CN220604616U - High-current adapter - Google Patents

High-current adapter Download PDF

Info

Publication number
CN220604616U
CN220604616U CN202322223749.XU CN202322223749U CN220604616U CN 220604616 U CN220604616 U CN 220604616U CN 202322223749 U CN202322223749 U CN 202322223749U CN 220604616 U CN220604616 U CN 220604616U
Authority
CN
China
Prior art keywords
compressing
base
tightly
block
metal strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202322223749.XU
Other languages
Chinese (zh)
Inventor
何纪法
史鲁军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaoxing Hongbang Electronics Technology Co ltd
Original Assignee
Shaoxing Hongbang Electronics Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaoxing Hongbang Electronics Technology Co ltd filed Critical Shaoxing Hongbang Electronics Technology Co ltd
Priority to CN202322223749.XU priority Critical patent/CN220604616U/en
Application granted granted Critical
Publication of CN220604616U publication Critical patent/CN220604616U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The utility model provides a high-current adapter, which comprises a base and a compression block arranged on the base, wherein a rectangular frame is arranged outside the base and the compression block, and a compression mechanism is arranged between the top of the rectangular frame and the compression block; the utility model discloses a compact heap, including compressing block, base, compressing block bottom is equipped with compresses tightly the arch, the base corresponds to compress tightly protruding department and is equipped with compresses tightly the recess, compress tightly protruding and compress tightly and all equipartition in the recess and have a plurality of metal strips, compress tightly protruding and compress tightly the metal strip one-to-one on the recess, compress tightly the metal strip wire on the recess and be connected with heavy current wire, compress tightly bellied metal strip and be connected with the interface. The utility model has the following beneficial effects: through compressing tightly protruding and compressing tightly sunken and last metal strip cooperation hold-down mechanism, it has solved current adapter when using with the pin junction of semiconductor device, has the technical problem that contact failure or area of contact are too little.

Description

High-current adapter
Technical Field
The utility model relates to the technical field of detection equipment accessories, in particular to a high-current adapter.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion, such as integrated circuit chips, power modules, mos field effect transistors, and the like.
When the semiconductor devices are manufactured or in production, some tests such as electrical parameter tests, reliability tests and packaging tests need to be performed, wherein the drain current tests in the electrical parameter tests need to use larger current, the semiconductor devices need to be connected with a detection device and a power supply through switching of an adapter when the tests are performed, and the situation that the connection part of the traditional adapter and pins of the semiconductor devices is poor in contact or small in contact area exists, and when large current needs to pass, the connection part heats, so that connection damage or the situation that the semiconductor devices are damaged occurs.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model provides a high-current adapter, which solves the technical problems of poor contact or over-small contact area at the joint of the existing adapter and a pin of a semiconductor device when the existing adapter is used.
The high-current adapter comprises a base and a compression block arranged on the base, wherein a rectangular frame is arranged outside the base and the compression block, and a compression mechanism is arranged between the top of the rectangular frame and the compression block;
the utility model discloses a compact heap, including compressing block, base, compressing block bottom is equipped with compresses tightly the arch, the base corresponds to compress tightly protruding department and is equipped with compresses tightly the recess, compress tightly protruding and compress tightly and all equipartition in the recess and have a plurality of metal strips, compress tightly protruding and compress tightly the metal strip one-to-one on the recess, compress tightly the metal strip wire on the recess and be connected with heavy current wire, compress tightly bellied metal strip and be connected with the interface.
The technical principle of the utility model is as follows: the pin of the semiconductor device is compressed by the metal strip on the compressing bulge and the compressing dent, and the contact area between the pin and the metal strip is always in the maximum state because the pin is compressed from two sides, and meanwhile, the compressing mechanism provides continuous compressing force, so that the situation that the connection part with the pin is loose is avoided, namely, the situation of poor contact is avoided.
Compared with the prior art, the utility model has the following beneficial effects: through compressing tightly protruding and compressing tightly sunken and last metal strip cooperation hold-down mechanism, it has solved current adapter when using with the pin junction of semiconductor device, has the technical problem that contact failure or area of contact are too little.
Further, the metal strips are arranged at the positions of the pressing protrusions and the pressing depressions close to one side, the high-current conducting wires are arranged on one side, far away from the metal strips, of the base, and the interface is arranged on one side, far away from the metal strips, of the rectangular frame.
Further, the base bottom corresponds and compresses tightly the sunken department and be equipped with the spread spectrum, the spread spectrum has the fixed slot with compressing tightly in the sunken, base keeps away from heavy current wire one side equipartition and has the spread spectrum, every spread spectrum both ends connect the spread spectrum respectively with compress tightly the fixed slot in the sunken, the metal strip is fixed in compressing tightly the sunken fixed slot, be equipped with the connecting strip in the fixed slot in spread spectrum and the spread spectrum, connecting strip and metal strip integrated into one piece, and the heavy current wire is connected to the connecting strip.
Further, the fixing grooves are uniformly distributed on the pressing protrusions, the mounting grooves are uniformly distributed on one side of the pressing blocks away from the connector, the metal strips on the pressing protrusions are L-shaped, the L-shaped metal strips are clamped into the fixing grooves and the mounting grooves of the pressing protrusions, the L-shaped metal strips are fixed in the mounting grooves by screws, the connecting strips are arranged on one side of the pressing protrusions, close to the connector, of the fixing grooves, and are connected with the metal strips and the connector on the pressing protrusions.
By the structure that the metal strips of the pressing bulge are different from those of the pressing recess, the direct connection of the two metal strips directly bypassing the pins of the semiconductor device in the middle part during pressing is avoided.
Further, a fixing block is arranged on one side, close to the metal strip, of the base, and the fixing block compresses the connecting strip in the connecting groove.
Further, the fixed block is provided with a positioning opening corresponding to the compaction depression.
The positioning function is performed on the semiconductor device, so that the pins of the semiconductor device can be accurately pressed by the metal strips.
Further, the compressing mechanism comprises a compressing screw, a compressing nut and a handle, wherein the compressing screw is arranged at the top center of the rectangular frame, the compressing nut is fixed at the top center of the compressing block, the compressing nut is in threaded connection with the compressing screw, and the handle is arranged at one end of the compressing screw far away from the compressing block.
Further, guide screws are arranged on two sides of the base, and penetrate through the compression block to be fixed on the base.
Furthermore, inclined surfaces are arranged on two sides of the bottom of the pressing protrusion, the cross section of the pressing depression is an inverted isosceles trapezoid, and the inclined surfaces are matched with two waists of the isosceles trapezoid.
Further, a supporting plate is arranged below the interface, the supporting plate is arranged on the rectangular frame, the interface is round, and elastic grooves are uniformly distributed on the interface in the circumferential direction.
Through setting up the elastic groove, when interface and check out test set are connected, the elastic groove is compressed and is warp, compresses tightly on check out test set's link, consequently even the interface appears wearing and tearing after, also can not lead to the contact failure, because: the connection is elastically deformed, and even if worn, the connection port can still be pressed on the connection end of the detection device.
Drawings
Fig. 1 is a front cross-sectional view of a high current adapter according to an embodiment of the present utility model.
Fig. 2 is a side cross-sectional view of a high current adapter according to an embodiment of the present utility model.
Fig. 3 is a schematic structural view of a pressing protrusion and a pressing recess according to an embodiment of the present utility model.
Fig. 4 is a top view of a base according to an embodiment of the present utility model.
Fig. 5 is a schematic structural view of a support plate according to an embodiment of the present utility model.
In the above figures: 10. a base; 11. compressing the concave; 12. a high current wire; 13. a connection channel; 14. a guide screw; 20. a compaction block; 21. pressing the bulge; 22. an inclined surface; 30. a rectangular frame; 31. a support plate; 40. a metal strip; 41. a connecting strip; 50. an interface; 51. an elastic groove; 60. a fixing groove; 61. a connecting groove; 62. a mounting groove; 70. a fixed block; 71. a positioning port; 80. a compressing mechanism; 81. a compression screw; 82. a compression nut; 83. a handle.
Detailed Description
The technical scheme of the utility model is further described below with reference to the accompanying drawings and examples.
The high-current adapter shown in fig. 1 comprises a base 10 and a compression block 20 arranged on the base 10, wherein a rectangular frame 30 is arranged outside the base 10 and the compression block 20, the base 10 is fixed on the inner side of the rectangular frame 30, and a compression mechanism 80 is arranged between the top of the rectangular frame 30 and the compression block 20, so that the compression block 20 is compressed on the base 10.
As shown in fig. 1-3, a pressing protrusion 21 is disposed at the bottom of the pressing block 20, a pressing recess 11 is disposed at a position of the base 10 corresponding to the pressing protrusion 21, a plurality of metal strips 40 are uniformly distributed in the pressing protrusion 21 and the pressing recess 11, in this embodiment, 3 strips, four strips and the like are used, the pressing protrusion 21 corresponds to the metal strips 40 on the pressing recess 11 one by one, and then the metal strips 40 on the upper side and the lower side can press pins of the semiconductor device, so as to realize electrical connection, the metal strips 40 on the pressing recess 11 are connected with a heavy current lead 12 for accessing heavy current, and the metal strips 40 of the pressing protrusion 21 are connected with an interface 50 for connecting detection equipment.
As shown in fig. 2, the metal strips 40 are disposed at the positions of the pressing protrusions 21 and the pressing depressions 11 near one side, the high-current wires 12 are disposed at the side of the base 10 far away from the metal strips 40, the interfaces 50 are disposed at the side of the rectangular frame 30 far away from the metal strips 40, and then the metal strips 40 are provided with a semiconductor device inspection station at one side, and the other side is used for connecting a circuit and inspection equipment.
As shown in fig. 1-2, a connecting channel 13 is arranged at the bottom of the base 10 corresponding to the compacting depression 11, fixing grooves 60 are uniformly distributed in the connecting channel 13 and the compacting depression 11, connecting grooves 61 are uniformly distributed at one side of the base 10 far away from the heavy current lead 12, two ends of each connecting groove 61 are respectively connected with the connecting channel 13 and the fixing grooves 60 in the compacting depression 11, a metal strip 40 is fixed in the fixing grooves 60 of the compacting depression 11, connecting strips 41 are arranged in the fixing grooves 60 in the connecting grooves 61 and the connecting channel 13, the connecting strips 41 and the metal strip 40 are integrally formed, and the connecting strips 41 are connected with the heavy current lead 12 to realize connection of the metal strip 40 and the heavy current lead 12.
As shown in fig. 1-2, fixing grooves 60 are uniformly distributed on the pressing protrusion 21, mounting grooves 62 are uniformly distributed on one side, far away from the interface 50, of the pressing block 20, the metal strips 40 on the pressing protrusion 21 are L-shaped, the L-shaped metal strips 40 are clamped into the fixing grooves 60 and the mounting grooves 62 of the pressing protrusion 21, the L-shaped metal strips 40 are fixed in the mounting grooves 62 by screws, namely, the fixing of the L-shaped metal strips 40 is realized by the screws, connecting strips 41 are arranged on one side, close to the interface 50, of the fixing grooves 60 of the pressing protrusion 21, the connecting strips 41 are connected with the metal strips 40 on the pressing protrusion 21 and the interface 50, and the connecting strips 41 and the L-shaped metal strips 40 are integrally formed.
The arrangement of the metal strips 40 and the connecting strips 41 on the base 10 is matched with the arrangement of the metal strips 40 and the connecting strips 41 on the pressing block 20, so as to avoid contact between the metal strips 40 on the base 10 and the metal on the pressing block 20 during the elegance and quiescence of the semiconductor device. In the above structure, the metal strip 40 on the base 10 bypasses from the bottom to be connected with the heavy current lead 12, so that the lower side of the connecting strip 41 of the compression block 20 is free of the metal strip 40 or the connecting strip 41, and further contact is avoided.
As shown in fig. 1-2 and 4, a fixing block 70 is fixed on one side of the base 10 close to the metal strip 40 by a screw, and the fixing block 70 presses the connecting strip 41 in the connecting groove 61, so as to fix the connecting strip 41 in the connecting groove 61 and the metal strip 40 integrally formed with the connecting strip 41. The specific fixing block 70 is provided with a positioning opening 71 corresponding to the pressing recess 11 for placing the semiconductor device, thereby playing a role in positioning.
As shown in fig. 1, the compressing mechanism 80 includes a compressing screw 81, a compressing nut 82 and a handle 83, wherein the compressing screw 81 is screwed on the top center of the rectangular frame 30, the compressing nut 82 is fixed on the top center of the compressing block 20, the compressing nut 82 is screwed with the compressing screw 81, the handle 83 is mounted on one end of the compressing screw 81 far away from the compressing block 20, and then the handle 83 is rotated to drive the compressing screw 81 to rotate, so that the compressing nut 82 drives the compressing block 20 to rise or fall.
As shown in fig. 1, guide screws 14 are provided at both sides of the base 10, and the guide screws 14 penetrate through the compression block 20 to be fixed on the base 10, thereby playing a role in guiding the movement of the compression block 20.
As shown in fig. 3, the two sides of the bottom of the pressing protrusion 21 are provided with inclined surfaces 22, the cross section of the pressing recess 11 is in the shape of an inverted isosceles trapezoid, and the inclined surfaces 22 are matched with the two waists of the isosceles trapezoid, so that the pressing protrusion 21 can be accurately pressed into the pressing recess 11.
As shown in fig. 2 and 5, the support plate 31 is disposed under the interface 50, the support plate 31 is mounted on the rectangular frame 30, that is, all the interfaces 50 are disposed on the support plate 31, so that the connection of the detection device is facilitated, the interface 50 is circular, elastic grooves 51 are uniformly distributed on the interface 50 circumferentially, and the interface 50 can be tightly connected with the detection device all the time through the elastic grooves 51 without loosening.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present utility model, which is intended to be covered by the scope of the claims of the present utility model.

Claims (10)

1. A high current adapter, characterized by: the device comprises a base and a compression block arranged on the base, wherein a rectangular frame is arranged outside the base and the compression block, and a compression mechanism is arranged between the top of the rectangular frame and the compression block;
the utility model discloses a compact heap, including compressing block, base, compressing block bottom is equipped with compresses tightly the arch, the base corresponds to compress tightly protruding department and is equipped with compresses tightly the recess, compress tightly protruding and compress tightly and all equipartition in the recess and have a plurality of metal strips, compress tightly protruding and compress tightly the metal strip one-to-one on the recess, compress tightly the metal strip wire on the recess and be connected with heavy current wire, compress tightly bellied metal strip and be connected with the interface.
2. The high current transducer according to claim 1, wherein: the metal strip is arranged at the position where the pressing protrusion and the pressing depression are close to one side, the high-current lead is arranged at one side of the base far away from the metal strip, and the interface is arranged at one side of the rectangular frame far away from the metal strip.
3. The high current transducer according to claim 2, wherein: the base bottom corresponds and compresses tightly the sunken department and be equipped with the spread spectrum, the spread spectrum has the fixed slot with compressing tightly in the sunken equipartition, base keeps away from heavy current wire one side equipartition and has the spread spectrum, every spread spectrum both ends connect the fixed slot in spread spectrum and the compressed tightly sunken respectively, the metal strip is fixed in compressing tightly sunken fixed slot, be equipped with the connecting strip in the fixed slot in spread spectrum and the spread spectrum, connecting strip and metal strip integrated into one piece, and the heavy current wire is connected to the connecting strip.
4. A high current transducer according to claim 3, wherein: the fixing device is characterized in that fixing grooves are uniformly distributed on the pressing protrusions, mounting grooves are uniformly distributed on one side, far away from the connector, of the pressing protrusions, the metal strips on the pressing protrusions are L-shaped, the L-shaped metal strips are clamped into the fixing grooves and the mounting grooves of the pressing protrusions, the L-shaped metal strips are fixed in the mounting grooves by screws, connecting strips are arranged on one side, close to the connector, of the fixing grooves of the pressing protrusions, and the connecting strips are connected with the metal strips and the connectors on the pressing protrusions.
5. A high current transducer according to claim 3, wherein: the base is close to metal strip one side and is equipped with the fixed block, the connecting strip in the connecting groove is pressed tightly to the fixed block.
6. The high current transducer according to claim 5, wherein: the fixed block is provided with a positioning opening corresponding to the compaction depression.
7. The high current transducer according to claim 1, wherein: the compressing mechanism comprises a compressing screw, a compressing nut and a handle, wherein the compressing screw is arranged at the top center of the rectangular frame, the compressing nut is fixed at the top center of the compressing block, the compressing nut is in threaded connection with the compressing screw, and the handle is arranged at one end of the compressing screw far away from the compressing block.
8. The high current transducer according to claim 7, wherein: guide screws are arranged on two sides of the base and penetrate through the compression block to be fixed on the base.
9. The high current transducer according to claim 1, wherein: the two sides of the bottom of the compaction protrusion are provided with inclined planes, the cross section of the compaction recess is in an inverted isosceles trapezoid shape, and the inclined planes are matched with two waists of the isosceles trapezoid shape.
10. The high current transducer according to claim 1, wherein: the support plate is arranged below the interface, the support plate is arranged on the rectangular frame, the interface is round, and elastic grooves are uniformly distributed on the interface in the circumferential direction.
CN202322223749.XU 2023-08-16 2023-08-16 High-current adapter Active CN220604616U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322223749.XU CN220604616U (en) 2023-08-16 2023-08-16 High-current adapter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322223749.XU CN220604616U (en) 2023-08-16 2023-08-16 High-current adapter

Publications (1)

Publication Number Publication Date
CN220604616U true CN220604616U (en) 2024-03-15

Family

ID=90180687

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322223749.XU Active CN220604616U (en) 2023-08-16 2023-08-16 High-current adapter

Country Status (1)

Country Link
CN (1) CN220604616U (en)

Similar Documents

Publication Publication Date Title
CN201654074U (en) Testing clamp
CN207281106U (en) Small lead pin pitch semiconductor devices bare chip aging test socket
CN217385580U (en) QFN packaging radio frequency chip test fixture
CN220604616U (en) High-current adapter
CN205263129U (en) Microwave power distributor test seat
CN217881929U (en) Hardware terminal structure with high sealing performance
CN215005843U (en) Meter connecting seat for three-phase electric energy meter calibration equipment
CN209948092U (en) Photovoltaic module power test connecting wire tool equipment
CN216217697U (en) Switching device
CN214895647U (en) Full-automatic electronic function test machine
CN213715389U (en) Integrated circuit chip reliability detection clamp
CN213149011U (en) Cable universality joint device
CN209894841U (en) Integrated clamp for laser chip
CN216525944U (en) Portable frequency conversion module test fixture
CN214097705U (en) Crimping type semiconductor chip test platform
CN219574299U (en) Small-batch bare chip detection device
CN201788194U (en) Testing fixture for electrical property of integrated circuit package chips
CN112684317B (en) Compression joint type semiconductor chip test platform and test method
CN219891298U (en) Probe fixture mechanism
CN220289793U (en) Wireless test fixture for cell buckle plate
CN212904990U (en) Ball planting type circuit packaging test rapid compression tool
CN219533207U (en) Down-pressure type rapid test fixture
CN218036934U (en) Protection shield short circuit test fixture
CN108680773A (en) A kind of test contact chip connector
CN109884425B (en) Testing device for power pin type packaging module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant