CN220493415U - Heat transfer device and heat radiation equipment - Google Patents

Abstract

The application provides a heat transfer device and firing equipment relates to firing equipment field, and heat transfer device includes first piece and the second piece of bending, the second piece of bending with first piece of bending sets up relatively, set up the recess on the second piece of bending, first piece of bending lid is located on the opening of recess in order to form the holding chamber, it has heat transfer medium to flow in the holding chamber, the second piece of bending with first piece of bending is connected in order to form the flexible piece, the flexible piece is used for transferring heat after contacting with the heat source, the flexible piece can bend in order to produce deformation, in order to carry out laminating contact with the heat source of different shapes, thereby can carry out the samming to the heat source of different shapes, the application scope of flexible piece is wide, has improved heat transfer device's heat transfer efficiency.

Description

Heat transfer device and heat radiation equipment

Technical Field

The application relates to the field of heat dissipation equipment, in particular to a heat transfer device and heat dissipation equipment.

Background

In recent years, electronic components have been increasingly developed in miniaturization and high power consumption, and attention has been paid to how to solve the problem of performance degradation of electronic components due to high heat generation. The temperature equalizing plate is used as a novel two-phase flow heat dissipation technology, has the advantages of high heat conductivity, good temperature equalizing property, reversible heat flow direction and the like, solves the problems of small contact area, large heat resistance, uneven heat flow density and the like of the traditional heat pipe, and becomes one of the effective ways for solving the heat dissipation of high heat flow density electronic devices in the electronic industry.

The temperature equalizing plates consist of a closed container, a capillary structure and working fluid, in order to ensure that the temperature equalizing plates have high-efficiency heat exchange performance, a shell is made of a material with high heat conductivity, liquid suction cores are attached to the periphery of the inner wall, and in order to meet pressure-resistant requirements, solid columns, sintering columns or liquid suction cores attached to the outer surfaces of the solid columns are designed in the temperature equalizing plates to form sintering rings. The existing temperature equalizing plate can only perform temperature equalizing on heat sources on the same plane, and cannot perform effective temperature equalizing on heat sources which are not in the same plane, so that the application range is small, and the heat dissipation efficiency of the heat sources is affected.

Disclosure of Invention

In order to overcome the defects in the prior art, the application provides a heat transfer device and heat dissipation equipment.

In a first aspect, the present application provides a heat transfer device comprising: the first bending piece and the second bending piece, the second bending piece with the first bending piece sets up relatively, set up the recess on the second bending piece, the first bending piece lid is located on the opening of recess is in order to form and hold the chamber, it has heat transfer medium to flow in holding the chamber, the second bending piece with the first bending piece is connected in order to form the flexible piece, the flexible piece is used for transmitting heat after contacting with the heat source.

With reference to the first aspect, in a possible implementation manner, the flexible member includes a first end portion and a second end portion, and the first end portion is used for transferring heat of the heat source to the second end portion after the first end portion contacts with the heat source.

With reference to the first aspect, in a possible implementation manner, after the first end portion is in contact with the heat source, the heat transfer medium near the first end portion flows in an oscillating manner in the accommodating cavity so as to transfer heat of the first end portion to the second end portion.

With reference to the first aspect, in one possible implementation manner, the heat transfer medium forms a plurality of columns in the accommodating cavity, and two adjacent columns are spaced apart.

With reference to the first aspect, in one possible implementation manner, the column includes: the device comprises a first column body and a second column body, wherein the first column body is a bubble column, the second column body is arranged at intervals with the first column body, and the second column body is a liquid column.

With reference to the first aspect, in a possible implementation manner, the groove is concavely disposed in a direction away from the first bending member, and the groove includes: the bearing portion is in the form of a ring closure and is arranged in the second bending part, the surrounding part surrounds the periphery of the bearing portion to form an accommodating space with an opening, and the first bending part is covered on the surrounding part.

With reference to the first aspect, in a possible implementation manner, the enclosure part is provided with a through hole, a hole plug is arranged in the through hole, the hole plug is detachably inserted in the through hole, and the hole plug is matched with the through hole.

With reference to the first aspect, in one possible implementation manner, the first bending piece is made of a heat conducting material, the second bending piece is made of a heat conducting material, and the shape of the second bending piece is matched with that of the first bending piece, and the second bending piece is welded with the first bending piece to form the flexible piece.

With reference to the first aspect, in one possible implementation manner, a length of the groove along a first direction is smaller than a length of the second bending member along the first direction, and a length of the first bending member along the first direction is smaller than a length of the second bending member along the first direction.

In a second aspect, the present application provides a heat dissipating device, including the heat transfer device described above.

Compared with the prior art, the beneficial effect of this application:

the application provides a heat transfer device, including first piece and the second piece of bending, first piece of bending lid is located on the opening of the recess of first piece of bending is in order to form and is held the chamber, it has heat transfer medium to flow in holding the chamber, heat transfer medium can carry out the heat transfer, the second piece of bending with first piece of bending is connected in order to form the flexible piece, can carry out the heat transfer after the flexible piece contacts with the heat source, the flexible piece can bend in order to produce deformation to can with different shapes the heat source laminating contacts, thereby can carry out the samming to the heat source of different shapes, the application scope of flexible piece is wide, has improved heat transfer device's heat transfer efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows an exploded schematic view of a heat transfer device;

FIG. 2 shows a schematic side view of a heat transfer device;

FIG. 3 is a schematic view showing the overall structure of the heat transfer device;

fig. 4 shows an enlarged schematic view of the portion a in fig. 1.

Description of main reference numerals:

100-a first bending piece; 200-second bending piece; 210-groove; 211-a supporting part; 212-a fence; 213-through holes; 300-a flexible member; 310-accommodating chambers; 320-a first end; 330-second end.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Example 1

Referring to fig. 1, an embodiment of the present application provides a heat transfer device, which is mainly used in a heat dissipating device, and the heat transfer device includes: the first bending piece 100 and the second bending piece 200. The second bending member 200 is disposed opposite to the first bending member 100, and a groove 210 is disposed on the second bending member 200. Referring to fig. 1 and 4, the first bending member 100 covers the opening of the recess 210 to form a receiving cavity 310. The accommodating chamber 310 is provided with a heat transfer medium, and the heat transfer medium can transfer heat. Referring to fig. 2, the second bending member 200 is connected to the first bending member 100 to form a flexible member 300. The flexible piece 300 is used for transferring heat after contacting with a heat source, the flexible piece 300 can be bent to generate deformation so as to be in fit contact with the heat sources with different shapes, so that the heat sources with different shapes can be subjected to uniform temperature, the application range of the flexible piece 300 is wide, and the heat transfer efficiency of the heat transfer device is improved.

In some embodiments, the first bending member 100 is made of a heat conductive material. The second bending member 200 is made of a heat conductive material, the shape of the second bending member 200 is matched with the shape of the first bending member 100, and the second bending member 200 is welded with the first bending member 100 to form the flexible member 300.

In some embodiments, the first bending member 100 is an O-shaped aluminum sheet. The second bending member 200 is an O-shaped aluminum sheet. The yield strength of the aluminum in the O state 6061 is 124999998.5N/square meter, the yield strength of the aluminum in the T4 state 6061 is 239999999.6N/square meter, the yield strength of the aluminum in the T6 state 6061 is 275000000.9N/square meter, and the softness of the aluminum in the O state is relatively higher than that of the aluminum in the T4 state and the aluminum in the T6 state.

In some embodiments, the groove 210 is concavely disposed away from the first bending member 100, and a length of the groove 210 along the first direction is smaller than a length of the second bending member 200 along the first direction. The length of the first bending member 100 in the first direction is smaller than the length of the second bending member 200 in the first direction.

Referring to fig. 4, in some embodiments, the recess 210 includes: the supporting portion 211 and the enclosing portion 212. The supporting portion 211 is disposed in the second bending member 200 in a loop shape. The enclosure 212 is disposed around the circumference of the support 211 to form an accommodating space having the opening. The accommodating space is used for accommodating the heat transfer medium.

Referring to fig. 1 and 4, in some embodiments, the first bending member 100 covers the enclosure 212 to form the accommodating cavity 310, so as to provide a flow channel for the heat transfer medium. The groove 210 is S-shaped in the second bending member 200, and the grooves 210 are connected end to end.

In some embodiments, the length of the supporting portion 211 along the second direction is greater than the length of the supporting portion 211 along the third direction. The first direction is perpendicular to the second direction, and the first direction is perpendicular to the third direction. The second direction is perpendicular to the third direction.

Referring to fig. 4, in some embodiments, a through hole 213 is disposed on the enclosure portion 212. The through hole 213 is disposed on the enclosure portion 212 along the second direction, and the through hole 213 is located at one end of the enclosure portion 212 away from the supporting portion 211, the through hole 213 is a circular hole, and a hole plug is disposed in the through hole 213. The hole plug is detachably inserted into the through hole 213, and the hole plug is matched with the through hole 213, so that the hole plug is in sealing connection with the enclosure.

In other embodiments, the through holes 213 are square holes.

In some embodiments, before the first bending member 100 is covered on the second bending member 200, the hole plug is pulled out of the through hole 213 and the output end of the heat transfer medium is connected to the through hole 213, so that the heat transfer medium in the output end is transferred into the groove 210, and the length of the heat transfer medium in the groove 210 along the first direction is smaller than the length of the enclosure member along the first direction, and the distance between the through hole 213 and the supporting portion 211 along the first direction is greater than the length of the heat transfer medium in the first direction in the groove 210, so that the heat transfer medium does not overflow from the through hole 213, and after the transfer of the heat transfer medium is completed, the hole plug is plugged into the through hole 213, and then after the first bending member 100 is covered on the enclosure member and the first bending member 100 is welded to the second bending member 200.

In some embodiments, the first bending member 100 and the second bending member 200 are welded by high temperature diffusion welding.

In some embodiments, the heat transfer medium is acetone. The heat transfer medium is acetone, so that the temperature of the use environment of the heat transfer device is not less than 120 ℃.

In other embodiments, the heat transfer medium may also be paraffin, water, etc., and will not be described herein.

In some embodiments, the cross section of the accommodating cavity 310 along the first direction is square, the length of the cross section along the first direction is 0.8 mm, the length of the cross section along the third direction is 3 mm, and the unit flow rate of the heat transfer medium in the accommodating cavity 310 is smaller due to the smaller cross section area of the cross section, so that the heat transfer medium forms columns in the accommodating cavity 310, and two adjacent columns are arranged at intervals.

In some embodiments, the column comprises: the first column body and the second column body. The first column is formed along the first direction, and the first column is a bubble column. The second column body and the first column body are arranged at intervals, the second column body is formed along the first direction, and the second column body is a liquid column.

In some embodiments, the first and second columns are spaced apart in the receiving cavity 310 and exhibit a random distribution.

In some embodiments, the length of the flexible member 300 along the first direction is 2 mm, and the flexible member 300 is a flexible board, and the thickness of the flexible member 300 is thinner, so that the flexible member 300 can be bent at a temperature of 200 ℃ to form a special-shaped structure, so that the flexible member 300 can be matched with heat sources with different shapes, thereby improving the application range of the flexible member 300 and improving the heat transfer efficiency.

Referring to fig. 3, in some embodiments, the flexible element 300 includes a first end 320 and a second end 330. The first end 320 and the second end 330 are respectively located at corresponding ends of the flexible member 300, and the first end 320 is configured to transfer heat of the heat source to the second end 330 after contacting with the heat source, so as to achieve a cooling effect.

In some embodiments, the first end 320 is a heated end. The second end 330 is a condensing end. After the first end 320 contacts with the heat source, the heat transfer medium near the first end 320 absorbs heat and then is vaporized, the vaporized heat transfer medium rapidly expands and increases pressure in the accommodating cavity 310, so that the vaporized heat transfer medium pushes the unvaporized heat transfer medium to move towards the second end 330 until moving to the second end 330, the vaporized heat transfer medium condenses and contracts in the accommodating cavity 310 near the second end 330, so that the pressure in the accommodating cavity 310 near the second end 330 is smaller than the pressure in the accommodating cavity 310 near the first end 320, and the heat transfer efficiency is high due to the fact that a pressure difference exists between the first end 320 and the second end 330 and a pressure difference exists between two adjacent circulation channels, so that the heat transfer medium in the accommodating cavity 310 oscillates and flows between the first end 320 and the second end 330, the heat on the heat source is transferred to the second end 320 through the first end 320, and the heat transfer efficiency is high in the whole heat transfer driving process.

In other embodiments, the first end 320 is a condensing end. The second end 330 is a heated end.

Before the heat transfer device is used, the flexible piece 300 is bent to deform, so that the shape of the bent flexible piece 300 is matched with the shape of the heat source, the bent flexible piece 300 can be in fit contact with the heat source, the flexible piece 300 can be bent according to the shape of the heat source to be in fit contact with the heat sources of different shapes, the heat sources of different shapes can be subjected to uniform temperature, the application range is wide, and the heat transfer efficiency of the flexible piece 300 is high. The first end 320 of the flexible member 300 after bending is contacted with the heat source in a fitting way, the heat transfer medium in the accommodating cavity 310 close to the first end 320 absorbs heat and is vaporized, the vaporized heat transfer medium rapidly expands and increases pressure in the accommodating cavity 310, then the unvaporized heat transfer medium is pushed to move towards the direction close to the second end 330, the vaporized heat transfer medium is condensed and liquefied in the accommodating cavity 310 close to the second end 330, so that the pressure in the accommodating cavity 310 close to the second end 330 is smaller than the pressure in the accommodating cavity 310 close to the first end 320, a pressure difference exists between the first end 320 and the second end 330, the heat transfer medium in the accommodating cavity 310 can vibrate and flow between the first end 320 and the second end 330, the heat on the heat source is transferred to the second end 330 through the first end 320, and the heat transfer process is further improved in an automatic vibration heat transfer mode in the flexible member 300, and the vibration heat transfer process is driven.

Example two

Referring to fig. 1 to 4, an embodiment of the present application provides a heat dissipating device, which includes the heat transfer device in any one of the foregoing embodiments, so that all the beneficial effects of the heat transfer device in any one of the foregoing embodiments are not described herein in detail.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims (10)

1. A heat transfer device, comprising:

a first bending piece;

the second bending piece is arranged opposite to the first bending piece, a groove is formed in the second bending piece, the first bending piece is covered on an opening of the groove to form a containing cavity, a heat transfer medium flows through the containing cavity, and the second bending piece is connected with the first bending piece to form a flexible piece;

the flexible piece is used for transferring heat after contacting with a heat source.

2. The heat transfer device of claim 1, wherein the flexible member comprises a first end and a second end, the first end configured to transfer heat from the heat source to the second end upon contact with the heat source.

3. The heat transfer device of claim 2, wherein the heat transfer medium adjacent the first end oscillates in the receiving chamber after the first end contacts the heat source to transfer heat from the first end to the second end.

4. The heat transfer device of claim 1, wherein the heat transfer medium forms a plurality of columns in the receiving chamber, and adjacent columns are spaced apart.

5. The heat transfer device of claim 4, wherein the column comprises:

the first column body is a bubble column;

the second column body, the second column body with first cylinder interval sets up, the second column body is the liquid column.

6. The heat transfer device of claim 1, wherein the groove is concavely disposed in a direction away from the first bending member, the groove comprising:

the supporting part is arranged in the second bending piece in a ring-back closed mode;

the enclosing part is arranged around the periphery of the bearing part to form an accommodating space with the opening, and the first bending piece is covered on the enclosing part.

7. The heat transfer device of claim 6, wherein the enclosure portion is provided with a through hole, wherein a hole plug is provided in the through hole, wherein the hole plug is detachably inserted in the through hole, and wherein the hole plug is matched with the through hole.

8. The heat transfer device of any one of claims 1-7, wherein the first bending member is a thermally conductive material, the second bending member is a thermally conductive material, and the shape of the second bending member matches the shape of the first bending member, and the second bending member is welded to the first bending member to form the flexible member.

9. The heat transfer device of any of claims 1-7, wherein a length of the groove in a first direction is less than a length of the second bend in the first direction, and wherein a length of the first bend in the first direction is less than a length of the second bend in the first direction.

10. A heat dissipating device comprising the heat transfer apparatus of any one of claims 1-9.