CN220604627U - Uniform pressurizing device and pressurizing system for substrate bonding - Google Patents
Uniform pressurizing device and pressurizing system for substrate bonding Download PDFInfo
- Publication number
- CN220604627U CN220604627U CN202322291533.7U CN202322291533U CN220604627U CN 220604627 U CN220604627 U CN 220604627U CN 202322291533 U CN202322291533 U CN 202322291533U CN 220604627 U CN220604627 U CN 220604627U
- Authority
- CN
- China
- Prior art keywords
- pressurizing
- pressure
- fluid
- layer
- substrate bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 66
- 239000012530 fluid Substances 0.000 claims abstract description 74
- 230000005540 biological transmission Effects 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims description 7
- 238000000265 homogenisation Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model provides a substrate bonding uniform pressurizing device and a pressurizing system, comprising: the device comprises a homogenizing pressure assembly, a fluid control assembly and an external pressurizing assembly, wherein the homogenizing pressure assembly comprises a pressurizing outer layer connected with the external pressurizing assembly, a pressurizing inner layer contacted with a surface to be bonded and a pressure homogenizing layer arranged between the pressurizing outer layer and the pressurizing inner layer, the fluid control assembly comprises a fluid source, a power unit, a transmission unit and a control unit, and the external pressurizing assembly comprises a spherical hinge and a pressurizing rod; the uniform pressurizing structure can uniformly apply pressure to the whole surface due to the action of the fluid transmission pressure of the pressure homogenizing layer, and the pressure uniformity is not influenced by the deformation of the pressurizing structure, the application pressure and other factors; the substrate bonding uniform pressurizing system is formed by symmetrically arranging two groups of substrate bonding uniform pressurizing devices, and can further eliminate pressure non-uniformity caused by deformation of a pressure bearing structure.
Description
Technical Field
The utility model relates to the field of semiconductors, in particular to a substrate bonding uniform pressurizing device and a pressurizing system.
Background
Currently, in the field of semiconductor packaging or MEMS device fabrication, a substrate bonding process is used, where a certain pressure and temperature are applied uniformly to two substrates that are bonded together.
When pressure is applied to the substrate, two types of technical solutions exist. The first technical proposal is that one or more pressurizing shafts transmit pressure through a plane pressing plate to apply pressure to the surface of the substrate below; the second technical proposal is that the pressure is applied to the surface of the substrate after the air is inflated through an air bag structure with the same area as the substrate.
In the first technical solution, since the area of the applied pressure is smaller than the area of the applied pressure, deformation of the pressure transmission structure is necessarily caused during the pressure transmission, resulting in non-uniformity of the pressure applied to the final stressed surface. The greater the pressure applied, the more pronounced the structural deformation and the greater the pressure non-uniformity.
In the second technical solution, uniformity can be ensured due to the pressure applied over the whole surface of the stressed surface. But is limited by the strength limitations of the balloon structure itself, not being able to exert too much pressure, thereby limiting the maximum pressure that can be exerted. Particularly when the surface to be pressurized is larger, the pressure that the balloon structure can withstand is correspondingly reduced, so that the solution cannot apply high or ultra-high pressure to a larger plane.
Therefore, how to achieve uniform pressing of the substrate under high pressure and ultra-high pressure is a new problem to be solved in the art.
Disclosure of Invention
In view of the above, the present utility model provides a device and a system for uniformly pressurizing bonding substrates, which solve the problems of structural deformation and insufficient pressure resistance of the gas bag in the prior art.
The embodiment of the specification provides the following technical scheme:
the utility model discloses a substrate bonding uniform pressurizing device, which comprises: a homogenization pressure assembly, a fluid control assembly, and an external pressurization assembly;
wherein, the homogenization pressure assembly includes a pressurized outer layer, a pressurized inner layer, and a pressure homogenization layer disposed between the pressurized outer layer and the pressurized inner layer: the pressurizing inner layer is connected with the external pressurizing assembly so as to transmit external pressure to the pressurizing outer layer through the pressure homogenizing layer, and the pressurizing outer layer transmits the homogenized pressure to the substrate to be bonded; the pressurized inner layer includes a fluid inlet and outlet;
the fluid control assembly comprises a fluid source, a power unit, a transmission unit and a control unit, wherein the power unit conveys fluid in the fluid source to the pressure homogenizing layer through the transmission unit and the fluid inlet and outlet, and the control unit is electrically connected with the power unit and/or the transmission unit so as to regulate and control the amount of fluid entering the pressure homogenizing layer;
the external pressurizing assembly comprises a pressurizing rod and a spherical hinge, and the pressurizing rod is fixed on one side, far away from the pressurizing outer layer, of the pressurizing inner layer through the spherical hinge.
Further, the fluid comprises a liquid or a gas.
Further, the pressure equalization layer comprises a fluid bladder and/or a fluid chamber.
Further, a circle of protrusions are arranged on one side, close to the pressurizing inner layer, of the outer periphery of the pressurizing outer layer, and sealing elements are arranged between the centripetal sides of the protrusions and the pressurizing inner layer.
Further, the thickness of the fluid in the pressure homogenizing layer is greater than or equal to zero in the working state of the substrate bonding uniform pressurizing device.
Further, the substrate bonding uniform pressurizing device further comprises a bellows component, a vacuum accommodating cavity and a bottom pressure bearing component, the substrate to be bonded is arranged in the vacuum accommodating cavity, the bellows component is used for movably connecting the bottom pressure bearing component and the homogenizing pressure component, wherein the substrate to be bonded is provided with a plurality of pressure sensors, and the pressure sensors are arranged in the vacuum accommodating cavity
The homogenizing pressure assembly can move in the direction of approaching or separating from the substrate to be bonded on the side wall of the bottom pressure bearing part so as to transfer the pressure generated by the substrate bonding uniform pressurizing device in the atmosphere environment to the substrate to be bonded in the vacuum environment.
Further, the fluid source is provided by a fluid tank or a service line.
Further, the transmission unit comprises a transmission pipeline and a control valve; the control valve is arranged on the transmission pipeline to regulate and control the amount of fluid conveyed into the pressure homogenizing layer.
In addition, the utility model also discloses a substrate bonding uniform pressurizing system which consists of two groups of the substrate bonding uniform pressurizing devices which are symmetrically arranged.
Further, one of the two groups of pressurizing devices provides pressure, and the other group bears the pressure; or both sets may be simultaneously providing pressure.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least:
1. the uniform pressurizing device can uniformly apply pressure to the whole surface due to the action of fluid transmission pressure of the pressure homogenizing layer, and uniformly apply pressure on the surface with the same area as the pressure homogenizing layer, so that the pressure uniformity is not influenced by factors such as deformation of a pressurizing structure, pressure application and the like;
2. according to the utility model, due to the isolation effect of the pressure homogenizing layer, the thickness of the fluid in the pressure homogenizing layer is larger than the deformation amount of the bottom of the pressurizing inner layer in the vertical direction when the maximum pressure is transmitted, so that the pressurizing inner layer and the pressurizing outer layer are not contacted, and the target surface is not negatively influenced when the pressurizing inner layer deforms;
3. the control unit can control the fluid quantity in the pressure homogenizing layer so as to switch between a uniform pressurizing mode and a conventional pressurizing mode, wherein the fluid in the pressure homogenizing layer is discharged to a fluid source in the fluid control assembly, the thickness of the fluid in the pressure homogenizing layer is zero, the pressurizing outer layer is contacted with the pressurizing inner layer, the conventional pressurizing rod pressurizing mode can be changed, and the switching between different pressurizing modes can adapt to various using situations and meet pressurizing requirements;
4. according to the utility model, the pressurizing rod is kept at a position, and the input of the power unit to the fluid quantity in the pressure homogenizing layer is regulated and controlled by the control unit, so that the pressure is applied to the pressurizing outer layer, the energy efficiency is improved, and the energy consumption is saved;
5. according to the external pressurizing assembly, the spherical hinge is selected to realize mechanical connection, so that the connection strength of the pressurizing rod piece is improved, and the service life of the system is prolonged;
6. the corrugated pipe assembly is used for meeting the vacuum pressurization requirement, the homogenizing and pressurizing device in the atmosphere environment and the materials to be pressurized in the vacuum environment are separated, the fluid layer does not need to meet the vacuum inner sealing requirement, and the system cost is reduced;
7. the utility model can be combined with the pressurizing device to form a system, is convenient for adjusting the pressurizing force, further eliminates the pressure non-uniformity caused by the deformation of the pressure-bearing structure, and improves the pressurizing efficiency of the system.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a uniform pressurizing mode of a substrate bonding uniform pressurizing device according to the present utility model;
FIG. 2 is a schematic view of a conventional pressurizing mode of a substrate bonding uniform pressurizing device according to the present utility model;
FIG. 3 is a schematic view of a vacuum pressurizing mode of a substrate bonding uniform pressurizing device according to the present utility model;
FIG. 4 is a schematic diagram of the structure of a substrate bonding uniform pressurization system of the present utility model;
the figure shows: 1. a homogenizing pressure assembly; 11. pressurizing the outer layer; 12. pressurizing the inner layer; 13. a pressure homogenizing layer; 2. a fluid control assembly; 21. a power unit; 22. a fluid source; 23. a transmission unit; 24. a control unit; 3. an external pressurization assembly; 31. a pressurizing rod; 32. spherical hinge; 4. a bellows assembly; 5. a vacuum accommodating cavity; 6. a bottom pressure-bearing piece.
Detailed Description
Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
Furthermore, in the following description, specific details are provided in order to provide a thorough understanding of the embodiments. However, it will be understood by those skilled in the art that the present utility model may be practiced without these specific details.
As shown in fig. 1, the embodiment of the present disclosure proposes a substrate bonding uniform pressurizing device, and a homogenizing pressure assembly 1 includes a pressurizing outer layer 11, a pressurizing inner layer 12, and a pressure homogenizing layer 13 disposed between the pressurizing outer layer 11 and the pressurizing inner layer 12: the pressurizing inner layer 12 connects the external pressurizing assembly 3, i.e., the pressurizing rod 31 and the ball hinge 32, to transmit the external pressure to the pressure homogenizing layer 13 to homogenize the external pressure; the pressurizing outer layer 11 is in contact with the surface of the substrate to be bonded, and transmits the pressure homogenized by the pressure homogenizing layer 13 to the substrate to be bonded. The pressurized inner layer 12 includes a fluid inlet and outlet. At this time, the pressure to be applied is provided by the pressurizing bar 31, and since the compressible amount of the fluid is small, the pressure is transmitted to the entire surface contacted by the fluid through the pressure homogenizing layer 13, and the pressure is uniformly applied to the pressurizing outer layer 11 on the same surface as the area of the pressure homogenizing layer 13, thereby uniformly pressurizing the surface of the substrate to be pressurized.
In this embodiment, the pressure homogenizing layer 13 is preferably a fluid cavity disposed between the pressurizing outer layer 11 and the pressurizing inner layer 12, the fluid cavity is directly defined by a three-dimensional space between the pressurizing outer layer 11 and the pressurizing inner layer 12, no additional fluid coating exists, and in order to increase the tightness of the fluid cavity, a circle of protrusion is disposed on one side of the outer circumference of the pressurizing outer layer 11, which is close to the pressurizing inner layer 12, in the pressurizing process, the protruding centripetal side is connected with the pressurizing inner layer 12 by using a sealing element, and the sealing element at the connection position can be matched with a corresponding packing sealing element according to the internal pressure, so as to adapt to various pressure requirements and reduce the difficulty and cost of system upgrade. The bottom of the pressurizing inner layer 12 is connected with the pressure homogenizing layer 13, and the upper part of the pressurizing inner layer 12 is connected with the external pressurizing assembly 3 and the pressurizing rod 31 through the spherical hinge 32. Due to the isolation of the pressure equalization layer 13, the thickness of the fluid in the pressure equalization layer 13 is greater than the deformation of the pressure inner layer 12 when the maximum pressure is transmitted, so that the pressure outer layer 11 and the pressure inner layer 12 are ensured not to be contacted, and the deformation of the pressure inner layer 12 has no negative effect on the target surface. It should be understood that, although the pressure equalization layer 13 is preferably a fluid chamber in the present embodiment, a person skilled in the art may select a fluid bladder as the pressure equalization layer 13 according to actual needs, and in the fluid bladder embodiment, the person skilled in the art may not need to provide an additional seal between the pressure outer layer 11 and the pressure inner layer 12, and may also select a continuous or discontinuous fluid bladder positioning protrusion on the bottom periphery of the pressure outer layer 11 according to cost considerations, and the fluid chamber should not be construed as limiting the protection scope of the pressure equalization layer 13.
Preferably, the fluid in the pressure equalization layer 13 is provided and supplemented by a fluid source 22, the fluid source 22 is provided by a fluid tank, a factory pipeline, and the fluid flows into the pressure equalization layer 13 through a fluid inlet and outlet of the pressurized inner layer 12 via a transmission unit 23; the control unit 24 in the fluid control assembly 2 controls the control valve in the transmission unit 23 to maintain the fluid amount in the pressure homogenizing layer 13 unchanged, and the homogenizing pressure assembly 1 uniformly transmits pressure as the external pressurizing assembly 3 pressurizes; further, the fluid pressure in the pressure homogenizing layer 13 can be controlled by the power unit 21 in the fluid control assembly 2, at this time, the power unit 21 becomes a source for applying pressure, the pressurizing rod 31 only needs to keep the position, and the control of the pressure applied to the substrate to be pressurized can be completed by adjusting the fluid quantity of the pressure homogenizing layer 13 by the power unit 21, so that the system improves the energy efficiency and saves the energy consumption. The transmission unit 23 in this embodiment comprises a transmission pipe and a control valve, which is preferably at least one of a shut-off valve, a plug valve or a ball valve; the control unit 24 regulates and controls the power unit 21 and/or the transmission unit 23, integrally manages each structure in the fluid control assembly 2, and controls the power unit 21 or the transmission unit 23 to flexibly adjust the fluid quantity of the pressure homogenizing layer 13 so as to adapt to different pressurization scenes.
Fig. 2 is a schematic diagram of a conventional pressurizing mode of a substrate bonding uniform pressurizing device, according to the embodiment of fig. 1, the fluid in the pressure homogenizing layer 13 is discharged to the fluid source 22 in the fluid control assembly 2, so that the pressurizing outer layer 11 and the pressurizing inner layer 12 are contacted, at this time, the system is changed from the uniform pressurizing mode to the conventional pressurizing mode, the pressurizing device is changed to the direct pressurizing by the pressurizing rod 31 through the pressurizing inner layer 12 and the pressurizing outer layer 11, and the switching between different pressurizing modes can adapt to various use situations and meet the pressurizing requirement.
Fig. 3 is a schematic diagram of a vacuum pressurizing mode of a substrate bonding uniform pressurizing device, based on the embodiment of fig. 1, the embodiment further includes a bellows assembly 4, a vacuum accommodating cavity 5 and a bottom pressure bearing member 6, the substrate to be bonded is disposed in the vacuum accommodating cavity 5 and placed on the bottom pressure bearing member 6, the bellows assembly 4 is used for movably connecting the bottom pressure bearing member 6 and the homogenizing pressure assembly 1, wherein the homogenizing pressure assembly 1 can move in a direction of approaching or separating from the substrate to be bonded on a side wall of the bottom pressure bearing member 6, so as to transfer pressure generated by the substrate bonding uniform pressurizing device in the atmosphere environment to the substrate to be bonded in the vacuum environment.
Preferably, the bellows assembly 4 is attached over the protrusions of the pressurizing outer layer 11, and as the pressurizing outer layer 11 is lowered by the application of pressure from the external pressurizing assembly 3, the bellows assembly 4 is extended, so that the substrates in the vacuum receiving chamber 5 are pressed and bonded; the mode separates the homogenizing and pressurizing device in the atmosphere environment from the material to be pressurized in the vacuum environment, the liquid layer is not required to meet the requirement of vacuum inner sealing, and the system cost is reduced.
The substrate bonding uniform pressurizing system shown in fig. 4 is a schematic structural diagram of the substrate bonding uniform pressurizing system, and the substrate bonding uniform pressurizing system includes two groups of any one of the substrate bonding uniform pressurizing devices, wherein the two groups of substrate bonding uniform pressurizing devices are symmetrically arranged on the upper surface and the lower surface of a substrate to be pressurized, and in the two groups of substrate bonding uniform pressurizing devices, the substrate bonding uniform pressurizing device positioned on the upper surface and/or the substrate bonding uniform pressurizing device positioned on the lower surface can be used as a pressure power source to provide pressure and can be used as a pressure receiving part to receive pressure, namely: one of which provides pressure and the other of which is subjected to pressure; or two groups of pressure are applied simultaneously, so that pressure non-uniformity caused by deformation of the pressure-bearing structure is further eliminated.
In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the description is relatively simple for the embodiments described later, and reference is made to the description of the foregoing embodiments for relevant points.
The present utility model is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (10)
1. A substrate bonding uniform pressurizing device, comprising:
a homogenization pressure assembly, a fluid control assembly, and an external pressurization assembly;
wherein the homogenizing pressure assembly comprises a pressurizing outer layer, a pressurizing inner layer and a pressure homogenizing layer arranged between the pressurizing outer layer and the pressurizing inner layer; the pressurizing inner layer is connected with the external pressurizing assembly so as to transmit external pressure to the pressurizing outer layer through the pressure homogenizing layer, and the pressurizing outer layer transmits the homogenized pressure to the substrate to be bonded; the pressurized inner layer includes a fluid inlet and outlet;
the fluid control assembly comprises a fluid source, a power unit, a transmission unit and a control unit, wherein the power unit conveys fluid in the fluid source to the pressure homogenizing layer through the transmission unit and the fluid inlet and outlet, and the control unit is electrically connected with the power unit and/or the transmission unit so as to regulate and control the amount of the fluid entering the pressure homogenizing layer;
the external pressurizing assembly comprises a pressurizing rod and a spherical hinge, and the pressurizing rod is fixed on one side, far away from the pressurizing outer layer, of the pressurizing inner layer through the spherical hinge.
2. The substrate bonding uniform pressurization device according to claim 1, wherein said fluid comprises a liquid or a gas.
3. The substrate-bonded uniform pressurization device of claim 1, wherein the pressure equalization layer comprises a fluid bladder and/or a fluid chamber.
4. The substrate bonding uniform pressurizing device according to claim 1, wherein a ring of protrusions is provided on a side of the outer periphery of the pressurizing outer layer, which is close to the pressurizing inner layer, and a sealing member is provided between a centripetal side of the protrusions and the pressurizing inner layer.
5. The substrate bonding uniform pressurizing device according to claim 1, wherein a thickness of the fluid in the pressure equalization layer is greater than or equal to zero in an operating state of the substrate bonding uniform pressurizing device.
6. The substrate bonding uniform pressure device according to claim 1, further comprising a bellows assembly, a vacuum receiving chamber, and a bottom pressure receiving member, wherein the substrate to be bonded is disposed in the vacuum receiving chamber, the bellows assembly being adapted to movably connect the bottom pressure receiving member and the homogenizing pressure assembly, wherein
The homogenizing pressure assembly can move in the direction of approaching or separating from the substrate to be bonded on the side wall of the bottom pressure bearing part so as to transfer the pressure generated by the substrate bonding uniform pressurizing device in the atmosphere environment to the substrate to be bonded in the vacuum environment.
7. The substrate bonding uniform pressure device according to claim 1, wherein said fluid source is provided by a fluid tank or a factory pipeline.
8. The substrate bonding uniform pressurizing device according to claim 1, wherein the transfer unit comprises a transfer pipe and a control valve; the control valve is arranged on the transmission pipeline to regulate and control the amount of fluid conveyed into the pressure homogenizing layer.
9. A substrate bonding uniform pressurizing system, characterized in that the pressurizing system is composed of two groups of the substrate bonding uniform pressurizing devices according to any one of claims 1 to 8 which are symmetrically arranged.
10. The substrate bonding uniform pressure system according to claim 9, wherein one of two sets of said pressure devices provides pressure and the other set is subjected to pressure; or both sets of said pressurizing means simultaneously providing pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322291533.7U CN220604627U (en) | 2023-08-24 | 2023-08-24 | Uniform pressurizing device and pressurizing system for substrate bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322291533.7U CN220604627U (en) | 2023-08-24 | 2023-08-24 | Uniform pressurizing device and pressurizing system for substrate bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220604627U true CN220604627U (en) | 2024-03-15 |
Family
ID=90172387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322291533.7U Active CN220604627U (en) | 2023-08-24 | 2023-08-24 | Uniform pressurizing device and pressurizing system for substrate bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220604627U (en) |
-
2023
- 2023-08-24 CN CN202322291533.7U patent/CN220604627U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9052021B2 (en) | Valve, fluidic apparatus, and fluid-supplying apparatus | |
| CN101230247B (en) | Rubber/resin composite seal material | |
| US10737415B2 (en) | Forming a profiled prepreg component | |
| US20190257434A1 (en) | Diaphragm valve with diaphragm seat carrier | |
| CN101733994A (en) | Apparatus for laminating a solar cell module | |
| CN220604627U (en) | Uniform pressurizing device and pressurizing system for substrate bonding | |
| CN202573217U (en) | Composite sheet pressing device | |
| CN109944894B (en) | Sealing structure, method and product of sub-opening on low-temperature-resistant air spring | |
| CN111799183A (en) | Method and device for material-fitting connection | |
| CN206874878U (en) | A kind of Piezoelectric Ceramic valve block of gas control | |
| CN101071047A (en) | Heat exchanger and manufacturing method thereof | |
| CN113153876A (en) | Bonding apparatus and bonding method | |
| CN208706612U (en) | A kind of wafer pressing device | |
| JP2005514561A (en) | Fluid transfer device and base plate | |
| CN215059810U (en) | Ultra-high pressure BA-level clean pressure reducing valve | |
| CN109140009A (en) | A kind of closed butterfly valve of controllable flow rate | |
| CN110296245A (en) | A kind of pressure release water compensating valve, hot-water heating system | |
| KR20170027408A (en) | Pressure-gain controlled multi-way control valve | |
| CN115264106B (en) | Integrated intelligent flow regulating device | |
| JP3585457B2 (en) | Apparatus for bonding substrates to form a liquid crystal display element and method for bonding substrates | |
| US11984328B2 (en) | Semiconductor manufacturing apparatus and semiconductor manufacturing method | |
| KR102637392B1 (en) | Microstructure manufacturing apparatus and microstructure manufacturing method | |
| US20220285176A1 (en) | Semiconductor manufacturing apparatus and semiconductor manufacturing method | |
| CN219017596U (en) | Vacuum cover plate for high-temperature bonding | |
| CN219882199U (en) | Wafer pressure head of semiconductor polishing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |