CN220584634U - Wireless 4G data acquisition heterogeneous computer host - Google Patents
Wireless 4G data acquisition heterogeneous computer host Download PDFInfo
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- CN220584634U CN220584634U CN202322334261.4U CN202322334261U CN220584634U CN 220584634 U CN220584634 U CN 220584634U CN 202322334261 U CN202322334261 U CN 202322334261U CN 220584634 U CN220584634 U CN 220584634U
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- data acquisition
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- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 239000000428 dust Substances 0.000 claims abstract description 16
- 230000002265 prevention Effects 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 4
- 238000013480 data collection Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000699670 Mus sp. Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a wireless 4G data acquisition heterogeneous computer host, which comprises a heat-radiating and dust-preventing mechanism, wherein the heat-radiating and dust-preventing mechanism comprises a case, a vertical plate is fixedly connected inside the case, a main board is fixedly connected to the upper side of the vertical plate, a main board element is fixedly arranged on the surface of the main board, a protection frame is fixedly connected to the inner side of the case, and the heat-radiating mechanism is fixedly connected inside the protection frame. According to the utility model, through the arrangement of the heat dissipation and dust prevention mechanism, when the main board and the main board element are operated, the fan is driven by the motor to rotate and blow against the main board and the main board element, the baffle is horizontally arranged by rotating, so that the vent is exposed, heat generated when the main board and the main board element are operated can be dissipated, the baffle is reset and vertically arranged when the main board and the main board element are not started, the vent is prevented from being blocked, external dust can be prevented from entering the inside of the case, and a large amount of dust can be effectively placed into the case to influence the heat dissipation of the main board and the main board element.
Description
Technical Field
The utility model relates to the technical field of wireless 4G data acquisition heterogeneous computing hosts, in particular to a wireless 4G data acquisition heterogeneous computing host.
Background
The wireless 4G data acquisition heterogeneous computing host is a computing device with wireless data acquisition capability and supporting heterogeneous computing. The device combines wireless communication technology with heterogeneous computing architecture, and aims to meet the application requirements of acquiring remote data and performing high-performance computing.
When data are required to be collected remotely and high-performance calculation can be performed, a wireless 4G data collection heterogeneous calculation host is generally used, so that a CPU can operate better, at present, most of the existing wireless 4G data collection heterogeneous calculation hosts adopting air cooling are provided with an air outlet, hot air in the host can be better dispersed, but impurities such as external dust enter the host through the air outlet, so that the host can generate a large amount of dust to influence the operation of the host in long-time operation, and the practicability is poor.
Disclosure of Invention
The utility model mainly solves the technical problems existing in the prior art and provides a wireless 4G data acquisition heterogeneous computing host.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a wireless 4G data acquisition heterogeneous computer, but including heat dissipation and dust prevention mechanism, but heat dissipation and dust prevention mechanism include quick-witted case, the inside fixedly connected with riser of machine case, the upside fixedly connected with mainboard of riser, the fixed surface of mainboard installs the mainboard component, the inboard fixedly connected with guard frame of machine case, the inside fixedly connected with heat dissipation mechanism of guard frame, heat dissipation mechanism includes the installing frame, the inside fixedly connected with dead lever of installing frame, the one end fixed mounting of dead lever has the motor, the output fixedly connected with fan of motor, the draw-in groove has been seted up on one side surface of machine case, the inside of draw-in groove is through bolt fixedly connected with closing cap, the vent has been run through on the surface of closing cap, the inside rotation of vent is connected with the baffle, mainboard component and the integrated circuit board of mainboard synthesis, and the mainboard component is provided with a plurality of, and the effect of every is all inequality, has CPU, GPU, protocol processor, communication module, memory module, safety chip respectively.
Preferably, the heat dissipation mechanism is arranged on one side of the main board, three heat dissipation mechanisms are arranged, wind power through the heat dissipation mechanism blows to the main board, and heat dissipated by the operation of the main board is dissipated through the ventilation opening.
Preferably, the upside fixedly connected with wiring mechanism of mainboard, wiring mechanism includes first slot, the inside of first slot is provided with the collecting plate, one side fixedly connected with second slot of collecting plate, the inside of second slot is provided with the layering board, and first slot is provided with two for the collecting plate can be installed more firmly some, and second slot and layering board all are provided with a plurality of, can carry out the wiring processing of layering with the circuit.
Preferably, the integrated board is connected with the first slot in a clamping manner, and the laminated board is connected with the second slot in a clamping manner, so that the assembly and the disassembly are more convenient, and the assembly and the disassembly of the laminated board and the second slot are also more convenient.
Preferably, the downside fixedly connected with heating panel of mainboard, the mounting groove has been seted up to the inside of riser, the mainboard passes through bolt fixed connection with the riser, and the bolt goes into in the mounting groove spiro union to the mainboard in, hides the bolt through the mounting groove.
Preferably, the inside fixedly connected with picture peg of machine case, picture peg and mainboard electric connection are provided with a plurality of interface in the inside of picture peg, are USB port, HDMI port and Type-C port respectively.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the arrangement of the heat dissipation and dust prevention mechanism, when the main board and the main board element are operated, the fan is driven by the motor to rotate and blow against the main board and the main board element, the baffle is horizontally arranged by rotating, so that the vent is exposed, heat generated when the main board and the main board element are operated can be dissipated, the baffle is reset and vertically arranged when the main board and the main board element are not started, the vent is prevented from being blocked, external dust can be prevented from entering the inside of the case, and a large amount of dust can be effectively placed into the case to influence the heat dissipation of the main board and the main board element.
2. According to the utility model, through the arrangement of the first slot on the upper side of the main board, the collecting board is fixed on the upper side of the main board through the first slot, the layering board is fixed on one side of the collecting board through the second slot, and the layering boards are provided with a plurality of layers, so that the circuits connected with the main board can be distributed on the upper side of the layering board for wiring treatment, the wiring space is larger, and some circuits can be classified, so that the connection effect of the arranged circuits can be better known, and the circuit layout in the case can be more orderly.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic side view of the overall structure of the present utility model;
FIG. 2 is a schematic side view in cross section of a first embodiment of the present utility model;
FIG. 3 is a schematic diagram of a second side view in cross section of the present utility model;
fig. 4 is a schematic top view in cross section of the present utility model.
In the figure: 1. a chassis; 2. a vertical plate; 3. a main board; 4. a main board element; 5. a protective frame; 6. a mounting frame; 7. a fixed rod; 8. a motor; 9. a fan; 10. a clamping groove; 11. a closing cap; 12. a vent; 13. a baffle; 14. a first slot; 15. a collecting plate; 16. a second slot; 17. a laminated plate; 18. a heat dissipation plate; 19. a mounting groove; 20. and (5) inserting plates.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, a wireless 4G data collection heterogeneous computing host machine comprises a heat dissipation and dust prevention mechanism, the heat dissipation and dust prevention mechanism comprises a case 1, a vertical plate 2 is fixedly connected to the inside of the case 1, a main board 3 is fixedly connected to the upper side of the vertical plate 2, a main board element 4 is fixedly arranged on the surface of the main board 3, a protection frame 5 is fixedly connected to the inside of the case 1, the heat dissipation mechanism is fixedly connected to the inside of the protection frame 5 and comprises a mounting frame 6, a fixing rod 7 is fixedly connected to the inside of the mounting frame 6, a motor 8 is fixedly arranged at one end of the fixing rod 7, a fan 9 is fixedly connected to the output end of the motor 8, a clamping groove 10 is formed in one side surface of the case 1, a sealing cover 11 is fixedly connected to the inside of the clamping groove 10 through bolts, a vent 12 is formed in a penetrating manner on the surface of the sealing cover 11, a baffle 13 is rotatably connected to the inside of the vent 12, and the heat dissipation mechanism is arranged on one side of the main board 3, three heat dissipation mechanisms are arranged when the main board 3 and the main board element 4 on the upper surface of the main board are in a certain extent, in order to avoid damaging the main board element 4 due to high temperature, a fan 3 and the element 4 are in a certain extent, a fan 9 is driven by the fan 8, and the fan 3 is not in a certain amount of being driven to rotate, and the main board element 4 is in a certain amount, and the inside of the main board element is prevented from being exposed to the inside the main board 3 and the main board element 3 and the vent element is in a certain state, and the vent 13 is in a certain state, and the case is in a certain state, and the air 13 is not is in a certain state, and is in the condition is in front of a certain state and is capable of being exposed to be in a certain condition; the main board element 4 is provided with a plurality of components, and each component has different functions and is respectively provided with a CPU, a GPU, a protocol processor, a communication module, a storage module and a security chip.
In one aspect of the present embodiment, the integrated board 15 is fixed on the upper side of the motherboard 3 through the first slot 14, the laminated board 17 is fixed on one side of the integrated board 15 through the second slot 14, and the laminated board 17 is provided with a plurality of wires connected to the motherboard 3 can be distributed on the upper side of the laminated board 17 for wiring treatment, so that the space for wiring is large, and some wires can be classified, so that the arranged wires can better know the effect of connection thereof, so that the circuit layout inside the chassis 1 looks more orderly.
In one aspect of this embodiment, heat is generated during operation of the motherboard 3 and motherboard component 4, and is conducted through the heat dissipation plate 18, such that the motherboard 3 and motherboard component 4 can be damaged by the heat, and the heat can be well dissipated through the fins on the heat dissipation plate 18, and the bolts are screwed into the mounting grooves 19 to fix the motherboard 3 and the riser 2 together.
In one aspect of this embodiment, the board is fixed inside the inner wall of the chassis 1 by bolts, and is electrically connected to the motherboard 3 by wires, and the ports in the board 20 can be used to connect external devices such as sensors, cameras, displays, keyboards, mice, and the like.
The working principle of the utility model is as follows: this wireless 4G data acquisition heterogeneous computing host computer is when using, realize wireless 4G's data acquisition work through the setting of communication module and long-range management system that include in the mainboard component 4, and be used for different grade type computational task through CPU and GPU that include in the mainboard component 4, thereby this host computer can be better carry out high performance's operation, this kind of operation is called heterogeneous calculation, can produce the heat at mainboard 3 and mainboard component 4 when the operation, the heat can be derived through heating panel 18, but the heat still can stay in quick-witted case 1, drive fan 9 through motor 8 and rotate and blow to mainboard 3 and mainboard component 4, through rotating baffle 13, make baffle 13 be the setting of transversely putting, make vent 12 expose, can dispel the heat that mainboard 3 and mainboard component 4 produced when not starting, reset baffle 13 and erect setting, prevent vent 12, can prevent that outside dust from entering into the inside of quick-witted case 1, can effectually place inside that a large amount of dust from entering into machine case 1 and causing the influence to mainboard 3 and component 4, all electric consumption equipment in this scheme all carry out the heat dissipation through external power supply.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. Wireless 4G data acquisition heterogeneous computer host computer, but including heat dissipation and dust prevention mechanism, its characterized in that: but heat dissipation and dust prevention mechanism includes quick-witted case (1), the inside fixedly connected with riser (2) of machine case (1), the upside fixedly connected with mainboard (3) of riser (2), the fixed surface of mainboard (3) installs mainboard component (4), the inboard fixedly connected with guard frame (5) of machine case (1), the inside fixedly connected with cooling mechanism of guard frame (5), cooling mechanism includes installing frame (6), the inside fixedly connected with dead lever (7) of installing frame (6), the one end fixedly connected with motor (8) of dead lever (7), the output fixedly connected with fan (9) of motor (8), draw-in groove (10) have been seted up on one side surface of machine case (1), the inside of draw-in groove (10) is through bolt fixedly connected with closing cap (11), vent (12) have been seted up in the surface of closing cap (11), the inside rotation of vent (12) is connected with baffle (13).
2. The wireless 4G data acquisition heterogeneous computing host of claim 1, wherein: the heat dissipation mechanism is arranged on one side of the main board (3), and three heat dissipation mechanisms are arranged.
3. The wireless 4G data acquisition heterogeneous computing host of claim 1, wherein: the wiring mechanism is fixedly connected to the upper side of the main board (3), the wiring mechanism comprises a first slot (14), a collecting board (15) is arranged in the first slot (14), a second slot (16) is fixedly connected to one side of the collecting board (15), and a laminated board (17) is arranged in the second slot (16).
4. The wireless 4G data acquisition heterogeneous computing host of claim 3, wherein: the collecting plate (15) is clamped with the first slot (14), and the layering plate (17) is clamped with the second slot (16).
5. The wireless 4G data acquisition heterogeneous computing host of claim 1, wherein: the lower side fixedly connected with heating panel (18) of mainboard (3), mounting groove (19) have been seted up to the inside of riser (2), mainboard (3) pass through bolt fixed connection with riser (2).
6. The wireless 4G data acquisition heterogeneous computing host of claim 1, wherein: the inside of the case (1) is fixedly connected with a plugboard (20), and the plugboard (20) is electrically connected with the main board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322334261.4U CN220584634U (en) | 2023-08-28 | 2023-08-28 | Wireless 4G data acquisition heterogeneous computer host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322334261.4U CN220584634U (en) | 2023-08-28 | 2023-08-28 | Wireless 4G data acquisition heterogeneous computer host |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220584634U true CN220584634U (en) | 2024-03-12 |
Family
ID=90116396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322334261.4U Active CN220584634U (en) | 2023-08-28 | 2023-08-28 | Wireless 4G data acquisition heterogeneous computer host |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220584634U (en) |
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2023
- 2023-08-28 CN CN202322334261.4U patent/CN220584634U/en active Active
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