CN220601303U - Super-thin light-emitting module structure used on card products and assembling jig - Google Patents
Super-thin light-emitting module structure used on card products and assembling jig Download PDFInfo
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- CN220601303U CN220601303U CN202322106287.3U CN202322106287U CN220601303U CN 220601303 U CN220601303 U CN 220601303U CN 202322106287 U CN202322106287 U CN 202322106287U CN 220601303 U CN220601303 U CN 220601303U
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- light
- light guide
- film
- component
- circuit board
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- 238000009792 diffusion process Methods 0.000 claims abstract description 30
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 44
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000889 atomisation Methods 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses an ultra-thin light-emitting module structure and an assembly jig used on card products, comprising a light source component used for providing a light source; the light source component is connected with a light guide component which adjusts the brightness of the light source to be consistent; the light guide component is connected with a connecting component for connecting the light source component in a bonding way; the upper part of the connecting component is connected with a light transmission component for further optimizing the light source in a laminating way; the light-transmitting component comprises a diffusion film and a PI film, the diffusion film and the PI film are consistent in size, the upper surface of the diffusion film is connected to the lower surface of the PI film in a bonding mode, and the lower surface of the diffusion film is connected to the connecting component in a bonding mode; the utility model has the advantages that: the diffusion film further optimizes the light, so that the light emitted by the light-emitting surface of the diffusion film achieves an atomization effect, and meanwhile, after the light is processed by the colored PI film, the color of the light emitted by the light-emitting surface achieves a required effect.
Description
Technical Field
The utility model relates to the technical field of light-emitting modules, in particular to an ultra-thin light-emitting module structure used on card products and an assembly jig.
Background
The luminous module is used as a high-quality light source and is widely applied to the fields of advertising lamp plates, luminous words and the like, and as the card products are small in size and thin in thickness, the luminous sources which are small in size and thin in thickness are required to be installed on the card products so as to meet the requirements.
For example, chinese application publication No. CN214009138U discloses a light emitting module, which sets a light shielding body and a light guiding structure on a light emitting body, so that light is more uniform, but the device cannot meet the requirement of diversification of light colors emitted by a card because the light color emitted by the light emitting body is specified unchanged.
Therefore, a new ultra-thin light-emitting module structure and an assembly jig for use in card products are needed, which solve the problem that the light-emitting color of the card products is single and meet the market requirements.
Disclosure of Invention
The utility model aims to solve the problems of the prior art and provides an ultra-thin light-emitting module structure and an assembly jig for card products.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model discloses an ultra-thin light-emitting module structure used on card products, which comprises a light source component used for providing a light source; the light source component is connected with a light guide component which adjusts the brightness of the light source to be consistent; the light guide component is connected with a connecting component for connecting the light source component in a bonding way; the upper part of the connecting component is connected with a light transmission component for further optimizing the light source in a laminating way;
preferably, the light-transmitting component comprises a diffusion film and a PI film, the diffusion film and the PI film are consistent in size, the upper surface of the diffusion film is connected to the lower surface of the PI film in a lamination mode, and the lower surface of the diffusion film is connected to the connecting component in a lamination mode.
Preferably, the PI film is a film with a specific color set according to the requirement, and a black shade is printed on the upper surface of the PI film.
Preferably, the light source assembly comprises a flexible circuit board and a light emitting chip, and the light emitting chip is fixedly and electrically connected to the flexible circuit board.
Preferably, a plurality of first through holes are formed in the peripheral edges of the flexible circuit board, a plurality of groups of grooves are uniformly formed in the middle of the flexible circuit board, the light emitting chips are inserted into the grooves, and the light emitting chips are electrically connected with the flexible circuit board.
Preferably, the light guide assembly comprises a light guide plate and light guide grooves, the light guide plate is attached to the flexible circuit board, the light guide grooves are uniformly arranged on the light guide plate, the number of the light guide grooves is the same as that of the grooves, and the light guide grooves are correspondingly arranged with the grooves.
Preferably, the light guide plate is made of a high light transmission material, and the size of the light guide plate is smaller than that of the flexible circuit board.
Preferably, the light guide groove is printed on the light guide plate through a heat pressing process.
Preferably, the connecting component comprises black glue, a glue printing plate and a light-transmitting block, the light-transmitting block is uniformly distributed on the glue printing plate, the black glue is uniformly coated on the upper surface and the lower surface of the glue printing plate along the edge of the light-transmitting block, the black glue bonds the lower surface of the glue printing plate with the flexible circuit board, the black glue bonds the upper surface of the glue printing plate with the lower surface of the diffusion film, and the glue printing plate adopts high light-transmitting materials.
Preferably, the number of the light-transmitting blocks is the same as that of the light guide grooves, and the light-transmitting blocks and the light guide grooves are correspondingly arranged.
Preferably, a plurality of second through holes are formed in the peripheral edge of the glue printing plate, the number of the second through holes is the same as that of the first through holes, and the positions of the second through holes correspond to that of the first through holes.
Preferably, a plurality of third through holes are formed in the peripheral edge of the PI film, the number of the third through holes is the same as that of the second through holes, and the positions of the third through holes correspond to those of the second through holes.
The utility model provides an equipment tool for assembling be used for super thin light emitting module structure on card class product, includes tool bottom plate and locating pin, locating pin fixed mounting in the edge all around of tool bottom plate, and the locating pin corresponds the setting with the first through-hole of flexible circuit board.
Advantageous effects
Compared with the prior art, the utility model has the following beneficial effects:
1. in the utility model, when the light emitted by the light source component reaches the light transmission component, the light firstly passes through the diffusion film, the diffusion film is further optimized to enable the light emitted by the light emitting surface of the diffusion film to achieve the atomization effect, the light atomized by the diffusion film is transmitted to the PI film, and the PI film is a film with a special color set according to the requirement, and after the light is processed by the colored PI film, the color of the light emitted by the light emitting surface achieves the required effect.
2. In the utility model, the flexible circuit board of the light source component is electrified, the light emitting chip emits light after being electrified, the light emitted by the light emitting chip is transmitted to the light guide plate, and the light transmitted through the light guide groove is consistent in brightness after being processed by the light guide groove on the light guide plate, so that the brightness of the light emitting surface is consistent.
3. In the utility model, the black glue coated on the upper and lower surfaces of the glue printing plate bonds the flexible circuit board and the lower surface of the light-transmitting component together, and meanwhile, the black glue plays a role in protecting light transmitted to the light-transmitting block from light leakage all around.
4. In the present utility model, a black light shielding material is printed on the upper surface of the PI film to shield the portion where light emission is not required.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is an exploded view of an ultra-thin light emitting module structure for use in card products according to the present utility model;
FIG. 2 is a schematic diagram of a single-product structure of an ultra-thin light emitting module used in a card product according to the present utility model;
fig. 3 is a perspective view of an assembling jig for assembling an ultra-thin light emitting module structure according to the present utility model.
The following is a reference numeral description:
1. a flexible circuit board; 101. a through hole; 102. a groove; 2. a light emitting chip; 3. a light guide plate; 4. a light guide groove; 5. black glue; 6. a glue printing plate; 601. a second through hole; 7. a light-transmitting block; 8. a diffusion film; 9. a PI film; 901. a third through hole; 10. a jig bottom plate; 11. and (5) positioning pins.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In some embodiments, referring to fig. 1-3 of the specification, a super-thin light emitting module structure for use on a card product includes a light source assembly for providing a light source;
the light source assembly comprises a flexible circuit board 1 and a light emitting chip 2, wherein the light emitting chip 2 is connected to the flexible circuit board 1 through a wire.
After the flexible circuit board 1 is electrified, electricity is transmitted to the light-emitting chip 2 through the lead, and the light-emitting chip 2 emits light after being electrified.
A plurality of first through holes 101 are formed in the peripheral edge of the flexible circuit board 1, a plurality of groups of grooves 102 are uniformly formed in the middle of the flexible circuit board 1, the light emitting chips 2 are inserted into the grooves 102, and the light emitting chips 2 are electrically connected with the flexible circuit board 1.
A plurality of groups of grooves 102 are formed in the flexible circuit board 1, the light-emitting chips 2 are connected in the grooves 102 through wires, the size is reduced, the space is saved, a plurality of first through holes 101 are formed in the peripheral edge of the flexible circuit board 1, and the assembly and the positioning are convenient.
The flexible circuit board 1 of the light source component is connected with a light guide component for adjusting the brightness of the light source to be consistent.
The light guide assembly comprises a light guide plate 3 and light guide grooves 4, wherein the light guide plate 3 is made of a high light transmission material, the size of the light guide plate 3 is smaller than that of the flexible circuit board 1, the light guide plate 3 is attached to the flexible circuit board 1, the light guide grooves 4 are uniformly arranged on the light guide plate 3, the number of the light guide grooves 4 is the same as that of the grooves 102, and the light guide grooves 4 are correspondingly arranged with the grooves 102.
The flexible circuit board 1 of the light source assembly is electrified, the light emitting chip 2 emits light after being electrified, the light emitted by the light emitting chip 2 is transmitted to the light guide plate 3, and after being processed by the light guide groove 4 on the light guide plate 3, the brightness of the light transmitted through the light guide groove 4 is consistent, and the brightness of a light emitting surface is ensured to be consistent.
The light guide plate 3 of the light guide assembly is attached and connected with a connecting assembly for connecting the flexible circuit board 1.
The connecting component comprises black glue 5, a glue printing plate 6 and a light-transmitting block 7, wherein the light-transmitting blocks 7 are uniformly distributed on the glue printing plate 6, the number of the light-transmitting blocks 7 is the same as that of the light-guiding grooves 4, the light-transmitting blocks 7 and the light-guiding grooves 4 are correspondingly distributed, the black glue 5 is uniformly coated on the upper surface and the lower surface of the glue printing plate 6 along the edges of the light-transmitting blocks 7, the lower surface of the glue printing plate 6 is bonded with the flexible circuit board 1 by the black glue 5, the upper surface of the glue printing plate 6 is bonded with the lower surface of the light-transmitting component by the black glue 5, and the glue printing plate 6 adopts high light-transmitting materials.
The black glue 5 coated on the upper and lower surfaces of the glue printing plate 6 bonds the flexible circuit board 1 and the lower surface of the light transmission component together, and meanwhile, the black glue 5 plays a role in protecting light transmitted to the light transmission block 7 from light leakage all around.
The upper surface of the glue plate 6 of the connection assembly is connected with a light transmission assembly for further optimizing the light source.
The printing opacity subassembly includes diffusion membrane 8 and PI membrane 9, and diffusion membrane 8 is unanimous with PI membrane 9's size, and the upper surface laminating of diffusion membrane 8 is connected and is being located PI membrane 9's lower surface, and the lower surface of diffusion membrane 8 is connected with the upper surface laminating of seal plate 6, and PI membrane 9 is the membrane that has specific colour that sets for according to the demand, and the upper surface printing of PI membrane 9 has black shade, covers the part that does not need the light-emitting.
When the light emitted by the light source component reaches the light transmission component, the light firstly passes through the diffusion film 8, the diffusion film 8 is further optimized for the light, the light emitted by the light emitting surface of the diffusion film 8 achieves the atomization effect, the light atomized by the diffusion film 8 is transmitted to the PI film 9, and the PI film 9 is a film with a special color set according to the requirement, and after the light is processed by the colored PI film 9, the color of the light emitted by the light emitting surface achieves the required effect.
In some embodiments, referring to fig. 1-3 of the specification, the light guide grooves 4 are printed on the light guide plate 3 by a heat press process.
A plurality of second through holes 601 are formed in the peripheral edge of the glue printing plate 6, the number of the second through holes 601 is the same as that of the first through holes 101, and the positions of the second through holes 601 correspond to that of the first through holes 101, so that the glue printing plate is convenient to assemble.
A plurality of third through holes 901 are formed in the peripheral edge of the PI film 9, the number of the third through holes 901 is the same as that of the second through holes 601, and the positions of the third through holes 901 correspond to that of the second through holes 601, so that the assembly is convenient.
In some embodiments, referring to fig. 1-3 of the present disclosure, an assembling jig for assembling an ultra-thin light emitting module structure used on a card product includes a jig base plate 10 and positioning pins 11, wherein the positioning pins 11 are fixedly mounted at the peripheral edges of the jig base plate 10, and the positioning pins 11 are disposed corresponding to first through holes 101 of a flexible circuit board 1.
During assembly, a first through hole 101 on a flexible circuit board 1 of a light source assembly is sleeved on a corresponding positioning pin 11, then a light guide plate 3 of a catheter assembly is attached to the middle of the flexible circuit board 1, a light guide groove 4 is kept corresponding to a groove 102, then a second through hole 601 on a glue printing plate 6 of a connecting assembly is sleeved on the positioning pin 11, finally a third through hole 901 on a PI film 9 of a light transmission assembly is sleeved on the positioning pin 11, and a black glue 5 of the connecting assembly connects the flexible circuit board 1 with a diffusion film 8 attached to the lower surface of the PI film 9 to complete assembly of a light emitting module.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art who is skilled in the art to which the present utility model pertains shall apply to the technical solution according to the present utility model and its inventive concept, and all equivalents and modifications are intended to be covered by the scope of the present utility model.
Claims (10)
1. The utility model provides an ultra-thin light-emitting module structure for on card class product which characterized in that: comprising a light source assembly for providing a light source; the light source component is connected with a light guide component which adjusts the brightness of the light source to be consistent; the light guide component is connected with a connecting component for connecting the light source component in a bonding way; the upper part of the connecting component is connected with a light transmission component for further optimizing the light source in a laminating way;
the light-transmitting component comprises a diffusion film (8) and a PI film (9), the diffusion film (8) and the PI film (9) are identical in size, the upper surface of the diffusion film (8) is connected to the lower surface of the PI film (9) in a fit mode, and the lower surface of the diffusion film (8) is connected to the connecting component in a fit mode.
2. The ultra-thin light emitting module structure for use on card-type products as claimed in claim 1, wherein: the PI film (9) is a film with a specific color set according to the requirement, and a black shading object is printed on the upper surface of the PI film (9).
3. The ultra-thin light emitting module structure for use on card-type products as claimed in claim 2, wherein: the light source assembly comprises a flexible circuit board (1) and a light emitting chip (2), and the light emitting chip (2) is fixedly and electrically connected to the flexible circuit board (1).
4. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 3, wherein: a plurality of first through holes (101) are formed in the peripheral edges of the flexible circuit board (1), a plurality of groups of grooves (102) are uniformly formed in the middle of the flexible circuit board (1), the light emitting chips (2) are inserted into the grooves (102), and the light emitting chips (2) are electrically connected with the flexible circuit board (1).
5. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 4, wherein: the light guide assembly comprises a light guide plate (3) and light guide grooves (4), wherein the light guide plate (3) is connected to the flexible circuit board (1) in a fitting mode, the light guide grooves (4) are uniformly arranged on the light guide plate (3), the number of the light guide grooves (4) is the same as that of the grooves (102), and the light guide grooves (4) are correspondingly arranged with the grooves (102).
6. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 5, wherein: the light guide plate (3) is made of high light transmission material, and the size of the light guide plate (3) is smaller than that of the flexible circuit board (1).
7. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 6, wherein: the light guide groove (4) is printed on the light guide plate (3) through hot pressing treatment.
8. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 7, wherein: the connecting assembly comprises a black glue (5), a glue printing plate (6) and a light-transmitting block (7), wherein the light-transmitting block (7) is uniformly distributed on the glue printing plate (6), the black glue (5) is uniformly coated on the upper surface and the lower surface of the glue printing plate (6) along the edge of the light-transmitting block (7), the lower surface of the glue printing plate (6) is bonded with the flexible circuit board (1) by the black glue (5), the upper surface of the glue printing plate (6) is bonded with the lower surface of the diffusion film (8) by the black glue (5), and the glue printing plate (6) adopts a high light-transmitting material.
9. The ultra-thin light emitting module structure for use on card-based products as claimed in claim 8, wherein: the number of the light-transmitting blocks (7) is the same as that of the light guide grooves (4), and the light-transmitting blocks (7) are correspondingly arranged with the light guide grooves (4).
10. An assembly jig for assembling the ultra-thin light emitting module structure for use on card-like products as claimed in claim 9, wherein: the assembly jig comprises a jig bottom plate (10) and positioning pins (11), wherein the positioning pins (11) are fixedly arranged at the peripheral edges of the jig bottom plate (10), and the positioning pins (11) are correspondingly arranged with first through holes (101) of the flexible circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322106287.3U CN220601303U (en) | 2023-08-07 | 2023-08-07 | Super-thin light-emitting module structure used on card products and assembling jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322106287.3U CN220601303U (en) | 2023-08-07 | 2023-08-07 | Super-thin light-emitting module structure used on card products and assembling jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220601303U true CN220601303U (en) | 2024-03-15 |
Family
ID=90177475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322106287.3U Active CN220601303U (en) | 2023-08-07 | 2023-08-07 | Super-thin light-emitting module structure used on card products and assembling jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220601303U (en) |
-
2023
- 2023-08-07 CN CN202322106287.3U patent/CN220601303U/en active Active
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