CN220473989U

CN220473989U - RK 3568-based B2B core board

Info

Publication number: CN220473989U
Application number: CN202322188805.0U
Authority: CN
Inventors: 徐冬梅; 董振超; 刘安; 王清华; 王�琦
Original assignee: Beijing Shenzhou Digital Co ltd
Current assignee: Beijing Shenzhou Digital Co ltd
Priority date: 2023-08-14
Filing date: 2023-08-14
Publication date: 2024-02-09
Anticipated expiration: 2033-08-14

Abstract

The utility model belongs to the technical field of core boards, and relates to a B2B core board based on RK3568, which comprises the following components: the RK3568 processor is respectively and electrically connected with the RK3568 processor, the RK3568 processor is used for image signal processing and calculation, the power management circuit is used for supplying power for the SOC kernel, the SOC peripheral GPI O, the LPDDR4 and the EMMC memory I C, the LPDDR4 memory circuit is used for data caching, the EMMC memory circuit is used for storing software programs and initial operation parameters, the RK3568 processor is provided with a plurality of peripheral interfaces, and the peripheral interfaces are connected with the BTB base. The power management circuit, the LPDDR4 storage circuit and the EMMC storage circuit are respectively connected with the SOC, and peripheral interfaces of the SOC are connected with the BTB seat; the BTB seat capable of transmitting high-speed signals is more stable, reliable and more convenient to design products based on modules, and the performance of transmitting the high-speed signals is guaranteed to the greatest extent.

Description

RK 3568-based B2B core board

Technical Field

The utility model relates to the technical field of core boards, in particular to a B2B core board based on RK 3568.

Background

At present, in the field of function interface expansion boards, peripheral interfaces of the function interface expansion boards are not rich enough and cannot meet the multifunctional requirements of users, and the function interface expansion boards generally use a stamp hole packaging mode or a pin interface mode to package the peripheral interfaces of the function interface expansion boards, but the two packaging modes have the following defects:

the stamp hole packaging mode has the defects that the stamp hole packaging mode can be used once, the circuit board can not be disassembled after being welded, and devices can not be distributed on the back surface of the circuit board, so that the area of the circuit board is increased;

the pin interface mode has the defects that the circuit board is inconvenient to disassemble, and the transmission quality of signals can be seriously affected when high-speed signals are transmitted.

And the design of the functional interface expansion board part is basically in an initial development stage, the early hardware design development is required, the development period is prolonged, and the debugging of the core part and the interface part is required to be verified repeatedly.

Disclosure of Invention

The utility model aims to solve the technical problems that the existing core board is inconvenient to detach and can not ensure the transmission quality of signals, and provides a B2B core board based on RK3568, which comprises the following components:

the RK3568 processor is respectively and electrically connected with a power management circuit, an LPDDR4 storage circuit and an EMMC storage circuit of the RK3568 processor, wherein the RK3568 processor is used for image signal processing and calculation, the power management circuit is used for supplying power to an SOC kernel, an SOC peripheral GPIO, an LPDDR4 and an EMMC storage IC, the LPDDR4 storage circuit is used for data caching, the EMMC storage circuit is used for storing software programs and initial operation parameters, the RK3568 processor is provided with a plurality of peripheral interfaces, and the peripheral interfaces are connected with a BTB base.

Preferably, the power management circuit comprises a power management chip DC-DC circuit, a power management chip LDO circuit, a power management chip management circuit, a power management chip CODEC circuit, a CPU power supply circuit and a peripheral power supply circuit, wherein the power management chip DC-DC circuit is used for supplying power to the SOC core, the power management chip LDO circuit is used for supplying power to the SOC peripheral, the power management chip management circuit is used for managing basic units of a power management part, the power management chip CODEC circuit is used for supplying power to the voice chip and providing audio functions, the CPU power supply circuit is used for supplying power to the CPU core of the SOC, and the peripheral power supply circuit is used for supplying power to a plurality of peripheral devices of the SOC.

Preferably, the LPDDR4 memory circuit includes: LPDDR4_200p.

Preferably, the EMMC storage circuit includes: emmc_b153_2l.

Preferably, the power management chip DC-DC circuit includes: the power management chip RK809-5.

Preferably, the power management chip LDO circuit comprises: the power management chip RK809-5, the SOC basic unit and the SOC peripheral equipment.

Preferably, the power management chip management circuit includes: through the power supply input end, the crystal oscillator, the reset port, the I2C communication port and the interrupt pin which are electrically connected.

Preferably, the power management chip CODEC circuit includes: the audio power supply input port, the I2S communication port, the MIC output port, the SPK output port and the Phone output port are electrically connected.

Preferably, the CPU power supply circuit includes: current buck chip TCS4525-WT.

Preferably, the peripheral power supply circuit includes: synchronous rectification buck DC-DC converter chip ME3113.

The B2B core board based on RK3568 has the following beneficial effects: the power management circuit, the LPDDR4 storage circuit and the EMMC storage circuit are respectively connected with the SOC, and peripheral interfaces of the SOC are connected with the BTB seat; the BTB seat capable of transmitting high-speed signals is more stable and reliable, and is more convenient for engineers to design products based on modules, so that the products can be rapidly marketed, and the performance of transmitting the high-speed signals is guaranteed to the greatest extent.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art. The utility model will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic structural diagram of an RK 3568-based B2B core board of the present utility model;

FIG. 2 is a schematic diagram of a BTB seat sub-circuit of the RK3568 based B2B core board of the present utility model;

FIG. 3 is a circuit diagram of the power management chip DC-DC circuit of the B2B core board based on RK3568 of the present utility model;

FIG. 4 is a circuit diagram of a power management chip LDO circuit of the B2B core board based on RK3568 of the present utility model;

FIG. 5 is a circuit diagram of a power management chip select switch power supply circuit of the RK3568 based B2B core board of the present utility model;

FIG. 6 is a circuit diagram of a power management chip CODEC circuit of the B2B core board based on RK3568 of the present utility model;

FIG. 7 is a circuit diagram of the CPU power supply circuit of the RK3568 based B2B core board of the present utility model;

FIG. 8 is a circuit diagram of the peripheral power supply circuit of the RK3568 based B2B core board of the present utility model;

FIG. 9 is a circuit diagram of the LPDDR4 memory circuit of the utility model based on the B2B core board of RK 3568;

FIG. 10 is a circuit diagram of an EMMC memory circuit of a RK3568 based B2B core board of the present utility model;

FIG. 11 is an SPI Flash memory circuit of a B2B core board based on RK3568 of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1, a schematic structural diagram of an RK 3568-based B2B core plate according to the present utility model is shown. As shown in fig. 1, in the B2B core board based on RK3568 according to the first embodiment of the present utility model, at least one RK3568 processor is included, and the power management circuit, the LPDDR4 memory circuit and the EMMC memory circuit are electrically connected to the RK3568 processor respectively.

The RK3568 processor is a general-purpose SOC for positioning middle and high ends, adopts a 22nm process technology, integrates a 4-core arm architecture A55 processor and a Mali G52 2EE graphics processor, and supports 4K decoding and 1080P encoding. The system supports various peripheral interfaces such as SATA/PCIE/USB3.0 and the like, is internally provided with independent NPU, and can be used for light star artificial intelligence application. The android 11 and linux system is supported, and the system is mainly oriented to industry customization markets such as Internet of things gateways, NVR storage, industrial control panels, industrial detection, industrial control boxes, karaoke, cloud terminals, vehicle-mounted central control and the like. The RK3568 is immediately updated and iterated with ARM architecture, and the A55 architecture and the G52 graphics processor are adopted, so that the performance of the product is continuously improved, and meanwhile, the 22nm advanced technology is adopted, so that the energy consumption performance can be effectively improved. DDR particle compatibility of RK3568 is very excellent. LP4/LP4xLP3/DDR4/DDR3, highest frequency 1600Mhz, maximum star support 8GB DDR3 and DDR4 support 2 chip select mode, maximum capacity support 8GB support DDR3 and DDR4 ECC.

The RK3568 processor is provided with a plurality of peripheral interfaces, and the peripheral interfaces are connected with the BTB table. RK3568 has rich function expansion interfaces, and can effectively improve the expansibility of industry customization. RK3568 supports PCIE 3.01X2/2X1 Lanes, and simultaneously supports PCIE 2.1X1 Lane, thereby meeting the expansion demands of 4G/5G, wifi, multiple network ports, NPU and the like. RK3568 supports 3x SATA3.0, solves various unstable problems of the traditional AP processor USB expansion SATA, and supports 4 paths of USB ports at most, 1xUSB3.0/USB2.0HOST +1xUSB3.0/USB2.0 OTG+1xUSB2.0 HOST+1xUSB2.0HOST. The dual gigabit Ethernet port is supported, the QSFMII is supported to reduce the occupation of the IO port, and the multi-network port requirements of industrial control, an Internet of things gateway and the like are met.

In this embodiment, the power management circuit is configured to supply power to the SOC core, the SOC peripheral GPIO, the LPDDR4, and the EMMC memory IC, the LPDDR4 memory circuit is configured to buffer big data, and the EMMC memory circuit is configured to store a software program and initial operating parameters.

In particular embodiments, the power management circuit may include, but is not limited to, a power management chip DC-DC circuit, a power management chip LDO circuit, a power management chip management circuit, a power management chip CODEC circuit, a CPU power supply circuit, and a peripheral power supply circuit, where the power management chip DC-DC circuit is configured to supply power to the SOC core, the power management chip LDO circuit is configured to supply power to the SOC peripheral, the power management chip management circuit is configured to manage basic units of the power management portion, the power management chip CODEC circuit is configured to supply power to the voice chip and provide audio functions, the CPU power supply circuit is configured to supply power to the CPU core of the SOC, and the peripheral power supply circuit is configured to supply power to the SOC plurality of peripherals.

FIG. 2 is a schematic diagram of the BTB base of the RK3568 based B2B core board of the present utility model. As shown in fig. 2, BTB seats, also known as BTB Connectors (BTB), are a common connector product in the electronics market. Compared with other types of connector products, the BTB seat has the characteristics of strongest transmission function, light weight, stable high-frequency transmission, no welding, noise reduction and the like. In terms of performance, the BTB seat has super-strong corrosion resistance and excellent environmental resistance, has the advantage of flexible connection, also bears a signal conversion function, is very excellent in performance as a bridge between electronic components, and can play a good role in a plurality of fields.

Fig. 3 is a circuit diagram of the power management chip DC-DC circuit of the utility model based on the B2B core board of RK 3568. As shown in fig. 3, the power management chip DC-DC circuit includes: the power management chip RK809-5. The power management chip RK809-5 can output multiple paths of DCDC and LDO, can be configured through I2C, and can better manage RK3568 platform power supply time sequence and power consumption optimization.

FIG. 4 is a circuit diagram of the LDO circuit of the B2B core board based on RK 3568. As shown in FIG. 4, the power management chip LDO circuit comprises a power management chip RK809-5, an SOC basic unit and an SOC peripheral. The SOC peripheral devices include SDIO, voice, PCIE2.0/SATA, PCIE3.0, mipi_tx/LVDS, mipi_ RX, HDMI, USB 2.0.0, USB3.0, GMAC, GPIO, etc.

Fig. 5 is a circuit diagram of a power management chip select switch power supply circuit of a B2B core board based on RK3568 of the present utility model as shown in fig. 5, the power management chip select switch power supply circuit comprises: through the power supply input end, the crystal oscillator, the reset port, the I2C communication port and the interrupt pin which are electrically connected.

FIG. 6 is a circuit diagram of the power management chip CODEC circuit of the B2B core board based on RK3568 of the present utility model. As shown in fig. 6, the power management chip CODEC circuit includes: the audio power supply input port, the I2S communication port, the MIC output port, the SPK output port and the Phone output port are electrically connected.

Fig. 7 is a circuit diagram of the CPU power supply circuit of the RK3568 based B2B core board of the present utility model. As shown in fig. 7, the CPU power supply circuit includes: current buck chip TCS4525-WT. After the input voltage 3v3_pmu passes through the current buck chip TCS4525-WT, the output voltage vdd_cpu supplies power to the core CPU of the SOC RK 3568.

Fig. 8 is a circuit diagram of the peripheral power supply circuit of the RK3568 based B2B core board of the present utility model. As shown in fig. 8, the peripheral power supply circuit includes: synchronous rectification buck DC-DC converter chip ME3113.ME3113 is a high-efficiency synchronous rectification BUCK converter chip, integrates two low-on-resistance NMOSFETs power switches, adopts bootstrap capacitors to supply power for driving of a high-side switch, inputs electric music to be 18V high, can carry 3A load current, adopts a constant on-time control framework, and has faster load transient response. The working mode is PFM in light load and PWM in heavy load. ME3113 has output short-circuit protection features. When the output is short-circuited, the ME3113 automatically stops switching for a period of time (about 3.5 ms), after which the ME3113 automatically resumes operation and is restarted, after a period of time (3 ms) after which the ME3113 again stops switching if the output is still short-circuited, and the ME3113 repeats stopping operation and restarting until the output short-circuited state is released, and the output voltage is restarted and rises to the set value. Pins for various peripheral functions, such as: SDIO, voice, PCIE2.0/SATA, PCIE3.0, mipi_tx/LVDS, mipi_ RX, HDMI, USB2.0, USB3.0, GMAC, MIC output, SPK output, phone output, GPIO, etc.

FIG. 9 is a circuit diagram of the LPDDR4 memory circuit of the utility model based on the B2B core board of RK 3568. As shown in fig. 9, the LPDDR4 memory circuit includes: the LPDDR4 memory circuit includes: LPDDR4_200p. Pin A5 of LPDDR4_200p is connected to one end of resistor R3801, the other end of resistor R3801 is connected to one end of resistor R3800, the other end of resistor R3800 is connected to pin A8 of LPDDR4_200p, pin T11 of LPDDR4_200p is connected to one end of capacitor C0201, and the other end of capacitor C0201 is grounded. The LPDDR4_200P is used for data caching, and can improve the memory speed and efficiency of the computing device. LPDDR4 increases speed while also reducing the operating voltage to 1.1V.

Fig. 10 is a circuit diagram of EMMC memory circuit of the RK3568 based B2B core board of the present utility model. As shown in fig. 10, the EMMC storage circuit includes: emmc_b153_2l. The pin H5 of emmc_b153_2l is connected to one end of the resistor R4007, the other end of the resistor R4007 is grounded, the pin C2 of emmc_b153_2l is connected to one end of the capacitor C4008, the other end of the capacitor C4008 is grounded, the pin K5 of emmc_b153_2l is connected to one end of the capacitor C4009 and one end of the resistor R4006, the pin M5 of emmc_b153_2l is connected to one end of the resistor R4005, the pin A3 of emmc_b153_2l is connected to one end of the resistor R4004, the other end of the resistor R4004 is connected to the other end of the resistor R4005 and the other end of the resistor R4006, and the pins C6, M4, P3, P5 of emmc_b153_2l are connected to one end of the capacitor C4000, one end of the capacitor C4001, one end of the capacitor C2, one end of the capacitor C3, one end of the capacitor C4004, and one end of the capacitor C4006 of the pins E6, F5 of emmc_b153_2l are connected to one end of the capacitor C4006, one end of the capacitor C5, and one end of the capacitor C4006 are connected to one end of the capacitor J6, respectively. The filtering is performed by capacitors C4008, C4009, C4000, C4001, C4002, C4003, C4004, C4005, C4006, C4007.

In specific implementation, the B2B core board based on RK3568 also comprises an SPI Flash storage circuit. FIG. 11 is an SPI Flash memory circuit of a B2B core board based on RK3568 of the present utility model. As shown in fig. 11, the SPI Flash storage circuit includes capacitors for power supply of the IC and filtering purposes of each pin of the power supply, an SPI communication signal line, and the like, and is used for SPI Flash storage.

Based on the high-performance core board designed by the Ruifeng micro RK3568J/RK3568 processor, a CPU adopts four-core 64-bit Cortex-A55, 22nm advanced technology, and the main frequency is 2.0GHz at most; ARM G52 EE GPU is integrated, and the integrated ARM G52 EE GPU is completely compatible with OpenGL ES1.1/2.0/3.2,OpenCL 2.0,Vulkan 1.1 and the like; the built-in Ruifeng micro self-grinding third generation NPU RKNN has the calculation force of 0.8Tops, supports caffe, tensorFlow, mxnet and other deep learning frameworks, and can realize one-key conversion of the model.

The method has excellent video processing performance, supports 4K 60fps H.265/H.264/VP9 video decoding, supports 1080P 60fps H.265/H.264 video coding and supports 8M ISP HDR.

The memory capacity of 1-8GB can be matched, the Bit width of 32Bit can be achieved, and the frequency is up to 1600MHz; the full-link ECC is supported, so that the data is safer and more reliable, and the requirements of the product application scene of the large memory are met.

Support wifi6 expansion, 5G/4G, etc. high-speed wireless network communication function expansion;

the B2B core board based on RK3568 can stably operate for a long time at the working temperature of-40-85 ℃; the system has rich interface resources, supports two-way GMAC, can expand 10/100/1000Mbps network interface, supports two-way PCIE GEN3.0 interface, and can expand interfaces such as PCIE3.0, SATA, MIPI_CSI, MIPI_ DSI, eDP, I2C, GPIO, USB 3.0.0, USB2.0, SDMC and the like.

The B2B core board based on RK3568 adopts a B2B full-function interface, so that the product is more stable and reliable, and an engineer can design the product based on a module more conveniently, and the product can be marketed rapidly.

The B2B core board based on RK3568 supports Android 11, android 12, ubuntu, debian, buildroot +QT and other systems, has excellent real-time performance, is widely applicable to scenes such as Internet of things gateways, edge computing, cloud terminals, intelligent NVR, industrial control, face gates and vehicle-mounted central control, is provided with complete development data, and is a mature application scheme, so that the customer research and development threshold can be reduced, and the product research and development period can be shortened.

Through the design of the embodiment, the utility model has the beneficial effects that: the power management circuit, the LPDDR4 storage circuit and the EMMC storage circuit are respectively connected with the SOC, and peripheral interfaces of the SOC are connected with the BTB seat; the BTB seat capable of transmitting high-speed signals is more stable and reliable, and is more convenient for engineers to design products based on modules, so that the products can be rapidly marketed, and the performance of transmitting the high-speed signals is guaranteed to the greatest extent.

While the utility model has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the utility model. In addition, many modifications may be made to adapt a particular situation to the teachings of the utility model without departing from its scope. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. A RK 3568-based B2B core board comprising:

2. The RK3568 based B2B core board of claim 1, wherein the power management circuitry comprises power management chip DC-DC circuitry for powering the SOC core, power management chip LDO circuitry for managing the power management portion base unit, power management chip CODEC circuitry for powering the voice chip and providing audio functionality, power management chip CODEC circuitry for powering the CPU core power supply of the SOC, CPU power supply circuitry for powering the SOC plurality of peripherals, peripheral power supply circuitry for powering the SOC core.

3. The RK3568 based B2B core board of claim 1, wherein the LPDDR4 memory circuit comprises: LPDDR4_200p.

4. The RK3568 based B2B core board of claim 1, wherein the EMMC storage circuitry comprises: emmc_b153_2l.

5. The RK3568 based B2B core board of claim 2, wherein the RK3568 processor DC-DC circuit comprises: the power management chip RK809-5.

6. The RK3568 based B2B core board of claim 2, wherein the RK3568 processor LDO circuit comprises: the power management chip RK809-5, the SOC basic unit and the SOC peripheral equipment.

7. The RK3568 based B2B core board of claim 2, wherein the RK3568 processor selection switch power supply circuitry comprises: through the power supply input end, the crystal oscillator, the reset port, the I2C communication port and the interrupt pin which are electrically connected.

8. The RK3568 based B2B core board of claim 2, wherein the RK3568 processor CODEC circuitry comprises: the audio power supply input port, the I2S communication port, the MIC output port, the SPK output port and the Phone output port are electrically connected.

9. The RK3568 based B2B core board of claim 2, wherein the CPU power circuitry comprises: current buck chip TCS4525-WT.

10. The RK3568 based B2B core board of claim 2, wherein the peripheral power circuit comprises: synchronous rectification buck DC-DC converter chip ME3113.