CN220526909U - Modularized diode - Google Patents
Modularized diode Download PDFInfo
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- CN220526909U CN220526909U CN202322189805.2U CN202322189805U CN220526909U CN 220526909 U CN220526909 U CN 220526909U CN 202322189805 U CN202322189805 U CN 202322189805U CN 220526909 U CN220526909 U CN 220526909U
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- diode
- diode chip
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 6
- 210000004027 cell Anatomy 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Photovoltaic Devices (AREA)
Abstract
The utility model relates to a modularized diode, which comprises a first terminal plate, a second terminal plate, a diode chip and a packaging body; one end of the first terminal plate is provided with a first connecting part perpendicular to the first terminal plate, one end of the second terminal plate is provided with a second connecting part perpendicular to the second terminal plate, the diode chip is perpendicular to the first terminal plate and the second terminal plate and is clamped between the first connecting part and the second connecting part, and two end faces of the diode chip are welded and fixed with the first connecting part and the second connecting part respectively; the package body is coated outside the diode chip, the first connecting part and the second connecting part. The modularized diode has simple structure and stable connection.
Description
Technical Field
The utility model relates to a chip diode, and belongs to the technical field of semiconductors.
Background
The solar junction box is a connector between the solar cell matrix formed by the solar cell components and the solar charging control device, and provides a combined connection scheme of the solar cell panel for users. The double-glass solar cell module consists of two glass layers on the front side and the back side and a solar cell positioned in the middle of the glass layers. The insulation of the glass is superior to that of the back plate, the double-glass assembly can meet higher system voltage, the abrasion resistance advantage is obvious, and the double-glass assembly is suitable for photovoltaic power stations in areas with more acid rain or large salt mist. Because of its structure, unlike a back-plate solar cell module, a split junction box is generally employed. Modular chip diodes are often used in split junction boxes.
Chinese patent document CN112271166a discloses an electrode structure that facilitates the encapsulation of a diode photovoltaic module, comprising a left electrode, a right electrode and a plastic package. The left electrode comprises a left end part, a middle part and a right end part, a left slot hole is formed in the joint of the right end part and the middle part, the upper side and the lower side of the right end part are wavy, the right side of the left slot hole is provided with a slot hole and a semi-enclosed groove in sequence, and chips are arranged on the upper side and the lower side of the slot hole of the right end part of the left electrode. The right electrode comprises a left end part and a right end part, a right slot hole is formed in the joint of the left end part and the right end part of the right electrode, a double-sided wavy convex block is arranged on the left side of the left end part of the right electrode, and connecting strips are arranged on the upper side and the lower side of the double-sided wavy convex block of the left end part of the right electrode. The plastic package body wraps the right end part of the left electrode and the left end part of the right electrode through the right slot hole of the right end part of the left electrode and the left slot hole of the right electrode. The electrode of the diode in the patent is connected in a lap joint way through the connecting strip, so that the stability is poor, the connecting structure is complex, the manufacturing procedures are more, and the cost is high.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a modularized diode with a simple structure and stable connection.
The utility model provides a technical scheme for solving the technical problems, which is as follows: a modularized diode comprises a first terminal plate, a second terminal plate, a diode chip and a packaging body; one end of the first terminal plate is provided with a first connecting part perpendicular to the first terminal plate, one end of the second terminal plate is provided with a second connecting part perpendicular to the second terminal plate, the diode chip is perpendicular to the first terminal plate and the second terminal plate and is clamped between the first connecting part and the second connecting part, and two end faces of the diode chip are welded and fixed with the first connecting part and the second connecting part respectively; the package body is coated outside the diode chip, the first connecting part and the second connecting part.
Preferably, the first terminal piece and the second terminal piece are arranged side by side, the first terminal piece and the first connecting portion are arranged in a T-shape, and the second terminal piece and the second connecting portion are arranged in a T-shape.
Preferably, the first terminal plate is provided with a first converging groove, the second terminal plate is provided with a second converging groove, the first converging groove and the second converging groove are arranged in parallel, and two sides of the package body are attached to the side edges of the first converging groove and the second converging groove.
Preferably, the first terminal plate and the second terminal plate are respectively provided with at least two limiting through holes.
Preferably, the first terminal plate and the second terminal plate are rectangular copper plates.
Preferably, the width of the package is greater than the widths of the first and second terminal plates.
Preferably, a press joint is arranged at one end of the first terminal plate far away from the first connecting part.
Preferably, a press joint is arranged at one end of the second terminal plate far away from the second connecting part.
Preferably, the width of the diode chip is greater than the width of the first connection portion, and the width of the diode chip is greater than the width of the second connection portion.
Preferably, the first terminal plate and the second terminal plate are the same in size and symmetrically arranged.
The utility model has the positive effects that: according to the modularized diode, the diode chips are vertically arranged, the two copper terminal plates are widened to form the connecting parts through the cold stamping process, then the connecting parts symmetrically clamp the diode chips, the positive end surface and the negative end surface of the diode chips are welded and fixed with the connecting parts of the two terminal plates respectively, the connecting mode is simpler, the welding surface is larger than the connecting mode of the electrodes of the traditional diode chips, the connecting structure is more stable, the heat dissipation effect is better, the manufacturing process is facilitated to be simplified, the cost is reduced, and the yield is improved.
Drawings
A modular diode according to the utility model is further described below with reference to the accompanying drawings.
Fig. 1 is a schematic perspective view of a modular diode according to embodiment 1.
Fig. 2 is a schematic perspective view of the modular diode of fig. 1 with the package removed.
Fig. 3 is a schematic perspective view of the modular diode according to embodiment 2.
The above reference numerals are as follows:
the semiconductor device comprises a first terminal plate 1, a second terminal plate 2, a diode chip 3, a press joint 4, a first converging groove 6, a second converging groove 7, a packaging body 8, a first connecting part 11 and a second connecting part 21.
Detailed Description
Example 1
Referring to fig. 1 and 2, the modularized diode of the present embodiment includes a first terminal plate 1, a second terminal plate 2, a diode chip 3, and a package 8. The first terminal piece 1 and the second terminal piece 2 are rectangular copper sheets, the first terminal piece 1 and the second terminal piece 2 are arranged side by side, and the first terminal piece 1 and the second terminal piece 2 are identical in size and symmetrically arranged. One end of the first terminal plate 1 is provided with a first connecting part 11 perpendicular to the first terminal plate 1, and the first terminal plate 1 and the first connecting part 11 are arranged in a T shape. One end of the second terminal plate 2 is provided with a second connecting part 21 perpendicular to the second terminal plate 2, and the second terminal plate 2 and the second connecting part 21 are arranged in a T shape. The diode chip 3 is perpendicular to the first terminal piece 1 and the second terminal piece 2 and is clamped between the first connecting portion 11 and the second connecting portion 21, and two end faces of the diode chip 3 are welded and fixed with the first connecting portion 11 and the second connecting portion 21 respectively. The package body 8 is wrapped around the diode chip 3, the first connection portion 11, and the second connection portion 21.
The first terminal plate 1 is provided with a first converging groove 6, and the second terminal plate 2 is provided with a second converging groove 7. The first and second flow converging grooves 6 and 7 are arranged in parallel. Two sides of the packaging body 8 are attached to the side edges of the first converging groove 7 and the second converging groove 7. The first terminal plate 1 and the second terminal plate 2 are respectively provided with two limiting through holes,
the width of the package body 8 is larger than the widths of the first terminal piece 1 and the second terminal piece 2, and the end of the first terminal piece 1 away from the first connection portion 11 is provided with the press-fit head 4. The width of the diode chip 3 is larger than the width of the first connection portion 11, and the width of the diode chip 3 is larger than the width of the second connection portion 21.
During manufacturing, one end of the first terminal plate 1 is punched into the first connection part 11 through cold punching, one end of the second terminal plate 2 is punched into the second connection part 21, one end face of the diode chip 3 is fixed on the first connection part 11 through soldering, and the other end face of the diode chip 3 is fixed on the second connection part 21 through soldering, so that the diode chip 3 is vertically arranged and clamped between the first connection part 11 and the second connection part 21, and finally plastic packaging is performed, and the package body 8 is coated outside the diode chip 3, the first connection part 11 and the second connection part 21. The diode chip 3 is tightly attached to the first connecting portion 11 and the second connecting portion 21, the contact area is large, the heat dissipation performance is better, and the connection is stable.
Example 2
Referring to fig. 3, the rest of the present embodiment is the same as embodiment 1 except that: the first terminal 1 and the second terminal piece 2 are not provided with the press joint 4, and the cable conductor can be directly welded on the first terminal piece 1 or the second terminal piece 2 when in use.
It should be understood that the above-described embodiments are merely examples for clearly illustrating the embodiments of the present utility model, and are not limiting of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While remaining within the scope of the utility model, obvious variations or modifications are incorporated by reference herein.
Claims (10)
1. A modular diode, characterized by: comprises a first terminal plate (1), a second terminal plate (2), a diode chip (3) and a package body (8); one end of the first terminal plate (1) is provided with a first connecting part (11) perpendicular to the first terminal plate (1), one end of the second terminal plate (2) is provided with a second connecting part (21) perpendicular to the second terminal plate (2), the diode chip (3) is perpendicular to the first terminal plate (1) and the second terminal plate (2) and is clamped between the first connecting part (11) and the second connecting part (21), and two end faces of the diode chip (3) are respectively welded and fixed with the first connecting part (11) and the second connecting part (21); the packaging body (8) is coated outside the diode chip (3), the first connecting part (11) and the second connecting part (21).
2. A modular diode according to claim 1, wherein: the first terminal piece (1) and the second terminal piece (2) are arranged side by side, the first terminal piece (1) and the first connecting portion (11) are arranged in a T-shaped mode, and the second terminal piece (2) and the second connecting portion (21) are arranged in a T-shaped mode.
3. A modular diode according to claim 1, wherein: the packaging structure is characterized in that a first converging groove (6) is formed in the first terminal plate (1), a second converging groove (7) is formed in the second terminal plate (2), the first converging groove (6) and the second converging groove (7) are arranged in parallel, and two sides of the packaging body (8) are attached to the side edges of the first converging groove (6) and the second converging groove (7).
4. A modular diode according to any one of claims 1 to 3, characterized in that: the first terminal plate (1) and the second terminal plate (2) are respectively provided with at least two limiting through holes.
5. A modular diode according to any one of claims 1 to 3, characterized in that: the first terminal piece (1) and the second terminal piece (2) are rectangular copper pieces.
6. A modular diode according to any one of claims 1 to 3, characterized in that: the width of the package body (8) is larger than the width of the first terminal plate (1) and the second terminal plate (2).
7. A modular diode according to any one of claims 1 to 3, characterized in that: one end of the first terminal plate (1) far away from the first connecting part (11) is provided with a pressing joint (4).
8. A modular diode according to any one of claims 1 to 3, characterized in that: and a pressing joint (4) is arranged at one end of the second terminal plate (2) far away from the second connecting part (21).
9. A modular diode according to any one of claims 1 to 3, characterized in that: the width of the diode chip (3) is larger than the width of the first connecting part (11), and the width of the diode chip (3) is larger than the width of the second connecting part (21).
10. A modular diode according to any one of claims 1 to 3, characterized in that: the first terminal plate (1) and the second terminal plate (2) are identical in size and symmetrically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322189805.2U CN220526909U (en) | 2023-08-15 | 2023-08-15 | Modularized diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322189805.2U CN220526909U (en) | 2023-08-15 | 2023-08-15 | Modularized diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220526909U true CN220526909U (en) | 2024-02-23 |
Family
ID=89923514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322189805.2U Active CN220526909U (en) | 2023-08-15 | 2023-08-15 | Modularized diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220526909U (en) |
-
2023
- 2023-08-15 CN CN202322189805.2U patent/CN220526909U/en active Active
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