CN220509975U - RTA equipment and RTA reaction board that can accurate accuse temperature - Google Patents

Abstract

The utility model provides RTA equipment capable of accurately controlling temperature and an RTA reaction machine table, wherein the RTA equipment is used for quenching and annealing a semiconductor chip at high temperature and comprises a carrier disc, a reaction chamber, a temperature adjusting processor and a plurality of temperature measuring components, the carrier disc is positioned in the reaction chamber, a plurality of fixed hole sites are arranged on the carrier disc, the fixed hole sites are distributed at the position, close to the middle point, of each edge of the carrier disc and the position, close to the center point, of a disc body of the carrier disc, one end of the temperature measuring component is connected with the fixed hole sites, the other end of the temperature measuring component is connected with the temperature adjusting processor, the temperature adjusting processor comprises a temperature measuring module and a temperature controlling module, a heating component is arranged in the reaction chamber, and the temperature controlling module is connected with the heating component.

Description

RTA equipment and RTA reaction board that can accurate accuse temperature

Technical Field

The utility model relates to the technical field of semiconductor chip production, in particular to RTA equipment capable of accurately controlling temperature and an RTA reaction machine.

Background

RTA (Rapid Thermal Annealing ) has important applications in the modern semiconductor industry for heat treating wafers with extremely rapid elevated temperatures for a brief duration at a target temperature (around 1000 ℃). The rapid temperature rise process and short duration can be optimized between repairing lattice defects, activating impurities and minimizing impurity diffusion, and annealing of the implanted wafer is often performed in an RTA station implanted with Ar or N2.

The existing semiconductor industry only relies on two temperature measuring components to grasp the temperature, the two temperature measuring components are only attached to a SIC disk, the temperature measuring components cannot be fixed on the SIC disk and contact failure to cause temperature deviation, time consumption of temperature measurement is long, the tested temperature and actual temperature deviation are large, all RTA alloy equipment adopts manual adjustment of TC-wafer values, namely, the temperature in the RTA equipment is manually adjusted, personnel staring is required, the temperature required in an RTA machine can not be timely given, and the quality of a semiconductor chip is finally affected.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide RTA equipment capable of accurately controlling temperature, and aims to solve the technical problems that in the prior art, the time for temperature measurement is long due to different fixing modes and placement modes of temperature measuring components, and the deviation between the measured temperature and the actual temperature is large, meanwhile, the traditional RTA alloy equipment adopts manual adjustment of TC-wafer values, so that people need to watch, and the temperature needed in an RTA machine can not be timely given, and finally the quality of a semiconductor chip is affected.

In order to achieve the above object, the present utility model is achieved by the following technical scheme:

the utility model provides a but RTA equipment of accurate accuse temperature for semiconductor chip high temperature quenching anneals, RTA equipment includes carrier plate, reaction chamber, temperature regulation treater and a plurality of temperature measurement subassembly, the carrier plate is located in the reaction chamber offer a plurality of fixed hole sites on the carrier plate, a plurality of fixed hole sites distribute each limit on the carrier plate is close to the position of midpoint and the disk body of carrier plate is close to the position of central point, the one end of temperature measurement subassembly with fixed hole site is connected, the other end of temperature measurement subassembly with temperature regulation treater is connected, temperature regulation treater includes temperature measurement module and temperature control module, be equipped with heating element in the reaction chamber, temperature control module with heating element connects.

Compared with the prior art, the utility model has the beneficial effects that:

because the temperature in the reaction chamber is even, and the slide glass dish is located the intermediate position in the reaction chamber, so the temperature of whole slide glass dish in the reaction chamber is even, through seting up fixed hole site at the quartering on the slide glass dish and intermediate position, and locate fixed hole site with the one end of temperature measurement subassembly, the temperature of each point on whole slide glass dish can be measured, this temperature is more close to actual temperature, in addition, set up fixed hole site at the quartering of slide glass dish and intermediate position, temperature measurement subassembly can hang in fixed hole site, make temperature measurement subassembly firmly fix on the slide glass dish, the effect of catching the temperature is better, in the view of all right, this arrangement scheme is more close to actual temperature in order to reach better temperature measurement effect in more firmly the temperature measurement subassembly, and temperature measurement subassembly will be measured temperature transfer to temperature regulation treater in, handle the regulation K value (heating coefficient), then export to the heating subassembly in the reaction chamber fast, in time give the required temperature in the reaction chamber, in order to promote the quality of semiconductor chip.

Further, the carrier plate is of a square structure, and a plurality of fixing holes are positioned at the midpoints of four sides of the carrier plate and at the center point of the plate body of the carrier plate.

Further, the fixing hole sites at the middle points of the four sides of the slide plate are arranged at the side edges of the slide plate, and the fixing hole sites at the center point of the slide plate are arranged at the bottom of the slide plate.

Further, the temperature measuring assembly comprises a thermocouple, the thermocouple comprises a hot electrode and a wiring part which are connected with each other, the free end of the hot electrode is bent towards the direction of the carrier disc to form a bending part, the bending part is inserted into the fixed hole site, and the wiring part is connected with a wiring port of the temperature adjusting processor.

Further, the RTA device capable of precisely controlling temperature further comprises a supporting frame, wherein the supporting frame is located at two opposite sides of the slide tray and used for supporting the slide tray, and a standing groove is formed in the supporting frame relative to the position of two bending parts in a sinking mode.

Further, the temperature control module comprises a signal receiving end, a signal processing end and a signal output end which are sequentially connected in sequence, wherein the signal receiving end is connected with the temperature measurement module, and the signal output end is connected with the heating component.

Further, the heating component comprises a plurality of heating lamp tubes, and the plurality of heating lamp tubes are arranged on the side wall of the reaction chamber.

Further, the chip carrier plate is provided with a monitoring chip and a plurality of chip source holes, and the monitoring chip is positioned between a plurality of chip source holes near the middle part of the chip carrier plate.

Further, the slide tray is made of SIC.

The utility model also provides an RTA reaction machine, which comprises the RTA equipment capable of accurately controlling temperature.

Drawings

FIG. 1 is a perspective view of an RTA reaction tool according to an embodiment of the present utility model;

FIG. 2 is an enlarged view of portion A of FIG. 1 at a first viewing angle;

FIG. 3 is an enlarged view of portion A of FIG. 1 at a second view angle;

FIG. 4 is an enlarged view of portion A of FIG. 1 at a third viewing angle;

FIG. 5 is an enlarged view of portion A of FIG. 1 at a fourth viewing angle;

FIG. 6 is a schematic diagram of the operation of the temperature adjustment processor according to an embodiment of the present utility model;

description of main reference numerals:

RTA reaction machine	10	Push-pull box	20
				Sliding bar	30	Carrier plate	40
Reaction chamber	50	Sheet source hole	41
				Monitoring sheet	42	Supporting frame	43
Stand up groove	44	Thermal electrode	45
				Wire connection part	46	Fixed hole site	47

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 6, an RTA reaction apparatus 10 in an embodiment of the utility model is shown, the RTA reaction apparatus 10 includes an RTA device capable of precisely controlling temperature, the RTA device capable of precisely controlling temperature is used for quenching and annealing a semiconductor chip at high temperature, the RTA device capable of precisely controlling temperature includes a carrier plate 40, a reaction chamber 50, a temperature adjusting processor and a plurality of temperature measuring components, the carrier plate 40 is located in the reaction chamber 50, a plurality of fixing holes 47 are formed on the carrier plate 40, the fixing holes 47 are uniformly distributed at positions of each edge of the carrier plate 40 near a middle point and positions of a plate body of the carrier plate 40 near a center point, one end of the temperature measuring component is connected with the fixing holes 47, the other end of the temperature measuring component is connected with the temperature adjusting processor, the temperature adjusting processor includes a temperature measuring module and a temperature controlling module, a heating component is arranged in the reaction chamber 50, and the temperature controlling module is connected with the heating component.

In this embodiment, the carrier plate 40 has a square structure, the plurality of fixing holes 47 are located at the midpoints of the four sides of the carrier plate 40 and at the center point of the tray body of the carrier plate 40, that is, 5 fixing holes 47 are distributed on the carrier plate 40 in front-back, left-right directions, the fixing holes 47 at the midpoints of the four sides of the carrier plate 40 are opened at the side edges of the carrier plate 40, the fixing holes 47 at the center point of the carrier plate 40 are opened at the bottom of the carrier plate 40, that is, 4 fixing holes 47 in front-back, left-right directions are opened from the side edges, and the middle fixing hole 47 is opened from the chassis.

It can be understood that in the existing semiconductor industry, the temperature is only grasped by two temperature measuring components, the two temperature measuring components are only attached to the SIC disk, the temperature measuring components cannot be fixed on the SIC disk, poor contact causes temperature deviation, time consumption of temperature measurement is long, the temperature deviation between the measured temperature and the actual temperature is large, and all RTA alloy devices manually adjust TC-wafer values, namely manually adjust the temperature in the RTA devices, so personnel are required to stare, the temperature required in the RTA machine cannot be timely given, and the quality of a semiconductor chip is finally affected;

because the temperature in the reaction chamber 50 is uniform, and the slide tray 40 is located at the middle position in the reaction chamber 50, the temperature of the whole slide tray 40 in the reaction chamber 50 is uniform, the temperature of each point on the whole slide tray 40 can be measured by arranging the fixing hole site 47 at the quarter point and the middle position on the slide tray 40 and arranging one end of the temperature measuring component in the fixing hole site 47, the temperature is closer to the actual temperature, in addition, the fixing hole site 47 is arranged at the quarter point and the middle position of the slide tray 40, the temperature measuring component can be hung in the fixing hole site 47, so that the temperature measuring component is firmly fixed on the slide tray 40, the effect of capturing the temperature is better, and the arrangement scheme can be used for more firmly fixing the temperature measuring component to achieve better temperature measuring effect, simultaneously, the measured temperature is closer to the actual temperature, and the measured temperature is transmitted to the temperature adjusting processor to process the temperature adjusting K value (heating coefficient), then the temperature is quickly output to the heating component in the reaction chamber 50, and the temperature of a semiconductor chip required in the reaction chamber 50 is timely improved.

Further, the RTA reaction stage 10 further comprises a push-pull box 20, and the temperature adjusting processor is located on the push-pull box 20 at an end of the slide tray 40 facing away from the reaction chamber 50.

Specifically, the temperature measuring assembly includes a thermocouple, the thermocouple includes a thermode 45 and a connection portion 46 that are connected to each other, the free end of the thermode 45 is bent towards the direction of the slide tray 40 to form a bent portion, the bent portion is inserted into the fixing hole 47, and the connection portion 46 is connected to a connection port of the temperature adjusting processor.

Further, the RTA apparatus capable of precisely controlling temperature further includes a supporting frame 43, where the supporting frame 43 is located at two opposite sides of the slide tray 40 and is used for supporting the slide tray 40, and on the supporting frame 43, a standing groove 44 is formed by recessing relative to two positions of the bending parts.

It will be appreciated that one end of the thermocouple is connected to the push-pull case 20 through the connection part 46, and the other end is extended into the fixing hole 47 at the side of the tray 40, and at the same time, in order to better support the tray 40, the height of the support frame 43 is greater than the height of the tray 40, so that a stand groove 44 is formed at the position of the support frame 43 with respect to the bent part, so that the bent part can be placed in the stand groove 44, and then the connection part 46 is connected with the connection port of the temperature adjustment processor.

In this embodiment, the supporting frame 43 is located at the left and right side walls of the slide tray 40, and two ends of the supporting frame 43 are located on the push-pull box 20, a hole for the slide tray 40 and the supporting frame 43 to enter is formed in the reaction chamber 50, and the push-pull box 20 slides and stretches on the reaction chamber 50 through a sliding rod 30.

It will be appreciated that the slide tray 40 is placed on the support frame 43 and is placed in the push-pull box 20 together with the support frame 43, and then the slide bar 30 is used to pull the push-pull box 20, so as to put the slide tray 40 into or take out of the reaction chamber 50.

Further, the temperature control module comprises a signal receiving end, a signal processing end and a signal output end which are sequentially connected in sequence, wherein the signal receiving end is connected with the temperature measurement module, and the signal output end is connected with the heating component.

It can be understood that the temperature control module reads the temperature measured by the temperature measurement module through the signal receiving end, and then performs high-order operation through the signal processing end, and this step is specifically that the K value (heating coefficient) is automatically adjusted according to the difference between the measured temperature and the temperature required by the current reaction chamber 50, and finally the current required temperature is rapidly output to the reaction chamber 50 through the signal output end, so that the process can realize rapid and accurate control of the temperature in the reaction chamber 50.

Further, the heating component includes a plurality of heating lamps, and a plurality of heating lamps are disposed on the side wall of the reaction chamber 50.

Further, the carrier plate 40 is provided with a monitor plate 42 and a plurality of plate source holes 41, and the monitor plate 42 is located between a plurality of plate source holes 41 near the middle of the carrier plate 40.

It can be understood that the chip source hole 41 is used for placing the semiconductor chip to be processed, and the monitor chip 42 is used for directly measuring the resistance value of the carrier tray 40, because the monitor chip 42 and the chip source hole 41 are located in the same carrier tray 40, the monitor chip 42 can indirectly measure the resistance value of the semiconductor chip to obtain the yield of the semiconductor chip, specifically, the monitor chip 42 is placed on the carrier tray 40 and is located in the reaction chamber 50 together with the semiconductor chip, and after the operation is completed, the resistance value is measured by a specific instrument.

Preferably, the carrier tray 40 is made of SIC.

It will be appreciated that the slide plate 40, which is made of silicon carbide, has the property of being resistant to high temperatures, and that good performance can be maintained throughout the reaction chamber 50.

In summary, in the RTA reaction apparatus of the above embodiment of the present utility model, the temperature measuring component is more firmly fixed to achieve better temperature measuring effect, and the measured temperature is closer to the actual temperature, and the temperature measuring component transmits the measured temperature to the temperature adjusting processor to measure the temperature, process and adjust the K value (heating coefficient), and then rapidly outputs the measured temperature to the heating component in the reaction chamber, so as to timely give the required temperature in the reaction chamber, thereby improving the quality of the semiconductor chip.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The RTA equipment capable of accurately controlling temperature is used for quenching and annealing semiconductor chips at high temperature and is characterized by comprising a carrier disc, a reaction chamber, a temperature adjusting processor and a plurality of temperature measuring components, wherein the carrier disc is positioned in the reaction chamber, a plurality of fixed hole sites are formed in the carrier disc, the fixed hole sites are distributed at the position, close to the middle point, of each edge of the carrier disc and the position, close to the center point, of a disc body of the carrier disc, one end of the temperature measuring component is connected with the fixed hole sites, the other end of the temperature measuring component is connected with the temperature adjusting processor, the temperature adjusting processor comprises a temperature measuring module and a temperature controlling module, a heating component is arranged in the reaction chamber, and the temperature controlling module is connected with the heating component.

2. The RTA apparatus of claim 1 wherein the carrier tray is square in configuration, and a plurality of the fixing holes are located at midpoints of four sides of the carrier tray and at a tray center point of the carrier tray.

3. The RTA apparatus of claim 2 wherein the fixed hole at the midpoint of the four sides of the slide tray is provided at the side of the slide tray, and the fixed hole at the center of the slide tray is provided at the tray bottom of the slide tray.

4. The RTA apparatus of claim 2 wherein the temperature measuring assembly comprises a thermocouple comprising a thermode and a wiring portion connected to each other, wherein the free end of the thermode is bent in a direction toward the carrier plate to form a bent portion, the bent portion is inserted into the fixed hole, and the wiring portion is connected to a wiring port of the temperature adjusting processor.

5. The precision temperature-controllable RTA apparatus of claim 4 further comprising a support frame positioned on opposite sides of the slide tray for supporting the slide tray, wherein on the support frame, a standing groove is formed by recessing relative to the positions of two of the bent portions.

6. The RTA apparatus of claim 1 wherein the temperature control module comprises a signal receiving end, a signal processing end and a signal output end sequentially connected in sequence, the signal receiving end is connected with the temperature measurement module, and the signal output end is connected with the heating component.

7. The RTA apparatus of claim 1 wherein the heat generating assembly comprises a plurality of heat lamps disposed on a side wall of the reaction chamber.

8. The RTA apparatus of claim 1 wherein the carrier tray is provided with a monitor sheet and a plurality of sheet source holes, the monitor sheet being positioned between a plurality of sheet source holes near the middle of the carrier tray.

9. The precisely controllable temperature RTA apparatus of claim 1 wherein the slide tray is made of SIC.

10. An RTA reaction station comprising the precisely temperature controllable RTA apparatus of any one of claims 1 to 9.