CN220604657U

CN220604657U - Suction type silicon wafer holder

Info

Publication number: CN220604657U
Application number: CN202322109487.4U
Authority: CN
Inventors: 吕群锋; 施鲁鸣; 孔剑雷; 胡丹辉
Original assignee: Zhejiang Naisiwei Intelligent Manufacturing Co ltd
Current assignee: Zhejiang Naisiwei Intelligent Manufacturing Co ltd
Priority date: 2023-08-07
Filing date: 2023-08-07
Publication date: 2024-03-15
Anticipated expiration: 2033-08-07

Abstract

The utility model discloses a suction type silicon wafer holder which comprises a support, wherein a plurality of clamping grooves are formed in one side wall of the support, supporting plates are arranged in the clamping grooves, movable claws are arranged at the tops of the supporting plates, a plurality of bayonets are formed in one side of the top ends of the supporting plates, inserting plates are fixedly connected to the bottom ends of the movable claws, fixed claws are fixedly connected to the other side of the top ends of the supporting plates, first inclined planes are formed in the tops of the fixed claws and the movable claws, and second inclined planes are formed in the bottoms of the first inclined planes. According to the utility model, a series of structures are arranged, and the contact area of the silicon wafer and the support hand is reduced, so that the process of coating diffusion of the silicon wafer is facilitated, the surface of the silicon wafer is not easy to scratch by the support hand when the diffusion coating process is performed, the continuous use of a vacuum control system such as a vacuum chuck and the like for fixing the silicon wafer is avoided, the energy consumed during the processing of the silicon wafer is saved, and the cost of the silicon wafer during the processing is reduced.

Description

Suction type silicon wafer holder

Technical Field

The utility model relates to the technical field of silicon wafer processing, in particular to a suction type silicon wafer holder.

Background

After the silicon wafer in the solar cell is subjected to secondary positioning through the carried silicon wafer basket and is washed, the silicon wafer is required to be transferred to a storage bin of a buffer rod through a sucker and other devices, then is conveyed to a large-breadth plate-type material frame through a special conveying mechanism and enters equipment to be subjected to treatment of a diffusion coating process, but the existing handle for lifting the silicon wafer usually adopts a vacuum sucker or a clamp to carry out large-area adsorption contact on the surface of the silicon wafer, so that the silicon wafer is scratched due to friction of the clamp and the sucker in the process of carrying out the diffusion coating process, and the coating is not easy to cover the surface of the silicon wafer, so that the diffusion process of the silicon wafer for coating is not facilitated; in addition, a vacuum system is needed to control the continuous suction of the suction cup to the silicon wafer in the silicon wafer production process, and the vacuum control system consumes more energy, so that the production cost of the silicon wafer is increased intangibly.

Disclosure of Invention

The utility model aims to provide a suction type silicon wafer holder to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a suction type silicon chip holds in palm hand, includes the support, a plurality of draw-in grooves have been seted up to a side wall of support, and is a plurality of the inside of draw-in groove all is equipped with the layer board, a plurality of movable claws, a plurality of the bayonet sockets have been seted up to one side on layer board top, a plurality of the equal fixedly connected with picture peg in bottom of movable claw, a plurality of the equal fixedly connected with stationary dog of opposite side on layer board top, a plurality of the first inclined plane has all been seted up at the top of stationary dog and a plurality of the movable claw, a plurality of the bottom on first inclined plane all is equipped with the second inclined plane, a plurality of the top activity on first inclined plane has inlayed the silicon chip.

Preferably, the front surface of the support is provided with a plurality of threaded holes, and a plurality of supporting plates are respectively and fixedly connected with a plurality of clamping grooves through screws penetrating through the threaded holes.

Preferably, the plurality of clamping grooves are divided into two longitudinal rows, and the interiors of the two longitudinal rows of clamping grooves are respectively communicated with the interiors of the plurality of threaded holes.

Preferably, the supporting plate is divided into two longitudinal rows through the two longitudinal rows of clamping grooves, and the silicon wafer is movably embedded and connected with the support through the two longitudinal rows of supporting plates.

Preferably, two side walls of the bottom of the plugboard are fixedly connected with cards, two cards are movably clamped and connected with the bottom of one bayonet, and the plugboard is movably clamped and connected with one bayonet through the cards.

Preferably, the movable claws are respectively and movably clamped and connected with the supporting plates through the inserting plates and the cards.

Preferably, the plurality of second inclined planes are respectively arranged at the tops of the movable claw and the fixed claw.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the suction type silicon wafer holder, the silicon wafer is contacted with the inclined plane at the edge of the holder when being sucked through the first inclined plane, the second inclined plane and the fixed claw, so that the contact area between the silicon wafer and the holder is reduced, the surface of the silicon wafer is not easy to scratch by the holder when a diffusion coating process is carried out, and the process of coating diffusion of the silicon wafer is facilitated.

2. This suction type silicon chip holds in palm hand for hold in palm the hand when absorbing the silicon chip through movable claw, picture peg, card and bayonet socket, can realize the suction clamp to the silicon chip through adjusting the distance between movable claw and the fixed jaw, avoid continuously using vacuum chuck etc. vacuum control system to fix the silicon chip, save the energy that the silicon chip consumed when processing, thereby be favorable to alleviateing the cost when the silicon chip is processed.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the pallet and support structure of the present utility model;

FIG. 3 is a schematic view of the first and second inclined planes according to the present utility model;

FIG. 4 is a schematic view of the bayonet and locking pawl structure of the present utility model;

fig. 5 is a schematic view of the card and board structure of the present utility model.

In the figure: 1. a supporting plate; 2. a support; 3. a clamping groove; 4. a threaded hole; 5. a silicon wafer; 6. a movable claw; 7. a first inclined surface; 8. a second inclined surface; 9. a fixed claw; 10. inserting plate; 11. a bayonet; 12. and (5) a card.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1 to 5, the suction type silicon wafer holder of this embodiment comprises a support 2, the support 2 is a base for fixing a plurality of holders, so that the holder is more stable when sucking and transferring silicon wafers 5, a plurality of clamping grooves 3 are formed in one side wall of the support 2, a plurality of clamping grooves 3 are respectively provided with a support plate 1, one end of the support plate 1, which is close to a fixed claw 9, needs to be inserted into the clamping groove 3 on the side surface of the support 2 for clamping and fixing, so as to realize sucking and lifting of the silicon wafers 5 by the support plate 1, the tops of the support plates 1 are respectively provided with a movable claw 6, the movable claws 6 and the support plate 1 are in split structures, the distances between the movable claws 6 and the support plates 1 can be adjusted by inserting bayonets 11 at different positions through inserting plates 10, so as to adapt to silicon wafers 5 with different lengths, meanwhile, a plurality of bayonets 11 are formed on one side of the top ends of the support plate 1, the bayonet 11 is square, so that the stability is better after the inserting plate 10 is inserted into the bayonet 11, the bottom ends of the movable claws 6 are fixedly connected with the inserting plate 10, the inserting plate 10 is square, the length is thicker than the thickness of the bayonet 11, the card 12 at the bottom of the inserting plate 10 can pass through the bayonet 11 and prop against the bottom of the supporting plate 1, the fixing claws 6 and the supporting plate 1 are fixed, the other sides of the top ends of the supporting plate 1 are fixedly connected with the fixing claws 9, the fixing claws 9 and the supporting plate 1 are in an integrated structure, the tops of the movable claws 6 and the fixing claws 9 are provided with the first inclined surfaces 7, the first inclined surfaces 7 are guide inclined surfaces, the inclination angles are 10-45 degrees, the bottoms of the two first inclined surfaces 7 are provided with the second inclined surfaces 8, the inclination angles of the second inclined surfaces 8 are 5-20 degrees, and the edges of the silicon chip 5 can be exactly clamped at the included angles of the first inclined surfaces 7 and the second inclined surfaces 8, thereby reducing the contact area of the silicon wafer 5 and the handle, being more beneficial to the process treatment of the silicon wafer 5 for diffusion coating, and the silicon wafer 5 is movably embedded at the tops of the two first inclined planes 7.

Specifically, a plurality of screw holes 4 have been seted up in the front of support 2, and a plurality of layer boards 1 pass through the screw rod of screw hole 4 respectively with a plurality of draw-in groove 3 fixed connection, and the screw rod of screw hole 4 can be after passing screw hole 4, withstands the layer board 1 in upper and lower draw-in groove 3 respectively to realize the fixed of layer board 1 in draw-in groove 3.

Further, the clamping grooves 3 are divided into two longitudinal rows, the inner parts of the clamping grooves 3 of the two longitudinal rows are respectively communicated with the inner parts of the threaded holes 4, and the tail parts of the supporting plates 1 can protrude out of one part of the notch, so that the screw rods in the threaded holes 4 can tightly press the supporting plates 1 in the upper clamping groove 3 and the lower clamping groove 3, and the supporting plates 1 can be fixed in the clamping grooves 3.

Further, the supporting plate 1 is divided into two longitudinal columns through the two longitudinal column clamping grooves 3, the silicon wafers 5 are movably embedded and connected with the supporting seat 2 through the two longitudinal column supporting plates 1, the supporting seat 2 is formed into two supporting hands formed by combining the supporting plates 1 on the horizontal plane through the two longitudinal column supporting plates 1, and the silicon wafers 5 are sucked and lifted, so that the stability of the silicon wafers 5 when lifted is improved.

Further, two side walls at the bottom of the inserting plate 10 are fixedly connected with cards 12, the two cards 12 are movably clamped and connected with the bottom of one bayonet 11, the inserting plate 10 is movably clamped and connected with one bayonet 11 through the cards 12, the two cards 12 are made of spring sheet materials, elasticity is good, random insertion and extraction of the inserting plate 10 in the bayonet 11 can be achieved, and an operator can conveniently use the inserting plate.

Further, the movable claws 6 are respectively movably clamped and connected with the supporting plates 1 through the inserting plates 10 and the cards 12, so that the positions of the movable claws 6 can be flexibly adjusted.

Further, a plurality of second inclined planes 8 are respectively arranged at the tops of the fixed claw 9 and the movable claw 6, and an overhead layer can be formed between the bottom of the silicon wafer 5 and the supporting plate 1 by the second inclined planes 8, so that the contact surface of the silicon wafer 5 and the supporting plate 1 is reduced, the blocking interference of the supporting hand on the silicon wafer 5 is reduced, and the diffusion of the coating of the silicon wafer 5 is facilitated.

The application method of the embodiment is as follows: when the suction type silicon wafer 5 is used for holding hands, the positions of the movable claws 6 are required to be adjusted according to the lengths of the silicon wafers 5, the inserting plates 10 at the bottoms of the movable claws 6 are required to be inserted into the bayonets 11 at different positions of the supporting plates 1, after the adjustment of the positions of the movable claws 6 is completed, the cards 12 at the bottoms of the inserting plates 10 are required to abut against the bottoms of the supporting plates 1, the movable claws 6 are enabled to be fixed with the supporting plates 1, then the supporting plates 1 after the adjustment are respectively inserted into the corresponding clamping grooves 3 on the support 2, the screw rods penetrate through the threaded holes 4, the supporting plates 1 in the clamping grooves 3 are fixed, the support 2 is enabled to be at different horizontal heights of the side walls of the support 2, two supporting plates 1 are fixed to form holding hands, then the support 2 can be inserted into the flower basket of the silicon wafers 5 in the flower basket, the silicon wafers 5 in the flower basket are transferred to the holding hands, at the time, edges of the secondarily positioned silicon wafers 5 in the flower basket are clamped with the connecting positions of the fixed claws 9 on the supporting plates 1 and the first inclined surfaces 7 and the second inclined surfaces 8 on the movable claws 6, the silicon wafers 5 are enabled to be sucked and lifted on the support 1, the support 5 is enabled to be transferred, and then the silicon wafers 2 can be placed on the support 2 to be placed together with the silicon wafer conveying mechanism.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a suction type silicon chip holds in palm hand, includes support (2), its characterized in that: a plurality of draw-in grooves (3) have been seted up to a side wall of support (2), a plurality of draw-in grooves (3) the inside all is equipped with layer board (1), a plurality of the top of layer board (1) all is equipped with movable claw (6), a plurality of bayonet sockets (11) have been seted up to one side on layer board (1) top, a plurality of the equal fixedly connected with picture peg (10) in bottom of movable claw (6), a plurality of the equal fixedly connected with fixed claw (9) of opposite side on layer board (1) top, a plurality of first inclined plane (7) have all been seted up at the top of fixed claw (9) and a plurality of movable claw (6), a plurality of the bottom of first inclined plane (7) all is equipped with second inclined plane (8), a plurality of the top activity of first inclined plane (7) is inlayed and is equipped with silicon chip (5).

2. The suction type silicon wafer holder according to claim 1, wherein: the front of the support (2) is provided with a plurality of threaded holes (4), and a plurality of supporting plates (1) are respectively and fixedly connected with a plurality of clamping grooves (3) through screws penetrating through the threaded holes (4).

3. The suction type silicon wafer holder according to claim 2, wherein: the clamping grooves (3) are divided into two longitudinal rows, and the interiors of the clamping grooves (3) in the two longitudinal rows are respectively communicated with the interiors of the threaded holes (4).

4. A suction type silicon wafer holder according to claim 3, wherein: the supporting plate (1) is divided into two longitudinal rows through the two longitudinal rows of clamping grooves (3), and the silicon wafer (5) is movably embedded and connected with the support (2) through the two longitudinal rows of supporting plate (1).

5. The suction type silicon wafer holder according to claim 1, wherein: two side walls of the bottom of the plugboard (10) are fixedly connected with cards (12), two cards (12) are movably clamped and connected with the bottom of one bayonet (11), and the plugboard (10) is movably clamped and connected with one bayonet (11) through the cards (12).

6. The suction type silicon wafer holder according to claim 5, wherein: the movable claws (6) are respectively and movably clamped and connected with the supporting plates (1) through the inserting plates (10) and the cards (12).

7. The suction type silicon wafer holder according to claim 1, wherein: the second inclined planes (8) are respectively arranged at the tops of the movable claw (6) and the fixed claw (9).