CN220543102U

CN220543102U - Receiving and transmitting assembly and radar

Info

Publication number: CN220543102U
Application number: CN202322032479.4U
Authority: CN
Inventors: 李慧; 魏铭志
Original assignee: Hefei Silicon Valley Microelectronics Co ltd
Current assignee: Hefei Silicon Valley Microelectronics Co ltd
Priority date: 2023-07-28
Filing date: 2023-07-28
Publication date: 2024-02-27
Anticipated expiration: 2033-07-28

Abstract

The utility model discloses a transceiver component and a radar. The transceiver assembly includes a plurality of radio frequency transmission channels. The radio frequency transmission channel comprises a microstrip line. The at least one radio frequency transmission channel further comprises at least one phase modulation group connected with the microstrip line. Wherein, the phase modulation group includes: the two phase modulation matching blocks with the same structure are connected with the microstrip line, and the two phase modulation matching blocks are spaced by a preset distance. The more the number of phase modulation groups connected by the microstrip line is, the larger the phase adjustment amount of the radio frequency signal transmitted by the radio frequency transmission channel where the microstrip line is positioned is. The technical scheme provided by the utility model has a simple design structure, can solve the problems of long debugging time, low efficiency, easy pollution of a product radio frequency transmission line and difficulty in meeting the requirement of mass production of the multi-channel phase consistency of the transceiver component, can realize the rapid adjustment of the radio frequency signal phase of the transceiver component, and is favorable for meeting the requirement of mass production of the product.

Description

Receiving and transmitting assembly and radar

Technical Field

The present utility model relates to the field of wireless communications technologies, and in particular, to a transceiver component and a radar.

Background

In communications and radar applications, where a radar system includes thousands of transceiver modules (TR modules), it is often desirable to have multiple channel signal coherence (coherent), and the index of phase coherence between the channels of the phased array transceiver modules directly affects the radar array performance index. In the early development and mass production stages of phased array transceiver assemblies, a large number of comprehensive phase tuning is necessary. Traditional electrical performance index debugging adopts manual mode, carries out actual measurement through changing or cutting microstrip line in the transceiver module, seeks the radio frequency transmission position that phase change is sensitive and less to other indexes influence simultaneously. Therefore, the product needs to be debugged repeatedly in the process of searching the radio frequency transmission line debugging point, the debugging time is long, the efficiency is low, the radio frequency transmission line of the product is easy to pollute, and the mass production requirement is difficult to meet.

Disclosure of Invention

The utility model provides a transceiver component and a radar, which are used for adjusting the phase by arranging a phase modulation group so as to solve the problems that the phase consistency among multiple channels of the transceiver component is long in debugging time, low in efficiency, easy to pollute a product radio frequency transmission line and difficult to meet the requirement of mass production.

In a first aspect, an embodiment of the present utility model provides a transceiver module, including: a plurality of radio frequency transmission channels; the radio frequency transmission channel comprises: a microstrip line;

at least one phase modulation group connected with the microstrip line is also included in the at least one radio frequency transmission channel; wherein, the phase modulation group includes: the two phase modulation matching blocks with the same structure are connected with the microstrip line, and the two phase modulation matching blocks are spaced by a preset distance; the more the number of phase modulation groups connected by the microstrip line is, the larger the phase adjustment amount of the radio frequency signal transmitted by the radio frequency transmission channel where the microstrip line is positioned is.

Optionally, the microstrip line and the phase modulation group are arranged on the same metal layer;

the transceiver component also comprises a dielectric substrate which is laminated with the metal layer.

Alternatively, the dielectric substrate has a thickness of 0.254mm and the metal layer has a thickness of 35 μm.

Alternatively, the microstrip line has a rectangular cross-sectional shape and a width of 0.56mm.

Alternatively, the cross-sectional shape of the phase modulation matching block is rectangular, the length of the phase modulation matching block is 0.35mm, and the width of the phase modulation matching block is 0.1mm.

Optionally, the preset distance is 1mm, and the distance between the phase modulation matching block and the microstrip line is 0.15mm.

Optionally, when at least two phase modulation groups are connected to one side of the microstrip line, a spacing between two adjacent phase modulation groups is 3mm.

Optionally, when the microstrip line is connected to at least two phase modulation groups, each phase modulation group is disposed on the same side of the microstrip line, or each phase modulation component is disposed on two sides of the microstrip line.

Optionally, the phase modulation matching block is bonded with the microstrip line through a bonding alloy wire; the diameter of the bond wires was 25 μm.

In a second aspect, an embodiment of the present utility model further provides a radar, including a transceiver module provided by any one of the embodiments of the present utility model.

According to the technical scheme, the phase modulation group connected with the microstrip line is arranged in at least part of the radio frequency transmission channels of the transceiver component, so that the phase adjustment of radio frequency signals transmitted by the radio frequency transmission channels where the microstrip line is positioned can be conveniently realized. Based on the structure of the transceiver component provided in this embodiment, in the debugging process of the transceiver component, operations such as replacement and cutting of the microstrip line are not required, and phase adjustment can be achieved only by connecting a proper number of phase modulation groups to the microstrip line of the radio frequency transmission channel needing phase adjustment. Therefore, the embodiment of the utility model can solve the problems of long debugging time, low efficiency, easy pollution of a product radio frequency transmission line and difficult satisfaction of mass production requirements of the multi-channel phase consistency of the transceiver component. In summary, compared with the prior art, the technical scheme provided by the embodiment of the utility model has a simple design structure, can realize the rapid adjustment of the radio frequency signal phase of the transceiver component, and is beneficial to meeting the requirement of mass production of products.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a transceiver component according to an embodiment of the present utility model;

fig. 2 is a schematic cross-sectional view of a transceiver module according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram of a microstrip line transmission simulation model according to an embodiment of the present utility model;

fig. 4 is a graph of a phase initial value of a microstrip line according to an embodiment of the present utility model;

FIG. 5 is a graph of simulation results of phase modulation according to an embodiment of the present utility model;

FIG. 6 is a graph showing simulation results of phase modulation according to another embodiment of the present utility model.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

Fig. 1 is a schematic structural diagram of a transceiver module according to an embodiment of the present utility model, referring to fig. 1, the transceiver module 100 includes a plurality of radio frequency transmission channels 1. The radio frequency transmission channel 1 comprises a microstrip line 11. At least one phase modulation group 12 connected to the microstrip line 11 is also included in the at least one radio frequency transmission channel 1. Wherein phase modulation group 12 comprises: two phase modulation matching blocks 21 with the same structure, wherein the two phase modulation matching blocks 21 are connected with the microstrip line 11, and the two phase modulation matching blocks 21 are spaced by a preset distance. The more the number of phase modulation groups 12 to which the microstrip line 11 is connected, the greater the amount of phase adjustment of the radio frequency signal transmitted by the radio frequency transmission channel 1 in which the microstrip line 11 is located.

Specifically, before mass production and debugging, the transceiver module 100 generally does not meet the requirement of phase consistency among a plurality of radio frequency transmission channels, so that a phase modulation group 12 connected with the microstrip line 11 needs to be disposed in at least part of the radio frequency transmission channels 1 to realize phase adjustment of signals transmitted by the radio frequency transmission channels. The phase-modulation matching block 21 is effectively equivalent to a small capacitor which, when connected to the microstrip line 11, can produce a certain phase delay to the signal. Illustratively, the phase adjustment capability of phase-modulating group 12 is related to the size of phase-modulating matching block 21 therein. The inventor has verified through simulation experiments that two phase modulation matching blocks 21 with the same structure are one phase modulation group 12, and compared with a monotone phase modulation matching block 21, a better phase adjustment effect can be achieved. The number of phase modulation groups 12 connected with the microstrip line 11 is increased or decreased, so that the effect of adjusting the phase of the radio frequency signal transmitted by the radio frequency transmission channel 1 where the microstrip line 11 is located can be achieved, and the radio frequency transmission loss and the return loss are not increased basically.

In the debugging process, the initial phase of each channel can be tested first, and after the phase difference is calculated, the phase adjustment requirement of each channel can be obtained. The amount of phase adjustment that one phase modulation group 12 needs to provide, and the number of phase modulation groups 12 that each channel needs to set, can be quickly counted according to the above-mentioned phase adjustment requirements. Wherein, the size of the phase modulation group 12 corresponding to the target phase adjustment amount can be obtained through simulation calculation; and, the phase adjustment result after each channel is connected with the target number of phase modulation groups 12 may be verified by simulation, and after the verification is passed, mass production of the transceiver component 100 is performed. Thus, the repeated manual debugging process can be avoided. Wherein the change value of the phase of the radio frequency signal by the phase modulation matching block 21 can be determined by adjusting the size and interval of the phase modulation matching block 21 in the phase modulation group 12. Illustratively, one phase modulation group 12 can provide a phase change value of 12.2 °.

According to the technical scheme of the embodiment, the phase modulation group 12 connected with the microstrip line 11 is arranged in at least part of the radio frequency transmission channel 1 of the transceiver component 100, so that the phase adjustment of radio frequency signals transmitted by the radio frequency transmission channel 1 where the microstrip line 11 is positioned can be conveniently realized. Based on the structure of the transceiver component 100 provided in this embodiment, in the debugging process of the transceiver component 100, operations such as replacement and cutting of microstrip lines are not required, and phase adjustment can be achieved only by connecting a proper number of phase modulation groups 12 to the microstrip line 11 of the radio frequency transmission channel 1 which needs to be subjected to phase adjustment. Therefore, the present embodiment can solve the problems of long debugging time, low efficiency, easy pollution of the rf transmission line, and difficulty in meeting the requirement of mass production in the multi-channel phase consistency of the transceiver module 100. In summary, compared with the prior art, the technical solution of the present embodiment has a simple design structure, and can implement rapid adjustment of the radio frequency signal phase of the transceiver component 100, which is beneficial to meeting the requirement of mass production of products.

Alternatively, the microstrip line 11 and the phase modulation group 12 may be made of the same material, for example, disposed on the same metal layer. The transceiver module 100 further includes a dielectric substrate laminated with the metal layer.

Illustratively, the metal layer may be a copper metal layer. The dielectric substrate can be selected from a low-loss high-frequency laminated board RF-35 of Tay Kang Nike, and has the advantages of low loss and high frequency. Specifically, the thickness of the dielectric substrate may be 0.254mm, the thickness of the metal layer is 35 μm, and the surface of the microstrip line may be plated with thick gold. The characteristic impedance of the microstrip line may be set to 50Ω.

In the present embodiment, the microstrip line 11 and the phase modulation group 12 are provided on the same metal layer, and the dielectric substrate is provided. The arrangement has simple structure, can reduce loss, and is beneficial to the rapid adjustment of the radio frequency signal phase of the transceiver component 100.

Alternatively, the cross-sectional shape of the microstrip line 11 may be rectangular or S-shaped on the basis of the above embodiments; the cross-sectional shape of phase-matching block 21 may be rectangular, polygonal, circular, or other irregular shape. The specific shape of the above structure can be designed according to practical requirements, and is not limited herein. Illustratively, for the convenience of the simulation design, the microstrip line 11 and the phase modulation matching block 21 may be provided with rectangular cross-sectional shapes.

In the following, a specific structure that phase modulation group 12 may have will be described, taking as an example that phase modulation group 12 can provide a phase adjustment amount of about 12.2 ° by applying radio frequency 27-31 GHz.

Fig. 2 is a schematic cross-sectional view of a transceiver component of a radio frequency transmission channel according to an embodiment of the present utility model. Referring to fig. 2, alternatively, the microstrip line 11 has a rectangular cross-sectional shape, and the width D1 of the microstrip line 11 is 0.56mm, on the basis of the above embodiments.

With continued reference to fig. 2, the cross-sectional shape of the phasing block 21 is optionally rectangular, the length D2 of the phasing block 21 is 0.35mm, and the width D3 of the phasing block 21 is 0.1mm, based on the embodiments described above.

With continued reference to fig. 2, the preset distance D4 is optionally 1mm, and the distance D5 between the phase modulation matching block 21 and the microstrip line 11 is 0.15mm, based on the above embodiments.

Specifically, as shown in fig. 2, the preset distance D4 may be the distance between the closest two sides of the two phase-modulation matching blocks 21 in one phase-modulation group 12, or the preset distance D4 may be the distance between the center points of the two phase-modulation matching blocks 21 in one phase-modulation group 12. The distance D5 between the phase-matching block 21 and the microstrip line 11 can be understood as the distance between the side of the phase-matching block 21 close to the microstrip line 11 and the side of the microstrip line 11 close to the phase-matching block 21.

With continued reference to fig. 2, in the above embodiments, alternatively, when at least two phase modulation groups 12 are connected to one side of the microstrip line 11, the interval between two adjacent phase modulation groups 12 is 3mm.

Specifically, as shown in fig. 2, the distance D6 between two adjacent phase modulation groups 12 may be understood as the distance between the side of the phase modulation group 12 adjacent thereto and the side of the phase modulation group 12 adjacent thereto close to the phase modulation group 12, or may be understood as the distance between the center points of the two adjacent phase modulation groups 12.

With continued reference to fig. 2, when the microstrip line 11 is connected to at least two phase modulation groups 12, each phase modulation group 12 is optionally disposed on the same side of the microstrip line 11. Alternatively, the phase modulation groups 12 may be arranged on both sides of the microstrip line 11.

With continued reference to fig. 1, on the basis of the above embodiments, the phase modulation matching block 21 is optionally bonded to the microstrip line 11 through a bonding wire 22. The bond wire 22 has a diameter of 25 μm. Illustratively, the gold wire bonding height may be set to 0.2mm.

Specifically, gold wire bonding has the characteristics of simple process, low cost and small thermal expansion coefficient, and is beneficial to the reliability, stability and even the overall electrical performance of the transceiver component 100.

Illustratively, the number and location of phase modulation groups 12 described above may be determined by the following design method: when the same rf signal is input to the plurality of rf transmission channels 1 in the transceiver module 100, the phase difference of the rf signals between the plurality of channels is detected. If the obtained phase differences are within the precision range required by the radio frequency signal phase, the phase modulation group 12 is not required to be arranged in each current channel. If a phase difference is detected that exceeds the required accuracy of the phase of the radio frequency signal, then at least some of the channels need to be phase adjusted. According to the preset target phase difference, the phase modulation design is carried out on the channel needing to be subjected to phase adjustment through high-frequency structural simulation (High Frequency Structure Simulator, HFSS).

Specifically, HFSS simulation software is used to set parameters related to the dielectric substrate of the rf transmission channel transceiver assembly 100, parameters of the simulation cavity, and parameters of the microstrip line 11, and a microstrip line transmission model is established, and the model can be seen in fig. 3. For example, the thickness of the dielectric substrate is set to 0.254mm, the thickness of the metal layer is 35 μm, the width of the microstrip line 11 is 0.56mm, and the length of the microstrip line 11 is 11mm. The simulation cavity 3 is 2.4mm wide, the cavity height is 3mm, and the cavity length is 11mm. The microstrip line 11 has a characteristic impedance Z0 set to 50Ω. The initial phase value curve of the microstrip line 11 is plotted by HFSS simulation. Fig. 4 is a graph of an initial value of a microstrip line phase provided in an embodiment of the present utility model, referring to fig. 4, specifically, a horizontal axis scale Freq [ KHz ] is a frequency of a radio frequency signal, and a vertical axis scale ang_deg (S (2, 1)) [ deg ] represents a signal phase. 3 points may be taken on the microstrip line 11 phase initial value curve, m1 (27.00,106.1752), m2 (29.00,59.3409) and m3 (31.00,12.4689), respectively.

On the basis of the model transmitted by the microstrip line 11, a phase modulation group 12 is additionally arranged, and a phase modulation model A is built. The length of each phase-modulation matching block 21 is set to be 0.35mm, the width is set to be 0.1mm, the distance between each phase-modulation matching block 21 and the microstrip line 11 is set to be 0.15mm, and the preset distance is set to be 1mm. The bond wire 22 was set to a diameter of 25 μm and the gold wire bonding height was set to 0.2mm. And drawing a phase modulation simulation result graph through HFSS simulation. Fig. 5 is a graph of a phase modulation simulation result provided by the embodiment of the present utility model, referring to fig. 5, comparing microstrip line phase initial value curves, and corresponding to 3 sampling points of the same frequency, it can be seen that on the phase modulation simulation result curves, the coordinates of m1, m2 and m3 are respectively changed into m1 (27.00,94.3562), m2 (29.00,45.9302) and m3 (31.00, -3.0745), which indicates that the phase change value introduced by one phase modulation group 12 in the frequency range of 37-31GHz is 13±2°.

On the basis of the phase modulation model A, a phase modulation group 12 is additionally arranged, and a phase modulation model B is built. The phase modulation model B includes two phase modulation groups 12 (i.e., four phase modulation matching blocks 21). The spacing between the two phase modulation groups 12 is set to 3mm. And drawing a phase modulation simulation result graph through HFSS simulation. Fig. 6 is a graph of another phase modulation simulation result provided in the embodiment of the present utility model, referring to fig. 6, comparing microstrip line phase initial value curves, and corresponding to 3 sampling points of the same frequency, it can be seen that on the phase modulation simulation result curves, the coordinates of m1, m2 and m3 are respectively changed to m1 (27.00,82.0745), m2 (29.00,31.6565) and m3 (31.00, -20.1691), which indicates that the phase change values introduced by the two phase modulation groups 12 in the 37-31GHz frequency range are 27±3°. It can be seen that the more the number of phase modulation groups 12 connected to the microstrip line 11, the greater the amount of phase adjustment of the radio frequency signal transmitted by the radio frequency transmission channel 1 where the microstrip line 11 is located. After the number and positions of the phase modulation groups 12 mounted on the microstrip line 11 are determined by the simulation, the mass production can be put into.

The technical scheme of the embodiment realizes the adjustment of the phase of the radio frequency signal transmitted by the radio frequency transmission channel 1 where the microstrip line 11 is positioned by setting the relevant parameters of the microstrip line 11 and the phase modulation matching block 21. The technical scheme of the embodiment has simple design structure, can realize the rapid adjustment of the radio frequency signal phase of the transceiver component 100, and is beneficial to meeting the requirement of mass production of products.

The embodiment of the utility model also provides a radar which comprises the transceiver component provided by any embodiment of the utility model. The radar provided by the embodiment of the utility model has the beneficial effects of the transceiver component provided by any embodiment of the utility model, and the technical principle and the generated beneficial effects are similar and are not repeated.

The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims

1. A transceiver module, comprising: a plurality of radio frequency transmission channels; the radio frequency transmission channel comprises: a microstrip line;

at least one phase modulation group connected with the microstrip line is also included in at least one radio frequency transmission channel; wherein, the phase modulation group includes: the two phase modulation matching blocks are connected with the microstrip line, and the two phase modulation matching blocks are spaced by a preset distance; the more the number of phase modulation groups connected with the microstrip line is, the larger the phase adjustment amount of the radio frequency signal transmitted by the radio frequency transmission channel where the microstrip line is positioned is.

2. The transceiver component of claim 1, wherein the microstrip line and the phase modulation group are disposed on the same metal layer;

the transceiver component further comprises a dielectric substrate which is laminated with the metal layer.

3. The transceiver module of claim 2, wherein the dielectric substrate has a thickness of 0.254mm and the metal layer has a thickness of 35 μm.

4. A transceiver module according to claim 2 or 3, wherein the microstrip line has a rectangular cross-sectional shape and a width of 0.56mm.

5. The transceiver module of claim 4, wherein the cross-sectional shape of the phased matching block is rectangular, the length of the phased matching block is 0.35mm, and the width of the phased matching block is 0.1mm.

6. The transceiver module of claim 5, wherein the predetermined distance is 1mm, and the phase modulation matching block is spaced from the microstrip line by 0.15mm.

7. The transceiver module of claim 6, wherein when at least two phase modulation groups are connected to one side of the microstrip line, a spacing between two adjacent phase modulation groups is 3mm.

8. The transceiver module of claim 1, wherein when the microstrip line is connected to at least two phase modulation groups, each phase modulation group is disposed on the same side of the microstrip line, or each phase modulation group is disposed on both sides of the microstrip line.

9. The transceiver assembly of claim 1, wherein the phase modulation matching block is bonded to the microstrip line by a bond wire; the bond wires have a diameter of 25 μm.

10. A radar, comprising: the transceiver module of any one of claims 1-9.