CN112835434A

CN112835434A - A server and its external modular cooling mechanism

Info

Publication number: CN112835434A
Application number: CN202110057866.6A
Authority: CN
Inventors: 孙建英
Original assignee: Inspur Electronic Information Industry Co Ltd
Current assignee: IEIT Systems Co Ltd
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-05-25

Abstract

The invention discloses an external modular heat dissipation mechanism, which comprises a first fan assembly arranged on the outer surface of one side wall of a case and used for blowing outside cold air into it, and a first fan assembly arranged on the outer surface of the other side wall of the case The second fan assembly is used to extract the hot air in it to the outside, and the first fan assembly and the second fan assembly can be detachably connected to the chassis. In this way, since the first fan assembly and the second fan assembly are arranged outside the side wall of the chassis and do not occupy any internal installation space of the chassis, more installation space can be reserved for the reasonable installation and arrangement of electronic components. Therefore, the air circulation gap in the chassis can be increased, so that the air can pass through more quickly and complete the circulation, thereby improving the heat dissipation efficiency from the inside to the outside. At the same time, the two will not be hindered by nearby electronic components during disassembly and assembly, so it is more convenient to disassemble and assemble. The invention also discloses a server, which has the above beneficial effects.

Description

Server and external modular heat dissipation mechanism thereof

Technical Field

The invention relates to the technical field of servers, in particular to an external modularized heat dissipation mechanism. The invention also relates to a server.

Background

With the development of the electronic technology in China, more and more electronic devices have been widely used.

Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application server, a WEB server and the like according to different service types provided by the server. The main components of the server include a processor, a hard disk, a memory, a system bus, etc., similar to a general computer architecture.

In the big data era, a large number of IT devices are centrally located in a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each type of IT equipment is composed of various hardware boards, such as a computing module, a memory module, a chassis, a fan module, and the like. The integrated installation of various modules in the server generates a large amount of heat, and therefore, the heat needs to be dissipated in time. Among many heat dissipation designs of servers, an air cooling design is the most used design method in various application scenarios.

At present, a plurality of cooling fans are generally arranged in a server chassis to realize air cooling and heat dissipation, and a heating element is sealed in the chassis and then cooled by corresponding heat dissipation equipment. During the period, heat is conducted and local heat exchange convection is conducted after the heat is generated by the self-heating element, the heat is transmitted to the heat exchange surface of the radiator through the local enhanced heat dissipation design, convection heat exchange is conducted at the heat exchange surface, the heat is injected into cooling media from the heat exchange surface, and the cooling media after heat exchange are discharged out of the case by means of the installation space in the case.

However, the heat dissipation fan needs to occupy the installation space of the chassis in the chassis, and in order to obtain a larger heat dissipation efficiency, the heat dissipation fan needs to occupy more installation space, which results in that the rest of electronic components are difficult to install in the chassis, and further causes the arrangement of the electronic components in the chassis to become tighter, resulting in a narrower gap for air to flow, and the heat is difficult to be dissipated to the outside quickly. Meanwhile, a plurality of cooling fans and electronic components are all mounted in the case in a crowded manner, and the cooling fans and the electronic components are also very inconvenient to disassemble and assemble.

Therefore, how to avoid occupying the installation space in the case on the basis of meeting the heat dissipation requirement of the server, the electronic components can be conveniently installed and arranged, the heat dissipation efficiency is improved, and the dismounting operation is convenient, which is a technical problem faced by technical personnel in the field.

Disclosure of Invention

The invention aims to provide an external modularized heat dissipation mechanism, which avoids occupying the installation space in a case on the basis of meeting the heat dissipation requirement of a server, is convenient for installation and arrangement of electronic components, improves the heat dissipation efficiency and is convenient for disassembly and assembly. Another object of the present invention is to provide a server.

In order to solve the technical problems, the invention provides an external modular heat dissipation mechanism, which comprises a first fan assembly and a second fan assembly, wherein the first fan assembly is arranged on the outer surface of the side wall of one side of a case and used for blowing external cold air into the case, the second fan assembly is arranged on the outer surface of the side wall of the other side of the case and used for pumping hot air in the case to the outside, and the first fan assembly and the second fan assembly are detachably connected with the case.

Preferably, the first fan assembly is disposed on an outer surface of a circumferential side wall of the chassis, and the second fan assembly is disposed on an outer surface of a vertical side wall of the chassis.

Preferably, the first fan assembly includes a plurality of fan modules and ventilation modules, and each of the fan modules and the ventilation modules are arranged on an end surface of an opening of a side wall of the chassis.

Preferably, a plurality of first mounting grooves and second mounting grooves are formed in the end face of the opening of the side wall of the case, first mounting columns matched with the first mounting grooves in a clamping mode are arranged on the fan modules and used for corresponding to the fan modules, and second mounting columns matched with the second mounting grooves in a clamping mode are arranged on the ventilation modules and used for corresponding to the fan modules.

Preferably, a plurality of through ventilation holes are formed in the ventilation module, and a dustproof membrane used for filtering impurities in the air flow flowing through the ventilation holes is arranged in the ventilation module.

Preferably, a movable plate is slidably inserted into a side wall of the ventilation module, and the dustproof film is slidably inserted into a side wall of the movable plate.

Preferably, the second fan assembly comprises an air box arranged on the outer surface of the side wall of the case and communicated with the inside of the case, a driving motor arranged on the air box, and an exhaust shaft which is rotatably arranged in the air box, connected with an output shaft of the driving motor and used for pumping hot air in the case to the outside, and a plurality of blades are axially arranged on the exhaust shaft.

Preferably, the second fan assembly further comprises a dust screen covering the surface of the bellows.

Preferably, the heat dissipation device further comprises a heat dissipation plate arranged on the outer surface of the side wall of the case, and a heat conduction member which extends into the case and is in contact with the heating element is arranged on the bottom surface of the heat dissipation plate.

The invention also provides a server, which comprises a case and an external modular heat dissipation mechanism arranged on the case, wherein the external modular heat dissipation mechanism is specifically any one of the external modular heat dissipation mechanisms.

The invention provides an external modularized heat dissipation mechanism which mainly comprises a first fan assembly and a second fan assembly. The first fan assembly is arranged on the outer surface of the side wall of one side of the case, is communicated with the inside of the case and is mainly used for blowing (or pumping) outside cold air into the case to form a forced convection heat dissipation effect on electronic components in the case. The second fan assembly is arranged on the outer surface of the side wall of the other side of the case and is mainly used for being matched with the first fan assembly to pump out (or discharge) heat accumulated in the case and hot air absorbing the heat to the outside of the case, so that the outside cold air blown into the case by the first fan assembly is quickly discharged after absorbing the heat, and the circulation is repeated to quickly and forcibly dissipate heat by convection for each heating element (each electronic component) installed in the case. And, first fan subassembly and second fan subassembly all detachably set up on the quick-witted case, can conveniently carry out dismouting operation on the quick-witted case. Therefore, the external modularized heat dissipation mechanism provided by the invention blows external cold air into the case through the first fan assembly, discharges internal hot air to the outside of the case through the second fan assembly, and realizes forced convection heat dissipation of electronic components in the case through the cooperative operation of the first fan assembly and the second fan assembly, thereby meeting the heat dissipation requirements of the server. Compared with the prior art, because first fan subassembly and second fan subassembly all set up outside the lateral wall of quick-witted case to do not occupy the internally mounted space of any quick-witted case, consequently can reserve more installation space and supply electronic components and parts to rationally install and arrange, thereby can increase the air current circulation clearance of quick-witted incasement, make the air current pass through more fast and accomplish and circulate, and then can improve the heat from interior to exterior and disperse efficiency. Meanwhile, the first fan assembly and the second fan assembly are arranged outside the case, so that the first fan assembly and the second fan assembly are not obstructed by nearby electronic components during disassembly and assembly, and the disassembly and assembly are more convenient.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.

Fig. 2 is an exploded view of the first fan assembly.

Fig. 3 is a schematic view showing a specific structure of the ventilation module.

Fig. 4 is an exploded view of the second fan assembly.

Fig. 5 is a schematic view of the mounting structure of the heat dissipation plate on the chassis.

Wherein, in fig. 1-5:

the fan comprises a case-1, a first fan assembly-2, a second fan assembly-3, a heat dissipation plate-4 and a heat conduction piece-5;

the air conditioner comprises a first installation groove-11, a second installation groove-12, a fan module-21, a ventilation module-22, an air box-31, a driving motor-32, an exhaust shaft-33, fan blades-34 and a dust screen-35;

the first mounting column-211, the second mounting column-221, the vent-hole-222, the dustproof film-223, the movable plate-224, the lifting block-225 and the notch-226.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.

In one embodiment of the present invention, the external modular heat dissipation mechanism mainly includes a first fan assembly 2 and a second fan assembly 3.

The first fan assembly 2 is arranged on the outer surface of the side wall of one side of the case 1, is communicated with the inside of the case 1, and is mainly used for blowing (or pumping) outside cold air into the case 1 to form a forced convection heat dissipation effect on electronic components in the case 1.

The second fan assembly 3 is arranged on the outer surface of the other side wall of the case 1 and is mainly used for being matched with the first fan assembly 2 to pump out (or discharge) heat accumulated in the case 1 and hot air absorbing the heat to the outside of the case 1, so that external cold air blown into the case 1 by the first fan assembly 2 is rapidly discharged after the heat is absorbed by the external cold air, and the external cold air is circulated and reciprocated to form rapid forced convection heat dissipation on each heating element (each electronic component) installed in the case 1.

Moreover, the first fan assembly 2 and the second fan assembly 3 are detachably arranged on the case 1, so that the case 1 can be conveniently disassembled and assembled.

So, the external modularization heat dissipation mechanism that this embodiment provided blows in quick-witted case 1 with external cold air through first fan subassembly 2 in, outside rethread second fan subassembly 3 discharges inside hot-air to quick-witted case 1, and both work in coordination, realize the compulsory convection heat dissipation to the electronic components in quick-witted case 1, satisfy the heat dissipation demand of server.

Compared with the prior art, because first fan subassembly 2 and second fan subassembly 3 all set up outside quick-witted case 1's lateral wall to do not occupy any quick-witted case 1's internally mounted space, consequently can leave more installation space and supply electronic components and parts to rationally install and arrange, thereby can increase the air current circulation clearance in quick-witted case 1, make the air current pass through more fast and accomplish and circulate, and then can improve the heat from interior to exterior and disperse efficiency. Meanwhile, the first fan assembly 2 and the second fan assembly 3 are installed outside the case 1, so that the first fan assembly and the second fan assembly are not obstructed by nearby electronic components during disassembly and assembly, and the disassembly and assembly are facilitated.

In order to facilitate the installation of the first fan assembly 2 and the second fan assembly 3 on the chassis 1, in this embodiment, the first fan assembly 2 is specifically disposed on the outer surface of the circumferential side wall of the chassis 1, that is, when the chassis 1 is installed horizontally, 4 front, rear, left and right side walls perpendicular to the horizontal plane; meanwhile, the second fan assembly 3 is specifically arranged on the outer surface of the vertical side wall of the case 1, namely, 2 upper and lower side walls parallel to the horizontal plane when the case 1 is horizontally installed. For example, the first fan assembly 2 may be disposed on a front side wall of the chassis 1, and the first fan assembly 2 may be disposed on a rear side wall of the chassis 1 in consideration of the presence of a front panel of the chassis 1. Similarly, the second fan assembly 3 may be disposed on the lower side wall of the chassis 1, and considering that the chassis 1 needs to be installed in the cabinet, it is preferable that the second fan assembly 3 is disposed on the upper side wall of the chassis 1.

As shown in fig. 2, fig. 2 is an exploded schematic view of the first fan assembly 2.

In a preferred embodiment with respect to the first fan assembly 2, the first fan assembly 2 basically comprises a fan module 21 and a ventilation module 22.

The fan module 21 is provided with a fan therein, and is mainly used to blow outside cold air into the inside of the cabinet 1 during operation. The ventilation module 22 is mainly used to enlarge the airflow path of the external cold air when the external cold air enters the inside of the chassis 1, so that the flow rate of the cold air is larger.

Generally, the fan module 21 may be provided in plural, for example, 2 to 4, and the ventilation module 22 may be provided in only one. Meanwhile, the fan modules 21 and the ventilation modules 22 may be linearly arranged on the outer surface of the side wall of the chassis 1, specifically, may be arranged on the side wall opening end surface of the chassis 1, so as to plug the side wall opening end surface of the chassis 1. For example, 2 fan modules 21 are provided and are respectively located at left and right sides of the opening end surface of the rear side wall of the chassis 1, and the ventilation module 22 is located at the middle position of the opening end surface of the rear side wall of the chassis 1. With this arrangement, when each fan module 21 is operated, the outside cool air flows into the inside of the cabinet 1 through both the fan module 21 and the ventilation module 22.

In addition, each fan module 21 and ventilation module 22 are of modular design, and when the number of fan modules 21 is large, the airflow velocity is also large, and each fan module 21 and ventilation module 22 can be disassembled and assembled on the outer surface of the side wall of the case 1 for adjusting the reasonable number of fan modules 21.

Specifically, this embodiment has seted up the first mounting groove 11 of a plurality of and a plurality of second mounting groove 12 on the lateral wall opening terminal surface of quick-witted case 1, be provided with the first erection column 211 of a plurality of on each fan module 21 simultaneously, be provided with a plurality of second erection column 221 on ventilation module 22, and each first erection column 211 all is used for forming the joint with the cooperation installation of each first mounting groove 11 that corresponds and is connected, and each second erection column 221 all is used for forming the joint with each second mounting groove 12 cooperation installation that corresponds simultaneously and is connected. With such arrangement, the fan module 21 can be conveniently dismounted and mounted on the chassis 1 by the clamping operation of the first mounting column 211 in the first mounting groove 11; similarly, the second mounting post 221 is clamped in the second mounting groove 12, so that the ventilation module 22 can be conveniently detached from the chassis 1.

As shown in fig. 3, fig. 3 is a schematic structural diagram of the ventilation module 22.

In a preferred embodiment of the ventilation module 22, in order to increase the ventilation amount, a plurality of ventilation holes 222 are formed in the ventilation module 22, and the outside cool air can enter the inside of the housing 1 through the ventilation holes 222. Meanwhile, a dustproof film 223 is further disposed in the ventilation module 22 to filter the cold air flowing through the ventilation hole 222, so as to prevent impurities such as dust in the air from entering the inside of the chassis 1.

Further, in order to facilitate the installation and periodic replacement of the dust-proof film 223, the present embodiment further includes a sliding slot formed on a side wall (e.g., a top wall) of the ventilation module 22, and a movable plate 224 is inserted into the sliding slot, so that the movable plate 224 can slide in the sliding slot and can be conveniently installed in the ventilation module 22 or taken out of the ventilation module 22. Meanwhile, the dust-proof film 223 is mounted on the movable plate 224, so that the dust-proof film 223 is attached to and detached from the ventilation module 22 along with the sliding operation of the movable plate 224. In order to facilitate the attachment and detachment of the dust-proof film 223 on the movable plate 224, similarly, the present embodiment further has a notch 226 formed on the sidewall of the movable plate 224, so that the dust-proof film 223 is inserted into the movable plate 224 through the notch 226. Of course, to avoid obstructing ventilation, the interior of the movable plate 224 is hollow, forming a frame structure, and most of the area is covered by the dust-proof film 223.

In addition, considering that the movable plate 224 is not easily drawn out after being inserted into the ventilation module 22, the present embodiment is provided with the pulling blocks 225 on both sides of the top end of the movable plate 224, so that the operator can conveniently press or pinch the pulling blocks 225 with fingers and then draw the movable plate 224 out of the ventilation module 22.

As shown in fig. 4, fig. 4 is an exploded schematic view of the second fan assembly 3.

In a preferred embodiment with respect to the second fan assembly 3, the second fan assembly 3 mainly comprises a wind box 31, a driving motor 32, a discharge shaft 33 and fan blades 34.

The bellows 31 is a main structure of the second fan assembly 3, is generally rectangular, and is mounted on an outer surface of a sidewall of the chassis 1 by a fastening member such as a bolt. The driving motor 32 is disposed on the side wall of the air box 31, and the exhaust shaft 33 is disposed in the air box 31, and one end of the exhaust shaft is connected to the output shaft of the driving motor 32, and is mainly used for rotating in the air box 31 under the driving of the driving motor 32. Meanwhile, a plurality of blades 34 are axially arranged on the exhaust shaft 33, and are mainly used for forming suction force on hot air in the case 1 in the process of rotating along with the exhaust shaft 33 and pumping the hot air in the case 1 to the outside. Obviously, the faster the rotation speed of the driving motor 32 is, the higher the efficiency of the exhaust shaft 33 for extracting the hot air in the cabinet 1 is, and the efficiency can be adjusted according to actual needs.

Further, in order to facilitate the communication between the air box 31 and the inside of the case 1, the bottom surface of the air box 31 is a hollow structure, and the corresponding side wall of the case 1 is also provided with a through hole so as to communicate with the bottom surface of the air box 31. Similarly, the top surface of the air box 31 is also hollow, so that the hot air in the case 1 can be conveniently discharged from the top surface of the air box 31 to the outside.

In addition, in order to prevent foreign substances such as dust in the outside cold air from entering the inside of the cabinet 1 through the air box 31, the present embodiment is further covered with a dust screen 35 on a surface (e.g., a top surface) of the air box 31. Similarly, the through hole formed in the side wall of the cabinet 1 communicating with the air box 31 may be covered with a dust screen 35. Meanwhile, each fan module 21 in the first fan assembly 2 may be covered with a dust screen 35.

In another embodiment of the present invention, the external modular heat dissipation mechanism includes a heat dissipation plate 4 and a heat conduction member 5 in addition to the first fan assembly 2 and the second fan assembly 3.

As shown in fig. 5, fig. 5 is a schematic view of the mounting structure of the heat dissipation plate 4 on the chassis 1.

Specifically, the heat dissipation plate 4 is disposed on the outer surface of the side wall of the case 1, for example, the side wall, and is mainly used for absorbing heat inside the case 1, and as a temperature equalization member, the heat dissipation plate contacts with external cold air to perform heat exchange, thereby achieving passive heat dissipation. The heat conducting member 5 is disposed on the bottom surface of the heat dissipating plate 4, and mainly penetrates through the side wall of the case 1, extends into the case 1, and contacts with each heating element, thereby directly absorbing and transferring heat generated by each heating element to the heat dissipating plate 4.

Furthermore, in order to improve the heat absorption efficiency of the heat dissipation plate 4, the heat dissipation plate 4 can be specifically attached to the outer surface of the side wall of the case 1, and has a large surface area, so that the heat exchange surface area is increased. The heat conducting member 5 may be a silicone grease column, a silicone grease head, etc., and has a strong heat absorbing effect.

The embodiment also provides a server, which mainly includes a chassis 1 and an external modular heat dissipation mechanism disposed on the chassis 1, wherein the specific content of the external modular heat dissipation mechanism is the same as the related content, and is not described herein again.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides an external modularization heat dissipation mechanism, its characterized in that, including set up in the lateral wall surface of one side of quick-witted case (1) and be used for blowing in first fan subassembly (2) in it with external cold air, set up in the opposite side lateral wall surface of quick-witted case (1) and be used for taking out the hot-air in it to external second fan subassembly (3), just first fan subassembly (2) and the equal detachably of second fan subassembly (3) with quick-witted case (1) is connected.

2. The external modular heat dissipation mechanism as claimed in claim 1, wherein the first fan assembly (2) is disposed on an outer surface of a circumferential sidewall of the chassis (1), and the second fan assembly (3) is disposed on an outer surface of a vertical sidewall of the chassis (1).

3. The external modular heat dissipation mechanism as claimed in claim 1, wherein the first fan assembly (2) includes a plurality of fan modules (21) and ventilation modules (22), and each of the fan modules (21) and the ventilation modules (22) are arranged on an open end surface of a side wall of the chassis (1).

4. The external modular heat dissipation mechanism according to claim 3, wherein the side wall opening end surface of the chassis (1) is provided with a plurality of first mounting grooves (11) and second mounting grooves (12), each fan module (21) is provided with a first mounting column (211) for being in clamping fit with the corresponding first mounting groove (11), and the ventilation module (22) is provided with a second mounting column (221) for being in clamping fit with the corresponding second mounting groove (12).

5. The external modular heat dissipation mechanism as claimed in claim 3, wherein the ventilation module (22) has a plurality of ventilation holes (222) formed therethrough, and a dust-proof membrane (223) is disposed in the ventilation module (22) for filtering impurities in the airflow passing through the ventilation holes (222).

6. The external modular heat dissipation mechanism of claim 5, wherein a movable plate (224) is slidably inserted on a sidewall of the ventilation module (23), and the dust-proof film (223) is slidably inserted on a sidewall of the movable plate (224).

7. The external modularized heat dissipation mechanism according to claim 1, wherein the second fan assembly (3) comprises an air box (31) disposed on an outer surface of a sidewall of the housing (1) and communicating with an inside of the housing (1), a driving motor (32) disposed on the air box (31), and an exhaust shaft (33) rotatably disposed in the air box (31) and connected to an output shaft of the driving motor (32) for exhausting hot air in the housing (1) to the outside, and a plurality of blades (34) are axially disposed on the exhaust shaft (33).

8. The external modular heat dissipation mechanism of claim 7, wherein the second fan assembly (3) further comprises a dust screen (35) covering the surface of the bellows (31).

9. The external modular heat dissipation mechanism according to any one of claims 1 to 8, further comprising a heat dissipation plate (4) disposed on the outer surface of the side wall of the case (1), and the bottom surface of the heat dissipation plate (4) is provided with a heat conduction member (5) extending into the case (1) and contacting with a heat generation element.

10. A server, comprising a chassis (1) and an external modular heat dissipation mechanism disposed on the chassis (1), wherein the external modular heat dissipation mechanism is the external modular heat dissipation mechanism of any one of claims 1 to 9.