CN213242526U

CN213242526U - Wafer conveying arm for external connection unit

Info

Publication number: CN213242526U
Application number: CN202022811353.3U
Authority: CN
Inventors: 唐正隆; 吴星华; 刘同同; 汪丽静
Original assignee: Hefei Kaiyue Semiconductor Technology Co ltd
Current assignee: Hefei Kaiyue Semiconductor Technology Co ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-05-18
Anticipated expiration: 2030-11-27

Abstract

The utility model discloses an external connection unit send wafer conveying arm, arm main part including integrative symmetrical structure, the arm main part includes fixed part and symmetric distribution and is in the horizontal support portion of fixed part both sides, the centre of fixed part is equipped with the arc spacing groove of a plurality of orientation supporting part, the end of supporting part is equipped with the arc draw-in groove of a plurality of orientation fixed part, the spacing groove with the outer edge of draw-in groove top all is equipped with convex excessive limit. The utility model adopts the above structure an external connection unit send wafer conveying arm, improve compatibility when using with external exposure machine butt joint, practice thrift the cost.

Description

Wafer conveying arm for external connection unit

Technical Field

The utility model relates to a wafer transfer arm technical field especially relates to an external connection unit sends wafer transfer arm.

Background

At present, a transfer arm in a transfer robot of a semiconductor device, which is butted with an exposure machine, has a single structure, can only transfer wafers of one type, and transfer arms of different sizes are required to be suitable for wafers of different sizes, so that the production cost is greatly increased. Moreover, the wafer sometimes warps during the transfer process, and the transfer arm cannot guarantee the stable transportation of the wafer, even the wafer is dropped, which causes unnecessary loss.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an external connection unit send wafer conveying arm improves compatibility when using with external exposure machine butt joint, practices thrift the cost.

In order to achieve the above object, the utility model provides an external connection unit send wafer conveying arm, arm main part including integrative symmetrical structure, arm main part includes fixed part and symmetric distribution and is in the horizontal support portion of fixed part both sides, the centre of fixed part is equipped with the arc spacing groove of a plurality of orientation supporting part, the end of supporting part is equipped with the arc draw-in groove of a plurality of orientation fixed part, the spacing groove with the outer edge of draw-in groove top all is equipped with convex excessive limit.

Preferably, the spacing groove includes first spacing groove, the second spacing groove that sets gradually from inside to outside, the level of first spacing groove is less than the level of second spacing groove, the draw-in groove includes first draw-in groove and the second draw-in groove that sets gradually from inside to outside, the level of first draw-in groove is less than the level of second draw-in groove, first spacing groove with first draw-in groove is located same circular, the second spacing groove with the second draw-in groove is located same circular.

Preferably, the center of the circle where the first limiting groove is located coincides with the center of the circle where the second limiting groove is located.

Preferably, the front end of the supporting part protrudes out of the second clamping groove.

Preferably, the fixing part is provided with a fixing hole connected to the frame.

Preferably, the arc length of the transition edge corresponds to an angle smaller than 90 degrees.

Therefore, the utility model adopts the above structure an external connection unit send wafer conveying arm, improve compatibility when using with external exposure machine butt joint, practice thrift the cost.

The technical solution of the present invention is further described in detail by the accompanying drawings and examples.

Drawings

FIG. 1 is a schematic view of an embodiment of a wafer transfer arm of the present invention with an external connection unit;

fig. 2 is a partial cross-sectional view of an embodiment of an external connection unit wafer transfer arm of the present invention.

Reference numerals

1. An arm body; 2. a fixed part; 3. a support portion; 4. a limiting groove; 5. a first limit groove; 6. a second limit groove; 7. a card slot; 8. a first card slot; 9. a second card slot; 10. a transition edge; 11. and (7) fixing holes.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following describes embodiments of the present invention with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of an embodiment of a wafer transfer arm sent by an external connection unit, fig. 2 is a partial cross-sectional view of an embodiment of a wafer transfer arm sent by an external connection unit, as shown in the figure, an embodiment of a wafer transfer arm sent by an external connection unit, including an arm main body 1 of an integrated symmetrical structure, the arm main body 1 includes a fixed part 2 and a horizontal support part 3 symmetrically distributed on two sides of the fixed part 2, and a fixing hole 11 connected to a frame is arranged on the fixed part 2 for fixing the whole.

The middle of fixed part 2 is equipped with a plurality of towards the arc spacing groove 4 of supporting part 3, and the end of supporting part 3 is equipped with a plurality of towards the arc draw-in groove 7 of fixed part 2, and spacing groove 4 and draw-in groove 7 are used for the fixed of wafer. The outer edges above the limiting groove 4 and the clamping groove 7 are provided with arc transition edges 10, and the transition edges 10 are used for accurately positioning the wafer. And the wafer enters the holding position over the transition edge 10 of the arc. The angle corresponding to the arc length of the transition edge 10 is smaller than 90 degrees, so that the damage caused by bumping in the wafer falling process is reduced while the accurate positioning of the wafer is ensured.

The limiting groove 4 comprises a first limiting groove 5 and a second limiting groove 6 which are sequentially arranged from inside to outside, the horizontal height of the first limiting groove 5 is lower than that of the second limiting groove 6, the first limiting groove 5 is used for fixing the small-sized wafer on the inner side, the second limiting groove 6 is used for fixing the large-sized wafer on the outer side, and the applicability is high. The clamping groove 7 comprises a first clamping groove 8 and a second clamping groove 9 which are sequentially arranged from inside to outside, and the front end of the supporting part 3 protrudes out of the second clamping groove 9. The horizontal height of the first clamping groove 8 is lower than that of the second clamping groove 9, the first clamping groove 8 is used for fixing small-sized wafers on the inner side, and the second clamping groove 9 is used for fixing large-sized wafers on the outer side. The first limiting groove 5 and the first clamping groove 8 are located on the same circle, and the second limiting groove 6 and the second clamping groove 9 are located on the same circle, so that the two sides of the wafer are fixed. The circle center of the circle where the first limiting groove 5 is located coincides with the circle center of the circle where the second limiting groove 9 is located, so that the wafer can be accurately positioned conveniently.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the present invention, and these modifications should also be construed as the protection scope of the present invention.

Claims

1. An external connection unit wafer transfer arm, comprising: the arm main part including integrative symmetrical structure, the arm main part includes fixed part and symmetric distribution and is in the horizontal support portion of fixed part both sides, the centre of fixed part is equipped with the arc spacing groove of a plurality of orientation supporting part, the end of supporting part is equipped with the arc draw-in groove of a plurality of orientation fixed part, the spacing groove with the outer edge of draw-in groove top all is equipped with convex excessive limit.

2. An external connection unit wafer transfer arm as recited in claim 1, wherein: the spacing groove includes first spacing groove, the second spacing groove that sets gradually from inside to outside, the level of first spacing groove is less than the level of second spacing groove, the draw-in groove includes first draw-in groove and the second draw-in groove that sets gradually from inside to outside, the level of first draw-in groove is less than the level of second draw-in groove, first spacing groove with first draw-in groove is located same circular, the second spacing groove with the second draw-in groove is located same circular.

3. An external connection unit wafer transfer arm as recited in claim 2, wherein: the circle center of the circle where the first limiting groove is located coincides with the circle center of the circle where the second limiting groove is located.

4. An external connection unit wafer transfer arm as recited in claim 2, wherein: the front end of the supporting part protrudes out of the second clamping groove.

5. An external connection unit wafer transfer arm as recited in claim 1, wherein: the fixing part is provided with a fixing hole connected to the rack.

6. An external connection unit wafer transfer arm as recited in claim 1, wherein: the angle corresponding to the arc length of the transition edge is less than 90 degrees.