CN217904925U

CN217904925U - Heat dissipation device for controller and controller assembly

Info

Publication number: CN217904925U
Application number: CN202221440985.6U
Authority: CN
Inventors: 曹豪杰
Original assignee: Beijing Idriverplus Technologies Co Ltd
Current assignee: Beijing Idriverplus Technologies Co Ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-11-25
Anticipated expiration: 2032-06-09

Abstract

The utility model discloses a heat abstractor and controller subassembly for controller, wherein heat abstractor includes: the cooling plate is provided with a cooling fin group, and a cooling fan is fixed on the cooling fin group, and an air outlet of the cooling fan faces the cooling fin group; the radiating fin group is provided with a hollow structure to form an air guide groove, one end of the air guide groove is adjacent to the position right below the radiating fan, and the other end of the air guide groove is adjacent to the edge of the radiating fin group. The embodiment of the utility model provides a heat abstractor compares in current water-cooling heat abstractor, and spare part is showing and is reducing, consequently can reduce heat abstractor's cost. Furthermore, because the parts are few and are integrated on the heat dissipation plate, the required installation space is relatively smaller after the controller is additionally provided with the heat dissipation device, and the heat dissipation device can be suitable for mechanical equipment with smaller space.

Description

Heat dissipation device for controller and controller assembly

Technical Field

The utility model relates to a controller field of making, in particular to heat abstractor and controller subassembly for controller.

Background

Automatic driving equipment such as an automatic driving automobile, a sweeper and the like is generally provided with a controller, and the controller is mainly used for receiving working condition information detected by a sensor of the equipment, carrying out corresponding decision and processing according to a control program which is pre-programmed in the equipment, and then outputting a control signal to a corresponding actuator through an output interface of the controller. At present, the types of controllers are more and more, and the integration and intellectualization levels are higher and higher, so that more and more chips and more components are used on the controllers. Some high performance chips, modules, and power-related components are relatively powerful and release a large amount of heat when the controller is operating. In order to ensure that the chip and the component are not burned down during normal operation, a heat dissipation device is usually provided for the controller to rapidly exhaust heat generated by the component from the controller, so as to ensure that the working temperature of the chip and the component is not burned down beyond the temperature saving of the chip and the component.

In the prior art, the controller generally adopts water cooling heat dissipation, and the heat dissipation device includes a cooling water pipeline 10, a water pump 11, a radiator 12 and a water tank 13 which are arranged inside the controller housing as shown in fig. 1. Under the action of the water pump 11, the cooling water flows into the cooling water pipeline 10 inside the controller shell from the water tank 13 through an external pipeline, the heat inside the controller is taken away through heat exchange, meanwhile, the cooling water is heated, the heated cooling water flows into the radiator 12 to be cooled, and the cooled cooling water circulates in the inflow water tank 13.

The water-cooling heat dissipation device has the following problems:

(1) The water-cooling heat abstractor needs to be equipped with a set of hydrologic cycle, cooling system alone for the controller, includes: the cooling water pipeline, the water tank, the water pump, the external pipeline, the radiator and the like in the controller shell are more in parts, so that the cost of the heat radiator is higher.

(2) Since there are many parts, the controller needs to occupy a large space after the heat dissipation device is mounted, and thus it is difficult to apply the controller to a small-sized machine with a small space.

(3) The water-cooling heat dissipation device is troublesome to maintain, and the later maintenance cost is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be applied to heat abstractor of controller to at least partly solve the problem that current water-cooling heat abstractor exists. An object of the utility model is to provide a controller subassembly, it includes the heat abstractor of first aspect.

To achieve the above object, the present invention provides in a first aspect a heat dissipation device for a controller, including:

heat dissipating plate having heat dissipating fin group, and

the heat dissipation fan is fixed on the heat dissipation fin group, and an air outlet of the heat dissipation fan faces the heat dissipation fin group;

the radiating fin group is provided with a hollow structure to form an air guide groove, one end of the air guide groove is close to the position right below the radiating fan, and the other end of the air guide groove is close to the edge of the radiating fin group.

In some embodiments, the air guide groove gradually widens in width in a length direction from the one end toward the other end.

In some embodiments, the fin group is provided with a plurality of air guide grooves, and the plurality of air guide grooves are not communicated with each other.

In some embodiments, the plurality of air guide grooves have different lengthwise directions.

In some embodiments, the number of the heat dissipation fans is at least two, wherein, corresponding to each heat dissipation fan, the heat dissipation fin group is provided with a plurality of air guide grooves in different directions, and the air guide grooves corresponding to different heat dissipation fans are not communicated with each other.

In some embodiments, the length direction of the air guide grooves is transverse to the extending direction of each fin in the heat dissipation fin group.

In some embodiments, the heat dissipating fin group includes a first region of heat dissipating fins located below the heat dissipating fan and a second region of heat dissipating fins surrounding the first region, and the height of the first region of heat dissipating fins is lower than the height of the second region of heat dissipating fins.

A second aspect of the present invention provides a controller assembly, comprising a controller and the aforementioned heat dissipation device.

In some embodiments, the housing of the controller is formed with a window exposing the chip, and a side of the heat dissipation plate facing away from the heat dissipation fin set is provided with a heat dissipation boss, and when the heat dissipation device is fixed on the controller, the heat dissipation boss passes through the window to approach the chip.

In some embodiments, the heat dissipating boss is located directly below the heat dissipating fan.

In some embodiments, a thermally conductive silicone layer is formed between the heat-dissipating boss and the chip.

In some embodiments, the controller assembly further includes a housing covering over the heat sink to protect the heat dissipation fan and the heat dissipation fin group, the housing being provided with a ventilation opening corresponding to the heat dissipation fan.

The embodiment of the utility model provides a heat abstractor absorbs the heat that the controller during operation chip produced through the heating panel, and the radiating fin group of heating panel can increase heat radiating surface area to improve the radiating efficiency. The heat dissipation fan can lead air with lower temperature in the surrounding environment to the heat dissipation plate, and the air is guided by the air guide grooves to be distributed in the gaps of the heat dissipation fins, flows along the heat dissipation fins and finally returns to the surrounding environment, so that heat absorbed by the heat dissipation plate is taken away, and the temperature of the chip is effectively reduced when the controller works.

Furthermore, the embodiment of the present invention provides a heat dissipation device, which mainly includes a heat dissipation plate having a heat dissipation fin set and a heat dissipation fan fixed thereon, and compared with the existing water-cooling heat dissipation device, the number of parts is significantly reduced, thereby reducing the cost of the heat dissipation device. Furthermore, because the parts are few and are integrated on the heat dissipation plate, after the controller is additionally provided with the heat dissipation device, the required installation space is relatively smaller, and the controller can be suitable for automatic driving equipment with smaller space. Moreover, because spare part is few, simple structure, consequently this heat abstractor later maintenance is more convenient, and the maintenance cost is also than lower.

Drawings

Fig. 1 is a schematic structural diagram of a conventional water-cooling heat dissipation device;

fig. 2 is a schematic structural diagram of a side surface of a heat dissipation plate of a heat dissipation device according to an embodiment of the present invention;

fig. 3 is a schematic structural view of another side surface of a heat dissipation plate of a heat dissipation device according to an embodiment of the present invention;

fig. 4 is an exploded view of a controller assembly provided by an embodiment of the present invention;

fig. 5 is an overall schematic diagram of a controller assembly according to an embodiment of the present invention.

Detailed Description

In order to clearly understand the technical solution, purpose and effect of the present invention, the detailed embodiments of the present invention will be described with reference to the accompanying drawings.

As shown in fig. 2-5, an embodiment of the present invention provides a heat dissipation device for a controller, including:

a heat-dissipating plate 20 having a heat-dissipating fin group 21, and

a heat dissipating fan 22 fixed to the heat dissipating fin set 21, an air outlet of the heat dissipating fan 22 facing the heat dissipating fin set 21;

the heat dissipating fin set 21 has a hollow structure to form an air guiding groove 23, one end 23A of the air guiding groove is adjacent to the right below of the heat dissipating fan 22, and the other end 23B is adjacent to the edge of the heat dissipating fin set 21.

The embodiment of the utility model provides a heat abstractor, the heat that the chip produced when absorbing the controller during operation through heating panel 20, radiating fin group 21 can increase heat radiating surface area to improve the radiating efficiency. The heat dissipation fan 22 can guide air with a lower temperature in the surrounding environment to the heat dissipation plate 20, and the air is guided by the air guiding groove 23, distributed in the gaps of the heat dissipation fins, flows along the heat dissipation fins, and finally returns to the surrounding environment, so as to take away the heat absorbed by the heat dissipation plate 20, thereby effectively reducing the temperature of the chip when the controller works.

Moreover, since the air guide grooves 23 are formed in the fin groups 21, even if a small-sized heat dissipation fan is used, the introduced air can be surely distributed in the gaps of almost all the heat dissipation fins via the air guide grooves 23, and therefore the volume of the heat dissipation apparatus can be further reduced.

In the present invention, the length direction of the air guide groove may be understood as a direction from one end of the air guide groove directly below the adjacent cooling fan to the other end of the edge of the adjacent cooling fin group.

In some embodiments of the present invention, the heat dissipation plate 20 may be made of copper metal. Copper has good thermal conductivity, and is more favorable for the heat dissipation plate 20 to absorb heat generated by the chip.

In some embodiments of the present invention, as shown in fig. 2, the air guide groove 23 gradually widens in width in the length direction from one end 23A toward the other end 23B. With the design, the flow velocity of the air in the process of being far away from the heat radiation fan 22 is more favorably maintained, and the heat radiation efficiency is favorably improved.

In some embodiments of the present invention, the heat dissipating fin group 21 is provided with a plurality of air guiding grooves 23, and the plurality of air guiding grooves 23 are not communicated with each other. In this way, it is advantageously avoided that direct contact of air in the different air guiding grooves 23 causes convection, which is detrimental to the guiding of air by the air guiding grooves 23 to the gaps of the heat dissipating fins. In the present embodiment, the plurality of air guide grooves 23 may correspond to one heat dissipation fan 22, or may correspond to a plurality of heat dissipation fans 22.

In some embodiments of the present invention, the length directions of the plurality of air guide grooves 23 are different. The arrangement of the air guide grooves 23 in different directions is more beneficial to more comprehensive and uniform distribution of air in the gaps of the radiating fins.

In some embodiments of the present invention, the number of the heat dissipation fans 22 may be at least two, wherein, corresponding to each heat dissipation fan 22, the heat dissipation fin set 21 is provided with a plurality of air guiding grooves 23 in different directions, and the air guiding grooves 23 corresponding to different heat dissipation fans 22 are not communicated with each other.

Through setting up a plurality of radiator fan 22, make every radiator fan 22 correspond and different radiating fin group region, can lead to the heating panel with a larger amount of ambient air to can improve the heat exchange efficiency of heating panel and ambient air, more be favorable to the cooling of chip. However, the provision of too many fans increases the volume of the heat dissipation device, and increases the manufacturing cost of the heat dissipation device. Therefore, the specific number of the heat dissipation fans can be determined by those skilled in the art according to actual needs. In some embodiments, the number of the heat dissipation fans may be two. Moreover, as mentioned above, the arrangement of the air guiding grooves 23 in different directions is more favorable for the air to be distributed in the gaps of the heat dissipating fins completely and uniformly. In addition, the air guiding grooves 23 corresponding to different heat dissipating fans 22 are not communicated with each other, so that convection caused by direct contact of air in the air guiding grooves 23 corresponding to different heat dissipating fans 22 can be avoided, and the convection of air is not beneficial to guiding the air to the gaps of the heat dissipating fins by the air guiding grooves 23.

In some embodiments of the present invention, each of the heat dissipation fans 22 corresponds to two air guiding grooves 23, and the length directions of the two air guiding grooves 23 are opposite to each other. As shown in fig. 2 and 4, two heat dissipation fans 22 are fixed to the heat dissipation plate 20, and two air guide grooves 23 are provided on both sides of each heat dissipation fan 22, respectively, and are opposite in the longitudinal direction. By the two air guide grooves 23, the air introduced by the cooling fan 22 can be distributed in the fin group region corresponding to the fan completely and uniformly.

In some embodiments of the present invention, the length direction of the air guiding grooves 23 is transverse to the extending direction of each fin in the fin group 21. With this design, the air guide groove 23 can realize the air guide function with a shorter length, the air flow rate loss is smaller, and the formation of the air guide groove 23 is simpler.

In some embodiments of the present invention, as shown in fig. 2, the heat dissipating fin group 21 includes a heat dissipating fin of a first region 21A located below the heat dissipating fan 22 and a heat dissipating fin of a second region 21B surrounding the first region 21A, and the height of the heat dissipating fin of the first region 21A is lower than that of the heat dissipating fin of the second region 21B. In the specific implementation process, the heat dissipation fan 22 is fixed to the first area 21A, and the height of the heat dissipation fins of the first area 21A is lower than that of the heat dissipation fins of the second area 21B, so that the height of the whole heat dissipation device can be further reduced and the volume of the heat dissipation device can be reduced without affecting the heat dissipation of the fins.

In some embodiments of the present invention, the first region 21A may be provided with a fan mounting hole, and the heat dissipation fan 22 may be fixed on the heat dissipation fin group 21 via the fan mounting hole.

As shown in fig. 4-5, an embodiment of the present invention further provides a controller assembly, which includes a controller and the aforementioned heat dissipation device.

In some embodiments of the present invention, the housing 31 of the controller is formed with a window 32 exposing the chip, and a side of the heat dissipation plate 20 facing away from the heat dissipation fin set 21 is provided with a heat dissipation boss 24 (as shown in fig. 3), and when the heat dissipation device is fixed on the controller, the heat dissipation boss 24 passes through the window 32 to approach the chip.

In the present embodiment, the number and shape of the windows 32 are the same as those of the heat dissipation bosses 24, so that the heat dissipation bosses 24 can smoothly pass through the windows 32 to approach the chip and absorb the heat generated by the chip. The number and shape of the windows 32 and the heat dissipating bosses 24 can be determined by those skilled in the art according to actual needs. Preferably, the number of windows 32, heat dissipating bosses 24 and heat dissipating fans 22 is the same. More preferably, the heat dissipation boss 24 is located directly below the heat dissipation fan 22. Because the heat dissipation boss 24 directly absorbs heat from the chip, the temperature of the heat dissipation boss 24 and the heat dissipation fins above the heat dissipation boss 24 is higher than that of other parts, so that the heat dissipation fan 22 is fixed right above the heat dissipation boss 24, low-temperature air in the environment introduced by the heat dissipation fan 22 is firstly contacted with the heat dissipation fins above the heat dissipation boss 24, and a larger temperature difference is more favorable for heat conduction and the heat dissipation effect is better.

In addition, the design of the heat dissipating bosses 24 facilitates manufacturing processes as compared to having the entire heat dissipating plate 20 close to the chip. This is because in order to better absorb the heat of the chip, the heat sink needs to be as close to the chip as possible, but at the same time cannot touch the chip to prevent damage to the chip, which requires high processing accuracy. The entire heat sink 20 has a large area, and thus, it is difficult to perform high-precision processing, and even if high-precision processing can be performed, the processing and manufacturing costs are high. The heat dissipating boss 24 has a much smaller area than the entire heat dissipating plate 20, and therefore, high-precision processing is easier and processing and manufacturing costs are lower.

In some embodiments of the present invention, the distance between heat dissipating boss 24 and the chip is about 0.2-0.4mm.

In some embodiments of the present invention, a thermal grease is filled between heat dissipation boss 24 and the chip, thereby forming a thermal grease layer between heat dissipation boss 24 and the chip. The heat resistance of the heat conduction silicone grease is smaller than that of air, the heat conduction silicone grease layer is arranged, heat generated by the chip can be more quickly transmitted to the heat dissipation boss 24 of the heat dissipation plate 20 through the heat conduction silicone grease, and the heat dissipation effect is better.

In some embodiments of the present invention, the housing 31 of the controller is provided with a first mounting hole of the heat dissipation plate, and the heat dissipation plate 20 is provided with a corresponding second mounting hole, and the heat dissipation plate 20 can be fixed on the housing 31 of the controller by using a threaded fastener, such as a screw, via the first mounting hole and the second mounting hole.

In some embodiments of the present invention, the controller assembly further includes a housing 25 covering the heat sink to protect the heat dissipation fan 22 and the heat dissipation fin set 21, and a ventilation opening corresponding to the heat dissipation fan 22 is provided on the housing 25 to facilitate the heat dissipation fan 22 to introduce air in the surrounding environment to the heat dissipation plate 20.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

Claims

1. A heat dissipation device for a controller, comprising:

heat dissipating plate having heat dissipating fin group, and

2. The heat dissipating device of claim 1, wherein the air guide grooves gradually widen in width in a length direction from the one end toward the other end.

3. The heat dissipating device according to claim 1 or 2, wherein the fin group is provided with a plurality of air guide grooves, and the plurality of air guide grooves are not communicated with each other.

4. The heat dissipating device of claim 3, wherein the plurality of air channels have different lengths.

5. The heat dissipating device according to claim 1 or 2, wherein the number of the heat dissipating fans is at least two, and the heat dissipating fin group is provided with a plurality of air guiding grooves with different length directions corresponding to each heat dissipating fan, and the air guiding grooves corresponding to different heat dissipating fans are not communicated with each other.

6. The heat sink according to claim 1 or 2, wherein the air guide grooves have a length direction transverse to an extending direction of each fin of the heat dissipating fin group.

7. The heat dissipating device according to claim 1 or 2, wherein the heat dissipating fin group includes a first region of heat dissipating fins located below the heat dissipating fan and a second region of heat dissipating fins surrounding the first region, the height of the first region of heat dissipating fins being lower than the height of the second region of heat dissipating fins.

8. A controller assembly comprising a controller and the heat dissipation device of any of claims 1-7.

9. The controller assembly of claim 8, wherein the housing of the controller is formed with a window exposing the chip, and a side of the heat sink plate facing away from the set of heat sink fins is provided with a heat sink boss through which the heat sink boss passes to access the chip when the heat sink device is secured to the controller.

10. The controller assembly of claim 9, wherein the heat dissipating boss is located directly below the heat dissipating fan.

11. The controller assembly of claim 9, wherein a thermally conductive silicone layer is formed between the heat-dissipating boss and the chip.

12. The controller assembly according to any one of claims 8-11, further comprising a housing covering over the heat sink to protect the heat dissipation fan and the set of heat dissipation fins, the housing being provided with a ventilation opening corresponding to the heat dissipation fan.