claims.

Claims

1. An electroplating apparatus, comprising:

a cleaning tank (1) adapted to contain a medical fluid;

a plating tank (2) adapted to contain a plating solution, the plating tank (2) being provided with an anode member (21) and a cathode member (22) inside;

and a vacuum pump (3) which is respectively connected with the cleaning tank (1) and the electroplating tank (2) and is suitable for pumping out the gas in the cleaning tank (1) and the electroplating tank (2).

2. Electroplating apparatus according to claim 1, further comprising a rinsing tank (4), the rinsing tank (4) being arranged between the cleaning tank (1) and the electroplating tank (2).

3. Electroplating apparatus according to claim 1, characterized in that the electroplating apparatus further comprises a first circulation line (11), a first circulation pump (12) and a first filter cartridge (13), the first circulation line (11) connecting the cleaning tank (1), the first circulation pump (12) and the first filter cartridge (13).

4. Electroplating apparatus according to claim 1, characterized in that it further comprises a second circulation line (23), a second circulation pump (24) and a second filter cartridge (25), the second circulation line (23) connecting the electroplating bath (2), the second circulation pump (24) and the second filter cartridge (25).

5. Electroplating apparatus according to claim 1, characterized in that it further comprises a connecting tube (5), a first cover (14) and a second cover (26), the first cover (14) covering the top of the cleaning tank (1), the second cover (26) covering the top of the electroplating tank (2); the first cover body (14) is provided with a first through hole (141), and the second cover body (26) is provided with a second through hole (261); one end of the connecting pipe (5) is connected with the vacuum pump (3), the other end of the connecting pipe comprises a first connecting branch pipe (51) and a second connecting branch pipe (52), the first connecting branch pipe (51) is connected with the first through hole (141), and the second connecting branch pipe (52) is connected with the second through hole (261).

6. Electroplating apparatus according to claim 1, characterized in that it further comprises a first pipe, a second pipe, a first cover (14) and a second cover (26), the first cover (14) covering the top of the cleaning tank (1), the second cover (26) covering the top of the electroplating tank (2); the first cover body (14) is provided with a first through hole (141), and the second cover body (26) is provided with a second through hole (261); one end of the first pipeline is connected with the vacuum pump (3), the other end of the first pipeline is connected with the first through hole (141), one end of the second pipeline is connected with the vacuum pump (3), and the other end of the second pipeline is connected with the second through hole (261).

7. Electroplating apparatus according to any one of claims 1 to 6, wherein a transmission mechanism (6) is provided within the electroplating bath (2), the cathode member (22) being fixed to the transmission mechanism (6), the transmission mechanism (6) being adapted to move the cathode member (22).

8. Electroplating apparatus according to claim 1, wherein the electroplating cell (2) comprises an anode isolation box (211), the anode member (21) being arranged within the anode isolation box (211).

9. Electroplating apparatus according to claim 1, wherein a spray tray (7) is further provided in the electroplating bath (2), the side wall of the spray tray (7) being provided with a plurality of water jets, the water jets being directed towards the cathode member (22).

10. Electroplating apparatus according to claim 1, characterized in that the electroplating apparatus further comprises a pressure measuring device (8), the pressure measuring device (8) being adapted to detect the pressure in the cleaning tank (1) and the electroplating tank (2).