CN220528471U - Air cooling domain controller for automatic driving vehicle and automatic driving vehicle - Google Patents

Abstract

The utility model relates to an air-cooled domain controller for an autonomous vehicle and an autonomous vehicle. The air-cooled domain controller includes: the upper shell assembly is provided with first radiating fins, second radiating fins and third radiating fins, wherein the first radiating fins are distributed at intervals in a first direction and have a height larger than that of the third radiating fins, the second radiating fins are distributed at intervals in a second direction and have a height of the third radiating fins, and the first radiating fins and the second radiating fins surround the third radiating fins to form concave parts; a lower housing; a printed circuit board disposed between the upper housing assembly and the lower housing; and at least one axial flow fan arranged in the concave part and having an air outlet facing the third heat radiation fins so as to radiate heat of the printed circuit board through the first heat radiation fins, the second heat radiation fins and the third heat radiation fins in a working state. In this way, the domain controller has good temperature uniformity and the overall heat dissipation effect is good.

Description

Air cooling domain controller for automatic driving vehicle and automatic driving vehicle

Technical Field

The present utility model relates generally to the field of autopilot, and in particular to an air-cooled domain controller for an autopilot vehicle and an autopilot vehicle.

Background

Along with the rapid development of intelligent driving, the integration level of the chip of the automatic driving domain controller is higher and higher, the heat productivity of the chip is larger and larger, and a heat dissipation structure is required to be introduced in order to ensure that the chip works in a reasonable range. There are three heat dissipation modes, namely natural heat dissipation, air cooling and water cooling. Air cooling is achieved by introducing heat into the heat sink fins and then carrying the heat away by the air flow provided by the fan. The water cooling is to dissipate heat through a refrigerant fluid medium. The natural heat dissipation is through natural convection of the fins and air.

In the current air-cooled autopilot controller, the radiator mostly adopts the whole radiating fins, so that the air quantity is unevenly distributed among the fins, and the air flow is not fully disturbed, so that the heat exchange capacity is insufficient; meanwhile, the radiator has poor temperature uniformity, so that the temperature difference of the radiator is overlarge, the radiating capacity is insufficient, and the radiating requirement of high power consumption cannot be met. For the heat dissipation requirement of high power consumption, water cooling is mostly adopted, the heat dissipation capability is still good, but an external water pipe is needed, the application is limited by the design of a cooling system of the whole vehicle, and the risk of water leakage exists.

In addition, the system parameters of the cooling system cannot be coupled with the chip in data, and the key parameters such as the temperature, the pressure and the flow of the system cannot be monitored and managed in real time, so that fine pipeline control and optimization adjustment cannot be realized, and the use requirements under certain specific use scenes (such as extreme environments, high-precision vehicle use scenes and the like) are limited.

Accordingly, there is a need to provide an air-cooled domain controller for an autonomous vehicle that addresses, at least in part, the prior art.

Disclosure of Invention

The utility model aims to provide an air cooling domain controller for an automatic driving vehicle and the automatic driving vehicle, so as to solve the problems of poor heat release performance and the like caused by poor temperature uniformity of a radiator and uneven air quantity distribution among fins in an air cooling heat dissipation structure of the existing automatic driving domain controller.

According to one aspect of the present utility model, an air-cooled domain controller for an autonomous vehicle is provided. The air-cooled domain controller includes: the upper shell assembly is provided with a first mounting surface, a plurality of first radiating fins, a plurality of second radiating fins and a plurality of third radiating fins are arranged on the first mounting surface, wherein the plurality of first radiating fins are distributed at intervals in a first direction and have a height larger than the height of the third radiating fins, the plurality of second radiating fins are distributed at intervals in a second direction and have a height of the third radiating fins, and the plurality of first radiating fins and the plurality of second radiating fins surround the plurality of third radiating fins to form concave parts; a lower housing; a printed circuit board disposed between the upper housing assembly and the lower housing; and at least one axial flow fan arranged in the concave part and having an air outlet facing the plurality of third heat dissipation fins so as to dissipate heat of the printed circuit board through the plurality of first heat dissipation fins, the plurality of second heat dissipation fins and the plurality of third heat dissipation fins in a working state.

According to the embodiments of the present disclosure, the air volume can be uniformly distributed between the fins, and the air flow passes through sufficient turbulence, so that the air flow turbulence degree and the heat exchange efficiency are improved, and meanwhile, the temperature uniformity of the radiator can also be improved, and the problem of insufficient heat dissipation capability caused by overlarge temperature difference is avoided. The setting of axial fan can realize the accurate control and the optimization to the radiator when increasing the amount of wind, is showing and is improving radiating efficiency.

In some embodiments, the printed circuit board includes at least one system on chip and the upper housing assembly includes: a radiator having a second mounting surface which is concavely arranged and is opposite to the first mounting surface; and a heat pipe module including a heat pipe and a heat dissipating copper block, the heat pipe being at least partially embedded in the second mounting surface so as to be thermally coupled to the heat sink, and the heat pipe being adapted to transfer heat emitted by the at least one system on chip at least partially to the heat pipe via the heat dissipating copper block. In such an embodiment, the heat dissipation area is increased while ensuring the compactness of the heat sink, and the heat dissipation efficiency is improved. Meanwhile, the radiator is thermally coupled with the heat pipe module, so that heat can be transferred out more effectively, and the rapid transfer and dispersion of the heat are realized, so that the normal operation of the chip is ensured, and the durability and the reliability of the domain controller are improved.

In some embodiments, the printed circuit board further comprises other heat generating devices, and the heat sink further comprises a third mounting surface on the same side as the second mounting surface and having a heat dissipating boss disposed thereon, the heat dissipating boss being adapted to transfer heat emitted by the other heat generating devices at least partially to the heat sink. In such an embodiment, heat of a plurality of heating devices can be intensively transferred to the radiator, and through the design of the heat dissipation boss, the heat transfer area can be increased, the heat dissipation efficiency is improved, and meanwhile, heat of the heating devices at different positions can be uniformly transferred to the radiator, so that the heat dissipation balance of the whole air-cooled domain controller is improved.

In some embodiments, a first thermally conductive gel is disposed between the at least one system on chip and the heat-dissipating copper block; or a first heat conducting gel is arranged between the heat radiating boss and other heating devices; or a second thermally conductive gel is disposed between the heat pipe and the heat sink. In such embodiments, the heat conducting properties of the heat sink and the heat pipe module can be improved, enabling heat to be transferred more quickly and efficiently; a heat conduction path can also be formed between the different components so that heat can be transferred more quickly, thereby improving the heat dissipation efficiency of the overall domain controller.

In some embodiments, the heat pipe module further includes a fixing copper sheet, two ends of the heat pipe respectively include an evaporation section and a condensation section, the evaporation section is thermally coupled to the heat dissipation copper block and the condensation section is fixed to the second mounting surface via the fixing copper sheet. In such an embodiment, heat emitted by the chip can be rapidly transferred to the heat-dissipating copper block, so that heat transfer efficiency of the radiator and the heat pipe module is maximized, and heat dissipation efficiency of the domain controller is improved.

In some embodiments, the following parameters of the first, second, and third pluralities of heat fins are related to one another: fin height, fin thickness, and fin pitch. When a plurality of heat dissipation fins are involved, the parameters of height, thickness, spacing and the like are mutually influenced, because the parameters of the heat dissipation fins, such as the surface area, the air flow resistance, the heat dissipation performance and the like, are determined together. In such an embodiment, by adjusting parameters such as the fin height and the pitch, an optimal airflow optimizing effect and a heat dissipating effect can be achieved, and the heat dissipating performance of the heat sink can be improved.

In some embodiments, the first direction is a length direction of the domain controller and the second direction is a width direction of the domain controller. In such an embodiment, an engineering implementation is provided.

In some embodiments, the axial flow fan is spaced a predetermined distance from the plurality of third heat fins and is adjacent to the at least one system on chip. In such an embodiment, excessive airflow resistance can be avoided, heat dissipation efficiency is improved, noise level is reduced, and use experience and reliability of the whole system are improved.

In some embodiments, the heat sink is formed via integral die casting; and the heat pipe is compatible with the layout of at least one system on chip on the printed circuit board. In such embodiments, the surface area and strength of the heat sink can be effectively increased, and the temperature uniformity of the domain controller can be further improved, thereby improving heat dissipation efficiency and stability.

According to a second aspect of the present utility model there is provided an autonomous vehicle comprising an air cooled domain controller according to the first aspect of the present disclosure.

It should be understood that the description in this summary is not intended to limit the critical or essential features of the embodiments of the utility model, nor is it intended to limit the scope of the utility model.

Other features of the present utility model will become apparent from the description that follows.

Drawings

The above, as well as additional purposes, features, and advantages of embodiments of the present utility model will become apparent in the following detailed written description and claims upon reference to the accompanying drawings. Several embodiments of the present utility model are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

FIG. 1 illustrates an exploded structural schematic of an air-cooled domain controller according to an example embodiment of the utility model;

FIG. 2 illustrates a schematic front view of an air-cooled domain controller upper housing assembly according to an example embodiment of the utility model;

FIG. 3 illustrates a schematic rear view of an upper housing assembly of an air-cooled domain controller according to an example embodiment of the utility model;

FIG. 4 illustrates a front cross-sectional view of an air-cooled domain controller according to an example embodiment of the utility model; and

FIG. 5 illustrates a schematic diagram of an air-cooled domain controller heat pipe module, according to an example embodiment of the utility model.

Like or corresponding reference characters indicate like or corresponding parts throughout the several views.

Detailed Description

Embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the utility model is susceptible of embodiment in the drawings, it is to be understood that the utility model may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the utility model. It should be understood that the drawings and embodiments of the utility model are for illustration purposes only and are not intended to limit the scope of the present utility model.

In describing embodiments of the present utility model, the term "comprising" and its like should be taken to be open-ended, i.e., including, but not limited to. The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first," "second," and the like, may refer to different or the same object. Other explicit and implicit definitions are also possible below.

As described above, the current radiator air quantity is unevenly distributed in the fin members, and the heat exchange capability is insufficient; the heat sinks are Wen Xingcha, so that the heat dissipation capacity is insufficient and the service life is even influenced; in addition, the system parameters of the cooling system cannot be coupled with the chip, and the key parameters such as the temperature, the pressure and the flow of the system cannot be monitored and managed in real time, so that the problems of fine pipeline control, optimization adjustment and the like cannot be realized.

According to the utility model, through the interval distribution of the radiating fins, the turbulence and turbulence of the radiating fins are increased, so that the convection heat exchange performance is improved; the radiating fins are distributed in two directions of the axial flow fan, so that the uniformity of the distribution of air quantity among the radiating fins is improved; the heat pipe module is embedded into the integrated die-casting radiator, so that the temperature uniformity of the radiator is obviously improved. The comprehensive application of the technical means can obviously improve the heat dissipation performance of the domain controller. Meanwhile, by arranging the sensor in the air cooling pipe and coupling with the system-level chip, key parameters such as pressure, flow and the like of the cooling system can be monitored and managed in real time, so that fine pipeline control and optimization adjustment are realized.

Hereinafter, the principle of the present utility model will be described with reference to fig. 1 to 5.

Fig. 1 shows an exploded structural schematic diagram of an air-cooled domain controller according to an exemplary embodiment of the present utility model.

As shown in fig. 1, an implementation of an air-cooled domain controller may include multiple components, as shown in fig. 1. The upper housing assembly 30, the axial fan 40, the printed circuit board 50, the lower housing 60, the fan housing 70, the first thermal conductive gel 80, and the second thermal conductive gel 90 may be assembled to form the entire air-cooled domain controller. Hereinafter, the structure and function of the above-described components will be described in detail.

In some embodiments, the air-cooled domain controller may be used to automatically drive a vehicle, which may be a motor vehicle or a non-motor vehicle, examples of which include, but are not limited to, a car, a sedan, a truck, a bus, an electric vehicle, a motorcycle, a bicycle, and the like. However, it should be understood that embodiments of the present utility model are equally applicable to near-vehicle broad-sense vehicles, such as boats, trains, planes, and the like. The autonomous vehicle may be a vehicle having some autopilot capability or a vehicle having semi-autopilot capability.

In some embodiments, referring to fig. 1, in some embodiments, the upper housing assembly 30 may include a heat sink 10 and a heat pipe module 20. In one embodiment, the heat sink 10 may be manufactured in an integral die-cast manner. The radiator formed by integral die casting can avoid the problems of uneven heat dissipation or increased failure rate caused by factors such as assembly precision, material difference and the like. In addition, the integrated radiator can be more closely attached to the chip, so that the heat transfer efficiency of the radiator 10 to the chip is improved.

In one embodiment, the integral radiator may also be subjected to a machining finish milling process after die casting to ensure its roughness and flatness. The heat dissipation efficiency of the radiator 10 can be further improved by the treatment, and meanwhile, the close fitting between the radiator 10 and other components can be ensured, so that the problem of poor heat conduction caused by gaps is avoided.

In other embodiments, the heat sink 10 may be manufactured by other methods, such as cold forging, precision casting, metal injection molding, etc., to achieve the same or similar results. These manufacturing methods may be selected according to actual needs so as to reduce manufacturing costs and manufacturing cycles of the heat sink 10 as much as possible while ensuring heat dissipation efficiency.

FIG. 2 illustrates a schematic front view of an air-cooled domain controller upper housing assembly 30 according to an example embodiment of the utility model. Referring to fig. 2, the upper housing assembly 30 (specifically, "heat sink 10") includes a first heat sink fin 11, a second heat sink fin 12, and a third heat sink fin 13 on a first mounting surface 14, the first heat sink fin 11, the second heat sink fin 12, and the third heat sink fin 13 each being a plurality in number and arranged at intervals, preferably uniformly spaced apart, to form a fin array, adjacent fins constituting heat dissipation channels. In one embodiment, the plurality of first heat dissipating fins 11 are arranged in the length direction (may also be referred to as "transverse") of the air-cooled domain controller, the plurality of second heat dissipating fins 12 are arranged in the width direction (may also be referred to as "longitudinal") of the air-cooled domain controller, and the arrangement direction of the plurality of third heat dissipating fins 13 may be selected according to actual needs, for example, in fig. 2, and also arranged in the width direction (may be referred to as "longitudinal") of the air-cooled domain controller.

It should be understood that the above-described lateral and longitudinal arrangements are merely illustrative, and that other arrangements may be employed to achieve the desired heat dissipation. For example, the device can be arranged obliquely and the like to meet the actual needs. Meanwhile, the number and the interval distance of the radiating fins can be adjusted according to actual needs. For example, the number and density of heat dissipating fins may be increased to increase heat dissipating efficiency; the number and density of the heat radiating fins can also be reduced to reduce the manufacturing cost.

In one embodiment, a heat conductive material may be further coated on the surface of the heat sink 10 to further improve heat dissipation efficiency. For example, a metal material having high heat conductive property, such as copper, silver, etc., may be coated on the surface of the heat dissipation fin to improve heat conduction efficiency.

With continued reference to fig. 2. In one embodiment, the first heat sink fins 11, 12 are greater in height than the third heat sink fins 13, and the array of first heat sink fins 11, 12 is disposed around the array of third heat sink fins 13, forming the recess 19. Specifically, the first heat dissipating fins 11 are distributed at two ends of the width of the air-cooled domain controller, the second heat dissipating fins 12 are distributed at two ends of the length of the air-cooled domain controller, and the third heat dissipating fins 13 are lower in height, so that the first heat dissipating fins 11 and the second heat dissipating fins 12 surround the third heat dissipating fins 13 to form concave portions 19.

In one embodiment, the fin heights, fin thicknesses, and fin pitch parameters of the plurality of first heat dissipation fins 11, the plurality of second heat dissipation fins 12, and the plurality of third heat dissipation fins 13 are related to each other, and are also related to the arrangement direction of the plurality of first heat dissipation fins 11, the plurality of second heat dissipation fins 12, and the plurality of third heat dissipation fins 13. For example, the designs of the first heat dissipation fins 11, the second heat dissipation fins 12 and the third heat dissipation fins 13 can adopt DOE design thought, and parameter combination optimization is performed on the height, thickness, spacing, direction and the like of the heat dissipation fins through a response surface optimization method. Among them, DOE is an experimental design method widely used in modern quality management and scientific research. It is a statistical method aimed at determining the optimal product or process design by systematically investigating and analyzing a number of design factors and their interactions. For example, when the DOE design concept is adopted, the first heat dissipation fins 11 and the second heat dissipation fins 12 may be the same or different, depending on the actual heat dissipation requirements.

In such an embodiment, through the interval distribution of the heat dissipation fins, turbulence and turbulence of the heat dissipation fins are increased, so that the heat convection performance is improved, a better heat dissipation effect is achieved, and the overall performance of the radiator is further improved. By adopting the DOE design thought, the optimization time can be greatly shortened, the optimal heat radiation fin parameter combination can be quickly found, the manufacturing efficiency and quality are improved, and the manufacturing cost is reduced.

In one embodiment, specifically, the width of the first radiator fin 11 and the second radiator fin 12 may be 10mm, the height may be 15mm, the thickness may be 1.5mm, and the pitch may be 4.5 to 5.5mm; the third heat sink fins 13 may have a width of 11mm, a height of 3mm to 5mm, a thickness of 1.5mm, and a pitch of 3.5mm. The combination of these parameters can be adjusted according to actual needs to meet different heat dissipation requirements. For example, the height and density of the heat dissipating fins may be increased to increase heat dissipating efficiency; the height and density of the heat sink fins can also be reduced to reduce manufacturing costs. Meanwhile, the parameters of the width, the height, the thickness and the spacing of the radiating fins should be set by comprehensively considering the factors of the whole size, the radiating performance, the manufacturing cost and the like of the radiator. In other embodiments, the optimal parameter combination may be determined according to the temperature, humidity, air flow rate, etc. of the environment in which the radiator is used, so as to achieve the optimal heat dissipation effect.

Reference is made to fig. 1 and 2. In some embodiments, the axial fan 40 may be installed in the recess 19, and its air outlet faces the third heat sink fins 13. In this way, the axial fan 40 blows air towards the surface of the radiator 10, so that the air flows along the first heat dissipation fins 11 in the first direction and the second heat dissipation fins 12 in the second direction to all fins, and heat on the heat dissipation fins is taken away, so that the heat dissipation efficiency is improved. Specifically, the axial fan 40 may be mounted on the recess 19 by a screw, and its air outlet is directed toward the third heat radiation fins 13. In some embodiments, the distance between the axial flow fan 40 and the third heat dissipation fins 13 may be 2mm-4mm, which may reduce the working back pressure of the axial flow fan 40, reduce the wind noise between the axial flow fan 40 and the heat dissipation fins, and also compromise the overall height requirement of the domain controller. It should be understood that the number of axial fans 40 shown in fig. 2 is 2, and of course any other suitable number may be used, depending on the heat dissipation requirements, and the parameters and layout design of the first heat dissipation fins 11, the second heat dissipation fins 12, and the third heat dissipation fins 13.

In some embodiments, a mesh or screen may be added between the axial flow fan 40 and the heat sink 10 to prevent foreign matters or dust from entering the inside of the heat sink 10, and the axial flow fan 40 and the heat radiating fins may be protected from damage. In addition, in some embodiments, a filter screen may be added between the axial fan 40 and the radiator 10 to filter dust and impurities in the air entering the inside of the radiator 10, so as to maintain the cleanness and stable heat dissipation performance of the radiator.

In practical application, the axial flow fan 40 with low rotation speed and low noise can be selected to reduce the noise generated by the axial flow fan 40 under the condition of ensuring the working efficiency of the axial flow fan 40. In some embodiments, the air inlet of the axial flow fan 40 corresponds to a surface far from the third heat dissipation fins 13, and the air outlet is located at a surface near to the third heat dissipation fins 13, so that the working temperature of the axial flow fan 40 in a high temperature environment can be effectively reduced, and the working life of the axial flow fan 40 can be prolonged.

In one embodiment, a fan housing 70 may be further provided on the axial flow fan 40 to prevent the axial flow fan 40 from being deformed by external impact. The fan housing 70 may cover the outside of the axial flow fan 40 and have a certain flexibility and strength to buffer and disperse force when being impacted by external force, thereby protecting the axial flow fan 40 from damage. The fan housing 70 may also improve the safety and reliability of the axial flow fan 40, reducing the failure rate and maintenance cost of the axial flow fan 40.

In some embodiments, the fan housing 70 may be made of a hard or flexible material, such as plastic, rubber, or synthetic fiber, and may have a variety of different shapes and configurations to accommodate the different shapes and sizes of the axial fans 40. In addition, the fan housing 70 may be designed to cooperate with the air outlet of the axial flow fan 40 to maximize the working efficiency and heat dissipation performance of the axial flow fan 40.

FIG. 3 illustrates a schematic rear view of a housing assembly on an air-cooled domain controller according to an example embodiment of the utility model. In some embodiments, referring to fig. 1 and 3, the heat sink 10 may include a heat dissipating boss 17, mounting studs 18, and a heat pipe module 20 on its back surface to improve the heat dissipating efficiency of the heat sink 10 in some embodiments. Specifically, in some embodiments, the heat sink 10 has a second mounting surface 15 and a third mounting surface 16, wherein the second mounting surface 15 is used to mount the heat pipe module 20 and the third mounting surface 16 is used to mount the heat dissipating boss 17. In one embodiment, the heat dissipating boss 17 may be positioned to correspond to other heat generating devices 52 on the printed circuit board 50 and adapted to at least partially transfer heat from the other heat generating devices 52 to the heat sink 10. The heat dissipation boss 17 may have a stepped shape, and the lower side has a stepped thickness of 1mm, for example, and is provided with a through hole for fixing the heat pipe module 20. In some embodiments, other heat generating devices 52 may be in contact with the heat dissipating boss 17 through the first thermally conductive gel 80 to conduct heat to the integral die cast heat sink 10. The first thermally conductive gel 80 may be a silicone grease-like compound having high thermal conductivity and good high temperature resistance.

In one embodiment, the heat pipe module 20 may include a heat pipe 21, a heat dissipating copper block 22, and a fixing copper sheet 23. The heat pipe 21 may be mounted on the second mounting surface 15 of the heat sink 10, which may be grooved on the heat sink 10. Specifically, the heat sink 10 may be provided with a heat pipe groove that mates with the heat pipe 21 and a groove that mates with the heat dissipating copper block 22 and the fixing copper sheet 23. Meanwhile, the heat sink 10 is further provided with holes matched with screws to fix the heat dissipating copper block 22 and the fixing copper sheet 23 to the heat sink 10 through bolting. In some embodiments, a second thermally conductive gel 90 may be disposed between the heat pipe 21 and the heat sink 10 to improve heat transfer efficiency. The amount of the second heat conductive gel 90 is controlled according to the gap between the heat pipe 21 and the second mounting surface 15, preferably about 0.1 mm. The second thermally conductive gel 90 may be a silicone grease-like composite or any other substance capable of satisfying thermal conductivity.

In some embodiments, the heat pipe 21 may be made of copper, aluminum alloy, or the like, and has good heat conducting performance and high temperature resistance. The heat dissipation copper block 22 can be a block-shaped object made of copper, and has high heat conduction performance and good mechanical strength. The fixing copper sheet 23 may be a sheet-shaped object made of copper for fixing the heat dissipation copper block 22 and the heat pipe 21, thereby ensuring reliability and stability of the heat pipe module 20.

FIG. 4 illustrates a front cross-sectional view of an air-cooled domain controller according to an example embodiment of the utility model. Fig. 5 shows a schematic diagram of an air-cooled domain controller heat pipe module 20 according to an example embodiment of the utility model. Referring to fig. 4 and 5, in one embodiment, the evaporation section 24 of the heat pipe 21 is coupled to the heat dissipating copper block 22, and the condensation section 25 is coupled to the fixing copper sheet 23. The heat pipe 21 is fixed on the second mounting surface 15 of the radiator 10 through a heat dissipation copper block 22 and a fixing copper sheet 23, and an evaporation section 24 and a condensation section 25 are respectively positioned at two ends of the heat pipe 21. The heat spreader copper 22 may directly or indirectly contact the system on chip 51 on the printed circuit board 50, for example, may be filled with a first thermally conductive gel 80 therebetween. In this way, the heat generated during operation of the system-in-chip 51 is conducted to the heat-dissipating copper block 22 through the first thermally conductive gel 80, with a major portion of the heat being conducted to the evaporator section 24 of the heat pipe 21 and a minor portion of the heat being conducted to the integral die-cast heat sink 10. The heat is conducted along the length of the heat sink 10 to the condensing section 25 of the heat pipe 21 and then through the second thermally conductive gel 90 to the heat sink 10. All heat is ultimately conducted to the integral die-cast radiator 10, which is carried away by the airflow of the axial fan 40 through the layout of the strictly designed cooling fins.

In this embodiment, the heat pipe 21 has an L-shaped structure, and is connected to the heat dissipating copper block 22 and the fixing copper sheet 23 by soldering. The length of the heat pipe 21 is 190-200 mm, the thickness is 3mm, and the width is 11.6mm. The internal wick of the heat pipe 21 is sintered by copper powder, and the working medium can be distilled water. In one embodiment, the axial flow fan 40 (or recess 19) is disposed adjacent to the system on chip 51 to provide targeted heat dissipation for the system chip with the greatest heat generation, maximizing heat dissipation.

In one embodiment, the placement of the shorter third heat sink fins 13 is critical. In one embodiment, the third heat sink fin 13 may be located adjacent to the system on chip 51 or other heat generating device 52 of interest, and is a key factor in forming a heat dissipation channel with the second heat sink fin 12 and the third heat sink fin 13. Through experiments, the overall heat dissipation effect of the domain controller when the third heat dissipation fins 13 are not provided is far less than when the third heat dissipation fins 13 are provided.

In some embodiments, the amount of first thermally conductive gel 80 depends on the gap between the system on chip 51 and the heat spreader copper 22, as well as the gap between the other heat generating devices 52 and the heat spreader boss 17. To achieve this, it is necessary to control the height and flatness of the heat dissipating copper block 22 and the heat dissipating boss 17, the warp of the printed circuit board 50, and the flatness of the mounting stud 18. In general, the nominal value of the gap can be controlled to be about 0.3 to 0.5 mm. This is to ensure that the first thermally conductive gel 80 can fill the gap and provide sufficient heat transfer efficiency.

In one embodiment, the heat pipe module 20 is secured to the integral die cast heat sink 10 by welding. In this embodiment, the heat pipe module 20 is made of copper, and the integral die-casting heat sink 10 is made of aluminum alloy. To ensure the welding effect, the integral die-casting radiator 10 is firstly subjected to the nickel plating treatment and then welded with the heat pipe module 20. This manufacturing method can increase the contact area between the heat pipe module 20 and the integral die-casting radiator 10 and can enhance the heat transfer efficiency therebetween.

In one embodiment, the printed circuit board 50 may be assembled using surface mount technology (Surface Mounted Technology, abbreviated as SMT) or Dual Inline Package technology (DIP) to form a complete printed circuit board. During assembly of the system, the printed circuit board 50 is secured to the mounting studs 18 of the upper housing assembly 30 by screws to ensure stability and reliability of the system. This manner of manufacture may increase the integration and performance of the system and may reduce the size and weight of the system. In addition, the assembly mode can improve maintainability and expandability of the system, and provides convenience for future upgrading and maintenance.

In one embodiment, the autopilot domain controller further includes a lower housing 60, referring to fig. 1 and 2, the lower housing 60 is secured to the domain controller upper housing assembly 30 by screws. In one embodiment, the printed circuit board 50 and the lower housing 60 may be secured to the upper housing assembly 30, and in particular, may be secured to the third mounting surface 16 of the upper housing assembly 30 (in particular, "heat sink 10") by a set of screws.

In some embodiments, in order to implement intelligent control of the air-cooled domain controller, the present utility model provides a plurality of sensors in corresponding positions of at least one of the heat pipes 21 of the heat pipe module 20, the heat sink 10, and the printed circuit board 50. The sensor is adapted to monitor in real time various parameters associated with the cooling effect and to communicate these parameters into the at least one system on chip 51. In the embodiment of the utility model, the system-in-chip 51 can realize intelligent control of real-time parameters returned by the sensor through data coupling, thereby ensuring the stability of the domain controller and improving the performance and reliability of the system through the control of the axial flow fan 40.

In one embodiment, the present utility model monitoring and managing real-time parameters associated with cooling effects may include junction temperature of at least one system on chip, evaporator 24 and condenser 25 fluid temperatures, turbulence, swirl, separation, backflow, boundary layer compression, radiator 10 outlet temperature, pressure drop, and the like. The parameters can be monitored and managed in real time through the sensors so as to realize fine pipeline control and optimal adjustment, thereby improving the heat dissipation efficiency and the heat conduction performance of the air-cooled domain controller. By data coupling with the system on chip 51, real-time monitoring and management of the parameters of the cooling pipe system can be achieved, thereby better meeting the use requirements of certain specific use scenarios, such as the use requirements of vehicles in extreme environments (e.g. high temperatures). The intelligent control scheme can greatly improve the performance and reliability of the system.

In such an embodiment, the data coupling with the system-in-chip 51 is used for real-time monitoring and management, so as to realize fine control and optimal adjustment of cooling parameters, thereby improving the heat dissipation efficiency and heat conduction performance of the air-cooled domain controller. In addition, the cooling parameters can be adjusted according to the use requirements of specific use scenes so as to meet the use requirements of the vehicle in the extreme environment (such as high temperature) of the air-cooled domain controller.

In summary, according to the embodiments of the present disclosure, through the interval distribution of the heat dissipation fins, turbulence and turbulence of the heat dissipation fins are increased, so that the convective heat transfer performance is improved; the radiating fins are distributed in two directions of the axial flow fan, so that the uniformity of the distribution of air quantity among the radiating fins is improved; the heat pipe module is embedded into the integrated die-casting radiator, so that the temperature uniformity of the radiator is obviously improved. The comprehensive application of the technical means can obviously improve the heat dissipation performance of the domain controller. Meanwhile, by arranging the sensor in the air cooling pipe and coupling with the system-level chip, key parameters such as pressure, flow and the like of the cooling system can be monitored and managed in real time, so that fine pipeline control and optimization adjustment are realized.

While several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the utility model. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable subcombination.

The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvements in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (10)

1. An air-cooled domain controller for an autonomous vehicle, comprising:

an upper housing assembly (30) having a first mounting surface (14), the upper housing assembly (30) providing a plurality of first heat dissipating fins (11), a plurality of second heat dissipating fins (12), and a plurality of third heat dissipating fins (13) on the first mounting surface (14), wherein the plurality of first heat dissipating fins (11) are spaced apart in a first direction and have a height greater than the third heat dissipating fins (13), the plurality of second heat dissipating fins (12) are spaced apart in a second direction and have a height of the third heat dissipating fins (13), and wherein the plurality of first heat dissipating fins (11) and the plurality of second heat dissipating fins (12) surround the plurality of third heat dissipating fins (13) to form a recess (19);

a lower case (60);

a printed circuit board (50) disposed between the upper housing assembly (30) and the lower housing (60); and

at least one axial flow fan (40) is arranged in the concave part (19) and the air outlet faces the third radiating fins (13) so as to radiate heat of the printed circuit board (50) through the first radiating fins (11), the second radiating fins (12) and the third radiating fins (13) in an operating state.

2. An air-cooled domain controller according to claim 1, wherein,

the printed circuit board (50) comprises at least one system on chip (51);

the upper housing assembly (30) includes:

a heat sink (10) having a second mounting surface (15), the second mounting surface (15) being recessed and opposite the first mounting surface (14); and

a heat pipe module (20) comprising a heat pipe (21) and a heat dissipation copper block (22),

the heat pipe (21) is at least partially embedded in the second mounting surface (15) so as to be thermally coupled with the heat sink (10), and the heat pipe (21) is adapted to transfer heat emitted by at least one of the system on chip (51) at least partially to the heat pipe (21) via the heat dissipating copper block (22).

3. An air-cooled domain controller according to claim 2, wherein,

the printed circuit board (50) further comprises other heat generating devices (52); and

the heat sink (10) further comprises a third mounting surface (16), the third mounting surface (16) being on the same side as the second mounting surface (15) and having a heat dissipating boss (17) provided thereon, the heat dissipating boss (17) being adapted to transfer heat emitted by the other heat generating device (52) at least partially to the heat sink (10).

4. An air-cooled domain controller as claimed in claim 3, wherein,

a first heat conducting gel (80) is arranged between at least one system-on-chip (51) and the heat dissipation copper block (22); or (b)

The first heat conduction gel (80) is arranged between the heat dissipation boss (17) and the other heating devices (52); or (b)

A second heat conducting gel (90) is arranged between the heat pipe (21) and the radiator (10).

5. An air-cooled domain controller according to claim 3, characterized in that the heat pipe module (20) further comprises a fixed copper sheet (23), the heat pipe (21) comprises an evaporation section (24) and a condensation section (25) at both ends, respectively, the evaporation section (24) being thermally coupled to the heat-dissipating copper block (22) and the condensation section (25) being fixed to the second mounting surface (15) via the fixed copper sheet (23).

6. An air-cooled domain controller according to claim 1, characterized in that the following parameters of the plurality of first radiator fins (11), the plurality of second radiator fins (12) and the plurality of third radiator fins (13) are related to each other: fin height, fin thickness, and fin pitch.

7. An air-cooled domain controller according to claim 1, wherein the first direction is a length direction of the domain controller and the second direction is a width direction of the domain controller.

8. An air-cooled domain controller according to claim 2, characterized in that the axial flow fan (40) is spaced a preset distance from the plurality of third heat fins (13) and is adjacent to at least one of the system-on-chip (51).

9. An air-cooled domain controller according to claim 2, wherein,

the radiator (10) is formed by integral die casting; and

the heat pipe (21) is adapted to the layout of at least one of the system on chip (51) on the printed circuit board (50).

10. An autonomous vehicle comprising an air-cooled domain controller according to any one of claims 1 to 9.