CN220456394U

CN220456394U - Wafer supporting arm and wafer supporting table

Info

Publication number: CN220456394U
Application number: CN202322075667.5U
Authority: CN
Inventors: 殷金涛
Original assignee: Shenghejing Micro Semiconductor Jiangyin Co Ltd
Current assignee: SJ Semiconductor Jiangyin Corp
Priority date: 2023-08-02
Filing date: 2023-08-02
Publication date: 2024-02-06
Anticipated expiration: 2033-08-02

Abstract

The utility model provides a wafer supporting arm and a wafer supporting table, wherein the wafer supporting arm comprises: a bracket body and an extension arm; the bracket arm body comprises a fixing part and a first bearing part which are sequentially connected, and the first bearing part is provided with a first bearing surface for bearing a wafer; the extension arm comprises a bridging part and a second bearing part which are connected in sequence, wherein the bridging part is detachably connected with the first bearing part, and the second bearing part is provided with a second bearing surface for bearing a wafer. The wafer supporting arm and the wafer supporting table can solve the problems of long time consumption and low efficiency of switching operation caused by correspondingly disassembling and replacing the wafer supporting arm assembly when wafers with different sizes are switched for production in the prior art.

Description

Wafer supporting arm and wafer supporting table

Technical Field

The present utility model relates to the field of semiconductor devices, and in particular, to a wafer support arm and a wafer support table.

Background

Currently, the wafer sizes are 8 inches and 12 inches, and other sizes, such as 14 inches and 16 inches, are common, and the factory production line usually only supports 1 size wafer for production, and when the wafer with different sizes needs to be supported for production, the wafer support table and the wafer support arm in the existing equipment need to be disassembled to meet the requirement of the wafer size. However, some devices do not support removal of the pallet, the removal process of the devices supporting removal is time consuming and requires repositioning.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, the present utility model is directed to a wafer supporting arm and a wafer supporting table, which are used for solving the problems of long time consumption and low efficiency of the switching operation caused by the need of correspondingly disassembling and replacing the wafer supporting arm assembly when the wafers with different sizes are switched for production in the prior art.

To achieve the above and other related objects, the present utility model provides a wafer carrier including: a bracket body and an extension arm; wherein,

the bracket arm body comprises a fixing part and a first bearing part which are connected in sequence, and the first bearing part is provided with a first bearing surface for bearing a wafer;

the extension arm comprises a bridging part and a second bearing part which are connected in sequence, wherein the bridging part is detachably connected with the first bearing part, and the second bearing part is provided with a second bearing surface for bearing a wafer.

Optionally, the first bearing surface and the second bearing surface are in the same horizontal plane.

Optionally, the extension arm adopts the arm of bending, the horizontal plane that the lower surface of bridging portion is located is higher than the horizontal plane that the lower surface of second loading part is located, the lower surface of bridging portion with the laminating of first loading surface sets up.

Optionally, a first slope surface is further provided on a side of the first bearing portion, which is close to the fixing portion, and a lower side of the first slope surface is connected with the first bearing surface;

the side of the second bearing part, which is close to the bridging part, is also provided with a second slope surface, and the lower side of the second slope surface is connected with the second bearing surface.

Optionally, the bridge portion and the first bearing portion are provided with screw holes corresponding to each other in position, and the bridge portion and the first bearing portion are detachably connected by means of the screw holes and screws.

Optionally, the first bearing surface and the second bearing surface are further provided with a cushion pad.

The utility model also provides a wafer pallet comprising: a support ring and an extension ring; wherein,

the support ring is provided with a first wafer bearing surface;

the extension ring is provided with a second wafer bearing surface;

the support ring is detachably connected with the extension ring;

and the first wafer bearing surface and the second wafer bearing surface are positioned on the same horizontal plane.

Optionally, the first wafer carrying surface and the second wafer carrying surface are further provided with a buffer pad.

Optionally, the support ring is further provided with a first slope guiding surface, and the lower side of the first slope guiding surface is connected with the first wafer bearing surface;

the extension ring is further provided with a second ramp guide surface, the underside of which is connected with the second wafer carrying surface.

As described above, the wafer supporting arm and the wafer supporting table of the utility model are provided with the supporting arm body (supporting ring) and the extension arm (extending ring) which are detachably connected, and the supporting arm body and the extension arm are both provided with the bearing surfaces for bearing the wafer.

Drawings

Fig. 1 is a schematic view of a wafer carrier.

Fig. 2 is a schematic view showing the structure of a wafer carrier arm provided with a cushion pad.

Fig. 3 is a schematic view showing the structure of a wafer carrier provided with a ramp guide block.

Fig. 4 is a schematic view of a structure of a wafer carrier.

Fig. 5 is a schematic view showing the structure of a wafer pallet provided with a cushion pad.

Description of element reference numerals

10. Wafer bracket

11. Bracket body

111. Fixing part

112. A first bearing part

1121. A first bearing surface

1122. First slope surface

1123. Screw hole

12. Extension arm

121. Bridging portion

122. A second bearing part

1221. A second bearing surface

1222. Second slope surface

131. Slope guide block

132. Cushion pad

20. Wafer supporting table

21. Support ring

22. Extension ring

211. First wafer bearing surface

221. Second wafer bearing surface

212. First slope guiding surface

222. Second slope guiding surface

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.

Please refer to fig. 1 to 5. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Example 1

As shown in fig. 1, the present embodiment provides a wafer support arm 10, where the wafer support arm 10 includes: a bracket body 11 and an extension arm 12; wherein:

the carrier arm body 11 includes a fixing portion 111 and a first bearing portion 112 connected in sequence, the fixing portion 111 is used for fixing the carrier arm body 11 on a semiconductor device, for example, in a reflow soldering device used in a 3D package of a 2.5D packaging machine, the first bearing portion 112 has a first bearing surface 1121 for bearing a wafer, and in use, a plurality of wafer carrier arms 10 cooperate together, for example, 3 wafer carrier arms 10 with equal intervals of 120 ° are adopted to jointly carry the wafer. It should be noted that, when the bracket arm body 11 is installed, not only the distance between the bracket arm body and the wafer needs to be corrected, but also the angle deviation between the bracket arm body and the center of the wafer needs to be corrected so as to prevent damage to the wafer.

The extension arm 12 comprises a bridging portion 121 and a second bearing portion 122 which are sequentially connected, wherein the bridging portion 121 is used for detachably connecting the extension arm 12 with the supporting arm body 11, and when a production line needs to prepare a wafer with a smaller size, the extension arm 12 can be mounted to the supporting arm body 11, so that the second bearing surface 1221 arranged on the second bearing portion 122 supports the wafer.

In this embodiment, the wafer supporting arm 10 is set to be the supporting arm body 11 and the extension arm 12 which are detachably connected, when the wafers with smaller production sizes are switched, the extension arm 12 is connected with the supporting arm 11 body, the wafers are supported by the second bearing surface 1221 on the extension arm 12, when the wafers with larger production sizes are switched, the extension arm 12 is detached, the wafers are supported by the first bearing surface 1121 on the supporting arm body 11, and the extension arm 12 is fast to detach and mount, so that the angle deviation of the supporting arm body 11 is not required to be additionally corrected, the time consumption of switching operation of operators can be effectively shortened, and the operation efficiency is improved.

Specifically, the first bearing surface 1121 and the second bearing surface 1221 are at the same level.

In this embodiment, some semiconductor devices cannot freely adjust the height position of the wafer carrier arm 10, and the first carrying surface 1121 and the second carrying surface 1221 are located at the same horizontal plane, so that it is avoided that the product quality is different due to the different operation heights, which is caused by the same operation parameter (recipe) during the production of the device.

More specifically, the extension arm 12 is a bending arm, the lower surface of the bridge portion 121 is located at a level higher than that of the lower surface of the second bearing portion 122, and the lower surface of the bridge portion 121 is attached to the first bearing surface 1121.

In this embodiment, when some semiconductor devices are operated, the height of the wafer needs to be adjusted, and when the thickness of the extension arm 12 exceeds the thickness of the bracket body 11, if the operation parameters are not adjusted, the wafer bracket 10 is at risk of colliding with other mechanisms when moving up and down; as shown in fig. 1, the lower surface of the bridge portion 121 is attached to the first bearing surface 1121, and the thickness of the extension arm 12 does not exceed the thickness of the fixing portion 111, so as to avoid collision risk.

Specifically, a first slope 1122 is further provided on a side of the first bearing portion 112 near the fixing portion 111, and a lower side of the first slope 1122 is connected to the first bearing surface 1121; the side of the second bearing portion 122 near the bridge portion 121 further has a second slope 1222, and the lower side of the second slope 1222 is connected to the second bearing surface 1221.

In this embodiment, the first ramp 1122 and the second ramp 1222 are used to constrain the position of the wafer, so that the wafer naturally slides down on the carrier by gravity, and the deviation of the wafer position is prevented from exceeding the constraint range.

As one example, as shown in fig. 1, the upper side of the first slope surface 1122 is connected to the upper surface of the fixing portion 111, and the lower side of the first slope surface 1122 is connected to the first bearing surface 1121, that is, the height of the upper surface of the fixing portion 111 of the bracket body 11 is greater than the height of the upper surface of the first bearing portion 112, and the first slope surface 1122 is formed by the height difference between the fixing portion 111 and the first bearing portion 112.

As another example, as shown in fig. 3, a ramp guide block 131 is disposed on a side of the first bearing portion 112 near the fixing portion 111, a ramp guide block 131 is also disposed on a side of the second bearing portion 122 near the bridge portion 121, the ramp guide block 131 is fixed on the first bearing surface 1121 and the second bearing surface 1221, and the ramp guide block 131 has a ramp surface for restraining a position of a wafer.

Specifically, the first bearing portion 112 is provided with a screw hole 1123, the bridge portion 121 and the first bearing portion 112 are provided with screw holes 1123 corresponding to each other, and the bridge portion 121 and the first bearing portion 112 are detachably connected by means of the screw holes and screws.

In this embodiment, as shown in fig. 1, the first bearing surface 1121 is provided with a plurality of screw holes 1123, and the bridge portion 121 is also provided with a plurality of screw holes, so that the extension arm 12 is effectively ensured not to deviate from the position of the bracket body 11 after being mounted, and the disassembly is simple.

Specifically, the first bearing surface 1121 and the second bearing surface 1221 are further provided with a cushion 132.

In this embodiment, as shown in fig. 2, the buffer pad 132 is made of a resin material, and has a certain elasticity, so that the lower surface of the wafer can be prevented from being scratched by directly contacting the first bearing surface 1121 and the second bearing surface 1221, and the friction force between the buffer pad 132 and the lower surface of the wafer can be increased to prevent the wafer from shaking.

Example two

The present embodiment provides a wafer pallet 20, as shown in fig. 4 and 5, the wafer pallet 20 includes: the support ring 21 has a first wafer bearing surface 211 and the extension ring 22 has a second wafer bearing surface 221.

In this embodiment, the wafer supporting table 20 is generally fixedly installed in the apparatus, and cannot be freely detached, and the detachable extension ring 22 is disposed in the supporting ring 21, so that the wafer supporting table 20 can be adapted to wafers with different sizes, when wafers with smaller production sizes are switched, the extension ring 22 is connected with the supporting ring 21, the wafers are supported by the second wafer bearing surface 221 of the extension ring 22, and when wafers with larger production sizes are switched, the extension ring 22 is detached, and the wafers are supported by the first wafer bearing surface 211 on the supporting ring 21, so as to realize rapid switching operation.

Specifically, the first wafer carrying surface 211 and the second wafer carrying surface 221 are at the same level.

In this embodiment, the first wafer carrying surface 211 and the second wafer carrying surface 221 are at the same level, so that the difference in product quality caused by the same operation parameter (recipe) during the production of the apparatus due to the different operation heights can be avoided.

Specifically, as shown in fig. 5, the first wafer carrying surface 211 and the second wafer carrying surface 221 are further provided with a buffer pad 132.

In this embodiment, as shown in fig. 5, the buffer pad 132 is made of a resin material, and has a certain elasticity, so that the lower surface of the wafer can be prevented from being scratched by directly contacting the first wafer carrying surface 211 and the second wafer carrying surface 221, and the buffer pad 132 can increase the friction force with the lower surface of the wafer, so as to prevent the wafer from shaking.

Specifically, the support ring 21 is further provided with a first slope guiding surface 212, and a lower side of the first slope guiding surface 212 is connected to the first wafer bearing surface 211; the extension ring 22 is further provided with a second ramp guide surface 222, the lower side of the second ramp guide surface 222 being connected to the second wafer carrying surface 221.

In the present embodiment, the first slope guiding surface 212 and the second slope guiding surface 222 are used for restraining the position of the wafer, so that the wafer naturally slides on the bearing surface by gravity, and the deviation of the wafer position beyond the restraining range is avoided.

As one example, as shown in fig. 5, the outer circumferential surface of the support ring 21 is located at a height greater than the height of the inner circumferential surface thereof, and the first slope guiding surface 212 is formed by the surface height difference of the support ring 21; the outer circumferential surface of the extension ring 22 is located at a height greater than the height of the inner circumferential surface thereof, and the second slope guiding surface 222 is formed by the height difference of the surface of the extension ring 22.

As another example thereof, the slope guide block 131 as described in the first embodiment may be provided, and will not be described again.

In summary, the wafer supporting arm and the wafer supporting platform provided by the utility model are provided with the supporting arm body (supporting ring) and the extension arm (extending ring) which are detachably connected, the supporting arm body and the extension arm are both provided with the bearing surfaces for bearing the wafer, when the wafer with smaller production size is switched, the extension arm is connected with the supporting arm body, the bearing surfaces on the extension arm support the wafer, when the wafer with smaller production size is switched, the extension arm is detached, the bearing surfaces on the supporting arm body support the wafer, and the extension arm is quickly assembled and disassembled without additionally correcting the position of the supporting arm body, so that the time consumption of switching operation of operators can be effectively shortened, and the operation efficiency is improved. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A wafer carrier, the wafer carrier comprising: a bracket body and an extension arm; wherein,

2. The wafer carrier of claim 1, wherein the first bearing surface is at a same level as the second bearing surface.

3. The wafer carrier of claim 2, wherein the extension arm is a bending arm, a lower surface of the bridge portion is located at a level higher than a level at which a lower surface of the second carrier portion is located, and the lower surface of the bridge portion is attached to the first carrier surface.

4. The wafer carrier of claim 1, wherein,

the side, close to the fixed part, of the first bearing part is also provided with a first slope surface, and the lower side of the first slope surface is connected with the first bearing surface;

5. The wafer carrier of claim 1, wherein the bridge portion and the first carrier portion are provided with corresponding screw holes, and the bridge portion and the first carrier portion are detachably connected by means of the screw holes and screws.

6. The wafer carrier of claim 1, wherein the first and second bearing surfaces are further provided with cushioning pads.

7. A wafer pallet, the wafer pallet comprising: a support ring and an extension ring; wherein,

the support ring is provided with a first wafer bearing surface;

the extension ring is provided with a second wafer bearing surface;

the support ring is detachably connected with the extension ring;

8. The wafer pallet of claim 7, wherein the first wafer bearing surface and the second wafer bearing surface are further provided with a cushion pad.

9. The wafer pallet of claim 7, wherein the support ring is further provided with a first ramp guide surface, an underside of the first ramp guide surface being coupled to the first wafer bearing surface;