CN220474609U - Chip module packaging structure - Google Patents
Chip module packaging structure Download PDFInfo
- Publication number
- CN220474609U CN220474609U CN202322015474.0U CN202322015474U CN220474609U CN 220474609 U CN220474609 U CN 220474609U CN 202322015474 U CN202322015474 U CN 202322015474U CN 220474609 U CN220474609 U CN 220474609U
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- CN
- China
- Prior art keywords
- shell
- chip
- sealing cover
- fixed
- chip module
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 33
- 238000003466 welding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The utility model belongs to the technical field of module packaging and discloses a chip module packaging structure, which comprises a shell, wherein a chip is arranged in the shell, a supporting component is arranged in the shell, the supporting component comprises a fixing seat, a spring and a contact plate, the fixing seat is arranged on the surface of the inner wall of the shell, the spring is fixed at one end of the fixing seat close to the chip, and the contact plate is fixed at one end of the spring close to the chip.
Description
Technical Field
The utility model belongs to the technical field of module packaging, and particularly relates to a chip module packaging structure.
Background
The chip module package refers to a shell for a chip, plays roles of placing, fixing, sealing, protecting the chip and enhancing electric heating performance, is also a bridge for communicating the world inside the chip with an external circuit, and contacts on the chip are connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board.
However, most of chip module packages in the current market cannot accommodate chips of different types, and the shapes and the sizes of the chips are often different, so that the problem of incompatibility between the packages and the sizes of the chips exists, and the problem that the chips are difficult to control clamping strength and operation when clamped by a clamp because the chips need to be clamped by a worker for welding when welded into a circuit is solved, and the chip packages are small in size, so that errors are easy to occur when welded, and certain defects exist.
Disclosure of Invention
The utility model aims to provide a chip module packaging structure, which solves the problem that the packaging proposed in the background art cannot be compatible with chips of continuous types and sizes and is inconvenient to clamp and weld due to small packaging volume during welding.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chip module packaging structure, includes the shell, the internally mounted of shell has the chip, the internally mounted of shell has supporting component, supporting component includes fixing base, spring and contact plate, the fixing base is installed in the surface of shell inner wall, the spring is fixed in the fixing base and is close to the one end of chip, the contact plate is fixed in the one end that the spring is close to the chip, packaging component is installed on the top of shell.
Preferably, the packaging assembly comprises a sealing cover, a clamping sleeve and a fixing block, wherein the sealing cover is arranged at the opening end of the shell, the clamping sleeve is arranged at one end of the sealing cover far away from the shell, a clamping groove is formed in the surface of the clamping sleeve, the fixing block is fixed at one end of the clamping sleeve far away from the sealing cover, and a through hole is formed in the surface of the fixing block.
Preferably, the two sides of the surface of the shell are provided with lead-out holes, the two sides of the surface of the chip are provided with pins, and the pins penetrate through the lead-out holes.
Preferably, the width and the height of the pins are equal to those of the lead-out holes.
Preferably, the bottom end inside the shell is fixed with a constant temperature pad, and one end of the sealing cover, which is close to the shell, is fixed with a sealing pad.
Preferably, the length and width of the jacket opening are smaller than those of the sealing cover, the length and width of the sealing gasket are larger than those of the inner wall of the shell, and when the sealing cover is closed, the bottom end of the sealing gasket is lower than the top end of the chip.
Compared with the prior art, the utility model has the beneficial effects that:
(1) The utility model is provided with the supporting component, the chip to be packaged is placed in the shell and then sealed, after the chip is placed, the contact plate can prop against the chip due to the elasticity of the spring to play a role of fixing the position, and the fixing seat is arranged for connecting the spring with the inner wall of the shell.
(2) The utility model provides the packaging assembly, a user uses the clamp to clamp the chip for packaging and welds the chip to the circuit board, the clamping end of the clamp is embedded into the clamping groove on the surface of the clamping sleeve, so that the clamp can be ensured not to generate displacement on the surface of the packaging, and the packaging is arranged on the circuit board for welding.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of the jacket of the present utility model;
FIG. 3 is a schematic diagram of a package according to the present utility model;
FIG. 4 is a bottom view of the closure of the present utility model;
in the figure: 1. a housing; 2. a chip; 3. pins; 4. a lead-out hole; 5. a fixing seat; 6. a spring; 7. a contact plate; 8. a constant temperature pad; 9. a cover; 10. a jacket; 11. a clamping groove; 12. a fixed block; 13. a through hole; 14. and a sealing gasket.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, the present utility model provides the following technical solutions: the utility model provides a chip module packaging structure, includes shell 1, and the internally mounted of shell 1 has chip 2, and the internally mounted of shell 1 has supporting component, and supporting component includes fixing base 5, spring 6 and contact plate 7, and fixing base 5 installs in the surface of shell 1 inner wall, and spring 6 is fixed in fixing base 5 and is close to the one end of chip 2, and contact plate 7 is fixed in spring 6 and is close to the one end piece of chip 2.
Through the technical scheme:
during the use, place the inside of shell 1 with the chip 2 that needs encapsulation, seal again can, chip 2 after placing, because the elasticity of spring 6, contact plate 7 can jack up chip 2, plays fixed position's effect, and installation fixing base 5 is used for connecting spring 6 and the inner wall of shell 1, and installation contact plate 7 replaces spring 6 and chip 2 contact, prevents the pointed end fish tail chip 2 of spring 6.
Further, lead-out holes 4 are formed in two sides of the surface of the shell 1, pins 3 are mounted on two sides of the surface of the chip 2, and the pins 3 penetrate through the lead-out holes 4.
Specifically, the mounting pins 3 are used for connecting the chip 2 and the circuit, and the lead-out holes 4 are formed so that the pins 3 protrude from the inside of the housing 1.
Further, the width and height of the lead 3 are equal to those of the lead-out hole 4.
Specifically, the width and height of the leads 3 are equal to the width and height of the lead-out holes 4, ensuring that the leads 3 can protrude from the lead-out holes 4 without affecting the package seal.
Referring to fig. 1-4, the package assembly includes a cover 9, a jacket 10, and a fixing block 12, wherein the cover 9 is mounted at an opening end of the housing 1, the jacket 10 is mounted at an end of the cover 9 away from the housing 1, a clamping groove 11 is formed on a surface of the jacket 10, the fixing block 12 is fixed at an end of the jacket 10 away from the cover 9, and a through hole 13 is formed on a surface of the fixing block 12.
Through the technical scheme:
when in use, the sealing cover 9 is closed at the opening end of the shell 1 and sealed, during welding, a user clamps the chip to package and welds the chip onto the circuit board by using the clamp, the clamping end of the clamp is embedded into the clamping groove 11 on the surface of the clamping sleeve 10, so that the clamp can be ensured not to generate displacement on the surface of the package, the package is arranged on the circuit board for welding, and after the welding is finished, the clamp clamps the through hole 13 on the surface of the fixed block 12, and the clamping sleeve 10 is pulled out.
Further, the bottom end inside the shell 1 is fixed with a constant temperature pad 8, and one end of the sealing cover 9 close to the shell 1 is fixed with a sealing pad 14.
In particular, the thermostatic pad 8 is installed to ensure that overheating does not occur inside the package, preventing the chip 2 from being damaged.
Further, the length and width of the opening of the jacket 10 are smaller than those of the cover 9, the length and width of the sealing gasket 14 are larger than those of the inner wall of the shell 1, and when the cover 9 is closed, the bottom end of the sealing gasket 14 is lower than the top end of the chip 2.
Specifically, the length and width of the opening of the jacket 10 are smaller than those of the sealing cover 9, so that the jacket 10 can be firmly embedded on the surface of the sealing cover 9, the length and width of the sealing gasket 14 are larger than those of the inner wall of the shell 1, sealing performance of the sealing cover 9 during closing is ensured, the bottom end of the sealing gasket 14 is lower than the top end of the chip 2 during closing of the sealing cover 9, and the sealing gasket 14 is prevented from being contacted with the chip 2 during closing.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a chip module packaging structure which characterized in that: comprising
The chip (2) is arranged in the shell (1), and a supporting component is arranged in the shell (1);
the supporting component comprises a fixing seat (5), a spring (6) and a contact plate (7), wherein the fixing seat (5) is arranged on the surface of the inner wall of the shell (1), the spring (6) is fixed at one end of the fixing seat (5) close to the chip (2), and the contact plate (7) is fixed at one end of the spring (6) close to the chip (2);
the top end of the shell (1) is provided with a packaging component.
2. The chip module package structure according to claim 1, wherein: the packaging assembly comprises a sealing cover (9), a clamping sleeve (10) and a fixing block (12), wherein the sealing cover (9) is arranged at the opening end of the shell (1), the clamping sleeve (10) is arranged at one end, far away from the shell (1), of the sealing cover (9), a clamping groove (11) is formed in the surface of the clamping sleeve (10), the fixing block (12) is fixed at one end, far away from the sealing cover (9), of the clamping sleeve (10), and a through hole (13) is formed in the surface of the fixing block (12).
3. The chip module package structure according to claim 2, wherein: the LED chip is characterized in that the two sides of the surface of the shell (1) are provided with lead-out holes (4), pins (3) are arranged on the two sides of the surface of the chip (2), and the pins (3) penetrate through the lead-out holes (4).
4. A chip module package structure according to claim 3, wherein: the width and the height of the pin (3) are equal to those of the lead-out hole (4).
5. The chip module package structure according to claim 4, wherein: the bottom inside shell (1) is fixed with constant temperature pad (8), closing cap (9) are close to the one end of shell (1) and are fixed with sealed pad (14).
6. The chip module package structure according to claim 5, wherein: the length and the width of the opening of the jacket (10) are smaller than those of the sealing cover (9), the length and the width of the sealing gasket (14) are larger than those of the inner wall of the shell (1), and when the sealing cover (9) is closed, the bottom end height of the sealing gasket (14) is lower than that of the top end of the chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322015474.0U CN220474609U (en) | 2023-07-29 | 2023-07-29 | Chip module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322015474.0U CN220474609U (en) | 2023-07-29 | 2023-07-29 | Chip module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220474609U true CN220474609U (en) | 2024-02-09 |
Family
ID=89780416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322015474.0U Active CN220474609U (en) | 2023-07-29 | 2023-07-29 | Chip module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220474609U (en) |
-
2023
- 2023-07-29 CN CN202322015474.0U patent/CN220474609U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |