CN101625076A - Light-emitting diode (LED) backlight module with fluorescent powder - Google Patents
Light-emitting diode (LED) backlight module with fluorescent powder Download PDFInfo
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- CN101625076A CN101625076A CN200810136069A CN200810136069A CN101625076A CN 101625076 A CN101625076 A CN 101625076A CN 200810136069 A CN200810136069 A CN 200810136069A CN 200810136069 A CN200810136069 A CN 200810136069A CN 101625076 A CN101625076 A CN 101625076A
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Abstract
A light-emitting diode (LED) backlight module comprises a light guide plate, an LED element and fluorescent powder; wherein, a reflecting surface and a light extraction surface of the light guide plate are arranged in a nonparallel manner; the fluorescent powder is spread on the surface of the light guide plate, in the body of the light guide plate or on the encapsulation shell of the LED element; partial excitation light emitted by the LED element is excited into transmitting light with different wavelength by the fluorescent powder, and the transmitting light is mixed with the excitation light to generate the light in other colors.
Description
Technical field
The present invention system is relevant to a kind of light-emitting diode (LED) backlight module, particularly a kind of light-emitting diode (LED) backlight module with fluorescent material.
Background technology
Owing to have low power consumption, long-life (be about traditional fluorescent lamp ten times) and can produce not the electromagnetic radiation advantages such as (visible radiation) that can damage the art work, (light-emitting diode LED) has become a kind of illumination component that is received by the market most to light emitting diode gradually.
Traditional light emitting diode is as long as the suitable electric current of input just can send and has the long coloured light of following train wave within it the light-emitting diode chip for backlight unit: ruddiness (wavelength 635 ± 10nm), green glow (wavelength 520 ± 10nm), blue light (wavelength 450-475nm), and gold-tinted (wavelength 565 ± 10nm) etc.Therefore, as long as the suitable electric current of input on the light-emitting diode chip for backlight unit in red light-emitting diode, this red light-emitting diode just can send ruddiness.Similarly, as long as the suitable electric current of input on the light-emitting diode chip for backlight unit in blue light-emitting diode, this blue LED chip just can send blue light.
Yet, be not that all coloured light can produce with above-mentioned mode.For instance, white light just can't produce with above-mentioned mode.
A kind of method of the most direct making one white light emitting diode is: with three send respectively blue light, ruddiness, and the blue light of green glow, ruddiness, and green light LED combines, to form this white light emitting diode.Thus, this white light emitting diode just can be launched this blue light, this ruddiness, and white light that this green glow mixed.Yet, owing to must comprise three light emitting diodes, so the cost of manufacture of above-mentioned three-in-one white light emitting diode is quite high.
In order to overcome above-mentioned shortcoming, inferior chemistry of day (Nichia Chemical) proposes a kind of white light emitting diode that includes single light emitting diode and a kind of phot-luminescence fluorescent material (photoluminescence phosphor), the chemical formula of this fluorescent material is (Y1-p-q-rGdpCeqSmr) 3 (Al1-sGas) 5O12, wherein, p between between 0 and 0.8, q between between 0.003 and 0.2, r between 0.0003 and 0.08 and s between 0 and 1.This single light emitting diode can be launched an excitation line, and this fluorescent material is to be covered on this single light emitting diode and by the mode that absorbs the part excitation line that this single light emitting diode launches, to inspire an emission light.Thus, the emission light that is not excited by residual excitation light and this fluorescent material that this fluorescent material absorbed launched of this single light emitting diode just can be mixed into white light.
Owing in order to the surface area that sends this excitation line 0.35 square millimeter (mm2) only arranged approximately on the light emitting diode, so fluorescent material is difficult for being covered in equably on the light emitting diode, causes light emitting diode only to have relatively poor luminous efficiency.
White light emitting diode is except can also can be applicable in the various device individually as the illumination component, with the light source in installing as this.For instance, white light emitting diode can be applicable in the backlight module, as the light source of this backlight module.Yet similarly, the white light emitting diode in the backlight module has the difficult problem that is covered in equably on this single light emitting diode of above-mentioned fluorescent material too.
Summary of the invention
Therefore main purpose of the present invention is to provide a kind of light-emitting diode (LED) backlight module with fluorescent material, to solve foregoing problems.
Light-emitting diode (LED) backlight module disclosed by the invention comprises a LGP, a light-emitting diode and fluorescent material.This LGP comprises that an incidence surface is used for receiving light, the light that one body is used for that this incidence surface is received is atomized into face light, one exiting surface is used for launching this body atomizing face light that light produced, and one reflecting surface be used for reflecting this body atomizing face light that light produced, wherein this reflecting surface and this exiting surface are provided with in non-parallel mode.This light-emitting diode is arranged at a side of the incidence surface of this LGP, with this incidence surface emission excitation line tomorrow.This fluorescent material is arranged on this LGP, is used for absorbing the part excitation line that this light-emitting diode sends, and inspires the emission light that wavelength differs from the wavelength of the excitation line that this light-emitting diode sends according to this.
Description of drawings
Fig. 1 is the schematic diagram of first embodiment of the invention light-emitting diode (LED) backlight module.
Fig. 2 is the schematic diagram of second embodiment of the invention light-emitting diode (LED) backlight module.
Fig. 3 to Fig. 7 is the schematic diagram of different embodiments of the invention light-emitting diode (LED) backlight module.
Fig. 8 to Figure 19 is the schematic diagram of the various multi-form LGPs of the present invention.
The main element symbol description
10,50 light-emitting diode (LED) backlight modules, 12 LGPs
14 light-emitting diodes, 16 fluorescent material
18 shaped LED lampshades, 20 incidence surfaces
22 bodies, 24 exiting surfaces
26 reflectings surface, 28 light-emitting diode chip for backlight unit
30 encapsulating housings, 32 colloids
52 ultraviolet light-emitting diodes elements, 54 red fluorescence powders
56 blue colour fluorescent powders, 58 green emitting phosphors
60 ultraviolet light-emitting diodes chips
100 light-emitting diode (LED) backlight modules, 102 LGPs
104 light-emitting diodes, 106 fluorescent material
108 reflector elements, 110 brightness enhancement film
120 light-emitting diode (LED) backlight modules, 122 LGPs
124 light-emitting diodes, 126 fluorescent material
128 reflector elements, 130 brightness enhancement film
132 optical microstructures
140 light-emitting diode (LED) backlight modules, 142 LGPs
144 light-emitting diodes, 146 fluorescent material
148 reflector elements, 150 brightness enhancement film
152 optical microstructures
160 light-emitting diode (LED) backlight modules, 162 LGPs
164 light-emitting diodes, 166 fluorescent material
168 reflector elements, 170 brightness enhancement film
172 circuit boards, 174 light-emitting diode chip for backlight unit
176 colloids
180 light-emitting diode (LED) backlight modules, 182 LGPs
184 light-emitting diodes, 186 fluorescent material
188 reflector elements, 190 brightness enhancement film
192 circuit boards, 194 light-emitting diode chip for backlight unit
196 colloids
The specific embodiment
See also Fig. 1, Fig. 1 is the schematic diagram of first embodiment of the invention one light-emitting diode (LED) backlight module 10.Light-emitting diode (LED) backlight module 10 comprises a LGP (light guide plate) 12, one light-emitting diode 14, fluorescent material 16 and a shaped LED lampshade 18, and wherein shaped LED lampshade 18 optionally is arranged in the light-emitting diode (LED) backlight module 10.
LGP 12 comprises that an incidence surface 20, that is used for receiving light (excitation line LEX as shown in Figure 1) is used for the exiting surface 24 and that the body (body) 22, that the light that incidence surface 20 is received is atomized into face light (planner light) is used for launching the face light that body 22 atomized is used for the reflecting surface 26 of reflecting surface light.In the equivalence, the linear light line that LGP 12 is received incidence surface 20 (linear light) converts the face light of emission from exiting surface 24 to.
Light-emitting diode 14 is arranged at incidence surface 20 sides of LGP 12, with incidence surface 20 emissions tomorrow one excitation line LEX.Light-emitting diode 14 comprises that an encapsulating housing 30, is arranged at the light-emitting diode chip for backlight unit 28 and that is used for launching excitation line LEX in the encapsulating housing 30 and is filled in and is used for the colloid (gel material) 32 of covering luminousing diode chip 28 in the encapsulating housing 30, and colloid 32 can be made by light-transmitting materials such as epoxy resin (epoxy resin) or silica gel.
The excitation line LEX that light-emitting diode 14 is sent can be introduced into to body 22, be atomized into face excitation line LEX by body 22 again by incidence surface 20, wherein part face excitation line LEX can be absorbed by fluorescent material 16, fluorescent material 16 can absorb part excitation line LEX that light-emitting diode 14 sent, and inspire an emission light LPHO according to this, and the wavelength of emission light LPHO is different from the wavelength of excitation line LEX.Light-emitting diode chip for backlight unit 28 in the light-emitting diode 14 can be a blue LED chip, that is to say, light-emitting diode 14 can be launched blue excitation light LEX, and fluorescent material 16 can be yttrium aluminium garnet fluorescent powder (Yttrium Aluminum Garnet, YAG), it can absorb blue excitation light LEX that blue light emitting diode element 14 launched, and inspire yellow emission light LPHO according to this.Thus, because what light-emitting diode 14 was launched can be mixed into white light with the yellow emission light LPHO that yttrium aluminium garnet fluorescent powder is inspired by the residual blue excitation line LEX that yttrium aluminium garnet fluorescent powder absorbed, so the face light that the equivalent exiting surface 24 of going up LGP 12 is launched is white light.
In addition, light-emitting diode (LED) backlight module 10 also can select for use a red light-emitting diode chip or a green light LED chip to replace this blue LED chip, as the light-emitting diode 14 that sends excitation line LEX, correspondingly, YAG fluorescent material 16 also can be respectively with green+blue colour fluorescent powder, and red+blue fluorescent material replace.Thus, can be mixed into white light with green and the blue emission light LPHO that green+blue colour fluorescent powder is inspired owing to what light-emitting diode 14 launched by the red excitation line LEX of the residue that green+blue colour fluorescent powder absorbed; Or because the green excitation line LEX of residue that is not absorbed by red+blue fluorescent material that light-emitting diode 14 is launched can be mixed into white light with redness and the blue emission light LPHO that red+blue fluorescent material is inspired, so the face light that the equivalent exiting surface 24 of going up LGP 12 is launched is white light.
See also Fig. 2, Fig. 2 is the schematic diagram of second embodiment of the invention one light-emitting diode (LED) backlight module 50.Except LGP 12, and LED lampshade 18, light-emitting diode (LED) backlight module 50 also comprises a ultraviolet light (ultra violet, UV) light-emitting diode 52, red fluorescence powder 54, blue colour fluorescent powder 56, and green emitting phosphor 58, wherein, similarly, shaped LED lampshade 18 also optionally is provided with in the light-emitting diode (LED) backlight module 50.
Ultraviolet light-emitting diodes element 52 comprises that encapsulating housing 30, colloid 32 and are arranged at the ultraviolet light-emitting diodes chip 60 that is used for launching a ultraviolet excitation light LUVEX in the encapsulating housing 30.
Red fluorescence powder 54 is applied on the surface of encapsulating housing 30 of ultraviolet light-emitting diodes element 52, be used for absorbing the ultraviolet excitation light LUVEX1 of first that ultraviolet light-emitting diodes elements 52 sent, and inspire a red emission light LRPHO according to this, the wavelength of red emission light LRPHO is different from the wavelength of ultraviolet excitation light LUVEX; Blue colour fluorescent powder 56 is applied on the LGP 12, as shown in Figure 2, blue colour fluorescent powder 56 is applied on the exiting surface 24 of LGP 12, be used for absorbing second portion ultraviolet excitation light LUVEX2 that ultraviolet leds element 52 sent, and inspire a blue emission light LBPHO according to this, the wavelength of blue emission light LBPHO is different from the wavelength of ultraviolet excitation light LUVEX; Green emitting phosphor 58 oozes mixes in the body 22 of LGP 12, be used for absorbing the ultraviolet leds element 52 third part ultraviolet excitation light LUVEX3 that sends, also inspire a green emitted light LGPHO according to this, the wavelength of green emitted light LGPHO is different from the wavelength of ultraviolet excitation light LUVEX.
Because its wavelength of ultraviolet excitation light LUVEX that ultraviolet light-emitting diodes chip 60 is sent is between 280nm to 405nm, it all is shorter than the green emitted light LGPHO that red emission light LRPHO that red fluorescence powder 54 excited, blue emission light LBPHO that blue colour fluorescent powder 56 is excited and green emitting phosphor 58 are excited, so ultraviolet light-emitting diodes chip 60 really can be used as the light-emitting diode in the light-emitting diode (LED) backlight module of the present invention.
Thus, the green emitted light LGPHO that inspired of the red emission light LRPHO that inspired of the residual excitation light LUVEX that is not absorbed by red fluorescence powder 54, blue colour fluorescent powder 56 or green emitting phosphor 58 that launched of ultraviolet light-emitting diodes element 52 and red fluorescence powder 54, blue emission light LBPHO that blue colour fluorescent powder 56 is inspired and green emitting phosphor 58 can be mixed into white light.
Certainly, red fluorescence powder 54, blue colour fluorescent powder 56, and green emitting phosphor 58 also can be as previous embodiment difference or whole, smear or ooze mix in the encapsulating housing 30 of ultraviolet light-emitting diodes element 52 or its surperficial on, or incidence surface 20 places of LGP 12, on reflecting plate 26 and the exiting surface 24, or ooze and mix in body 22, as long as these fluorescent material are positioned on the excitation line path, rise from ultraviolet light-emitting diodes chip 60 in this excitation line path, inside by way of encapsulating housing 30, the surface of encapsulating housing 30, the incidence surface 20 of LGP 12, body 22, and reflecting plate 26, and eventually to exiting surface 24.
In the second embodiment of the present invention, light-emitting diode (LED) backlight module 50 comprises ultraviolet light-emitting diodes element 52, reaches three kinds of fluorescent material, that is red fluorescence powder 54, blue colour fluorescent powder 56, and green emitting phosphor 58, yet, the light-emitting diode (LED) backlight module that comprises ultraviolet light-emitting diodes element 52 in it of the present invention also can only comprise two kinds or even only comprise a kind of fluorescent material.
Specifically, if this light-emitting diode (LED) backlight module only comprises two kinds of fluorescent material, then the wavelength of these two kinds of emission light that fluorescent material excited can be respectively between 500nm to 570nm, and between between the 570nm to 655nm.In order to make human eye can experience preferable colour rendering, if this module application that only comprises two kinds of fluorescent material is in the environment on daytime, then the wavelength of these two kinds of emission light that fluorescent material excited can be respectively between 530nm to 570nm, and between between the 575nm to 625nm; On the other hand, if this module application is in the environment at night, then the wavelength of these two kinds of emission light that fluorescent material excited can be respectively between 500nm to 525nm, and between between the 630nm to 655nm.
If this module only comprises a kind of fluorescent material, the wavelength of the emission light that then this fluorescent material excited can be between 535nm ± 50nm.In order to make human eye can experience preferable colour rendering, in the environment on daytime, the wavelength of the emission light that then this fluorescent material excited can be between between the 535nm to 585nm as if this module application that only comprises a kind of fluorescent material; On the other hand, in the environment at night, the wavelength of the emission light that then this fluorescent material excited can be between between the 485nm to 530nm as if this module application.
In an embodiment of the present invention, be example all with the light-emitting diode (LED) backlight module that sends white light, yet light-emitting diode (LED) backlight module of the present invention also can blend the light of other colors by the setting of fluorescent material, no matter therefore whether the color of the light of light-emitting diode (LED) backlight module generation is white, as long as in light-emitting diode (LED) backlight module, fluorescent material is arranged on the LGP, all belong to category of the present invention.
See also Fig. 3, Fig. 3 is the schematic diagram of another embodiment of the present invention one light-emitting diode (LED) backlight module 100.Light-emitting diode (LED) backlight module 100 comprises a LGP 102, a light-emitting diode 104, fluorescent material 106, a reflector element 108, and a brightness enhancement film 110.Fluorescent material 106 is arranged between reflector element 108 and the LGP 102, and its action principle is not described in detail in this as previously mentioned; Reflector element 108 can be a reflector plate (reflecting sheet), is arranged at the below of LGP 102, is used for passing the light reflected back LGP 102 of LGP 102 downwards to increase the utilization rate of light; Brightness enhancement film 110 is arranged at exiting surface one side of LGP 102, is used for increasing light luminance.In addition, fluorescent material 106 also can be arranged at LGP 102 inside (exiting surface, incidence surface, reflecting surface, or body in), or is arranged between LGP 102 and the brightness enhancement film 110, is not described in detail in this.
See also Fig. 4, Fig. 4 is the schematic diagram of another embodiment of the present invention one light-emitting diode (LED) backlight module 120.Light-emitting diode (LED) backlight module 120 comprises a LGP 122, a light-emitting diode 124, fluorescent material 126, a reflector element 128, and a brightness enhancement film 130.Fluorescent material 126 is arranged between reflector element 128 and the LGP 122, and its action principle is not described in detail in this as previously mentioned; Reflector element 128 is to be used for and will to pass the light reflected back LGP 102 of LGP 102 downwards to increase the utilization rate of light; Brightness enhancement film 130 is arranged at the top of LGP 102, is used for increasing light luminance; The reflecting surface place, below that is LGP 122 with the previous embodiment difference is provided with a plurality of optical microstructures 132, and it can destroy the total reflection of light in LGP 122, and light refraction is gone out LGP 122.In addition, see also Fig. 5, Fig. 5 is the schematic diagram of another embodiment of the present invention one light-emitting diode (LED) backlight module 140.Light-emitting diode (LED) backlight module 140 comprises a LGP 142, a light-emitting diode 144, fluorescent material 146, a reflector element 148, and a brightness enhancement film 150.Fluorescent material 146 is arranged between reflector element 148 and the LGP 142, and its action principle is not described in detail in this as previously mentioned; Reflector element 148 is to be used for and will to pass the light reflected back LGP 142 of LGP 142 downwards to increase the utilization rate of light; Brightness enhancement film 150 is arranged at the top of LGP 142, is used for increasing light luminance; The exiting surface place, top that is LGP 142 with the previous embodiment difference is provided with a plurality of optical microstructures 152, and it can be used to the diffuse light line to brightness enhancement film 150.A plurality of optical microstructures of the present invention can be arranged at reflecting surface, incidence surface or the exiting surface of LGP, maybe can be arranged at reflector element or brightness enhancement film etc.; And fluorescent material 126 also can be arranged at LGP 122 inside (exiting surface, incidence surface, reflecting surface, or body in), or is arranged between LGP 122 and the brightness enhancement film 130, is not described in detail in this.
See also Fig. 6, Fig. 6 is the schematic diagram of another embodiment of the present invention one light-emitting diode (LED) backlight module 160.Light-emitting diode (LED) backlight module 160 comprises a LGP 162, a light-emitting diode 164, fluorescent material 166, a reflector element 168, and a brightness enhancement film 170.Fluorescent material 166 is arranged between reflector element 168 and the LGP 162, and its action principle is not described in detail in this as previously mentioned; Reflector element 168 is to be used for and will to pass the light reflected back LGP 162 of LGP 162 downwards to increase the utilization rate of light; Brightness enhancement film 170 is arranged at exiting surface one side of LGP 162, is used for increasing light luminance.Light-emitting diode 164 is that a plate carries chip light emitting diode element (Chip On Board LED), and it comprises a circuit board 172, and it can be a printed circuit board (PCB); One light-emitting diode chip for backlight unit 174 is installed on the circuit board 172, is used for launching light; And a colloid 176 that is used for covering luminousing diode chip 174, colloid 176 can be made by the material of printing opacities such as epoxy resin or silica gel, and wherein colloid 176 is put glue covering luminousing diode chip 174 and lead thereof fully.And light-emitting diode 164 is also applicable to the embodiment of Fig. 4 and Fig. 5, meaning is that this plate carries the chip light emitting diode element applicable to having reflecting element or having reflecting element and the light-emitting diode (LED) backlight module that is formed with the LGP of optical microstructures, its structural principle is same as present embodiment, is not described in detail in this.
See also Fig. 7, Fig. 7 is the schematic diagram of another embodiment of the present invention one light-emitting diode (LED) backlight module 180.Light-emitting diode (LED) backlight module 180 comprises a LGP 182, a light-emitting diode 184, fluorescent material 186, a reflector element 188, and a brightness enhancement film 190.Fluorescent material 186 is arranged between reflector element 188 and the LGP 182, and its action principle is not described in detail in this as previously mentioned; Reflector element 188 is to be used for and will to pass the light reflected back LGP 182 of LGP 182 downwards to increase the utilization rate of light; Brightness enhancement film 190 is arranged at exiting surface one side of LGP 182, is used for increasing light luminance.Light-emitting diode 184 is that a plate carries the chip light emitting diode element, and it comprises a circuit board 192, and it can be a printed circuit board (PCB); One light-emitting diode chip for backlight unit 194 is installed on the circuit board 192, is used for launching light; An and colloid 196 that is used for covering luminousing diode chip 194; colloid 196 can be made by the material of epoxy resin or silica gel; colloid 196 part point glue covering luminousing diode chips 194 wherein; meaning i.e. the conductor part of covering luminousing diode chip 194 only; avoid wire fracture with guardwire, it can put the conductor part and the non-conductor part saving cost of glue covering luminousing diode chip fully than the embodiment colloid of Fig. 6.And light-emitting diode 194 is also applicable to the embodiment of Fig. 4 and Fig. 5, meaning is that this plate carries the chip light emitting diode element applicable to having reflecting element or having reflecting element and the light-emitting diode (LED) backlight module that is formed with the LGP of optical microstructures, its structural principle is same as present embodiment, is not described in detail in this.In addition, Fig. 6 in like manner of the present invention and Fig. 7 also can be provided with reflecting surface, incidence surface, the exiting surface of a plurality of optical microstructures in LGP, or in the body, maybe can be arranged at reflector element or brightness enhancement film etc.; And fluorescent material 186 also can be arranged at LGP 182 inside (exiting surface, incidence surface, reflecting surface, or body in), or is arranged between LGP 182 and the brightness enhancement film 190, is not described in detail in this.
In addition, LGP 12 of the present invention can be clapboard or flat board.The space of notebook computer Yin Qinei is limited, and all mostly adopt the wedge shape LGP, the plate LGP of the then many employings of LCD display.LGP 12 is provided with network point distribution (pattern, show), its can destroy incidence surface 20 light that receives interference, also and then with the linear light line evenly convert face light to.The manufacturing technology of network point distribution can be divided into two kinds of printing-type (sanction plate) and non-printing-types (ejaculation plate) approximately, the former utilizes the wire mark mode that printing ink is imprinted on the acrylic plate, to make the optics network point distribution, the latter is then directly with ejection forming technique, network point distribution is designed in mould steel, relatively, the processing procedure of non-printing-type is comparatively simple and precision is high, is the mainstream technology of present LGP.
Compared to conventional art, light-emitting diode (LED) backlight module of the present invention be with fluorescent material be arranged at reflecting surface, exiting surface or the incidence surface place of LGP, maybe can mix on the encapsulating housing that is formed on light-emitting diode and LGP on.Thus, light-emitting diode (LED) backlight module of the present invention just can be launched the white light with high-luminous-efficiency, or can blend the light of other colors by the setting of fluorescent material.Moreover, by in reflecting surface, the incidence surface of LGP, or form the structural design of corner angle on the exiting surface, can adjust rising angle effectively, and then increase the light extraction efficiency of LGP.
The above only is the preferred embodiments of the present invention, and is all according to equalization variation and modification that the present invention did, all should belong to covering scope of the present invention.
Claims (35)
1. light-emitting diode (LED) backlight module with fluorescent material comprises:
One LGP, it comprises:
One incidence surface is used for receiving light;
One body, the light that is used for that this incidence surface is received is atomized into face light;
One exiting surface is used for launching this body atomizing face light that light produced; And
One reflecting surface is used for reflecting this body atomizing face light that light produced, and this reflecting surface and this exiting surface are provided with in non-parallel mode;
One light-emitting diode is arranged at a side of this incidence surface of this LGP, with this incidence surface emission excitation line tomorrow; And
Fluorescent material is arranged on this LGP, is used for absorbing the part excitation line that this light-emitting diode sends, and inspires the emission light that wavelength differs from the wavelength of the excitation line that this light-emitting diode sends according to this.
2. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is to ooze to mix in the body of this LGP.
3. light-emitting diode (LED) backlight module according to claim 2, wherein this fluorescent material is for sneaking into the plastics of the body that is used for making this LGP according to a predetermined ratio, and by the mode of mould ejection formation, intersperses among in the body of this LGP.
4. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is for sneaking in a chemical solvent, and this chemical solvent is coated on this LGP with ink-jetting style.
5. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material be formed on this incidence surface of this LGP, on the exiting surface of this LGP, or on the reflecting surface of this LGP.
6. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is in the glue of sneaking on being coated on this LGP.
7. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is coated on this LGP in the mode of coating a cathode-ray tube.
8. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is to coat on the diaphragm of transparent printing opacity, and this diaphragm of coating this fluorescent material is attached on this incidence surface of this LGP, on the exiting surface of this LGP, or on the reflecting surface of this LGP.
9. light-emitting diode (LED) backlight module according to claim 1, wherein this fluorescent material is to mix with the translucent material heating to form a diaphragm after cooling, and this diaphragm is attached on this incidence surface of this LGP, on the exiting surface of this LGP, or on the reflecting surface of this LGP.
10. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a blue light emitting diode element, and this fluorescent material be yttrium aluminium garnet fluorescent powder (YttriumAluminum Garnet, YAG).
11. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a green light LED element, and this fluorescent material comprises blue colour fluorescent powder and red fluorescence powder.
12. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a red light-emitting diode element, and this fluorescent material comprises blue colour fluorescent powder and green emitting phosphor.
13. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a ultraviolet light (ultra violet, a UV) light-emitting diode, and this fluorescent material comprises blue colour fluorescent powder.
14. light-emitting diode (LED) backlight module according to claim 13, wherein this fluorescent material also comprises yttrium aluminium garnet fluorescent powder.
15. light-emitting diode (LED) backlight module according to claim 13, wherein this fluorescent material also comprises green emitting phosphor and red fluorescence powder.
16. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a ultraviolet light-emitting diodes element, and the wavelength of the emission light that this fluorescent material excited is between between the 500nm to 570nm.
17. light-emitting diode (LED) backlight module according to claim 16, the wavelength of the emission light that wherein this fluorescent material excited is between between the 530nm to 570nm or between the 500nm to 525nm.
18. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is a ultraviolet light-emitting diodes element, and the wavelength of the emission light that this fluorescent material excited is between 500nm to 570nm or between between the 570nm to 655nm.
19. light-emitting diode (LED) backlight module according to claim 18, the wavelength of the emission light that wherein this fluorescent material excited is between 535nm to 585nm or between between the 575nm to 625nm.
20. light-emitting diode (LED) backlight module according to claim 18, the wavelength of the emission light that wherein this fluorescent material excited is between 500nm to 525nm or between between the 630nm to 655nm.
21. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode comprises:
One encapsulating housing; And
One light-emitting diode chip for backlight unit is arranged in this encapsulating housing, is used for launching excitation line.
22. light-emitting diode (LED) backlight module according to claim 19, wherein this encapsulating housing is provided with fluorescent material.
23. light-emitting diode (LED) backlight module according to claim 1 wherein is formed with at least one corner angle on this reflecting surface.
24. light-emitting diode (LED) backlight module according to claim 1 wherein is formed with at least one corner angle on this exiting surface.
25. light-emitting diode (LED) backlight module according to claim 1 wherein is formed with at least one corner angle on this incidence surface.
26. light-emitting diode (LED) backlight module according to claim 1, it also comprises a reflector element, and the below that it is arranged at this LGP is used for and will passes this LGP of light reflected back of this LGP downwards.
27. light-emitting diode (LED) backlight module according to claim 1, it also comprises a brightness enhancement film, is arranged at a side of this exiting surface of this LGP, is used for increasing light luminance.
28. light-emitting diode (LED) backlight module according to claim 1, it also comprises a plurality of optical microstructures, it is arranged at this reflecting surface, this incidence surface or this exiting surface of this LGP, these a plurality of optical microstructures are to be used for destroying the total reflection of light in this LGP, so as to light refraction being gone out this LGP.
29. light-emitting diode (LED) backlight module according to claim 1, wherein this light-emitting diode is that a plate carries the chip light emitting diode element.
30. light-emitting diode (LED) backlight module according to claim 29, wherein this light-emitting diode comprises:
One circuit board;
One light-emitting diode chip for backlight unit is installed on this circuit board, is used for launching light; And
Colloid is used for covering this light-emitting diode chip for backlight unit.
31. light-emitting diode (LED) backlight module according to claim 30, wherein this circuit board is a printed circuit board (PCB).
32. light-emitting diode (LED) backlight module according to claim 30, wherein this colloid is made by the light transmission material.
33. light-emitting diode (LED) backlight module according to claim 30, wherein this colloid is made by epoxy resin or silica gel material.
34. light-emitting diode (LED) backlight module according to claim 30, wherein this colloid is put glue fully and is covered this light-emitting diode chip for backlight unit and lead thereof.
35. light-emitting diode (LED) backlight module according to claim 30, wherein this colloid covers the conductor part of this light-emitting diode chip for backlight unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810136069A CN101625076A (en) | 2008-07-11 | 2008-07-11 | Light-emitting diode (LED) backlight module with fluorescent powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810136069A CN101625076A (en) | 2008-07-11 | 2008-07-11 | Light-emitting diode (LED) backlight module with fluorescent powder |
Publications (1)
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| CN101625076A true CN101625076A (en) | 2010-01-13 |
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| CN200810136069A Pending CN101625076A (en) | 2008-07-11 | 2008-07-11 | Light-emitting diode (LED) backlight module with fluorescent powder |
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| CN102073090A (en) * | 2010-11-05 | 2011-05-25 | 深圳市华星光电技术有限公司 | Light guide plate and backlight module |
| CN102287759A (en) * | 2010-06-15 | 2011-12-21 | 鸿富锦精密工业（深圳）有限公司 | Light guide plate and backlight module |
| CN102374492A (en) * | 2010-08-12 | 2012-03-14 | 海洋王照明科技股份有限公司 | Light guide plate and preparation method thereof, light-emitting diode (LED) plane light source and display |
| WO2012155377A1 (en) * | 2011-05-19 | 2012-11-22 | 深圳市华星光电技术有限公司 | Light guide plate using uv light source and backlight display module thereof |
| CN103168260A (en) * | 2010-10-28 | 2013-06-19 | 皇家飞利浦电子股份有限公司 | Lighting device with waveguide plate |
| CN103277710A (en) * | 2012-10-30 | 2013-09-04 | 厦门天马微电子有限公司 | Backlight system and liquid crystal display module |
| WO2013139049A1 (en) * | 2012-03-19 | 2013-09-26 | 深圳市华星光电技术有限公司 | Side-type backlight module |
| WO2014101255A1 (en) * | 2012-12-29 | 2014-07-03 | 欧普照明股份有限公司 | Led package structure |
| CN106461182A (en) * | 2014-06-05 | 2017-02-22 | 飞利浦照明控股有限公司 | Luminescence concentrator with increased efficiency |
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| CN102287759A (en) * | 2010-06-15 | 2011-12-21 | 鸿富锦精密工业（深圳）有限公司 | Light guide plate and backlight module |
| CN102374492A (en) * | 2010-08-12 | 2012-03-14 | 海洋王照明科技股份有限公司 | Light guide plate and preparation method thereof, light-emitting diode (LED) plane light source and display |
| CN103168260B (en) * | 2010-10-28 | 2016-10-19 | 皇家飞利浦电子股份有限公司 | There is the luminaire of waveguide plate |
| CN103168260A (en) * | 2010-10-28 | 2013-06-19 | 皇家飞利浦电子股份有限公司 | Lighting device with waveguide plate |
| CN102073090B (en) * | 2010-11-05 | 2012-08-22 | 深圳市华星光电技术有限公司 | Light guide plate and backlight module |
| CN102073090A (en) * | 2010-11-05 | 2011-05-25 | 深圳市华星光电技术有限公司 | Light guide plate and backlight module |
| WO2012155377A1 (en) * | 2011-05-19 | 2012-11-22 | 深圳市华星光电技术有限公司 | Light guide plate using uv light source and backlight display module thereof |
| US8680492B2 (en) * | 2011-05-19 | 2014-03-25 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Light guide plate and backlight module utilizing ultraviolet light source |
| WO2013139049A1 (en) * | 2012-03-19 | 2013-09-26 | 深圳市华星光电技术有限公司 | Side-type backlight module |
| CN103277710A (en) * | 2012-10-30 | 2013-09-04 | 厦门天马微电子有限公司 | Backlight system and liquid crystal display module |
| WO2014101255A1 (en) * | 2012-12-29 | 2014-07-03 | 欧普照明股份有限公司 | Led package structure |
| CN106461182A (en) * | 2014-06-05 | 2017-02-22 | 飞利浦照明控股有限公司 | Luminescence concentrator with increased efficiency |
| US10422942B2 (en) | 2014-06-05 | 2019-09-24 | Signify Holding B.V. | Luminescence concentrator |
| CN114203033A (en) * | 2021-11-16 | 2022-03-18 | 深圳市高展光电有限公司 | Prevent blue light display screen subassembly |
| CN114203033B (en) * | 2021-11-16 | 2023-09-08 | 深圳市高展光电有限公司 | Blue light prevention display screen assembly |
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