CN220479280U - Pressure-maintaining heat-preserving curing module - Google Patents
Pressure-maintaining heat-preserving curing module Download PDFInfo
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- CN220479280U CN220479280U CN202321454899.5U CN202321454899U CN220479280U CN 220479280 U CN220479280 U CN 220479280U CN 202321454899 U CN202321454899 U CN 202321454899U CN 220479280 U CN220479280 U CN 220479280U
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- 230000007246 mechanism Effects 0.000 claims abstract description 89
- 238000007723 die pressing method Methods 0.000 claims abstract description 8
- 230000009471 action Effects 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 19
- 239000000872 buffer Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 11
- 238000004321 preservation Methods 0.000 claims description 10
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model aims to provide the pressure-maintaining heat-preserving curing module with high working efficiency, good curing effect and strong adaptability. The automatic die pressing device comprises an upper die fixing mechanism, an upper die pressure maintaining mechanism, a lower die jacking and positioning mechanism and a lower die pressure maintaining mechanism, wherein the upper die pressure maintaining mechanism is fixed at the lower end of the upper die fixing mechanism, and the lower die pressure maintaining mechanism is arranged at the action end of the lower die jacking and positioning mechanism and is positioned below the upper die pressure maintaining mechanism. The utility model relates to the technical field of chip dispensing and curing.
Description
Technical Field
The utility model relates to the technical field of chip dispensing curing, in particular to a pressure-maintaining heat-preserving curing module.
Background
In the context of the information age, cured chips are of paramount importance in people's life. The chip is required for common electronic devices such as automobiles, mobile phones, computers, televisions and the like, or can be said to be almost all the products related to the term "science and technology". The chip is just like the "heart" of the electronic device, and without the chip, the electronic device would be at risk of "paralysis". As the demand for chips increases, the market for chips increases, and thus, the scale of enterprises involved in chip production increases.
Generally, a chip needs to be dispensed during production, and after the chip dispensing process, the chip must be cured under pressure maintaining, and meanwhile, the chip must be kept at a certain temperature interval. At present, most of pressure-maintaining heat-preserving curing modes of chips are that chip products are put into a curing machine manually, and the chip products are subjected to pressure-maintaining heat-preserving curing through the curing machine. However, the current manual operation mode is low in production efficiency, and only single-sided heat preservation is performed during curing, so that good curing effect is not guaranteed.
Therefore, the application specifically provides a pressurize heat preservation solidification module, can realize automatic pressurize heat preservation solidification work, work efficiency is high to have two-sided heat preservation function during solidification, be favorable to guaranteeing the solidification effect.
Disclosure of Invention
The utility model aims to solve the technical problem of overcoming the defects of the prior art and providing the pressure-maintaining heat-preserving curing module with high working efficiency, good curing effect and strong adaptability.
The technical scheme adopted by the utility model is as follows: the automatic die pressing device comprises an upper die fixing mechanism, an upper die pressure maintaining mechanism, a lower die jacking and positioning mechanism and a lower die pressure maintaining mechanism, wherein the upper die pressure maintaining mechanism is fixed at the lower end of the upper die fixing mechanism, and the lower die pressure maintaining mechanism is arranged at the action end of the lower die jacking and positioning mechanism and is positioned below the upper die pressure maintaining mechanism.
Further, lower mould pressurize mechanism includes the mounting panel down, be provided with down the heating module assembly on the mounting panel down, be provided with the locating plate on the heating module assembly down, the periphery of locating plate encircles and is provided with a plurality of locating pins.
Further, go up mould pressurize mechanism and include the mounting panel, the lower extreme of going up the mounting panel is provided with the heating module assembly, the lower extreme of going up the heating module assembly is provided with the installation piece, the lower extreme of installation piece is provided with down the heat insulating board, array is provided with a plurality of pressurize plungers in the installation piece, the pressurize plunger floats to set up in the installation piece and the lower extreme wears out the installation piece with the heat insulating board down and with the locating plate cooperation, set up a plurality of with locating pin matched with locating pin hole on the heat insulating board down.
Further, the installation piece upper end is equipped with multichannel horizontal recess, a plurality of pressurize plunger distributes in multichannel horizontal recess, the both sides of going up the mounting panel all are provided with high temperature resistant cylinder, two the output of high temperature resistant cylinder all connects the spring return board, offer the protruding cooperation between a plurality of horizontal grooves of stepping down with horizontal recess on the spring return board, the pressurize plunger is in through the floating setting of extension spring in the installation piece, the upper end of extension spring is in horizontal recess and with the spring return board contact.
Further, the lower die jacking and positioning mechanism comprises a lower fixing seat, a screw rod driving assembly is arranged on the lower fixing seat, and the lower mounting plate is fixed on the action end of the screw rod driving assembly.
Further, go up mould fixed establishment and include the portal frame, the both sides of portal frame all are provided with the buffer board, be provided with the buffer on the buffer board, the buffer is located the below of spring return board and with the cooperation of spring return board.
Further, a plurality of pressure sensors are arranged between the lower mounting plate and the lower heating module assembly.
Further, the both sides of lower heating module assembly all are provided with the location curb plate, the inboard of location curb plate is provided with the slider, the lower extreme of mounting panel is provided with fixed perpendicular piece down, the both sides of fixed perpendicular piece all are provided with the slide rail, the slider with slide rail sliding fit.
Further, an upper heat insulation plate is arranged between the upper mounting plate and the upper heating module assembly, and heat insulation side plates are arranged around the mounting blocks.
The beneficial effects of the utility model are as follows: according to the utility model, through the cooperation between the upper die pressure maintaining mechanism and the lower die pressure maintaining mechanism, the pressure maintaining, heat preserving and curing work of the chip product is realized under the drive of the lower die jacking and positioning mechanism, and the upper die pressure maintaining mechanism and the lower die pressure maintaining mechanism can respectively maintain the pressure and heat on the two sides of the chip product, so that the curing effect can be ensured; can cooperate with the assembly line at the during operation, realize the automatic feeding of chip product and get off to can accomplish automated operation, work efficiency is high, and can change the chip product of different models as required, the suitability is stronger.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic perspective view of the lower die lifting and positioning mechanism and the lower die pressure maintaining mechanism;
FIG. 3 is an exploded view of the lower die lifting and positioning mechanism and the lower die pressure maintaining mechanism of the utility model;
FIG. 4 is a schematic perspective view of the upper die fixing mechanism and the upper die pressure maintaining mechanism according to the present utility model;
FIG. 5 is a schematic perspective view of the upper die fixing mechanism and the upper die pressure maintaining mechanism according to the present utility model;
FIG. 6 is an exploded view of the upper die dwell mechanism of the present utility model;
FIG. 7 is an exploded view of another angle of the upper die dwell mechanism of the present utility model;
fig. 8 is an exploded view of the mounting block of the present utility model.
Detailed Description
As shown in fig. 1 to 8, in the present embodiment, the present utility model includes an upper die fixing mechanism 1, an upper die pressure maintaining mechanism 2, a lower die lifting and positioning mechanism 3, and a lower die pressure maintaining mechanism 4, wherein the upper die pressure maintaining mechanism 2 is fixed at the lower end of the upper die fixing mechanism 1, and the lower die pressure maintaining mechanism 4 is disposed at the actuating end of the lower die lifting and positioning mechanism 3 and is located below the upper die pressure maintaining mechanism 2. The upper die fixing mechanism 1 is used for installing the upper die pressure maintaining mechanism 2, the upper die pressure maintaining mechanism 2 is used for maintaining pressure and preserving heat on the upper end face of the chip, the lower die jacking and positioning mechanism 3 is used for installing the lower die pressure maintaining mechanism 4 and driving the lower die pressure maintaining mechanism 4 to perform lifting action so as to perform pressure maintaining, heat preserving and solidifying operation on the chip, and the lower die pressure maintaining mechanism 4 is used for maintaining pressure and preserving heat on the lower end face of the chip; during operation, the chip is sent to the lower die pressure maintaining mechanism 4, then the lower die jacking and positioning mechanism 3 acts to drive the lower die pressure maintaining mechanism 4 to move upwards to be matched with the upper die pressure maintaining mechanism 2, the chip is clamped, and then the upper die pressure maintaining mechanism 2 and the lower die pressure maintaining mechanism 4 start to maintain pressure and keep temperature, so that the glue of the chip can be solidified.
In this embodiment, the lower die pressure maintaining mechanism 4 includes a lower mounting plate 41, a lower heating module assembly 42 is disposed on the lower mounting plate 41, a positioning plate 43 is disposed on the lower heating module assembly 42, and a plurality of positioning pins 44 are disposed around the periphery of the positioning plate 43. The lower mounting plate 41 is used for fixedly mounting the lower heating module assembly 42, the lower heating module assembly 42 is used for heating so as to realize a heat preservation effect, the positioning plate 43 is arranged at the upper end of the lower heating module assembly 42 and has a good heat conduction effect, and the positioning plate 43 is used for placing chips; two positioning pins 44 are arranged on the front, rear, left and right sides of the positioning plate 43, and the eight positioning pins 44 are used for positioning the chips, so that the eight positioning pins 44 can be used for positioning the chip carriers when the chips are placed on the chip carriers during pressure maintaining, heat preserving and curing, and a batch of chips can be placed on the positioning plate 43; in addition, the chip carrier has a plurality of placing positions, and can place a plurality of chips once to the placing position is opened and is had the opening, and when the chip was placed in the placing position, its lower terminal surface of chip pass through the opening with locating plate 43 contact, thereby can receive the heat transfer of heating module assembly 42 down in order to realize the heat preservation effect.
In this embodiment, the upper die pressure maintaining mechanism 2 includes an upper mounting plate 21, the lower extreme of the upper mounting plate 21 is provided with an upper heating module assembly 22, the lower extreme of the upper heating module assembly 22 is provided with a mounting block 23, the lower end of the mounting block 23 is provided with a lower heat insulation board 24, a plurality of pressure maintaining plungers 25 are arranged in an array in the mounting block 23, the pressure maintaining plungers 25 are arranged in the mounting block 23 in a floating manner, the lower end of the pressure maintaining plungers penetrates out of the mounting block 23 and the lower heat insulation board 24 and is matched with the positioning plate 43, and a plurality of positioning pin holes 26 matched with the positioning pins 44 are formed in the lower heat insulation board 24. The upper mounting plate 21, the upper heating module assembly 22, the mounting block 23 and the lower heat insulation plate 24 are sequentially arranged from top to bottom, the lower heat insulation plate 24 is a plate-shaped piece with a hollow middle part formed by four heat insulation strips, the upper heating module assembly 22 is used for heating so that heat can be transferred to the mounting block 23, a plurality of pressure maintaining plungers 25 are arranged in the mounting block 23, and the pressure maintaining plungers 25 are used for maintaining pressure of a chip and also receiving heat to realize heat preservation, so that the upper end face of the chip is subjected to pressure maintaining and heat preservation; the pressure maintaining plunger 25 has a floating effect, so that the pressure maintaining plunger can exert a pressing effect on the chip when contacting the chip, thereby exerting pressure and maintaining pressure; the lower heat insulation plate 24 is provided with a positioning pin hole 26 matched with the positioning pin 44, so that the alignment of the upper die pressure maintaining mechanism 2 and the lower die pressure maintaining mechanism 4 can be ensured, the accurate butt joint can be realized, and each pressure maintaining plunger 25 can be ensured to be aligned with a corresponding chip.
In this embodiment, the upper end of the mounting block 23 is provided with a plurality of transverse grooves 27, a plurality of pressure maintaining plungers 25 are distributed in the plurality of transverse grooves 27, both sides of the upper mounting plate 21 are provided with high temperature resistant cylinders 28, the output ends of the two high temperature resistant cylinders 28 are connected with a spring reset plate 29, a plurality of transverse abdicating grooves 210 are formed in the spring reset plate 29 and are matched with protrusions between the transverse grooves 27, the pressure maintaining plungers 25 are arranged in the mounting block 23 in a floating manner through telescopic springs 211, and the upper ends of the telescopic springs 211 are positioned in the transverse grooves 27 and are in contact with the spring reset plate 29. The spring reset plate 29 is embedded and arranged at the upper end of the mounting block 23, and moves up and down under the synchronous drive of the two high temperature resistant cylinders 28, so that the pressure maintaining plunger 25 can be pressed down for reset after being retracted under the stress.
In this embodiment, the lower die lifting and positioning mechanism 3 includes a lower fixing seat 31, a screw driving assembly 32 is disposed on the lower fixing seat 31, and the lower mounting plate 41 is fixed on an actuating end of the screw driving assembly 32. The lower fixing seat 31 is used for installing the screw rod driving assembly 32, the screw rod driving assembly 32 comprises a motor, a screw rod, a nut and the like, and the lower mounting plate 41 is fixed on the screw rod driving assembly 32 and driven by the screw rod driving assembly 32 to perform lifting motion, so that the lower die pressure maintaining mechanism 4 can be driven to move up and down to be matched with the upper die pressure maintaining mechanism 2 to realize pressure maintaining, heat preserving and curing of chips.
In this embodiment, the upper die fixing mechanism 1 includes a gantry 11, buffer plates 12 are disposed on two sides of the gantry 11, a buffer 13 is disposed on the buffer plates 12, and the buffer 13 is located below the spring return plate 29 and is matched with the spring return plate 29. The portal frame 11 is used for installing the upper die pressure maintaining mechanism 2, and the buffer 13 is used for limiting the stroke of the spring return plate 29, so that the spring return plate moves in a set stroke.
In this embodiment, a plurality of pressure sensors 45 are disposed between the lower mounting plate 41 and the lower heating module assembly 42. The number of the pressure sensors 45 is four, and the pressure can be monitored through the four pressure sensors 45, so that the pressure of the chip in pressure maintaining is ensured to be in a reasonable range, and real-time monitoring and control are realized.
In this embodiment, positioning side plates 46 are disposed on two sides of the lower heating module assembly 42, a sliding block 47 is disposed on an inner side of the positioning side plates 46, a fixed vertical block 48 is disposed at a lower end of the lower mounting plate 41, sliding rails 49 are disposed on two sides of the fixed vertical block 48, and the sliding block 47 is in sliding fit with the sliding rails 49. Through the cooperation between location curb plate 46 the slider 47 the fixed vertical block 48 with slide rail 49 can ensure down the removal of heating module assembly 42 is more accurate, just reciprocates promptly for its installation strength is higher, avoids only relying on the installation of pressure sensor 45, guarantees the stability of structure.
In this embodiment, an upper heat insulation plate 212 is disposed between the upper mounting plate 21 and the upper heating module assembly 22, and heat insulation side plates 213 are disposed around the mounting blocks 23. The upper heat insulation plate 212 is used for preventing heat from losing through the upper mounting plate 21, and the heat insulation side plate 213 also has a heat insulation effect, so that the temperature loss is prevented from being too fast, and the temperature stability of the pressure maintaining plunger 25 is ensured.
The working principle of the utility model is as follows: the chip product in the carrier is positioned between the upper die pressure maintaining mechanism and the lower die pressure maintaining mechanism, the lower heating module assembly and the upper heating module assembly receive signals to start heating in the XY direction through eight positioning pins, the upper surface temperature and the lower surface temperature are maintained within set temperatures after a period of time, and the upper heat insulating plate plays roles of isolating heat loss and preventing the integral overheating of the upper die fixing mechanism. And then the lower die lifting and positioning mechanism receives a signal to start working, and drives the lower die pressure maintaining mechanism and the chip product to accurately set the stroke. The chip product is lifted to contact the pressure maintaining plunger, the lower die pressure maintaining mechanism runs an accurate stroke, the telescopic spring is forced to compress to provide stable pressure maintaining force, the pressure sensor strictly monitors the pressure of the telescopic spring, and the chip product is subjected to pressure maintaining and heat preservation. In the process, the heat-preserving side plate plays a role in reducing heat loss and keeping temperature;
and after the pressure maintaining is finished, the lower die jacking and positioning mechanism receives a signal and performs a process opposite to the jacking stage, the lower die pressure maintaining mechanism descends, a chip product is separated from the upper die pressure maintaining mechanism, the high-temperature-resistant air cylinder is ventilated to work, the spring reset plate is driven to move downwards along the Z axis to push the telescopic spring to reset, and the buffer buffers and positions the spring reset plate.
The utility model has the advantages that:
1. the compression stroke of the spring of the machine is controllable, and the pressure maintaining force is monitored and controlled in real time; the pressure maintaining effect is good, and the phenomenon of pressing distortion and damage during chip curing is greatly reduced;
2. the upper and lower die heating modules are used for independently controlling the temperature, and the temperature of the upper and lower surfaces of the chip contacted with the upper and lower die heating modules is kept within a set temperature;
3. the quick conversion of products with different lengths can be realized by matching with the replacement of the positioning module;
4. the structure is compact, light and simple, and the maintenance operation is convenient; the automation degree and the production efficiency of the pressure-maintaining heat-preserving curing of the chip can be improved, and the labor cost is saved.
While the examples of this application are described in terms of practical aspects, they are not to be construed as limiting the meaning of this application, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (9)
1. The utility model provides a pressurize heat preservation solidification module which characterized in that: the automatic die pressing device comprises an upper die fixing mechanism (1), an upper die pressing mechanism (2), a lower die jacking and positioning mechanism (3) and a lower die pressing mechanism (4), wherein the upper die pressing mechanism (2) is fixed at the lower end of the upper die fixing mechanism (1), and the lower die pressing mechanism (4) is arranged at the action end of the lower die jacking and positioning mechanism (3) and is located below the upper die pressing mechanism (2).
2. The pressure-maintaining heat-preserving curing module set forth in claim 1, wherein: the lower die pressure maintaining mechanism (4) comprises a lower mounting plate (41), a lower heating module assembly (42) is arranged on the lower mounting plate (41), a positioning plate (43) is arranged on the lower heating module assembly (42), and a plurality of positioning pins (44) are arranged around the periphery of the positioning plate (43).
3. The pressure-maintaining heat-preserving curing module set forth in claim 2, wherein: the upper die pressure maintaining mechanism (2) comprises an upper mounting plate (21), an upper heating module assembly (22) is arranged at the lower end of the upper mounting plate (21), a mounting block (23) is arranged at the lower end of the upper heating module assembly (22), a lower heat insulation plate (24) is arranged at the lower end of the mounting block (23), a plurality of pressure maintaining plungers (25) are arranged in the mounting block (23) in an array mode, the pressure maintaining plungers (25) are arranged in the mounting block (23) in a floating mode, the lower ends of the pressure maintaining plungers penetrate out of the mounting block (23) and the lower heat insulation plate (24) and are matched with the positioning plate (43), and a plurality of positioning pin holes (26) matched with the positioning pins (44) are formed in the lower heat insulation plate (24).
4. A pressure-maintaining heat-preserving curing module as claimed in claim 3, wherein: the utility model discloses a pressure maintaining plunger, including installation piece (23), pressure maintaining plunger (25), mounting block (27) are equipped with multichannel horizontal recess (27), a plurality of pressure maintaining plunger (25) are distributed in multichannel horizontal recess (27), the both sides of going up mounting plate (21) all are provided with high temperature resistant cylinder (28), two spring return board (29) are all connected to the output of high temperature resistant cylinder (28), offer on spring return board (29) a plurality of horizontal groove of stepping down (210) with protruding cooperation between horizontal recess (27), pressure maintaining plunger (25) are in through telescopic spring (211) floating arrangement in installation piece (23), the upper end of telescopic spring (211) is in horizontal recess (27) and with spring return board (29) contact.
5. The pressure-maintaining heat-preserving curing module set forth in claim 2, wherein: the lower die jacking and positioning mechanism (3) comprises a lower fixing seat (31), a screw rod driving assembly (32) is arranged on the lower fixing seat (31), and the lower mounting plate (41) is fixed on the action end of the screw rod driving assembly (32).
6. The pressure-maintaining heat-preserving curing module set forth in claim 4, wherein: the upper die fixing mechanism (1) comprises a portal frame (11), buffer plates (12) are arranged on two sides of the portal frame (11), a buffer (13) is arranged on the buffer plates (12), and the buffer (13) is located below the spring reset plate (29) and matched with the spring reset plate (29).
7. The pressure-maintaining heat-preserving curing module set forth in claim 5, wherein: a plurality of pressure sensors (45) are arranged between the lower mounting plate (41) and the lower heating module assembly (42).
8. The pressure-maintaining heat-preserving curing module set forth in claim 7, wherein: the utility model discloses a heating module, including lower heating module assembly (42), slide rail (49) are all provided with in both sides, the inboard of location curb plate (46) is provided with slider (47), the lower extreme of lower mounting panel (41) is provided with fixed perpendicular piece (48), the both sides of fixed perpendicular piece (48) all are provided with slide rail (49), slider (47) with slide rail (49) sliding fit.
9. The pressure-maintaining heat-preserving curing module set forth in claim 4, wherein: an upper heat insulation plate (212) is arranged between the upper mounting plate (21) and the upper heating module assembly (22), and heat insulation side plates (213) are arranged around the mounting blocks (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321454899.5U CN220479280U (en) | 2023-06-08 | 2023-06-08 | Pressure-maintaining heat-preserving curing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321454899.5U CN220479280U (en) | 2023-06-08 | 2023-06-08 | Pressure-maintaining heat-preserving curing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220479280U true CN220479280U (en) | 2024-02-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321454899.5U Active CN220479280U (en) | 2023-06-08 | 2023-06-08 | Pressure-maintaining heat-preserving curing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220479280U (en) |
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2023
- 2023-06-08 CN CN202321454899.5U patent/CN220479280U/en active Active
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